Datasheet
300mA Variable Output
LDO Regulator
BA3662CP-V5
●General Description
The BA3662CP-V5 is low-saturation regulator. The output voltage can be arbitrarily configured using the external resistance.
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
High Output Voltage Precision : ±2%
Low saturation with PNP output
Built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuits
Built-in thermal shutdown circuit for protecting the IC
from thermal damage due to overloading
Built-in over- voltage protection circuit that prevents
the destruction of the IC due to power supply surges
●Key Specifications
Input Power Supply Voltage:
Output voltage type:
Output current:
Shutdown current:
Operating temperature range:
●Package
TO220CP-V5
W (Typ.) x D (Typ.) x H (Max.)
10.00mm x 20.12mm x 4.60mm
25V(Max.)
Fixed
0.3A(Max.)
0μA(Typ.)
-40℃ to +125℃
TO220CP-V5
●Applications
Audiovisual equipments, FPDs, televisions, personal
computers or any other consumer device
●Typical Application Circuit
VCC
VO
CIN
COUT
R1
C
CTL
R2
GND
CIN,COUT : Ceramic
Capacitor
●Ordering Information
B
A
3
6
6
2
P
-
V
5
-
Package
CP-V5: TO220CP-V5
Part Number
●Lineup
Maximum output
current (Max.)
0.3A
C
Output Voltage
(Max.)
15V
○Product structure：Silicon monolithic integrated circuit
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001
E2
Packaging and forming specification
E2: Embossed tape and reel
Package
TO220CP-V5
Reel of 500
Orderable Part Number
BA3662CP-V5E2
○This product is not designed protection against radioactive rays.
1/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Block Diagram
VO
VCC
CTL
GND
C
Fig.1
●Pin Configuration
●Pin Description
Pin No.
Pin Name
1
CTL
Output Control Pin
2
Vcc
Power Supply Pin
3
GND
GND
4
Vo
Output Pin
5
C
Adjustable Pin
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
Function
2/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
※1
Supply Voltage
Ratings
Unit
Vcc
-0.3 to +35.0
V
VCTL
-0.3 to +Vcc
V
Pd
2000
mW
Operating Temperature Range
Topr
-40 to +125
℃
Storage Temperature Range
Maximum Junction
Temperature
Tstg
-55 to +150
℃
Tjmax
+150
℃
Vcc
peak
+50
V
Output Control Voltage
※2
Power Dissipation
※3
Peak Supply Voltage
※ 1 Not to exceed Pd.
※ 2 TO220CP-V5:Derating in done at 16mW/℃ for operating above Ta≧25℃.(without heat sink)
※ 3 Applied voltage : 200msec or less (tr≥1msec)
NOTE : This product is not designed for protection against radioactive rays.
tr≧1msec
50V
35V
MAX200msec
(Voltage Supply more than 35V)
0V
●Recommended Operating Ratings (Ta=-40 to +125℃)
Parameter
Symbol
Min.
Max.
Unit
Supply Voltage
Vcc
4.0
25.0
V
Output Control Voltage
VCTL
0
Vcc
V
Output Current
Io
0
0.3
A
Output Voltage
Vo
3.0
15.0
V
●Protect Features
Parameter
Symbol
Min.
Typ.
Max.
Unit
Vcc
26
28
30
V
Over Voltage protection
●Electrical Characteristics(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ)
Symbol
Min.
Typ.
Max.
Unit
Shut Down Current
Parameter
Isd
－
0
10
µA
VCTL=0V
Bias Current
Ib
－
2.5
5.0
mA
VCTL=2V, Io=0mA
C Terminal Voltage
Conditions
Vc
1.200
1.225
1.250
V
Io=50mA
Dropout Voltage
⊿Vd
－
0.3
0.5
V
Ripple Rejection
R.R.
