BA823F

Serial-in / Parallel-out Driver Series Serial-Parallel 3-input Driver BA823F No.09051EAT01 ●Description BA823F are an 8-bit serial-to-parallel-output driver, applicable for thermal printer heads or LED character display drivers. ●Features 1) Capable of driving a maximum of 200mA. 2) Non-driving current consumption can be reduced by controlling the strobe timing pulse. 3) Output data terminal can be used for a cascade configuration. 4) Digital ground and power ground are separated. 5) TTL and CMOS allow driving. ●Applications Driver for thermal print head Driver for LED character display ●Absolute maximum ratings (Ta=25℃) Parameter Power supply voltage Power dissipation BA823F Symbol Vcc Pd VIN MAX Topr Tstg Limits 7.0＊1 500 ＊3 ●Thermal derating curve Unit V mW V ℃ ℃ Power dissipation 　Pd　(mW) 875 750 625 500 375 250 125 0 -25 0 25 50 75 100 125 Ambient temperature　Ta　(℃) 150 BA823 BA823F Input voltage Operating temperature Storage temperature +0.3 to +6.0 -20 to +75 -55 to +125 *1 Voltage of O0~O7 terminals is 34V (Max.) *2 Reduced by 5.5 mW/C over 25C. *3 Reduced by 5.0 mW/C over 25C. 70℃ Fig.1 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/8 2009.06 - Rev.A BA823F ●Electrical characteristics (Unless otherwise specified, Ta=25℃,Vcc=+5.0V) Parameter Power supply Current dissipation(no load)1 Current dissipation(no load)2 Input low level voltage Input high level voltage Input low level current Input high level current Maximum output voltage Output saturation voltage Output current “H” output voltage “L” output voltage Minimum set up time Minimum shift clock width Minimum timing pulse width Maximum transfer time Symbol VCC IO1 IO2 VIL VIH IIL IIH VO OFF VO ON IOL VDOH VDOL t1 T2 T3 fMax Min. 4.5 2 2.4 500 Typ. 5.0 4 8 0.8 Max. 5.5 6 11 0.8 0.4 100 21.8 1.3 207 0.8 300 1 1 Unit V mA mA V V mA μA V V mA V V ns μs μs kHz Technical Note Conditions VCC terminal @All outputs = “0” @All outputs = “0” VIN=4.5V VIN=2.0V Ō 0 to Ō 7, Io=10μA @Io=100mA sink External voltage = 11.8V RL=10kΩ VIH=2.0V,VIL=0.8V VIH=2.0V,VIL=0.8V VIH=2.0V,VIL=0.8V VIH=2.0V,VIL=0.8V Test Circuit Fig.2 Fig.2 Fig.2 Fig.2 Fig.2 Fig.2 Fig.3 Fig.3 Fig.3 Fig.3 Fig.3 Fig.3 - ●Usage conditions range OUTPUT CURRENT : IOUT (mA) 200 100 Max usage conditions Usage condition range 0 10 20 Fig.2: Conditions to use supply voltage and output current (per circuit) Maximum conditions of use in the diagram to the left, show the absolute maximum supply voltage and IC output current. This product should not exceed the usage conditions range. 0 SUPPLY VOLTAGE : Vcc (V) Fig.2 Power supply voltage and current usage conditions www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/8 2009.06 - Rev.A BA823F ●Block diagram Ō0 12 Technical Note Ō1 11 Ō2 10 Ō3 9 Ō4 8 Ō5 7 Ō6 6 Ō7 5 16 VCC STROBE INPUT S DATA INPUT D4 SHIFT PULSE C 1 15 3 13 2 4 14 DATA OUTPUT DO GND1 GND2 GND (Dig) ●Pin descriptions Pin No. 2 15 1 12 11 10 9 8 7 6 5 3 16 13 4 14 Pin Name SHIFT PULSE DATA INPUT STROBE OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT OUTPUT DATA OUTPUT VCC GND GND GND Symbol C D1 S Ō0 Ō1 Ō2 Ō3 Ō4 Ō5 Ō6 Ō7 Do VCC GND1 GND2 GND(Dig) Shift pulse of shift register Data input of shift register is stored during the shift pulse rise time. When “1” is effective, the content of shift register is outputted. “0” is effective when the content of register is “1” on the 1st bit is outputted. “0” is effective when the content of register is “1” on the 2nd bit is outputted. “0” is effective when the content of register is “1” on the 3rd bit is outputted. “0” is effective when the content of register is “1” on the 4th bit is outputted. “0” is effective when the content of register is “1” on the 5th bit is outputted. “0” is effective when the content of register is “1” on the 6tht bit is outputted. “0” is effective when the content of register is “1” on the 7tht bit is outputted. “0” is effective when the content of register is “1” on the 8th bit is outputted. Data having passed through the output circuit of Ō7 becomes