Datasheet
Operational Amplifiers
Low Noise Operational Amplifiers
BA4580Rxxx BA4584FV BA4584Rxx
General Description
Packages
BA4580Rxxx, BA4584FV, BA4584Rxx integrates two or
four independent high voltage gain Op-Amps on a
single chip. Especially, this series are suitable for any
audio applications due to low noise and low distortion
characteristics and are usable for other many
applications by wide operating supply voltage range.
SOP8
SOP-J8
TSSOP-B8
MSOP8
SOP14
SSOP-B14
Features
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.20mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
5.00mm x 6.40mm x 1.35mm
Key Specification
High Voltage Gain
Low Input Referred Noise Voltage
Low Distortion
Wide Operating Supply Voltage Range
Wide Temperature Range
Operating Supply Voltage Range (Split Supply):
BA4580Rxxx, BA4584FV
±2V to ±16V
BA4584Rxx
±2V to ±9.5V
Slew Rate:
5V/µs(Typ)
Total Harmonic Distortion:
0.0005%(Typ)
Input Referred Noise Voltage:
5 nV/ Hz (Typ)
Operating Temperature Range:
BA4584FV
-40°C to +85°C
BA4580Rxxx,BA4584Rxx
-40°C to +105°C
Application
Audio Application
Consumer Electronics
Simplified Schematic
VCC
VCC
-IN
－IN
OUT
VOUT
+IN
＋IN
VEE
VEE
Figure 1. Simplified schematic
○Product structure：Silicon monolithic integrated circuit
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CC
UT2
N2
N2
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
Pin Configuration
BA4580RF
BA4580RFJ
BA4580RFVT
BA4580RFVM
: SOP8
: SOP-J8
: TSSOP-B8
: MSOP8
1
OUT1
Pin No.
OUT1 1
8 VCC
2
-IN1
CH2
+ -
4
VEE
2
+IN1 3
3
VCC 4
4
+IN2 5
5
-IN2 6
6
7 OUT2
CH1
- +
3
+IN1
-IN1 1 2
6 -IN2
5 +IN2
OUT27 7
BA4584RF
BA4584FV, BA4584RFV
CH1
- +
CH1 OUT1
- +
-IN1
+ CH3
-IN2
9 -IN3
8 OUT3
OUT2
8
VCC
Pin No.
Pin Name
1
OUT1
2
-IN1
14 OUT4
3
+IN1
CH4
+ -
13 -IN4
4
VCC
5
+IN2
6
-IN2
VCC 4
11 VEE
7
OUT2
5
10 +IN3
8
OUT3
9 -IN3
9
-IN3
8 OUT3
10
+IN3
11
VEE
12
+IN4
13
-IN4
14
OUT4
- +
CH2
10 +IN3
+IN2
12 +IN4
-IN2 6
11 VEE
VEE
- +
CH2
13 -IN4
12 +IN4
+IN1
+IN1 3
+IN2
CH4
+ -
: SOP14
: SSOP-B14
OUT1 1
-IN1 2
14 OUT4
Pin Name
+ CH3
OUT2 7
Package
SOP8
SOP-J8
TSSOP-B8
MSOP8
SOP14
SSOP-B14
BA4580RF
BA4580RFJ
BA4580RFVT
BA4580RFVM
BA4584RF
BA4584FV
BA4584RFV
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
Ordering Information
B
A
4
5
8
x
x
Part Number
BA4580Rxxx
BA4584FV
BA4584Rxx
x
x
x
-
Package
F
: SOP8
SOP14
FJ : SOP-J8
FV : SSOP-B14
FVT : TSSOP-B8
FVM : MSOP8
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/TSSOP-B8/SOP14/
SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
Line-up
Operating
Temperature
Range
Operating Supply
Voltage Range
(Split Supply)
-40°C to +85°C
Supply
Current
(Typ)
Slew
Rate
(Typ)
12mA
±2.0V to ±16.0V
6mA
5V/µs
-40°C to +105°C
±2.0V to ±9.5V
11mA
Orderable
Part Number
Package
SSOP-B14
Reel of 2500
BA4584FV-E2
SOP8
Reel of 2500
BA4580RF-E2
SOP-J8
Reel of 2500
BA4580RFJ-E2
TSSOP-B8
Reel of 3000
BA4580RFVT-E2
MSOP8
Reel of 3000
BA4580RFVM-TR
SOP14
Reel of 2500
BA4584RF-E2
SSOP-B14
Reel of 2500
BA4584RFV-E2
Absolute Maximum Ratings (TA=25℃)
Parameter
Ratings
Symbol
Supply Voltage
BA4580Rxxx
BA4584FV
VCC-VEE
+36
PD
0.78
-
SOP-J8
0.67
(Note2,7)
-
TSSOP-B8
0.62
(Note3,7)
-
0.59
(Note4,7)
-
(Note 8)
MSOP8
SOP14
-
SSOP-B14
-
Unit
V
(Note1,7)
SOP8
Power Dissipation
BA4584Rxx
-
W
0.61
0.87
(Note5,7)
(Note6,7)
Differential Input Voltage
VID
+36
V
Input Common-mode Voltage Range
VICM
VEE to VEE+36
V
(Note 9)
Input Current
II
Operating Supply Voltage Range
Vopr
Output Current
IOUT
Operating Temperature Range
Topr
Storage Temperature Range
Maximum Junction Temperature
-10
mA
+4 to +32
(±2 to ±16)
+4 to +19
(±2 to ±9.5)
±50
-40 to +105
mA
-40 to +85
-55 to +150
Tstg
+150
TJmax
V
-40 to +105
℃
℃
℃
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
To use at temperature above TA＝25℃ reduce 6.2mW/℃.
