78 Series Regulators
1A Output 78 series Regulators
500mA Output 78 series Regulators
BA78□□Series,BA78M□□Series
No.12019ECT01
●Description
BA78□□, BA78M□□ series are three-terminal regulators available with several fixed output voltages. It supplies the
stable fixes voltage from unstable direct input voltage. The useful output voltage lineup is 5V, 6V, 7V, 8V, 9V, 10V, 12V, 15V,
18V, 20V, 24V with 0.5A / 1A current ability. They have nearly same electric characteristics as competitor products and cover
a wide range of application.
●Features
1) Built-in over-current protection circuit and thermal shutdown circuit
2) High ripple rejection
3) Available TO220CP-3, TO252-3 package to a wide range application
4) Compatible replacement to competitor products
5) Various voltage lineup (5V, 6V, 7V, 8V, 9V, 10V, 12V, 15V, 18V, 20V, 24V)
●Applications
Fixed voltage power supply for TV, Audio components, etc
●Line up
■1A BA78□□Series
Part Number
5V
BA78□□CP
○
BA78□□FP
○
6V
○
○
7V
○
○
8V
○
○
9V
○
○
10V
○
○
12V
○
○
15V
○
○
18V
○
○
20V
○
○
24V
○
○
Package
TO220CP-3
TO252-3
■0.5A BA78M□□Series
Part Number
5V
6V
BA78M□□CP
○
○
BA78M□□FP
○
○
7V
○
○
8V
○
○
9V
○
○
10V
○
○
12V
○
○
15V
○
○
18V
○
○
20V
○
○
24V
○
○
Package
TO220CP-3
TO252-3
●Output Voltage and Marking
Part Number:BA78□□□□
a
b
Symbol
a
(1A)
Part Number:BA78M□□□□
a
b
assignment of output voltage
□□
05
06
07
08
09
10
b
Symbol
Output voltage(V) □□ Output voltage(V)
5.0V typ.
12
12V typ.
6.0V typ.
15
15V typ.
7.0V typ.
18
18V typ.
8.0V typ.
20
20V typ.
9.0V typ.
24
24V typ.
10.0V typ.
Package
CP:TO220CP-3
FP:TO252-3
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© 2012 ROHM Co., Ltd. All rights reserved.
1/12
a
b
(0.5A)
assignment of output voltage
□□ Output voltage(V) □□
05
5.0V typ.
12
06
6.0V typ.
15
07
7.0V typ.
18
08
8.0V typ.
20
09
9.0V typ.
24
10
10.0V typ.
Package
CP:TO220CP-3
FP:TO252-3
Output voltage(V)
12V typ.
15V typ.
18V typ.
20V typ.
24V typ.
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Absolute Maximum Rating (Ta=25℃)
BA78□□CP/FP, BA78M□□CP/FP
Parameter
Power supply voltage
TO220CP-3
Power Dissipation 1
TO252-3
TO220CP-3
Power Dissipation 2
TO252-3
BA78□□
Output Current
BA78□□M
Operating Temperature Range
Storage Temperature Range
Operating Junction Temperature Range
Symbol
Vin
Limits
35
2 *1
1 *1
*2
22
10 *2
1 *3
0.5 *3
-40~+85
-55~+150
-40~+150
Pd1
Pd2
Io
Topr
Tstg
Tj
Unit
V
W
W
A
℃
℃
℃
*1 Derating in done 16mW/℃(TO220CP-3), 8mW/℃(TO252-3) for temperatures above Ta=25℃
*2 Derating in done 176mW/℃(TO220CP-3), 80mW/℃(TO252-3) for temperatures above Ta=25℃, Mounted on infinity Alminium heat sink.
*3 Pd,ASO and Tjmax(150℃) should not be exceeded.
●Operating Conditions(Ta=25℃, Pd should not be exceeded)
BA78□□CP/FP
Parameter
Symbol
Min.
Max.
Unit.
BA7805
7.5
25
BA7806
8.5
21
BA7807
9.5
22
BA7808
10.5
23
BA7809
11.5
26
Input
BA7810
12.5
25
Vin
V
Voltage
BA7812
14.5
27
BA7815
17.5
30
BA7818
21
33
BA7820
23
33
BA7824
27
33
Output Current
Io
1
A
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© 2012 ROHM Co., Ltd. All rights reserved.
