BA6424AFS-E2

Datasheet DC Brushless Fan Motor Driver Standard Single-phase Full wave Fan Motor Driver BA6424AFS ●General Description This is the summary of application for BA6424AFS. BA6424AFS incorporates lock protection and automatic restart circuit. ●Features
Lock protection and auto restart
Rotating speed pulse signal (FG) output
Lock alarm signal (AL) output ●Package(s) SSOP-A16 W(Typ.) x D(Typ.) x H(Max.) 6.60mm x 6.20mm x 1.71m ●Applications
General consumer electronics, BD player, DVR, STB
Office equipment, Copier, FAX Laser Printer etc. SSOP-A16 ●Absolute maximum ratings Symbol Ratings Unit Supply voltage Vcc 30 V Power dissipation Pd 812.5* mW Operation temperature Topr -40 to +100 ℃ Storage temperature Tstg -55 to +150 ℃ Output current Iomax 1.0** A Output voltage Vout 30 V FG signal output voltage Vfg 30 V AL signal output voltage Val 30 V Tjmax 150 ℃ Parameter Junction temperature * ** Reduce by 6.5mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) This value is not to exceed Pd. ●Operating Conditions Parameter Symbol Ratings Unit Operating supply voltage range Vcc 6.0 to 28.0 V Hall input voltage range Vh 2.5 to Vcc V ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays .www.rohm.com TSZ02201-0H1H0B100240-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/10 TSZ22111・14・001 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Electrical characteristics (Unless otherwise specified Ta=25℃,Vcc=12V) Limits Parameter Symbol Min. Typ. Max. Unit Conditions Characteristics Fig.1 Circuit current Icc 2.7 5.4 8.1 mA At output OFF Charge current of capacitor for lock detection Ildc 1.55 3.10 4.65 μA Vld=1.8V - Discharge current of capacitor for lock detection Ildd 0.33 0.66 0.99 μA Vld=1.8V - Charge-discharge current ratio of capacitor for lock detection rcd 3.0 4.7 6.4 - rcd=Ildc/Ildd - Clamp voltage of capacitor for lock detection Vldcl 2.00 2.48 3.00 V - Charge current of capacitor for lock detection Vldcp 0.70 0.99 1.30 V - Output L voltage Vol - 0.8 1.2 V Io=200mA Fig.2 Output H voltage Voh - 0.9 1.4 V Io=-200mA Voltage between output and Vcc Fig.3 FG output L voltage Vfgl - 0.1 0.3 V Ifg=10mA Fig.4 FG output leak current Ifgl - 0 10 μA Vfg=30V - AL output L voltage Vall - 0.1 0.3 V Ial=10mA Fig.4 AL output leak current Iall - 0 10 μA Val=30V - Vofs -20 0 20 mV - Vfgofs -45 -25 -5 mV - Hall input - output offset voltage Hall input - FG offset voltage ●Reference Data 2 7 0 -25℃ 6 4 100℃ 3 2 1.5 Output H voltage, Voh [V] Output L voltage, Vol [V] Circuit current, Icc [ mA] 25℃ 5 6V 12V 1 28V 0.5 -0.5 28V -1 12V 6V -1.5 Operating Voltage Range 1 -2 0 0 0 6 12 18 24 0 30 0.2 Supply voltage, Vcc [V] 0.6 0.8 0 1 12V 0.05 6V Collector-emitter current, Ice[A] Collector-emitter current, Ice[A] 28V 0.1 1.0 0 2 4 6 8 10 AL current, Ial [mA] Fig.4 FG/AL output L voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.8 1 1.0 0.1 0.1 0 0.6 10.0 10.0 0.15 0.4 Fig.3 Output H voltage Fig.2 Output L voltage 0.2 0.2 Output Current, Io [A] Output Current, Io [ A] Fig.1 Circuit current AL low voltage, Vall [V] 0.4 0.1 1.0 10.0 100.0 Collector-emitter voltage, Vce[V] Fig.5 Output Tr ASO（upper） (TON=100msec) 2/10 0.1 1.0 10.0 100.0 Collector-emitter voltage, Vce[V] Fig.6 Output Tr ASO（lower） (TON=100msec) TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Block diagram, application circuit, and pin assignment (Constant etc are for reference) Capacitor for setting lock detect ing and aut o res tart time LD P. 4 REG 7 0.47μF to 4.7μF + - + Take a measure agains t Vcc voltage rise generated by rev ers e connection of current and count er electromot ive force. REG AL LOCK DETECTI ON AN D AUTO RESTART 6 1 G ND Vcc AMP 4 P.6 HALL H+ 9 2kΩ to 10kΩ HALL AMP + LOGIC - 3 M P.7 14 O UT1 H10 T his is an open collector output. Connect a pull-up resistor. O UT2 AMP TSD Set acc ording to the amplit ude of hall element output and hall input voltage range. FG 5 P.4 Function PIN No. Terminal name 1 GND 2 N.C. 3 OUT2 Motor output terminal2 4 Vcc Power supply terminal 5 FG Rotating speed pulse signal output terminal 6 AL Lock alarm signal output terminal 7 LD Lock detection and auto restart capacitor connecting terminal 8 N.C. 9 H+ Hall input terminal+ 10 H- Hall input terminal- 11 N.C. 12 N.C. 13 N.C. 14 OUT1 15 N.C. 16 N.C. GND terminal Motor output terminal1 ●Truth table H+ H- OUT1 OUT2 FG H L H L H L H L H L www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/10 AL : normal operation :L(output is ON) lock detection :H(output is OFF) TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Description of operations 1) Lock protection and automatic restart Lock detection ON time (Ton) and lock detection OFF time (Toff) is set by charging and discharging of external capacitor of LD terminal. C･(Vldcl-Vldcp) Ton (Lock detection ON time) = C : Capacity of capacitor equipped externally on LD terminal Vldcl : LD terminal clamping voltage Vldcp : LD terminal comparator voltage Ildc : LD terminal charging current Ildd : LD terminal discharging current Ildc C･(Vldcl-Vldcp) Toff (Lock detection OFF time) = Ildd HOutputTr OFF OUT1 Tofff Output Tr ON Ton LD terminal clamping voltage LD LD terminal comparator voltage HIGH (open collector) AL FG Motor locking Lock detection Lock release Returns normal operation Fig.7 Lock protection timing chart *BA6424AFS returns normal operation by the input of hall signal during Toff. 2) Hall input setting Hall input voltage range is shown in operating conditions. Hall input voltage range Vcc Hall input voltage range upper limit Hall input voltage range lower limit GND Fig.8 Hall input voltage range Adjust the value of hall element bias resistor R1 in Fig.9 so that the input voltage of a hall amplifier is input in "hall input voltage range" including signal amplitude. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ○Reducing the noise of hall signal Hall element may be affected by Vcc noise or the like depending on the wiring pattern of board. In this case, place a capacitor like C1 in Fig.9. In addition, when wiring from the hall element output to IC hall input is long, noise may be loaded on wiring. In this case, place a capacitor like C2 in Fig.9. H- H+ Vcc C2 C1 RH Hall bias current Hall element R1 = Vcc / (RH+R1 ) Fig.9 Application near hall signal ＊This IC doesn’t have hall input hysteresis. Note the hall input so that the FG signal do not chatter by the noise of the hall signal. ●Equivalent circuit 1) Hall input terminal 2) Motor output terminal Vcc Vcc H+ H- OUT1 OUT2 GND 3) Lock detection and automatic restart capacitor connecting terminal 4) FG/AL signal output terminal FG or AL Vcc LD GND www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Safety measure 1) Reverse connection protection diode Reverse connection of power results in IC destruction as shown in Fig.10. When reverse connection is possible, reverse connection protection diode must be added between power supply and Vcc. In normal energization Reverse power connection Vcc After reverse connection destruction prevention Vcc Vcc Circuit block Each pin GND Internal circuit impedance high  amperage small Circuit block Each pin Circuit block GND Large current flows  Thermal destruction Each pin GND No destruction Fig.10 Flow of current when power is connected reversely 2) Measure against Vcc voltage rise by back electromotive force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, Vcc voltage rises because the diode prevents current flow to power supply. ON ON ON Phase switching ON Fig.11 Vcc voltage rise by back electromotive force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zener diode between Vcc and GND. If necessary, add both (C). (B) Zener diode (A) Capacitor ON ON ON ON (C) Capacitor and zener diode ON ON Fig.12 Measure against Vcc voltage rise www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS 3) Problem of GND line PWM switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. Vcc Motor Driver M GND Controller PWM input Prohibited Fig.13 GND Line PWM switching prohibited 4) FG and AL output FG and AL output is an open collector and requires pull-up resistor. The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when FG or AL output terminal is directly connected to power supply, could damage the IC. Vcc FG/AL Pull-up resistor Protection resistor R1 Connector of board Fig.14 Protection of FG and AL terminal Vcc ●Calculation of power consumed by IC Icc Power consumed by this IC Pc is approximately calculated as follows: AL IAL Pc=Pc1+Pc2+Pc3 ・Pc1：Power consumption by circuit current Pc1=Vcc×Icc OUT1 ・Pc2：Power consumption at output stage Pc2=VOL×Io+VOH×Io VOL is L voltage of output terminal 1 and 2. VOH is H voltage of output terminal 1 and 2. Io is the current flowing to output terminal 1 and 2. ・Pc3：Power consumption at AL Pc3=VAL×IAL VAL is L voltage of AL output. IAL is the current of AL. Io OUT2 Fig.15 Calculation of power consumed by IC Power consumption by IC greatly changes with use condition of IC such as power supply voltage and output current. Consider thermal design so that the maximum power dissipation on IC package is not exceeded. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Thermal derating curve Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.16 shows the model of heat resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the equation below: θja ＝ (Tj - Ta) / P [℃/W] Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at a specified condition. Fig.17 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70 [mm] x 1.6 [mm] (copper foil area below 3 [%])) θja = (Tj - Ta) / P [℃/W] Ambient temperature Ta[℃] Chip surface temperature Tj[℃] Power consumption P[W] Fig.16 Thermal resistance Pd(mW) 1000 812.5 800 600 400 200 0 25 50 75 100 125 150 Ta(℃) *Reduce by 6.5 mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board) Fig.17 Thermal derating curve www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Cautions on use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum ratings. Because the cause of this damage cannot be identified as a short circuit or an open circuit, if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.. 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. Power supply line Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low temperatures) GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions, except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO. Thermal shut down circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. GND wiring pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. Capacitor between output and GND When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND below 100uF. IC terminal input When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic element is actuated. In use We are sure that the example of application circuit is preferable, but please check the character further more in application to a part which requires high precision. In using the unit with external circuit constant changed, consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/10 TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet BA6424AFS ●Physical Dimension SSOP-A16 6.6 ± 0.2 (MAX 6.95 include BURR) Tape Embossed carrier tape Quantity 2500pcs 9 6 4 24 A FS Direction of feed 0.3MIN 4.4±0.2 6.2±0.3 16 15 14 13 12 11 10 1 2 3 4 5 6 7 0.11 1.5±0.1 0.1 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) Lot No. 8 1PIN MARK 0.8 E2 0.15 ± 0.1 0.36 ± 0.1 1pin Reel (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/10 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0H1H0B100240-1-2 19.Jul.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. 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The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001