To use at temperature above TA＝25℃ reduce 5.4mW/℃
To use at temperature above TA＝25℃ reduce 5.0mW/℃
To use at temperature above TA＝25℃ reduce 4.8mW/℃
To use at temperature above TA＝25℃ reduce 4.9mW/℃
To use at temperature above TA＝25℃ reduce 7.0mW/℃
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 9) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as
short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is
operated in a special mode exceeding the absolute maximum ratings.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
Electrical Characteristics
○BA4580R (Unless otherwise specified VCC=+15V, VEE=-15V, TA=25℃)
Limits
Parameter
Symbol
Unit
Min
Typ
Max
Condition
Input Offset Voltage
(Note 10)
VIO
-
0.3
3
mV
Input Offset Current
(Note 10)
IIO
-
5
200
nA
-
IB
-
100
500
nA
-
Large Signal Voltage Gain
AV
90
110
-
dB
RL≥ 10kΩ, OUT=±10Ｖ
Maximum Output Voltage
VOM
±12
±13.5
-
V
RL≥ 2kΩ
Input Common-mode Voltage Range
VICM
±12
±13.5
-
V
Common-mode Rejection Ratio
CMRR
80
110
-
dB
RS≤ 10kΩ
Power Supply Rejection Ratio
PSRR
80
110
-
dB
RS≤ 10kΩ
Supply Current
ICC
-
6
9
mA
RL=∞, All Op-Amps, VIN+=0V
Slew Rate
SR
-
5
-
V/μs
RL≥ 2kΩ
GBW
-
10
-
MHz
f=10kHz
fT
-
5
-
MHz
RL=2kΩ
THD+N
-
0.0005
-
%
-
5
-
nV/ Hz
-
0.8
-
μVrms
-
110
-
dB
Input Bias Current
(Note 11)
Gain Bandwidth Product
Unity Gain Frequency
Total Harmonic Distortion+ Noise
Input Referred Noise Voltage
Channel Separation
RS≤ 10kΩ
-
AV=20dB, OUT=5Vrms
RL=2kΩ
f=1kHz, 20Hz~20kHz BPF
RS=100Ω, VI=0V, f=1kHz
VN
CS
RIAA, RS=2.2 kΩ, 30kHz LPF
R1=100Ω, f=1kHz
(Note 10) Absolute value
(Note 11) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584 (Unless otherwise specified VCC=+15V, VEE=-15V, TA =25℃)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Input Offset Voltage
(Note 12)
VIO
-
0.3
3
mV
Input Offset Current
(Note 12)
IIO
-
5
200
nA
-
IB
-
100
500
nA
-
Large Signal Voltage Gain
AV
90
110
-
dB
RL≥ 10kΩ, OUT=±10Ｖ
Maximum Output Voltage
VOM
±12
±13.5
-
V
RL≥ 2kΩ
Input Common-mode Voltage Range
VICM
±12
±13.5
-
V
Common-mode Rejection Ratio
CMRR
80
110
-
dB
RS≤ 10kΩ
Power Supply Rejection Ratio
PSRR
80
110
-
dB
RS≤ 10kΩ
Supply Current
ICC
-
12
18
mA
RL=∞, All Op-Amps, VIN+=0V
Slew Rate
SR
-
5
-
V/μs
RL≥ 2kΩ
GBW
-
10
-
MHz
f=10kHz
fT
-
5
-
MHz
RL=2kΩ
THD+N
-
0.0005
-
%
-
5
-
nV/ Hz
-
0.8
-
μVrms
-
110
-
dB
Input Bias Current
(Note 13)
Gain Bandwidth Product
Unity Gain Frequency
Total Harmonic Distortion+ Noise
Input Referred Noise Voltage
Channel Separation
RS≤ 10kΩ
-
AV=20dB, OUT=5Vrms
RL=2kΩ
f=1kHz, 20Hz~20kHz BPF
RS=100Ω, VI=0V, f=1kHz
VN
CS
RIAA, RS=2.2 kΩ, 30kHz LPF
R1=100Ω, f=1kHz
(Note 12) Absolute value
(Note 13) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584R (Unless otherwise specified VCC=+9.5V, VEE=-9.5V, TA =25℃)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
Condition
Input Offset Voltage
(Note 14)
VIO
-
0.3
3
mV
Input Offset Current
(Note 14)
IIO
-
5
200
nA
-
IB
-
100
500
nA
-
Large Signal Voltage Gain
AV
90
110
-
dB
RL≥ 10kΩ, OUT=±10Ｖ
Maximum Output Voltage
VOM
±6.5
±8
-
V
RL≥ 2kΩ
Input Common-mode Voltage Range
VICM
±6.5
±8
-
V
Common-mode Rejection Ratio
CMRR
80
110
-
dB
RS≤ 10kΩ
Power Supply Rejection Ratio
PSRR
80
110
-
dB
RS≤ 10kΩ
Supply Current