2/12
BA78M□□CP/FP
Parameter
BA78M05
BA78M06
BA78M07
BA78M08
BA78M09
Input
BA78M10
Voltage
BA78M12
BA78M15
BA78M18
BA78M20
BA78M24
Output Current
Symbol
Vin
Io
Min.
7.5
8.5
9.5
10.5
11.5
12.5
14.5
17.5
21
23
27
-
Max.
25
21
22
23
26
25
27
30
33
33
33
0.5
Unit.
V
A
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Electrical Characteristics
BA78M□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24), Io=350mA unless otherwise specified)
Parameter
Output Voltage 1
Symbol
Vo1
Output Voltage 2
Vo2
Line Regulation 1
Reg.I1
Line Regulation 2
Reg.I2
Ripple Rejection
R.R.
Temperature
Coefficient of
Output Voltage
Tcvo
Peak Output Current
Dropout Voltage
Io-p
Vd
Type
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06/07/08/09/10/12
15/18
20/24
common
common
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© 2012 ROHM Co., Ltd. All rights reserved.
Min
4.8
5.75
6.7
7.7
8.6
9.6
11.5
14.4
17.3
19.2
23.0
4.75
5.7
6.65
7.6
8.55
9.5
11.4
14.25
17.1
19.0
22.8
62
60
57
56
56
56
55
54
53
53
50
-
3/12
Limit
Typ
5.0
6.0
7.0
8.0
9.0
10.0
12.0
15.0
18.0
20.0
24.0
3
3
4
4
4
5
5
6
7
8
10
1
1
1
1
2
2
3
3
3
4
5
78
74
71
69
67
66
63
60
58
58
55
-1.0
-0.5
-0.6
-0.7
875
2.0
Max
5.2
6.25
7.3
8.3
9.4
10.4
12.5
15.6
18.7
20.8
25.0
5.25
6.3
7.35
8.4
9.45
10.5
12.6
15.75
18.9
21.0
25.2
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
50
50
50
50
50
50
50
-
Unit
V
V
mV
mV
dB
mV/℃
mA
V
Condition
Io=350mA
Vin=7.5~20V, Io=5mA~350mA
Vin=8.5~21V, Io=5mA~350mA
Vin=9.5~22V, Io=5mA~350mA
Vin=10.5~23V, Io=5mA~350mA
Vin=11.5~24V, Io=5mA~350mA
Vin=12.5~25V, Io=5mA~350mA
Vin=15~27V, Io=5mA~350mA
Vin=17.5~30V, Io=5mA~350mA
Vin=21~33V, Io=5mA~350mA
Vin=23~33V, Io=5mA~350mA
Vin=27~33V, Io=5mA~350mA
Vin=7~25V, Io=200mA
Vin=8~25V, Io=200mA
Vin=9~25V, Io=200mA
Vin=10.5~25V, Io=200mA
Vin=11.5~26V, Io=200mA
Vin=12.5~28V, Io=200mA
Vin=14.5~30V, Io=200mA
Vin=17.5~30V, Io=200mA
Vin=21~33V, Io=200mA
Vin=23~33V, Io=200mA
Vin=27~33V, Io=200mA
Vin=8~12V, Io=200mA
Vin=9~25V, Io=200mA
Vin=10~25V, Io=200mA
Vin=11~25V, Io=200mA
Vin=12~25V, Io=200mA
Vin=14~26V, Io=200mA
Vin=16~30V, Io=200mA
Vin=20~30V, Io=200mA
Vin=24~33V, Io=200mA
Vin=24~33V, Io=200mA
Vin=28~33V, Io=200mA
ein=1Vrms, f=120Hz, Io=100mA
Io=5mA, Tj=0~125℃
Tj=25℃
Io=500mA
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Electrical Characteristics
BA78M□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io=350mA unless otherwise specified)
Parameter
Symbol
Load Regulation 1
Reg.L1
Load Regulation 2
Reg.L2
Output Noise
Voltage
Vn
Bias Current
Bias Current Change1
Ib
Ib1
Bias Current Change 2
Ib2
Short-Circuit
Output Current
Ios
Output Resistance
Ro
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© 2012 ROHM Co., Ltd. All rights reserved.