45
55
－
dB
Line Regulation
Reg.I
－
20
100
mV
Vcc=Vo×0.95
f=120Hz, ein※1=1Vrms,
Io=100mA
Vcc=6→25V
Load Regulation
Temperature Coefficient of
Output Voltage
Short Current
Reg.L
－
40
80
mV
Io=5mA→200mA
Tcvo
－
±0.02
－
%/℃
Ios
－
0.1
－
A
Vcc=25V,Vo=0V
ON Mode Voltage
VthH
2.0
－
－
V
ACTIVE MODE, Io=0mA
OFF Mode Voltage
VthL
－
－
0.8
V
OFF MODE, Io=0mA
Input High Current
ICTL
100
200
300
µA
VCTL=5V, Io=0mA
Io=5mA,Tj=0℃ to 125℃
※ 1 ein : Input Voltage Ripple
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
3/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Typical Performance Curves
BA3662CP-V5(5.0V preset voltage)
(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ)
Fig.2
Circuit Current
Fig.3
Line Regulation
Fig.5
Load Regulation
Fig.4
Line Regulation
(Io=200mA)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
4/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Typical Performance Curves - continued
Fig.7
Ripple Rejection
(lo=100mA)
Fig.6
Dropout Voltage Io-△Vd Characteristics
(Vcc=4.75V)
Fig.8
Output Voltage
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
Fig.9
Circuit Current (lo=0mA→300mA)
(IFEEDBACK_R≒555µA)
5/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Typical Performance Curves - continued
Fig.11
CTL Voltage vs Output Voltage
Fig.10
CTL Voltage vs CTL Current
Fig.13
Thermal Shutdown
Circuit Characteristics
Fig.12
Overvoltage Operating
(lo = 200mA)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
6/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Measurement Circuit for Typical Performance Curves
A
Vo
Vcc
Vo
Vcc
6.8kΩ
6.8kΩ
1µ F
CTL
1µ F
+
GND
Vo
Vcc
CTL
ADJ
22µ F
6.8kΩ
1µ F
+
ADJ
GND
CTL
V
+
GND
ADJ
V
22µ F
22µ F
200mA
2.2kΩ
5V
2.2kΩ
2.2kΩ
5V
IFEEDBACK _R
Measurement
Circuit
of Fig.1
Measurement
Circuit
of Fig.2
Measurement
Circuit
of Fig.2
Measurement
Circuit
of Fig.3
Measurement
Circuit
of Fig.3
Measurement
Circuit
of Fig.4
V
Vo
Vcc
Vo
Vcc
1µ F
CTL
6.8kΩ
+
GND
ADJ
22µ F
10V
CTL
CTL
GND
1µ F
+
ADJ
CTL
V
22µ F
10V
Vcc
Vo
CTL
ADJ
6.8kΩ
1µ F
+
GND
10V
100mA
Measurement
Circuit
of Fig.7
Measurement
Circuit
of Fig.6
ADJ
2.2kΩ
2.2kΩ
5V
2.2kΩ
6.8kΩ
6.8kΩ
1µ F
ADJ
5V
Vo
Vcc
+
GND
22µ F
Measurement
Circuit
of Fig.5
Measurement
Circuit
of Fig.6
Vo
Vcc
CTL
10V
2.2kΩ
5V
Measurement
Circuit
of Fig.5
Measurement
Circuit
of Fig.4
1µ F
22µ F
4.75V
2.2kΩ
5V
～
A
+
ADJ
GND
6.8kΩ
1Vrms
1µ F
A
Vo
Vcc
6.8kΩ
22µ F
A
+
GND
22µ F
10V
IFEEDBACK _R
5V
2.2kΩ
A
Vo
Vcc
Vo
Vcc
6.8kΩ
1µ F
CTL
ADJ
1µ F
CTL
V
22µ F
10V
Vcc
Vo
CTL
ADJ
6.8kΩ
+
GND
Measurement
Circuit
of Fig.9
Measurement
Circuit
of Fig.10
Measurement
Circuit
of Fig.8
Measurement
Circuit
of Fig.9
Measurement
Circuit
of Fig.7
Measurement
Circuit
of Fig.8
2.2kΩ
Measurement
Circuit
of Fig.10
Measurement
Circuit
of Fig.11
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
6.8kΩ
1µ F
+
GND
ADJ
V
22µ F
10V
2.2kΩ
5V
200mA
Measurement
Circuit
of Fig.11
Measurement
Circuit
of Fig.12
7/14
+
GND
V
22µ F
10V
5V
2.2kΩ
Measurement
Circuit
of Fig.12
Measurement
Circuit
of Fig.13
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●I/O equivalence circuit
CTL Pin
Vcc Pin
Vo Pin
C Pin
Vcc
25kΩ
Vcc
CTL
10 kΩ
C
IC
25kΩ
Vo
5.5 kΩ
●Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14.
Please be aware that the offset due to the current that flows from the C pin becomes large when resistors with large values
are used. The use of resistors with R1=2kΩ to 15kΩ is recommended.
Vo
R2
IC
Vo ≒ Vc × (R1+R2) / R1
Vc≒1.225V
(TYP.)
C pin
R1
Fig.14
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
8/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Power Dissipation
25
(1)When using a maximum heat sick : θjc=6.25(℃/W)
(2)When using an IC alone : θja=62.5(℃/W)
Power Dissipation Pd （W)
(1) 20.0
20
15
10
5
(2) 2.0
0
0
25
50
75
100
125
150
Ambient Temperature Ta(℃)
Fig.15
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC
at temperatures less than the maximum junction temperature Tjmax.
Fig.15 shows the acceptable loss and heat reducing characteristics of the TO220CP-V5 package. Even when the ambient
temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the
IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows.