ICC
-
11
17
mA
RL=∞, All Op-Amps, VIN+=0V
Slew Rate
SR
-
5
-
V/μs
RL≥ 2kΩ
GBW
-
10
-
MHz
f=10kHz
fT
-
5
-
MHz
RL=2kΩ
THD+N
-
0.0005
-
%
-
5
-
nV/ Hz
-
0.8
-
μVrms
-
110
-
dB
Input Bias Current
(Note 15)
Gain Bandwidth Product
Unity Gain Frequency
Total Harmonic Distortion+ Noise
Input Referred Noise Voltage
Channel Separation
RS≤ 10kΩ
-
AV=20dB, OUT=5Vrms
RL=2kΩ
f=1kHz, 20Hz~20kHz BPF
RS=100Ω, VI=0V, f=1kHz
VN
CS
RIAA, RS=2.2 kΩ, 30kHz LPF
R1=100Ω, f=1kHz
(Note 14) Absolute value
(Note 15) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Power Supply Voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
1.3 Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
1.4 Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics Item
2.1 Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
2.4 Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
2.5 Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
2.6 Circuit Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
2.7 Output Saturation Voltage (VOM)
Signifies the voltage range that can be output under specific output conditions.
2.8 Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.10 Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
2.11 Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
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BA4580Rxxx
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BA4584Rxx
Datasheet
2.12 Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
2.13 Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
2.14 Total Harmonic Distortion+ Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.15 Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
Typical Performance Curves
○BA4580Rxxx
10
SUPPLY CURRENT [mA] .
POWER DISSIPATION [W] .
1
BA4580RF
0.8
BA4580RFJ
0.6
BA4580RFVT
0.4
BA4580RFVM
0.2
0
0
25
50
75
105
100
8
-40℃
6
4
105℃
2
0
125
±0
AMBIENT TEMPERATURE [℃] .
Figure 2.
Derating Curve
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
SUPPLY CURRENT [mA]
8.0
±15V
6.0
4.0
±7.5 V
2.0
0.0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
±5
±10
±15
SUPPLY VOLTAGE [V]
±20
Figure 3.
Supply Current - Supply Voltage
10.0
±2 V
25℃
100
30
25
20
15
10
5
0
0.1
Figure 4.
Supply Current - Ambient Temperature
1
LOAD RESISTANCE [kΩ]
10
Figure 5.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V, TA=25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA4584Rxx
Datasheet
20
20
15
15
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
○BA4580Rxxx
VOH
5
0
-5
VOL
-10
VOH
10
5
0
-5
-10
VOL
-15
-15
-20
-20
0.1
1
±2
10
±4
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
LOAD RESISTANCE [kΩ]
Figure 7.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ, TA =25℃)
20
20
15
15
OUTPUT VOLTAGE [V] .
OUTPUT VOLTAGE [V] .
Figure 6.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V, TA =25℃)
10
VOH
5
0
-5
VOL
-10
-15
-20
-50
10
VOH
5
0
-5
VOL
-10
-15
-20
-25
0
25
50
75
100
125
0
5
10
15
20
AMBIENT TEMPERATURE [℃]
OUTPUT CURRENT [mA]
Figure 8.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 9.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, TA =25℃)
25
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4580Rxxx
6
INPUT OFFSET VOLTAGE [mV] .