Type
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
common
common
05
06
07
08
09
10
12
15
18
20
24
05/06/07/08
09/10/12/15/18/20/24
05
06
07
08
09
10
12
15
18
20
24
Min
-
4/12
Limit
Typ
20
20
20
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
10
10
10
10
40
60
70
80
90
100
110
130
140
150
170
4.5
0.4
0.17
9
10
11
12
13
14
16
19
22
25
37
Max
100
120
140
160
180
200
240
300
360
400
480
50
60
70
80
90
100
120
150
180
200
240
6.0
0.5
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
-
Unit
Condition
mV
Io=5mA~500mA
mV
Io=5mA~200mA
µV
f=10Hz~100kHz
mA
mA
Io=0mA
Io=5mA~350mA
Vin:8~25V, Io=200mA
Vin:9~25V, Io=200mA
Vin:10~25V, Io=200mA
Vin:10.5~25V, Io=200mA
Vin:12~25V, Io=200mA
Vin:13~25V, Io=200mA
Vin:14.5~30V, Io=200mA
Vin:17.5~30V, Io=200mA
Vin:21~33V, Io=200mA
Vin:23~33V, Io=200mA
Vin:27~33V, Io=200mA
Vin=25V
Vin=30V
mA
A
mΩ
f=1kHz
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Electrical Characteristics
BA78□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io=500mA unless otherwise specified)
Parameter
Output Voltage 1
Symbol
Vo1
Output Voltage 2
Vo2
Line Regulation 1
Reg.I1
Line Regulation 2
Reg.I2
Ripple Rejection
R.R.
Temperature
Coefficient of
Output Voltage
Tcvo
Peak Output Current
Dropout Voltage
Io-p
Vd
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
Type
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06/07/08/09/10/12
15/18
20/24
common
common
Min
4.8
5.75
6.7
7.7
8.6
9.6
11.5
14.4
17.3
19.2
23.0
4.75
5.7
6.65
7.6
8.55
9.5
11.4
14.25
17.1
19.0
22.8
62
59
57
56
56
55
55
54
53
53
50
-
5/12
Limit
Typ
5.0
6.0
7.0
8.0
9.0
10.0
12.0
15.0
18.0
20.0
24.0
3
4
5
5
6
7
8
9
10
12
15
1
2
2
3
4
4
5
5
5
7
10
78
73
69
65
64
64
63
62
61
60
58
-1.0
-0.5
-0.6
-0.7
1.7
2.0
Max
5.2
6.25
7.3
8.3
9.4
10.4
12.5
15.6
18.7
20.8
25.0
5.25
6.3
7.35
8.4
9.45
10.5
12.6
15.75
18.9
21.0
25.2
100
120
140
160
180
200
240
300
360
400
480
50
60
70
80
90
100
120
150
180
200
240
-
Unit
V
V
mV
mV
Condition
Io=500mA
Vin=7.5~20V, Io=5mA~1A
Vin=8.5~21V, Io=5mA~1A
Vin=9.5~22V, Io=5mA~1A
Vin=10.5~23V, Io=5mA~1A
Vin=11.5~26V, Io=5mA~1A
Vin=12.5~25V, Io=5mA~1A
Vin=15~27V, Io=5mA~1A
Vin=17.5~30V, Io=5mA~1A
Vin=21~33V, Io=5mA~1A
Vin=23~33V, Io=5mA~1A
Vin=27~33V, Io=5mA~1A
Vin=7~25V, Io=500mA
Vin=8~25V, Io=500mA
Vin=9~25V, Io=500mA
Vin=10.5~25V, Io=500mA
Vin=11.5~26V, Io=500mA
Vin=12.5~27V, Io=500mA
Vin=14.5~30V, Io=500mA
Vin=17.5~30V, Io=500mA
Vin=21~33V, Io=500mA
Vin=23~33V, Io=500mA
Vin=27~33V, Io=500mA
Vin=8~12V, Io=500mA
Vin=9~13V, Io=500mA
Vin=10~15V, Io=500mA
Vin=11~17V, Io=500mA
Vin=13~19V, Io=500mA
Vin=14~20V, Io=500mA
Vin=16~22V, Io=500mA
Vin=20~26V, Io=500mA
Vin=24~30V, Io=500mA
Vin=26~32V, Io=500mA
Vin=30~33V, Io=500mA
dB
ein=1Vrms, f=120Hz,
Io=100mA
mV/℃
Io=5mA, Tj=0~125℃
A
V
Tj=25℃
Io=1A
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Electrical Characteristics
BA78□□CP/FP
