BA6219B

Reversible Motor Drivers for Brush Motors 2.0A or More Reversible Motor Drivers (Single Motor) BA6219BFP-Y,BA6222 or No.11008EBT03 e N co ew m m D es en ig de ns d f ●Description These motor drivers are full bridge drivers for brush motor applications, supporting output currents of up to 2A. The output modes are available in four modes, normal, reverse, stop (idling), and braking in accordance with input logic (2 inputs). The output voltage can be optionally set by reference voltage setting pin. ●Features 1) Large output current (lOMAX=2.2A) 2) Built-in thermal shutdown circuit 3) Output voltage can be optionally set by reference voltage setting pin 4) High output voltage can be set by low voltage input because of it has 11.4dB gain (BA6222) 5) Low standby current ●Applications Audio-visual equipment; PC peripherals; Car audios; Car navigation systems; OA equipments ●Absolute maximum ratings (Ta=25℃, All voltages are with respect to ground) Ratings Parameter Symbol BA6219BFP-Y BA6222 Unit Supply voltage VCC1, VCC2 24 V Output current IOMAX 2.2*1 A All other input pins VIN TOPR R Operating temperature -0.3 ~ VCC1 Storage temperature ot Power dissipation Junction temperature -0.3 ~ VCC1+0.3 -25 ~ 75 V ℃ TSTG -55 ~ 150 -55 ~ 125 ℃ Pd 1.45*2 2.00*3 W Tjmax 150 125 ℃ N *1 Do not, exceed Pd or ASO (Pulse at 1/100 duty: 500µs). *2 HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/℃ above 25℃. *3 HSIP10 package. Derated at 20mW/℃ above 25℃. ●Operating conditions (Ta=25℃) Parameter Supply voltage Symbol Ratings Unit VCC1, VCC2 8 ~ 18 V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Electrical characteristics (BA6219BFP-Y, unless otherwise specified, Ta=25℃ and VCC1= VCC2= 12V) Limits Parameter Symbol Unit Conditions Min. Typ. Max. ICC1 - 1.2 2.5 mA Standby mode Supply current 2 ICC2 - 16 35 mA FWD/REV mode Supply current 3 ICC3 - 25 60 mA Brake mode Input threshold voltage H VIH 3.0 - VCC1 V Input threshold voltage L VIL 0 - 1.0 V VR bias current IVREF 0.6 1.2 2.4 mA RL=60Ω, VR=6.8V CD1 current ICD1 0.7 1.5 3.0 mA (IN1, IN2)=(H, L), CD1 -> GND CD2 current ICD2 0.7 1.5 3.0 mA (IN1, IN2)=(L, H), CD2 -> GND Output leak current IOL - - 1 mA (IN1, IN2)=(L, L), VCC2 current Output voltage H VOH 6.5 - - V RL=60Ω, VR=6.8V Output voltage L VOL - 1.2 V RL=60Ω, VR=6.8V e N co ew m m D es en ig de ns d f or Supply current 1 ●Electrical characteristics (BA6222, unless otherwise specified, Ta=25℃ and VCC1= VCC2= 12V) Limits Parameter Symbol Unit Conditions Min. Typ. Max. ICC1 - 1.2 2.5 mA Standby mode, VR=0V Supply current 2 ICC2 - 16 35 mA FWD/REV mode, VR=0V Supply current 3 ICC3 - 25 60 mA Brake mode, VR=0V Input threshold voltage H VIH 3.0 - VCC1 V Input threshold voltage L VIL 0 - 1.0 V IVREF - 1.2 5.0 µA = VR 1.0V GV 10.35 11.35 12.35 dB (IN1, IN2)=(H, L) or (L, H), IOUT=0.1A*1 CD1 current ICD1 0.7 1.5 3.0 mA (IN1, IN2)=(H, L), CD1 -> GND CD2 current ICD2 0.7 1.5 3.0 mA (IN1, IN2)=(L, H), CD2 -> GND Output leak current IOL - - 1 mA (IN1, IN2)=(L, L), VCC2 current Output voltage H VOH 9.5 - - V IOUT=0.1A, VR=5V Output voltage L VOL - 0.5 V IOUT=0.1A, VR=5V R Supply current 1 VR bias current N ot VR-OUT trans. gain *1 Vout1 = VOH-VOL @VR=1V Vout2 = VOH-VOL @VR=2V These voltages are stabilized value without any heat radiation board. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/10 GV = 20 log Vout2 – Vout1 2V – 1V 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Electrical characteristic curves (Reference data) 1.0 0.5 20 15 10 8 10 12 14 16 18 10 14 16 18 8 Fig.2 Supply current 2 (reverse) (BA6219BFP-Y) 12 Supply Current: Icc3 [mA]_ Stand-by Current: Icc2 [mA]_ 20 15 14 16 18 10 0 R 6.5 6.0 12 14 16 0.5 1 20 18 8 -25°C 25°C 75°C 1.5 10 10.0 9.5 0.5 Output Current: Iout [A] ot 16 1 18 2.5 2.0 1.5 1.0 75°C 25°C -25°C 0.5 0.0 0 1.5 2 0 0.5 1 1.5 2 Output Current: Iout [A] Output Current: Iout [A] Fig.8 Output high voltage (BA6222) Fig.9 Output low voltage (BA6219BFP-Y) 3 N 14 Fig.6 Supply current 3 (brake) (BA6222) 9.0 Fig.7 Output high voltage (BA6219BFP-Y) 12 3.0 75°C 25°C -25°C 10.5 2 3.0 -25°C 25°C 75°C Supply Voltage: Vcc [V] Fig.5 Supply current 2 (reverse) (BA6222) 11.0 7.0 18 30 Supply Voltage: Vcc [V] Output High Voltage: VOH [V] _ 7.5 16 10 8 Fig.4 Supply current 1 (standby) (BA6222) 75°C 25°C -25°C 14 40 -25°C 25°C 75°C Supply Voltage: Vcc [V] 8.0 12 Fig.3 Supply current 3 (brake) (BA6219BFP-Y) Output Low Voltage: VOL [V]_ 10 10 Supply Voltage: Vcc [V] 10 8 -25°C 25°C 75°C e N co ew m m D es en ig de ns d f 3 i) Without heat sink ii) Mounted on ROHM standard PCB 2.5 (70mm x 70mm x 1.6mm FR4 glas s-epox y board) i) 2.0W i) Package only 2 2 Pd [W] 2.0 1.5 1.0 Pd [W] Circuit Current: Icc1 [mA] _ 1.0 0.5 Output High Voltage: VOH [V] _ 12 25 -25°C 25°C 75°C 1.5 20 Supply Voltage: Vcc [V] Fig.1 Supply current 1 (standby) (BA6219BFP-Y) 2.0 30 10 8 Supply Voltage: Vcc [V] Output Low Voltage: VOL [V]_ Supply Current: Icc3 [mA]_ 1.5 40 -25°C 25°C 75°C or 25 -25°C 25°C 75°C Stand-by Current: Icc2 [mA]_ Circuit Current: Icc1 [mA] _ 2.0 ii)1.45W 1 75°C 25°C -25°C 0.5 0.0 0 0.5 1 1.5 1 i)0.85W 2 Output Current: Iout [A] Fig.10 Output low voltage (BA6222) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 0 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [°C] Fig.11 Thermal derating curve (HSOP25) 3/10 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [°C] Fig.12 Thermal derating curve (HSIP10) 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Block diagram and pin configuration BA6219BFP-Y 11 TSD IN1 24 6 CTRL IN2 15 8 19 20 FIN GND 7 VR 4 CD2 13 2 C3 Table 1 BA6219BFP-Y VCC1 VCC2 R1 C1 OUT1 OUT2 M C4 GND GND CD1 C2 Name Function 2 CD1 Cross conduction control pin 4 VR Reference voltage setting pin 6 IN1 Control input (forward) 7 GND 8 IN2 GND Control input (reverse) e N co ew m m D es en ig de ns d f ZD Pin or 10 10 VCC1 Power supply (small signal) 11 VCC2 Power supply (driver stage) 13 CD2 Cross conduction control pin 15 OUT2 Driver output 19 GND GND GND 20 GND GND GND NC NC NC OUT2 NC 24 OUT1 Driver output FIN GND GND Fig.13 BA6219BFP-Y NC OUT1 NC NC NC GND NC CD1 NC VR NC IN1 GND GND IN2 NC VCC1 VCC2 NC CD2 Note: All pins not described above are NC pins. Fig.14 HSOP25 BA6222 7 8 TSD IN1 CTRL IN2 2 x4 5 10 x4 6 R 1 FIN VR 4 CD2 C5 9 3 C3 Table 2 BA6222 VCC1 VCC2 R1 C1 OUT1 OUT2 M C4 GND CD1 C2 ot ZD Name 1 GND GND 2 OUT1 Driver output 3 CD1 Cross conduction control pin 4 VR Reference voltage setting pin 5 IN1 Control input (forward) 6 IN2 Control input (reverse) 7 VCC1 Power supply (small signal) 8 VCC2 Power supply (driver stage) 9 CD2 Cross conduction control pin 10 OUT2 Driver output FIN GND GND Function OUT2 CD2 VCC2 VCC1 IN2 VR IN1 CD1 GND OUT1 N Fig.15 BA6222 Pin Fig.16 HSIP10 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●External application components Resistor for the current limitation, R1 This is a current limiting resistor for collector loss reduction and at the time of short-circuited output. It depends on the power supply voltage used, etc., but choose resistance of about 5 to 10Ω. In addition, set resistance with utmost care to voltage drop caused by inrush current that flows when the motor is started. 2) Zener diode for the output high voltage setting, ZD This is the zener diode used when output high voltage (VR pin voltage) is set. BA6219BFP-Y: Output high voltage ≈ zener voltage BA6222: Output high voltage ≈ fourfold zener voltage 3) Stabilization capacitor for the power supply line, C1 Please connect the capacitor of 1μF to 100μF for the stabilization of the power supply line, and confirm the motor operation. 