INPUT OFFSET VOLTAGE [mV] .
6
4
-40℃
2
25℃
0
105℃
-2
-4
4
±2V
2
±7.5V
0
±15V
-2
-4
-6
-6
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
SUPPLY VOLTAGE [V]
50
75
100
125
200
200
180
180
INPUT BIAS CURRENT [nA]
.
25
Figure 11.
Input Offset Voltage - Ambient Temperature
(VICM=0V, OUT=0V)
Figure 10.
Input Offset Voltage - Supply Voltage
(VICM=0V, OUT=0V)
INPUT BIAS CURRENT [nA]
0
AMBIENT TEMPERATURE [℃]
160
140
120
-40℃
100
80
60
105℃
25℃
40
160
140
±7.5V
120
100
80
60
±15V
±2V
40
20
20
0
0
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Figure 13.
Input Bias Current - Ambient Temperature
(VICM=0V, OUT=0V)
Figure 12.
Input Bias Current - Supply Voltage
(VICM=0V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA4584Rxx
Datasheet
20
30
INPUT OF FSET CURRENT [nA]
.
30
INPUT OFFSET CURRENT [nA]
○BA4580Rxxx
105℃
10
0
25℃
-40℃
-10
-20
20
±2V
0
±15V
-10
-20
-30
-30
±0
±2
-50
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
COMMON MODE REJECTION RATIO [dB]
5
4
105℃
3
2
25℃
-40℃
1
0
-1
-2
-3
-4
-5
-4
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 15.
Input Offset Current - Ambient Temperature
(VICM=0V, OUT=0V)
Figure 14.
Input Offset Current - Supply Voltage
(VICM=0V, OUT=0V)
INPUT OFFSET VOLTAGE [mV]
±7.5V
10
150
125
100
75
50
25
0
-50
-3
-2
-1
0
1
2
3
4
COMMON MODE INPUT VOLTAGE [V]
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 17.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, VICM=-12V to +12V)
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+4V/-4V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
12/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
.
○BA4580Rxxx
10
.
125
SLEW RATE [V/μs]
POWER SUPPLY REJECTION RATIO [dB]
150
100
75
50
5
0
-5
25
0
-10
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
125
±0
±4 ±6 ±8 ±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
Figure 19.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, TA=25℃)
Figure 18.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V to +15V/-15V)
80
1
TOTAL HARMONIC DISTORTION [%] .
INPUT REFERRED NOISE VOLTAGE
[nV/√Hz] .
±2
60
40
20
0
0.1
20kHz
0.01
1kHz
0.001
20Hz
0.0001
1
10
100
1000
FREQUENCY [Hz]
10000
0.1
1
OUTPUT VOLTAGE [Vrms]
10
Figure 21.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V, AV=20dB,
RL=2kΩ, 80kHz-LPF, TA=25℃)
Figure 20.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, TA=25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
13/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
30
60
25
50
0
-30
40
-60
20
15
10
5
10
100
FREQUENCY [kHz]
-90
GAIN
20
-120
10
-150
0
-180
2
3
4
5
6
7
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
10
10
10
10
10
10
0
1
30
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
○BA4580Rxxx
1000
FREQUENCY [Hz]
Figure 22.
Maximum Output Voltage Swing - Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ, TA=25℃)
Figure 23.
Voltage Gain・Phase - Frequency
(VCC/VEE=+15V/-15V, AV=40dB, RL=2kΩ, TA=25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
14/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584FV
24
0.8
SUPPLY CURRENT [mA] .
POWER DISSIPATION [W]
1
BA4584FV
0.6
0.4
0.2
0
0
85
25
50
75
100
AMBIENT TEMPERATURE [℃]
20
-40℃
16
12
8
85℃
4
0
125
±0
Figure 24.
Derating Curve
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
SUPPLY CURRENT [mA]
20
±15V
12
8
±2 V
4
±7.5 V
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
±5
±10
±15
SUPPLY VOLTAGE [V]
±20
Figure 25.
Supply Current - Supply Voltage
24
16
25℃
100
30
25
20
15
10
5
0
0.1
1
10
LOAD RESISTANCE [kΩ]
Figure 27.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+15V/-15V, TA =25℃)
Figure 26.
Supply Current - Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
15/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
20
20
15
15
10
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
○BA4584FV
VOH
5
0
-5
VOL
-10
VOH
5
0
-5
-10
VOL
-15
-15
-20
-20
0.1
1
±2
10
±4
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
LOAD RESISTANCE [kΩ]
Figure 29.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ, TA =25℃)
20
20
15
15
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 28.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+15V/-15V, TA =25℃)
VOH
5
0
-5
VOL
-10
-15
-20
-50
10
VOH
5
0
-5
VOL
-10
-15
-20
-25
0
25
50
75
100
0
AMBIENT TEMPERATURE [℃]
5
10
15
20
25
OUTPUT CURRENT [mA]
Figure 30.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+15V/-15V, RL=2kΩ)
Figure 31.