(Ta=25℃,Vin=10V(05),11V(06),13V(07),14V(08),15V(09),16V(10),19V(12),23V(15),27V(18),29V(20),33V(24),Io=500mA unless otherwise specified)
Parameter
Symbol
Load Regulation 1
Reg.L1
Load Regulation 2
Reg.L2
Output Noise
Voltage
Vn
Bias Current
Bias Current Change 1
Ib
Ib1
Bias Current Change 2
Ib2
Short-Circuit
Output Current
Ios
Output Resistance
Ro
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
Type
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
05
06
07
08
09
10
12
15
18
20
24
common
common
05
06
07
08
09
10
12
15
18
20
24
05/06/07/08
09/10/12/15/18/20/24
05
06
07
08
09
10
12
15
18
20
24
Min
-
-
6/12
Limit
Typ
15
16
17
19
20
21
23
27
30
32
37
5
6
6
7
8
8
10
10
12
14
15
40
60
70
80
90
100
110
125
140
150
180
4.5
0.6
0.3
9
10
10
10
10
11
12
14
17
19
27
Max
100
120
140
160
180
200
200
300
360
400
480
50
60
70
80
90
90
100
150
180
200
240
8.0
0.5
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
-
Unit
Condition
mV
Io=5mA~1A
mV
Io=250mA~750mA
µV
f=10Hz~100kHz
mA
mA
Io=0mA
Io=5mA~1A
Vin:8~25V, Io=500mA
Vin:8.5~25V, Io=500mA
Vin:9.5~25V, Io=500mA
Vin:10.5~25V, Io=500mA
Vin:11.5~26V, Io=500mA
Vin:12.5~27V, Io=500mA
Vin:14.5~30V, Io=500mA
Vin:17.5~30V, Io=500mA
Vin:21~33V, Io=500mA
Vin:23~33V, Io=500mA
Vin:27~33V, Io=500mA
Vin=25V
Vin=30V
mA
A
mΩ
f=1kHz
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●BA78M□□ Characteristics data(Ta=25℃, Vin=10V(05), 14V(08), 23V(15) unless otherwise specified)
20
20
20
Ta=25℃
Ta=25℃
Io=0mA
15
Io=350mA
15
Vo [V]
Vo [V]
Vo [V]
10
BA78M08
5
BA78M05
BA78M05
0
15
20
25
0
30
0
5
10
Vin [V]
Fig.1 Line Regulation (Io=0mA)
15
20
25
30
0
Ta=25℃
5
10
15
20
25
30
Vin [V]
Vin [V]
Fig.2 Line Regulation (Io=350mA)
Fig.3 Line Regulation(Io=500mA)
2.0
20
6
Ta=25℃
Io=0mA
Ta=25℃
BA78M05
5
15
4
BA78M15
1.5
BA78M08
BA78M05
3
BA78M15
Io-p [A]
BA78M08
Vo [V]
Ib [mA]
BA78M05
0
10
10
BA78M08
5
5
BA78M15
BA78M08
5
0
Io=500mA
Io=500mA
15
BA78M15
BA78M15
10
Ta=25℃
Ta=25℃
10
BA78M08
2
5
BA78M05
BA78M15
1.0
0.5
1
0
0
0
5
10
15
20
25
30
0.0
0.0
0.5
1.0
Vin [V]
1.5
10
15
25
30
Fig.6 Peak Output Current
100
1.0
Ta=25℃
Ta=25℃
0.8
BA78M05
80
BA78M05
BA78M08
BA78M15
1.5
BA78M05
BA78M08
BA78M15
20
Vin [V]
Fig.5 Load Regulation
2.0
R.R. [dB]
0.6
Ios [A]
1.0
5
Io [A]
Fig.4 V
IN - Ib
Io
Vin
Vd [V]
0
2.0
0.4
60
BA78M08
BA78M15
40
0.5
0.2
0.0
0
0.0
0
0.1
0.2
0.3
0.4
0.5
0
0
5
10
Io [A]
20
25
10
10
30
Ta=25℃
BA78M15
5
BA78M15
Ib[mA]
4
0.0
BA78M15
4
BA78M08
BA78M08
BA78M08
3
BA78M05
2
-0.5
BA78M08
1
0
0
20
40
Ta [℃]
60
80
BA78M05
BA78M05
-1.5
0
3
2
1
-1.0
-20
BA78M15
5
Ib [mA]
BA78M05
1M
1000000
6
Io=0mA
1.0
1K
10K
100K
1000
10000
100000
Frequency[Hz]
Frequency [Hz]
6
Io=5mA
0.5
100
100
Fig.9 Ripple Rejection Ratio
Fig.8 Short – Circuit Output Current
1.5
⊿Vo/Vo [%]
15
Vin [V]
Fig.7 Dropout Voltage
-40
Ta=25℃
Io=100mA
20
100
Fig.10 Ta - Vo
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© 2012 ROHM Co., Ltd. All rights reserved.