4) Capacitors for the cross conduction control of output transistors, C2 and C3 Simultaneous ON is prevented by delaying base potential buildup of transistors which enter output high state. Set the capacitors from 0.01μF to 1μF and make sure inrush current caused by simultaneous output ON does not flow when output mode is switched. 5) Phase compensating capacitor, C4 Noise is generated in output pins or oscillation results in accord with the set mounting state such as power supply circuit, motor characteristics, PCB pattern artwork, etc. As noise oscillation measures, connect 0.01μF to 0.1μF capacitors. 6) Phase compensating capacitor, C5 (BA6222 only) The gain about fourfold VR pin voltage in output high voltage is set, and the output oscillates easily. Please connect the capacitor of 3300pF to 0.1µF as an oscillation prevention measures when the oscillation is seen in the output voltage. e N co ew m m D es en ig de ns d f or 1) ●Functional descriptions 1) Operation modes Table 3 Logic table IN1 L H L H IN2 OUT1 OUT2 Operation L OPEN* OPEN* L H L Forward (OUT1 > OUT2) H L H Reverse (OUT1 < OUT2) H L L Brake (stop) Stop (idling) R *OPEN is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. Stand-by mode In stand-by mode, all output power transistors are turned off, and the motor output goes to high impedance. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. N ot a) d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 Output high voltage setting This function optionally sets output voltage by the output high voltage setting pin and controls the motor rotating speed. However, when the output high voltage is set to a low level, consumption at IC increases. Carry out thermal design with sufficient margin incorporated with the power dissipation (Pd) under the actual application condition taken into account. BA6219BFP-Y The circuit diagram associated with the output high voltage setting VR pin is as per shown on the right. The maximum output voltage VOMAX is expressed by: VCC1 Q1 Q2 VCC2 Q3 VOMAX = VCC1 - ( VSAT(Q1) + VF(Q2) + VF(Q3) + VF(Q4) ) Q5 Q6 In addition, the relation of VR voltage to output voltage at VOMAX or lower is expressed by: Q7 Q4 or a) OUT VR e N co ew m m D es en ig de ns d f 2) VOH = VR + ( VF(Q5) + VF(Q6) + VF(Q7) ) - ( VF(Q2) + VF(Q3) + VF(Q4) ) VOH = VR + ΔVF ≈ VR Fig. 17 ΔVF depends on the output current but is nearly VOH=VR. (Reference values; VSAT ≈ 0.25V, VF ≈ 0.75V) b) BA6222 As the relationship between the output high voltage setting pin VR voltage and output high voltage VOH is expressed by: VOH VCC1 - 3VF - VSAT BA6222 VOH ≈ 4 x VR + VOFS In such event, VOFS means the offset voltage, which varies in accord with output current and chip temperature. The VR voltage region can be classified into three categories in accord with the output state: (A) Output high voltage 0V offset region (B) Fourfold gain region (C) Output voltage saturated region (A) BA6219BFP-Y (B) (C) VR Fig. 18 Using this function with the VR pin connected to a load which has output impedance of several hundred ohms may result in oscillation. In such event, connect a capacitor of 3300pF or higher to about 0.1μF across VR and GND and make sure that the motor is free of oscillation. c) Power supply voltage range of VR voltage When output voltage control pin (VR) is used: VOH R VR < VCC1 - ( VSAT(Q1) + VF(Q5) + VF(Q6) + VF(Q7) ) VR ≈ VCC1 - 2.5V VR < VCC2 - ( VSAT(Q3) - VF(Q3) - VF(Q2) ) - ( VF(Q5) + VF(Q6) + VF(Q7) ) VR ≈ VCC2 - 1V The output voltage control function does