Maximum Output Voltage
- Output Current
(VCC/VEE=+15V/-15V, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
16/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
6
6
4
4
-40℃
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BA4584FV
25℃
2
0
105℃
-2
-4
±2V
2
±7.5V
0
±15V
-2
-4
-6
-6
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Figure 33.
Input Offset Voltage - Ambient Temperature
(VICM=0V, OUT=0V)
Figure 32.
Input Offset Voltage - Supply Voltage
(VICM=0V, OUT=0V)
200
180
180
160
160
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
.
200
140
25℃
120
100
80
-40℃
60
105℃
40
140
±7.5V
±4V
120
100
80
60
±15V
40
20
20
0
0
±0
±2
±4
±6
-50
±8 ±10 ±12 ±14 ±16
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Figure 34.
Input Bias Current - Supply Voltage
(VICM=0V, OUT=0V)
Figure 35.
Input Bias Current - Ambient Temperature
(VICM=0V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
17/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584FV
30
INPUT OFFSET CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
6
4
-40℃
25℃
2
0
105℃
-2
-4
20
±2V
10
±7.5V
0
±15V
-10
-20
-30
-6
±0
±2
±4
±6
±8
-50
±10 ±12 ±14 ±16
SUPPLY VOLTAGE [V]
Figure 36.
Input Offset Current - Supply Voltage
(VICM=0V, OUT=0V)
COMMON MODE REJECTION RATIO [dB]
INPUT OFFSET VOLTAGE [mV]
85℃
3
-40℃
2
25℃
1
0
-1
-2
-3
-4
-5
-15
100
Figure 37.
Input Offset Current - Ambient Temperature
(VICM=0V, OUT=0V)
5
4
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
150
125
100
75
50
25
0
COMMON MODE INPUT VOLTAGE [V]
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
Figure 38.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+15V/-15V, OUT=0V)
Figure 39.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+15V/-15V, VICM=-12V to +12V)
-10
-5
0
5
10
-50
15
100
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
18/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
10
150
.
125
SLEW RATE [V/μs]
POWER SUPPLY REJECTION RATIO [dB]
.
○BA4584FV
100
75
50
5
0
-5
25
0
-10
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
100
±0
±4
±6 ±8 ±10 ±12 ±14 ±16 ±18
SUPPLY VOLTAGE [V]
Figure 41.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, TA =25℃)
Figure 40.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V to +15V/-15V)
1
TOTAL HARMONIC DISTORTION [%]
80
INPUT REFERRED NOISE VOLTAGE
[nV/√Hz] .
±2
60
40
20
0.1
20kHz
0.01
0.001
1kHz
20Hz
0.0001
0
1
10
100
1000
FREQUENCY [Hz]
0.1
10000
1
OUTPUT VOLTAGE [Vrms]
10
Figure 43.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+15V/-15V, AV=20dB,
RL=2kΩ, 80kHz-LPF, TA =25℃)
Figure 42.
Equivalent Input Noise Voltage – Frequency
(VCC/VEE=+15V/-15V, RS=100Ω, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
19/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
30
60
25
50
0
-30
40
-60
20
15
10
5
10
100
FREQUENCY [kHz]
-90
GAIN
20
-120
10
-150
0
-180
2
3
4
5
6
7
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
10
10
10
10
10
10
0
1
30
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
○BA4584FV
1000
FREQUENCY [Hz]
Figure 44.
Maximum Output Voltage Swing – Frequency
(VCC/VEE=+15V/-15V, RL=2kΩ, TA =25℃)
Figure 45.
Voltage Gain・Phase - Frequency
(VCC/VEE=+15V/-15V, AV=40dB, RL=2kΩ, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
20/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584Rxx
20
SUPPLY CURRENT [mA] .
POWER DISSIPATION [W]
1
BA4584RFV
0.8
BA4584RF
0.6
0.4
0.2
0
0
105
25
50
75
100
AMBIENT TEMPERATURE [℃]
16
12
8
105℃
4
0
±0
125
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
SUPPLY CURRENT [mA]
20
±9.5V
12
8
±2 V
±4.5 V
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
±4
±6
±8
±10
Figure 47.
Supply Current - Supply Voltage
24
4
±2
SUPPLY VOLTAGE [V]
Figure 46.