-40
-20
0
20
40
Ta[℃]
Fig.11 Ta - Ib
7/12
60
80
100
0
0.1
0.2
0.3
0.4
0.5
Io [A]
Fig.12 Io - Ib
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●BA78□□ Characteristics data (Ta=25℃, Vin=10V(05), 14V(08), 23V(15)
20
20
20
Ta=25℃
Ta=25℃
Io=0mA
15
Io=500mA
15
BA7815
10
10
BA7808
BA7808
5
5
0
BA7808
5
BA7805
BA7805
5
10
15
20
25
30
BA7805
0
0
0
0
5
10
Vin [V]
15
20
25
0
30
5
10
Fig.14 Line Regulation (Io=500mA)
6
20
25
30
Fig15. Line Regulation (Io=1A)
20
Ta=25℃
15
Vin [V]
Vin [V]
Fig.13 Line Regulation (Io=0mA)
2.0
Io=0mA
Ta=25℃
Ta=25℃
5
BA7815
BA7805
15
1.5
4
3
BA7815
Io-p [A]
BA7805
BA7808
Vo [V]
Ib [mA]
Io=1A
15
Vo [V]
Vo [V]
10
Ta=25℃
BA7815
BA7815
Vo [V]
unless otherwise specified)
10
BA7808
2
BA7808
1.0
BA7815
BA7805
5
0.5
1
0
0
0
5
10
15
20
25
30
0.0
0.0
0.5
1.0
Vin [V]
1.5
0
5
15
R.R. [dB]
Ios [A]
BA7805
80
BA7805
BA7808
BA7815
1.5
0.5
30
100
Ta=25℃
BA7805
BA7808
BA7815
25
Fig.18 Peak Output Current
2
Ta=25℃
1.5
20
Vin [V]
Fig.17 Load Regulation
2.0
1.0
10
Io [A]
Fig.16 Vin - Ib
Vd [V]
2.0
1
0.5
60
BA7808
BA7815
40
20 Ta=25℃
Io=100mA
0.0
00
0
0
0.2
0.4
0.6
0.8
1
0
5
10
15
20
25
10
10
30
100
100
1K
10K
1000
10000
Frequency [Hz]
Vin [V]
Io [A]
Fig.19 Dropout Voltage
Fig.21 Ripple Rejection Ratio
Fig.20 Short – Circuit Output Current
6
6
1.5
Io=0mA
Io=0mA
Io=5mA
1.0
5
0.5
4
100K 1000000
1M
100000
Ta=25℃
BA7815
BA7815
5
0.0
4
BA7808
BA7808
3
BA7805
2
-0.5
BA7805
Ib [mA]
BA7815
Ib [mA]
ΔVo/Vo [%]
BA7815
BA7808
BA7805
-1.5
1
0
-20
0
20
BA7805
2
1
-1.0
-40
BA7808
3
40
60
80
100
0
-40
-20
0
20
40
60
80
100
0
0.2
0.4
0.6
Ta [℃]
Ta [℃]
Io [A]
Fig.22 Ta - Vo
Fig.23 Ta - Ib
Fig.24 Io - Ib
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© 2012 ROHM Co., Ltd. All rights reserved.
8/12
0.8
1
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Internal Circuit Structural Diagram
INPUT
R4
R9
R8
R10
R13
D2
Q9
Q8
Q16
Q12
Q17
Q15
R5
R21
R12
R17
R11
Q10
Q13
Q5
R6
R16
C1
Q11
Q7
Q18
Q1
Q14
R7
R20
R15
R2
R1
D1
OUTPUT
Q6
R22
Q2
R18
R19
Q4
Q3
R14
R3
D3
COMMON
FIN
1 2 3
TO220CP-3
PIN No.