the input of the next stage 5.0V .is used normally (±10%) Especially, GND of the output circuit of Ō 0~ Ō 3 Especially, GND of the output circuit of Ō 4~ Ō7 Especially, GND of the logic circuit Function ●Description of operation BA823 is configured internally as shown in the block diagram. Terminals of clock C, data D1, and strobe S are used as input. Data input is synchronized with the clock, read serially during the rise time and latched at the rise time edge of the shifted shift register. The content of the set shift register appears on the output terminal of Ō0~ Ō7 when the strobe is input, as shown in the time chart of Fig.5. Pulse width is the same as that of the strobe input pulse. Data output terminal D0, is a terminal used for cascade connection of the IC, where the output of the final stage of the shift register has appeared, and is connected to the next data input terminal D1. In this case, when the clock and the strobe are used in conjunction, output terminal can be increased by 8 bits at a time. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/8 2009.06 - Rev.A BA823F ●Measurement circuits Technical Note Vcc=5.0V A Data should be left “0”. Item ICC IIH BA823F SW1 1 2 SW2 1 1～3 VIN=4.5V A 3 2 SW2 1 2 1 PG After 8 pulses have elapsed. SW1 Fig.3 Icc 1st measurement circuit VCC=5.0V Item VO ON IOL BA823F 5 1 2 SW1 8 7 6 SW2 SW3 2 A IO 82Ω VA 4 SW1 1 1 2 SW2 1～8 1～8 1～8 SW3 1 1 2 VO OFF 3 2 1 IO = 10μA when VO OFF is measured VA = 30V when IO ON is measured PG After 8 pulses have elapsed. 100mA 1 Fig.4 Vo ON, Vo OFF, IOL measurement circuit ●Input conditions Data input D1 Shift pulse C t1 t2 Print pulse S t3 Fig.5 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/8 2009.06 - Rev.A BA823F ●Timing chart Clock input DATA input Strobe input C D1 S Technical Note Ō0 Ō1 Ō2 Ō3 Ō4 Ō5 Ō6 Ō7 DATA output DO Fig.6 ●Application example 10V Ō0 Ō1 Ō2 Ō3 Ō4 Ō5 Ō6 Ō7 Ō0 Ō1 Ō2 Ō3 Ō4 Ō5 Ō6 Ō7 Ō0 Ō1 Ō2 Ō3 Ō4 Ō5 Ō6 BA823F GND1 GND2 C VCC DO D1 D1 S BA823F GND1 GND2 C VCC DO D1 S BA823F GND1 C VCC GND2 DO S DATA signal Shift pulse Power supply 5V Print pulse Fig.7 Example: Print head using the strobe function Disabling the high current while the heating element is switched off is advantageous. Use for thermal printer (when the timing is 1 phase) example www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Ō7 5/8 2009.06 - Rev.A BA823F ●Interfaces (a) Input (b) Output Technical Note VCC 1,2,15pin 10kΩ 5.5kΩ 20kΩ 12kΩ 1.0kΩ 5,6,7,8,9,10,11,12pin (c) Serial data output VCC 10kΩ 100Ω 200Ω 3pin 500Ω 5kΩ Fig.8 ●Thermal derating curve 200 160 15% 13% 30% MAXIMUM OUTPUT CURENT : low(mA) 34% 120 Ta=75℃ Ta=25℃ BA823 80 40 0 0 20 40 60 80 BA823F 48mA 42mA 22mA 18mA 100 OUTPUT DUTY CYCLE(ALL BIT “ON”)(%) At repetition frequency 1Hz or higher Fig.9 Output conditions www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/8 2009.06 - Rev.A BA823F Technical Note ●Notes for use 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 6. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 8. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Resistor Pin A Pin A P+ N P P+ Transistor (NPN) Pin B C B E B P P+ N C E Pin B N N Parasitic element N P+ N P substrate Parasitic element GND P substrate Parasitic element GND GND GND Parasitic element Other adjacent elements Fig.10 Example of IC structure 9. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/8 2009.06 - Rev.A BA823F ●Ordering part number Technical Note B D 8 Part No. 2 3 F Package F: SOP16 - E 2 Part No. Packaging and forming specification E2: Embossed tape and reel SOP16 10 ± 0.2 (MAX 10.35 include BURR) 16 9 Tape Quantity Direction of feed 0.3MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.2 ± 0.3 4.4 ± 0.2 ( reel on the left hand and you pull out the tape on the right hand ) 1 8 0.15 ± 0.1 1.5 ± 0.1 0.11 1.27 0.4 ± 0.1 0.1 1pin (Unit : mm) Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/8 2009.06 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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