Derating Curve
16
25℃
-40℃
125
20
FV
15
10
5
0
0.1
1
10
LOAD RESISTANCE [kΩ]
Figure 48.
Supply Current - Ambient Temperature
Figure 49.
Maximum Output Voltage Swing
- Load Resistance
(VCC/VEE=+9.5V/-9.5V, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
21/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584Rxx
10
10
VOH
5
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
VOH
0
-5
VOL
5
0
-5
VOL
-10
-10
0.1
1
±2
10
±4
±6
±8
SUPPLY VOLTAGE [V]
LOAD RESISTANCE [kΩ]
Figure 51.
Maximum Output Voltage
- Supply Voltage
(RL=2kΩ, TA =25℃)
15
15
10
10
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 50.
Maximum Output Voltage
- Load Resistance
(VCC/VEE=+9.5V/-9.5V, TA =25℃)
5
VOH
0
VOL
-5
5
VOH
0
VOL
-5
-10
-10
-15
-50
±10
-15
-25
0
25
50
75
100
0
125
5
10
15
20
25
OUTPUT CURRENT [mA]
AMBIENT TEMPERATURE [℃]
Figure 53.
Maximum Output Voltage
- Output Current
(VCC/VEE=+9.5V/-9.5V, TA =25℃)
Figure 52.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+9.5V/-9.5V, RL=2kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
22/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
○BA4584Rxx
6
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
6
4
-40℃
25℃
2
0
105℃
-2
-4
4
±2V
2
±4.5V
0
-2
±9.5V
-4
-6
-6
±0
±2
±4
±6
±8
-50
±10
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE [V]
Figure 54.
Input Offset Voltage - Supply Voltage
(VICM=0V, OUT=0V)
Figure 55.
Input Offset Voltage - Ambient Temperature
(VICM=0V, OUT=0V)
200
180
180
160
160
140
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
.
200
-40℃
25℃
120
100
80
60
105℃
40
140
±2V
±4.5V
120
100
80
60
±9.5V
40
20
20
0
0
±0
±2
±4
±6
±8
-50
±10
SUPPLY VOLTAGE [V]
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [℃]
Figure 56.
Input Bias Current - Supply Voltage
(VICM=0V, OUT=0V)
Figure 57.
Input Bias Current Ambient Temperature
(VICM=0V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
23/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
20
30
INPUT OFFSET CURRENT [nA]
.
30
INPUT OFFSET CURRENT [nA]
○BA4584Rxx
105℃
10
0
25℃
-10
-40℃
-20
20
0
±9.5V
-10
-20
-30
-30
±0
±2
±4
±6
±8
-50
±10
COMMON MODE REJECTION RATIO [dB]
5
105℃
3
25℃
2
-40℃
1
0
-1
-2
-3
-4
-5
-4
0
25
50
75
100
125
Figure 59.
Input Offset Current - Ambient Temperature
(VICM=0V, OUT=0V)
Figure 58.
Input Offset Current - Supply Voltage
(VICM=0V, OUT=0V)
4
-25
AMBIENT TEMPERATURE [°C]
SUPPLY VOLTAGE [V]
INPUT OFFSET VOLTAGE [mV]
±4.5V
±2V
10
150
125
100
75
50
25
0
-50
-3
-2
-1
0
1
2
3
4
COMMON MODE INPUT VOLTAGE [V]
-25
0
25
50
75 100
AMBIENT TEMPERATURE [°C]
125
Figure 61.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+9.5V/-9.5V, VICM=-12V to +12V)
Figure 60.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+4V/-4V, OUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
24/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
.
○BA4584Rxx
10
.
125
SLEW RATE [V/μs]
POWER SUPPLY REJECTION RATIO [dB]
150
100
75
50
5
0
-5
25
-10
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [℃]
±0
125
±4
±6
±8
SUPPLY VOLTAGE [V]
±10
Figure 63.
Slew Rate - Supply Voltage
(CL=100pF, RL=2kΩ, TA =25℃)
Figure 62.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2V/-2V to +9.5V/-9.5V)
1
TOTAL HARMONIC DISTORTION [%]
80
INPUT REFERRED NOISE VOLTAGE
[nV/√Hz] .
