BA5912BFP

1/5 Structure Product Name Device Name Features : : : : Silicon Monolithic Integrated Circuit Power Driver For CD-ROM BA5912BFP • • • • • • • • Driver exclusively for the 2-ch BTL Use of an HSOP25PIN power package can achieve downsizing of the set. A wide dynamic range Using an external mute terminal, the output current can be muted. (CH1, CH2 independently muted.) Muting both 2CHs will lead to the standby mode. Three power supply systems provided.(PreVcc, CH1 PowVcc, CH2 PowVcc) Two built-in general OP-AMPs installed. A built-in thermal shutdown circuit installed. ABSOLUTE MAXIMUM RATINGS (Ta=25°C) Parameter Power Supply Voltage Power Dissipation Operating Temperature Range Storage Temperature Range Symbol Vcc Pd Topr Tstg Limits 13.5 1.45*1 -35 to 85 -55 to 150 Unit V W °C °C *1 When mounted on the glass/epoxy board with the size: 70 mm×70 mm, the thickness: 1.6 mm, and the rate of copper foil occupancy area: 3% or less. Over Ta=25°C, derating at the rate of 11.6mW/°C. RECOMMENDED OPERATING CONDITIONS (To determine a power supply voltage, the power dissipation must be taken into consideration.) Parameter Pre-stage Power Supply Voltage Power-stage Power Supply Voltage Symbol PreVcc PowVcc Limits 4.5 to 13.2 4.5 to PreVcc Unit V V This product has not been checked for the strategic materials (or service) defined in the Foreign Exchange and Foreign Trade Control Low of Japan so that a verification work is required before exporting it. Not designed for radiation resistance. REV. A 2/5 ELECTRIC CHARACTERISTICS (Ta=25°C, Pre, Pow Vcc=5V, BIAS=2.5V, RL=8Ω, unless otherwise noted.) The items except Maximum Output Amplitude and Standby Circuit Current have the constant limit values regardless of the voltage value of VREF. Parameter Consumption Current (at no signal) Standby Circuit Current Output Offset Voltage Maximum Output Amplitude 1 Maximum Output Amplitude 2 Closed Circuit Voltage Gain Mute ON Voltage Mute OFF Voltage Vref Switching Voltage 1 Vref Switching Voltage 2 Offset Voltage Input Bias Current High-level Output Voltage Low-level Output Voltage Output Driving Current Sink Output Driving Current Source Slew Rate VOFOP IBOP VOHOP VOLOP ISINK ISOURCE SROP -5 4.00 10 10 0 4.36 0.74 50 40 1 5 300 1.1 MV NA V V MA MA V/µs Vcc with 50Ω attached GND with 50Ω attached 100KHz square wave, 4VP-P output Voo VOM1 VOM2 Gvc VMON VMOFF VREF1 VREF2 -50 3.2 3.7 10.0 GND 2.0 GND 2.0 0 3.5 4.0 11.5 50 13.0 0.5 Vcc 0.5 Vcc MV V V DB V V V V Pre Vcc=Pow Vcc Pre Vcc > Pow Vcc+VF REF1,2 ≤ 0.5V Pre Vcc=12V, Pow Vcc=5V REF1,2 > 2.0V VIN=BIAS ± 0.5V Symbol Icc Iscc MIN. TYP 9.0 0 MAX. 14.0 100 Unit MA µA Condition when no load applied, REF1,2 ≥ 2.0V When no load applied, REF1,2 ≤ 0.5V OUTLINE DIMENSIONS, SYMBOLS Part Number (UNIT: mm) REV. A 3/5 APPLICATION CIRCUIT DIAGRAM When used at Pre Vcc > Pow Vcc + VF and in the standby mode, REF1 (PIN3) and REF2 (PIN12) must be set to open, or 0.5V or less. When used with REF1 (PIN3) and REF2 (PIN12) shorted; or MUTE1 (PIN2) and MUTE2 (PIN13) shorted, each microcomputer output must be able to supply a current of 300µA or so. PIN NUMBERS, PIN NAMES No. 1 2 3 4 5 6 7 8 9 10 11 12 13 Pin Name GND MUTE1 REF1 Pow Vcc1 OUT１OUT1+ GND OUT2+ OUT2Pow Vcc2 Pre Vcc REF2 MUTE2 Description Substrate GND CH1 mute terminal CH1Vref switching terminal Pow Vcc(CH1) CH1 negative output terminal CH1 positive output terminal Substrate GND CH2 positive output terminal CH2 negative output terminal Pow Vcc(CH2) Pre Vcc CH2Vref switching terminal CH2 mute terminal * The positive or negative polarity on an output terminal is determine by the input polarity. No. 14 15 16 17 18 19 20 21 22 23 24 25 Pin Name IN2’ IN2 OP1-OUT OP1-INOP-IN+ GND BIAS OP2-IN+ OP2-INOP2-OUT IN1 IN1’ Description CH2 input terminal for gain control CH2 input terminal with gain fixed Operational amplifier 1 output Operational amplifier 1- input Operational amplifier 1+ input Substrate GND Bias input terminal Operational amplifier 2+ input Operational amplifier 2- input Operational amplifier 2 output CH1 input terminal with gain fixed CH1 input terminal for gain control REV. A 4/5 CAUTIONS ON USE (1) When the mute terminal voltage (at pin 2 and pin 13) is set to open or dropped to 0.5V (typ.) or less, the output current (CH1, CH2) can be muted individually. Under conditions of normal use, the pin 2 and pin 13 should be pulled-up to 2.0V or above. Setting both mute terminals (pin 2 and pin 13) to open, or 0.5V or less will automatically enter the standby mode. (2) On the Bias