Pc=(Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd≧Pc
Solving this for load current Io in order to operate within the acceptable loss,
Io≦
Pd－Vcc×Ib
Vcc－Vo
Vcc:
Vo:
Io:
Ib:
Ishort:
Input voltage
Output voltage
Load current
Circuit current
Short current
(Please refer to Fig.9 for Ib.)
It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example)
When Ta=85℃,Vcc=10V,Vo=5V
1.04－10×Ib
5
Io≦192mA (Ib:8mA)
Io≦
With the IC alone :θja=62.5℃/W → -16mW/℃
25℃=2.0W → 85℃=1.04W
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Ib+Ishort)
(Please refer to Fig.5 for Ishort.)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
9/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Operational Notes
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins
are at a voltage below the GND at any time, regardless of transient characteristics.
4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by
poor soldering or foreign objects) may result in damage to the IC.
6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Power dissipation
If IC is used on condition that the power loss is over the power dissipation, the reliability will become worse by heat up. The
power dissipation that is described to the absolute maximum rating in this specification is a value when the heat sink is not
populated. In this case it exceed the power dissipation, please consider using the heat sink,etc. Also, be sure to use this IC
within a power dissipation range allowing enough of margin.
9. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.
Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)
Tjmax : Maximum junction temperature=150℃,
θja : Thermal resistance of package-ambience[℃/W],
Pc
: Power dissipation [W],
Vo
: Output Voltage,
Io : Load,
Package Power dissipation
Power dissipation
Ta : Peripheral temperature [℃],
Pd : Package Power dissipation [W],
Vcc : Input Voltage,
Ib : Bias Current
: Pd (W)=(Tjmax－Ta)/θja
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
10. Vcc pin
Insert a capacitor (capacitor≧above 0.33µF) between the Vcc and GND pins. The appropriate capacitance value varies
by application. Be sure to allow a sufficient margin for input voltage levels.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
10/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
11. Vo Terminal
Please attach an anti-oscillation capacitor between Vo and GND. The capacitance of the capacitor may significantly
change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or
aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low
temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Fig.16. In cases where there are
sudden load fluctuations, the large capacitor is recommended. Below figure, it is ESR-to-Io stability Area characteristics,
measured by 22µF-ceramic-capacitor and resistor connected in series.
This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method.
Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can
vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the
final status of these items for actual use.
Keep capacitor capacitance within a range of 22µF to 1000µF. It is also recommended that a 0.33µF bypass capacitor be
connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input
voltage or the load, please check the operation in real application to determine proper capacitance.
Vcc=10V VO=5V
Ta=25℃
R1=2kΩ to 15kΩ
Cin=0.33µF Cout=22µF
100
U n sta b le o p e ra tin g re g io n
Cout_ESR（Ω）
Cout (22µF)
10
R2
Cin
Vcc
(10V)
1
CTL
(0.33µF)
GND
ADJ
Io (ROUT)
VCTL
(5V)
100
200
R1
(2k to 15kΩ)
U n sta b le o p e ra tin g re g io n
0 .1
0
ESR (above 0.001Ω)
Vo
Vcc
Sta b le o p e ra tin g re g io n
※Operation Note 11 Measurement circuit
300
Io[mA]
Fig.16 Cout_ESR vs Io (reference data)
12. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit
output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous or transitive operation of the
protection circuits.
13. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used
after this function has activated, or in applications where the operation of this circuit is assumed.
14. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.
15. Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V
on the VCC pin.
Vcc
GND
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
11/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
16. Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the
VCC pin.
Vcc
GND
17. Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown.
protection diode should be inserted on the output to protect the IC.
In such cases, a
18. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors. For example (refer to the figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Transistor (NPN)
Resistor
B
(Pin B)
(Pin A)
(Pin B)
E
C
B
N
P
P+
N
P
P+
N
P+
N
Parasitic elements
GND
E
P
P+
N
N
GND
N
P substrate
Parasitic elements
or transistors
C
GND
Parasitic elements
or transistors
(Pin A)
Parasitic elements
Example of Simple Monolithic IC Architecture
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
12/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Physical Dimension Tape and Reel Information
TO220CP-V5
4.5±0.1
(1.0)
1.444
0.82±0.1
0.92
1.778
Tape
Embossed carrier tape
Quantity
500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
16.92
13.60
+0.2
2.8 -0.1
8.0 ± 0.2
12.0 ± 0.2
4.92 ± 0.2
1.0 ± 0.2
+0.4
15.2 -0.2
+0.3 φ3.2±0.1
10.0 -0.1
0.42±0.1
1.58
(2.85)
4.12
(Unit : mm)
Reel
1pin
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
TO220CP-V5 (TOP VIEW)
Part Number Marking
LOT Number
BA3662
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
13/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
BA3662CP-V5
●Revision History
Date
Revision
26.Jun.2012
001
Changes
New Release
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
14/14
TSZ02201-0R6R0A600110-1-2
26.Jun.2012 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