±2
60
40
20
10
100
1000
FREQUENCY [Hz]
20kHz
0.01
1kHz
0.001
20Hz
0.0001
0.1
0
1
0.1
10000
1
OUTPUT VOLTAGE [Vrms]
10
Figure 65.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=+9.5V/-9.5V, AV=20dB,
RL=2kΩ, 80kHz-LPF, TA =25℃)
Figure 64.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=+9.5V/-9.5V, RS=100Ω, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･00
25/40
TSZ02201-0RAR1G200030-1-2
20.Nov.2014 Rev.003
BA4580Rxxx
BA4584FV
BA4584Rxx
Datasheet
60
20
0
50
-30
15
10
5
10
100
FREQUENCY [kHz]
30
-60
-90
GAIN
20
-120
10
-150
0
-180
2
3
4
5
6
7
10
10
10
10
10
10
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0
1
40
PHASE [deg]
PHASE
VOLTAGE GAIN [dB]
MAXIMUM OUTPUT VOLTAGE SWING [VP-P]
○BA4584Rxx
1000
FREQUENCY [Hz]
Figure 66.
Maximum Output Voltage Swing - Frequency
(VCC/VEE=+9.5V/-9.5V, RL=2kΩ, TA =25℃)
Figure 67.
Voltage Gain・Phase - Frequency
(VCC/VEE=+9.5V/-9.5V, Av=40dB, RL=2kΩ, TA =25℃)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Application Information
NULL method Condition for Test Circuit1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
S1
S2
BA4580Rxxx,
BA4584FV
S3
BA4584R
Calculation
VCC
VEE
EK
VCC
VEE
EK
Input Offset Voltage
VF1
ON
ON
OFF
15
-15
0
9.5
-9.5
0
1
Input Offset Current
VF2
OFF
OFF
OFF
15
-15
0
9.5
-9.5
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
15
-15
0
9.5
-9.5
0
3
ON
ON
ON
15
-15
-10
9.5
-9.5
-4.5
15
-15
10
9.5
-9.5
4.5
ON
ON
OFF
3
-27
12
3
-16
6.5
27
-3
-12
16
-3
-6.5
ON
ON
OFF
2
-2
0
2
-2
0
15
-15
0
9.5
-9.5
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply
Rejection Ratio
VF10
-Calculation1. Input Offset Voltage (VIO)
|VF1|
[V]
VIO =
1+RF/RS
2. Input Offset Current (IIO)
|VF2-VF1|
IIO =
RI ×(1+RF/RS)
0.1µF
500kΩ
VCC
+15V
EK
RS=50Ω
RI=10kΩ
[A]
500kΩ
DUT
3. Input Bias Current (IB)
RI=10kΩ
VICM
2 × RI ×(1+RF/RS)
6
RF=50kΩ
SW1
NULL
SW3
IB =
5
0.1µF
RS=50Ω
|VF4-VF3|
4
4. Large Signal Voltage Gain (AV)
AV = 20Log ΔEK × (1+RF/RS)
|VF5-VF6|
VF
RL
SW2
50kΩ
[A]
1000pF
-15V
VEE
Figure 68. Test circuit1 (one channel only)
[dB]
5. Common-mode Rejection Ration (CMRR)
CMRR = 20Log ΔVICM × (1+RF/RS)
|VF8-VF7|
[dB]
6. Power supply rejection ratio (PSRR)
ΔVCC × (1+ RF/RS)
PSRR = 20Log
|VF10 – VF9|
[dB]
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current
OFF OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF OFF
High Level Output Voltage
OFF OFF
ON
OFF OFF
ON
OFF OFF
OFF OFF OFF
ON
OFF
Low Level Output Voltage
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF
ON
OFF
Output Source Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON
OFF OFF
ON
OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF
Gain Bandwidth Product
OFF
ON
OFF OFF
ON
Equivalent Input Noise Voltage
ON
OFF OFF OFF
ON
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ON
ON
ON
ON
OFF OFF OFF OFF
ON
OFF OFF
ON
ON
OFF OFF OFF OFF
ON
OFF OFF OFF OFF
ON
OFF OFF OFF
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Input voltage
SW4
R2
SW5
●
VH
VCC
－
SW1
SW2
VL
SW3
＋
SW6
RS
SW7
SW9
SW8
t
Input wave
SW10 SW11 SW12 SW13 SW14
Output voltage
R1
C
VEE
C
VIN-
90% SR=ΔV/Δt
VH
RL
VIN+
CL
ΔV
VOUT
VRL
10%
VL
Δt
t
Output wave
Figure 70. Slew Rate Input Waveform
Figure 69. Test Circuit 2 (each Op-Amp)
VCC
VCC
R1//R2
R1//R2
OTHER
CH
VEE
R1
VIN
R2
VEE
OUT1
V VOUT1
=0.5Vrms
R1
R2
V
=0.5[Vrms]
OUT2
VOUT2
100 OUT1
100×VOUT1
CS 20 log
CS＝20×log
OUT2
VOUT2
Figure 71. Test circuit 3 (Channel Separation)
(VCC=+15V,VEE=-15V, R1=100Ω, R2=10kΩ)
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Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA =25℃(normal temperature). IC is
heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and
thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA℃/W. The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 72. (a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature Ta, maximum junction temperature TJMAX, and power dissipation PD can be calculated by the equation below:
θJA = (TJMAX-TA) / PD
℃/W
Derating curve in Figure 72. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 73. (c),(d)
show a derating curve for an example of BA4580Rxxx, BA4584FV, BA4584Rxx.