terminal (pin 20), the applied voltage of 0.7V (typ.) or less will activate a mute function. Under conditions of normal use, It should be set to 1.0V or above. (3) When the power supply voltage drops to 3.5V (typ.) or less, the internal circuit will turn OFF and, when recovering to 4.0V (Typ.) or above, the internal circuit will startup. (4) Thermal shutdown (TSD), mute ON, bias terminal voltage drop, or power supply voltage drop will activate the mute function, where only the driver part can be muted. While muting, the voltage at the output terminal will equal to the internal bias voltage. (5) When Pre Vcc=Pow Vcc, the Vref switching terminal must be set to open or 0.5V or less (internal bias voltage=(Pow VCC - VF)/2); or, when Pre Vcc>Pow Vcc+VF, the Vref switching terminal must be pulled up to 2.0V or above (internal bias voltage=Pow VCC/2). (6) Even though a radiating fin is connected to the GND inside of the package, it must be connected to the external GND. (7) About absolute maximum ratings Exceeding the absolute maximum ratings, such as the applied voltage or the operating temperature range, may cause permanent device damage. As these cases cannot be limited to the broken short mode or the open mode, if a special mode where the absolute maximum ratings may be exceeded is assumed, it is recommended to take mechanical safety measures such as attaching fuses. (8) About power supply lines As a measure against the back current regenerated by a counter electromotive force of the motor, a capacitor to be used as a regenerated-current path can be installed between the power supply and GND and its capacitance value should be determined after careful check that any problems, for example, a leak capacitance of the electrolytic capacitor at low temperature, are not found in various characteristics. (9) About GND potential The electric potential of the GND terminal must be kept lowest in the circuitry at any operation states. (10) About thermal design With consideration of the power dissipation (Pd) under conditions of actual use, a thermal design provided with an enough margin should be done. (11) About operations in a strong electric field When used in a strong electric field, note that a malfunction may occur. (12) ASO When using this IC, the output Tr. must be set not to exceed the values specified in the absolute maximum ratings and ASO. (13) Thermal shutdown circuit This IC incorporates a thermal shutdown circuit (TSD circuit). When the chip temperature reaches the value shown below, the coil output to the motor will be set to open. The thermal shutdown circuit is designed only to shut off the IC from a thermal runaway and not intended to protect or guarantee the entire IC functions. Therefore, users cannot assume that the TSD circuit once activated can be used continuously in the subsequent operations. TSD ON Temperature [°C] (typ.) 175 Hysteresis Temperature [°C] (typ.) 25 (14) About earth wiring patterns When a small signal GND and a large current GND are provided, it is recommended that the large current GND pattern and the small signal GND pattern should be separated and grounded at a single point of the reference point of the set in order to prevent the voltage of the small signal GND from being affected by a voltage change caused by the resistance of the pattern wiring and the large current. Make sure that the GND wiring patterns of the external components will not change, too. REV. A 5/5 (15) This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other. This P layer and an N layer in each element form a PN junction to construct various parasitic elements. Due to the IC structure, the parasitic elements are inevitably created by the potential relationship. Activation of the parasitic elements can cause interference between circuits and may result in a malfunction or, consequently, a fatal damage. Therefore, make sure that the IC must not be used under conditions that may activate the parasitic elements, for example, applying the lower voltage than the ground level (GND, P substrate) to the input terminals. In addition, do not apply the voltage to input terminals without applying the power supply voltage to the IC. Also while applying the power supply voltage, the voltage of each input terminal must not be over the power supply voltage, or within the guaranteed values in the electric characteristics. REV. A Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2007 ROHM CO.,LTD. THE AMERICAS / EUPOPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0