1
2
3
Symbol
INPUT
COMMON
OUTPUT
TO252-3
Function
Input terminal
Ground terminal
Output terminal
PIN No.
1
2
3
FIN
Symbol
INPUT
N.C.
OUTPUT
COMMON
Function
Input terminal
Non connection terminal
Output terminal
Ground terminal
●Protection Circuit
Vin=10V
BA7805CP
6
5
Output voltage : Vo [V]
(1)Over-current protection circuit
When the maximum rating current or more is rushed, it controls the
current ability and protects the IC from destruction.
4
3
2
1
0
1
2
Output Current : IO[A]
6
5
Output Voltage : Vo [V]
(2) Thermal shutdown circuit
When the chip temperature of IC exceeds the setting temperature, the IC goes
OFF, and it controls the IC not to be destroyed by the heat generation.
It can be restored by being lowered the chip temperature of IC below the
setting temperature.
4
Vin=10V
BA7805CP
3
2
1
0
25 50 75 100 125 150 175 200
Chip Junction temperature : Tj [℃]
2
Maximum output current : IO-P[A]
(3) Safety operation area control circuit
It controls the output current in inverse proportion ratio to voltage difference
(input-output).
When voltage difference becomes bigger, the IC will be destroyed in rush current.
It protects the IC by controlling the current ability according to the voltage level.
Tj=25℃
BA7805CP
1.5
1
0.5
0
10
20
30
40
Input-Output voltage difference: Vin-Vo [V]
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© 2012 ROHM Co., Ltd. All rights reserved.
9/12
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Thermal design
Refer to the following thermal derating curves (Fig. 25, 26), when using in the status of Ta=25℃ or more.
The characteristic of IC is greatly related to the operating temperature.
When it is used in over maximum junction temperature, the elements inside IC might become weaker and be destroyed.
It is recommended to take into consideration thermal of IC.
Note that the temperatures are in the allowed temperature limits and operated within Pd.
It is necessary to operate it at junction temperature Tjmax or less to prevent IC from the thermal destruction.
Please operate IC within permissible loss Pd because the junction temperature Tj might become considerably a high
temperature even if ambient temperature Ta is normal temperature (25℃).
Power consumption Pc(W) may be expressed by the equation shown below:
Pc=(Vin-Vo)×Io+ Vin×Ib
permissible loss Pd≧Pc
Io ≦
Vin
Vo
Io
Ib
Pd Vin Ib
Vin Vo
: Input Voltage
: Output Voltage
: Output Current
: Bias current
Maximum Output current IoMAX can be calculated in thermal design.
・Calculation example
Ex.1) Ta=85℃, Vin =7.5V, Vo=5.0V
Using TO220CP-3 alone
θja=62.5℃/W→16mW/℃
Pd=1.04W at 85℃
1.04 7.5 4.5m
Io ≦
7.5 5.0
Io≦400mA
Be sure to use this IC within a power dissipation at the range of operating temperature.
25
12.5
(1) Mounted on infinity Alminium heat sinkθj-c=5.7(℃/W)
(2) Using an IC aloneθj-a=62.5℃/W
POWER DISSIPATION: Pd[W]
POWER DISSIPATION: Pd[W]
(1) 22.0
20
15
10
5
(2) 2.0
0
(1) 10.0
(1) Mounted on infinity Alminium heat sinkθj-c=12.5 (℃/W)
(2) Using an IC aloneθj-a=125.0℃/W
10
7.5
5
2.5
(2) 1.0
0
0
25
50
75
100
125
150
0
AMBIENT TEMPERATURE : Ta[℃]
Fig.25 Thermal derating curve (TO220CP-3)
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta[℃]
Fig.26
Thermal derating curve (TO252-3)
●Terminal Setting and Cautions
・INPUT
It is recommended that a capacitor (about 0.33uF) be inserted between INPUT and COMMON.
The value of capacitor is designed suitable for the actual application.
・OUTPUT
It is recommended that a capacitor (about 0.1uF) be inserted between OUTPUT and COMMON.
A tantalum capacitor can also be used for this pin because insufficient capacitors may cause oscillation by a temperature
change.
・COMMON
Keep the no voltage drop between Ground level of set board and IC.