Power Dissipation of LSI [W]
PD(max)
θJA=(TJmax-TA)/ PD
°C/W
P2
θJA2 < θJA1
Ambient Temperature TA [ °C ]
θ’JA2 θ
JA2
P1
TJ’max
θ’JA1
0
Chip Surface Temperature TJ [ °C ]
25
50
TJmax
θJA1
75
100
125
150
Ambient Temperature TA [ °C ]
(b) Derating Curve
(a) Thermal Resistance
Figure 72. Thermal resistance and derating curve
1
BA4580RF(Note 16)
0.8
0.8
POWER DISSIPATION[W]
POWER DISIPATION [W] .
1
BA4580RFJ(Note 17)
0.6
0.4
BA4580RFVT(Note 18)
BA4580RFVM(Note 19)
0.2
BA4584RFV(Note 20)
0.6
0.4
BA4584RF(Note 21)
0.2
BA4584FV(Note 21)
0
0
0
25
50
75
100
0
125
25
AMBIENT TEMPERATURE [℃] .
(c)BA4580Rxxx
(Note 16)
6.2
(Note 17)
5.4
(Note 18)
5.0
(Note 19)
4.8
50
75
100
125
AMBIENT TEMPERATURE[℃]
(d)BA4584FV/BA4584Rxx
(Note 20)
7.0
(Note 21)
4.9
Unit
mW/℃
When using the unit above TA=25℃, subtract the value above per degree℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 73. Derating Curve
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Application Examples
○Voltage Follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is
configured to be equal to the input voltage (IN). This
circuit also stabilizes the output voltage (OUT) due to
high input impedance and low output impedance.
Computation for output voltage (OUT) is shown below.
OUT=IN
VCC
OUT
IN
VEE
Figure 74. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (IN) is amplified
by a voltage gain and depends on the ratio of R1 and
R2. The out-of-phase output voltage is shown in the
next expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
VCC
IN
R1
OUT
R1//R2
VEE
Figure 75. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
VCC
OUT
IN
For non-inverting amplifier, input voltage (IN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (OUT) is in-phase
with the input voltage (IN) and is shown in the next
expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since
its input side is the same as that of the operational
amplifier.
VEE
Figure 76. Non-inverting Amplifier Circuit
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 77. Example of monolithic IC structure
12. Unused Circuits
It is recommended to apply the connection (see Figure 78.) and set the
non-inverting input terminal at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit.
Keep this potential
in VICM
13. Input Voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics.
VCC
VICM
VEE
Figure 78. Example of Application Circuit
for Unused Op-amp
14. Power Supply(single/dual)
The operational amplifier operates when the voltage supplied is between VCC and VEE. Therefore, the single supply
operational amplifier can be used as dual supply operational amplifier as well.
15. IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.
16. The IC Destruction Caused by Capacitive Load
The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor.
When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output
capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.
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Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Package Name
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Physical Dimension, Tape and Reel Information
Package Name
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Package Name
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Physical Dimension, Tape and Reel Information
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Physical Dimension, Tape and Reel Information
Package Name
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Marking Diagrams
SOP8(TOP VIEW)
SOP-J8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SOP14(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
Product Name
BA4580Rxxx
BA4584FV
BA4584Rxx
Package Type
F
SOP8
FJ
SOP-J8
FVT
TSSOP-B8
FVM
MSOP8
FV
F
FV
SSOP-B14
SOP14
SSOP-B14
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4584R
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Datasheet
Land Pattern Data
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
PKG
Land pitch
e
Land space
MIE
SOP8
SOP14
1.27
4.60
1.10
0.76
SOP-J8
1.27
3.90
1.35
0.76
SSOP-B14
0.65
4.60
1.20
0.35
MSOP8
0.65
2.62
0.99
0.35
TSSOP-B8
0.65
4.60
1.20
0.35
SOP8, SOP14, SOP-J8, SSOP-B14,
MSOP8, TSSOP-B8
b2
e
MIE
ℓ2
Revision History
Date
Revision
27.Feb.2012
31.Oct.2014
20.Nov.2014
001
002
003
Changes
New Release
Page.3 Absolute Maximum Ratings : Added Input Current
Page.3 Absolute Maximum Ratings : Modified Input Current
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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