not operate in the region outside this range. In addition, when the VR pin is not used, use by shorting VR to VCC1. Control range Saturation range VR Fig. 19 Switching of rotating direction (FWD/REV) When the rotating direction is changed over by the motor rotating condition, switch the direction after the motor is temporarily brought to the BRAKE condition or OPEN condition. It is recommended to keep the relevant conditions as follows: via BRAKE: Longer than braking time*. ot N 3) (* the time required for the output L terminal to achieve potential below GND when brake is activated.) via OPEN: The time longer than 1 ms is recommended. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Interfaces IN1 IN2 20k 10k VR 10k Fig. 20 IN1, IN2 (BA6219BFP-Y, BA6222) Fig.21 VR (BA6222) or 10k VCC2 e N co ew m m D es en ig de ns d f VCC1 CD1 CD2 OUT1 OUT2 VR GND Fig. 22 VCC1, VCC2, VR, CD1, CD2, GND (BA6219BFP-Y) VCC2 VCC1 CD1 CD2 OUT2 GND Fig. 23 VCC1, VCC2, CD1, CD2, GND (BA6222) N ot R OUT1 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Notes for use Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. N ot R e N co ew m m D es en ig de ns d f or 1) 10) BA6219BFP-Y BA6222 TON [℃] 180 150 THYS [℃] 15 15 *All temperature values are typical. Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1μF between output and GND. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. e N co ew m m D es en ig de ns d f or 11) Transistor (NPN) Resistor Pin A Pin B C Pin B B Pin A E B N P+ N P+ P N Parasitic element N P+ N P GND N P substrate P substrate Parasitic element P + Parasitic element GND E Parasitic GND element Other adjacent elements N ot R Appendix: Example of monolithic IC structure GND C www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/10 2011.05 - Rev.B Technical Note BA6219BFP-Y,BA6222 ●Ordering part number 6 A Part No. 2 1 9 B F Part No. 6219B 6222 P - Y Package FP-Y: HSOP25 None: HSIP10 13.6 ± 0.2 2.75 ± 0.1 Tape Embossed carrier tape Quantity 2000pcs 14 E2 0.3Min. e N co ew m m D es en ig de ns d f 5.4 ± 0.2 7.8 ± 0.3 25 2 Packaging and forming specification E2: Embossed tape and reel None: Tube HSOP25 (MAX 13.95 include BURR) E or B 1 13 1.95 ± 0.1 Direction of feed ( reel on the left hand and you pull out the tape on the right hand The direction is the 1pin of product is at the upper left when you hold ) 0.25 ± 0.1 0.11 1.9 ± 0.1 S 0.1 S 0.8 0.36 ± 0.1 12.0 ± 0.2 Reel (Unit : mm) HSIP10 1pin Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 26.5±0.3 3.6±0.2 25±0.2 Container Tube Quantity 500pcs Direction of feed Direction of products is fixed in a container tube 8.4±0.3 16.2±0.2 1.6 6.4±0.5 27.0±0.5 1.2 R1.6 1 10 2.54 0.6 0.8 1.3 0.5±0.1 (Unit : mm) N ot R ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/10 2011.05 - Rev.B Datasheet Notice Precaution on using ROHM Products Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. or 1. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. 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If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. ot R 2. N e N co ew m m D es en ig de ns d f (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic or 1. e N co ew m m D es en ig de ns d f This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. 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Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. All information and data including but not limited to application example contained in this document is for reference only. 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Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. N ot R e N co ew m m D es en ig de ns d f or 3. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001