When there is the voltage difference, setting voltage becomes inaccuracy and unstable.
It is recommended to connect by wide, short pattern, and lower the inpedance.
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© 2012 ROHM Co., Ltd. All rights reserved.
10/12
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Notes for use
(1) Absolute Maximum Ratings
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute
maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,
short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the
absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses.
(2) Ground voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(3) Thermal design
When you do the kind of use which exceeds Pd, It may be happened to deteriorating IC original quality such as decrease
of electric current ability with chip temperature rise. Do not exceed the power dissipation (Pd) of the package specification
rating under actual operation, and please design enough temperature margins.
(4) Short-circuiting between terminals, and mismounting
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may
result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and
power supply or GND may also cause breakdown.
(5) Operation in Strong electromagnetic field
Be noted that using the IC in the strong electromagnetic radiation can cause operation failures.
(6) Inspection with the IC set to a pc board
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the
inspection process, be sure to turn OFF the power supply before it is connected and removed.
(7) Input to IC terminals
+
This is a monolithic IC with P isolation between P-substrate and each element as illustrated below. This P-layer and the
N-layer of each element form a P-N junction, and various parasitic element are formed.
If a resistor is joined to a transistor terminal as shown in Fig 28.
○P-N junction works as a parasitic diode if the following relationship is satisfied;
GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and
○if GND>Terminal B (at NPN transistor side),
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
(8) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(9) Thermal shutdown circuit
A temperature control circuit is built in the IC to prevent the damage due to overheat.Therefore, the output is turned off
when the thermal circuit works and is turned on when the temperature goes down to the specified level.
But, built-in the IC a temperature control circuit to protect itself, and avoid the design used the thermal protection.
(10) Over current protection circuit
The over-current protection circuits are built in at output, according to their respective current outputs and prevent the IC
from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for
preventing destruction by unexpected accident. When it’s in continuous protection circuit moving period don’t use please.
And for ability, because this chip has minus characteristic, be careful for heat plan.
(11) There is a possibility to damage an internal circuit or the element when Vin and the voltage of each terminal reverse in the
application. For instance, Vin is short-circuited to GND etc. with the charge charged to an external capacitor. Please use
the capacitor of the output terminal with 1000μF or less. Moreover, the Vin series is recommended to insert the diode of
the by-pass the diode of the backflow prevention or between each terminal and Vin.
Pin B
Bypass diode
Backflow prevention diode
Resistor
Transistor (NPN)
Pin A
Pin B
B
C
C
B
E
E
Parasitic
element
VCC
N
Output terminal
N
P+
P
P+
N
P+
N
P substrate
Parasitic element
Fig.27 Bypass Diode
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© 2012 ROHM Co., Ltd. All rights reserved.
GND
N
P
P+
N
P substrate
Parasitic element
Fig.28
11/12
GND
GND
Other adjacent elements
Pin A
GND
Parasitic
element
Simplified structure of monorisic IC
2012.03 - Rev.C
Technical Note
BA78□□Series,BA78M□□Series
●Ordering part number
A
7
Part No
8
M
Part No
0
Output
Current
None:1A
M
:0.5A
5
Output
Voltage
05 : 5V
F
P
-
Package
CP :TO220CP-3
FP :TO252-3
~
B
E
2
Packaging and forming specification
E2: Embossed tape and reel
(TO220CP-3, TO252-3)
24 : 24V
TO220CP-3
+0.2
2.8-0.1
8.0±0.2
+0.4
15.2-0.2
12.0±0.2
4.5±0.1
Tape
Embossed carrier tape
Quantity
500pcs
Direction
of feed
1.0±0.2
5.61±0.2
+0.3
10.0-0.1
φ3.2±0.1
1
2
3
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.42±0.1
(0.585)
2.85
0.82±0.1
1.3
2.54
2.46
1 2
3
Reel
(Unit : mm)
1pin
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-3
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
1.5
3
0.8
2
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2.5
9.5±0.5
5.5±0.2
FIN
1
Embossed carrier tape
Quantity
2.3±0.2
0.5±0.1
0.65
Tape
0.65
0.5±0.1
0.75
2.3±0.2
2.3±0.2
1.0±0.2
1pin
(Unit : mm)
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© 2012 ROHM Co., Ltd. All rights reserved.
Reel
12/12
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.03 - Rev.C
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001