Datasheet
Operational Amplifier Series
Automotive Excellent EMI Characteristics
Ground Sense
Operational Amplifiers
BA82904Yxxx-C BA82902Yxxx-C
Key Specifications
General Description
BA82904Yxxx-C and BA82902Yxxx-C are high-gain,
ground sense input Op-Amps. These ICs are
monolithic ICs integrated dual or quad independent
Op-Amps on a single chip. These Op-Amps have
some features of low power consumption, and can
operate from 3V to 36V (single power supply).
BA82904Yxxx-C
and
BA82902Yxxx-C
are
manufactured for automotive requirements of engine
control unit, electric power steering, and so on.
Furthermore, they have the advantage of EMI
tolerance dose. It is easy to replace with conventional
products, and the EMI design is simple.
Operating Supply Voltage Range
Single Supply:
3V to 36V
Dual Supply:
±1.5V to ±18.0V
Low Supply Current
BA82904Yxxx-C
0.5mA (Typ)
BA82902Yxxx-C
0.7mA (Typ)
Input Bias Current:
20nA (Typ)
2nA (Typ)
Input Offset Current:
Operating Temperature Range: -40°C to +125°C
Packages
Features
SOP8
SOP14
SSOP-B14
MSOP8
SOP-J14
TSSOP-B14J
AEC-Q100 Qualified(Note 1)
Single or Dual Power Supply Operation
Wide Operating Supply Voltage Range
Standard Op-Amp Pin-assignments
Operable from Almost GND Level for Both Input
and Output
Low Supply Current
High Open Loop Voltage Gain
Internal ESD Protection Circuit
Wide Operating Temperature Range
Integrated EMI Filter
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.20mm
(Note 1) Grade 1
Applications
Engine Control Unit
Electric Power Steering (EPS)
Anti-Lock Braking System (ABS)
Automotive Electronics
Selection Guide
Maximum Operating Temperature
Output Current
Source / Sink
Automotive
Supply Current
125°C
BA82904YF-C
BA82904YFVM-C
Dual
30mA / 20mA
0.5mA
Quad
30mA / 20mA
0.7mA
〇Product structure : Silicon monolithic integrated circuit
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TSZ22111 • 14 • 001
BA82902YF-C
BA82902YFV-C
BA82902YFJ-C
BA82902YFVJ-C
〇This product has no designed protection against radioactive rays
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Equivalent Circuit
VCC
-IN
OUT
+IN
VEE
Figure 1. Equivalent Circuit (One Channel Only)
Pin Configuration
BA82904YF-C: SOP8
BA82904YFVM-C: MSOP8
(TOP VIEW)
OUT1 1
-IN1 2
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
8 VCC
7 OUT2
CH1
- +
+IN1 3
CH2
+ -
6 -IN2
6
-IN2
7
OUT2
8
VCC
Pin No.
Pin Name
1
OUT1
5 +IN2
VEE 4
BA82902YF-C: SOP14
BA82902YFV-C: SSOP-B14
BA82902YFJ-C: SOP-J14
BA82902YFVJ-C: TSSOP-B14J
(TOP VIEW)
2
-IN1
14 OUT4
3
+IN1
13 -IN4
4
VCC
+IN1 3
12 +IN4
5
+IN2
VCC 4
11 VEE
OUT1 1
-IN1 2
CH1
- +
CH4
+ -
10 +IN3
+IN2 5
-IN2 6
- +
CH2
+ CH3
OUT2 7
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TSZ22111 • 15 • 001
6
-IN2
7
OUT2
8
OUT3
9 -IN3
9
-IN3
8 OUT3
10
+IN3
11
VEE
12
+IN4
13
-IN4
14
OUT4
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BA82904Yxxx-C BA82902Yxxx-C
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
VCC-VEE
36
V
Differential Input Voltage
VID
36
V
Input Common-mode Voltage Range
VICM
(VEE-0.3) to (VEE+36)
V
II
-10
mA
Tstg
-55 to +150
°C
Tjmax
150
°C
Supply Voltage
(Note 1)
Input Current
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design PCB boards with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then the input pin voltage is set to VEE or more.
Recommended Operating Conditions
Parameter
Symbol
Operating Supply Voltage
Vopr
Operating Temperature
Topr
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TSZ22111 • 15 • 001
Min
Typ
Max
3
(±1.5)
-40
5
(±2.5)
+25
36
(±18)
+125
3/35
Unit
V
°C
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BA82904Yxxx-C BA82902Yxxx-C
Thermal Resistance(Note 1)
Parameter
Thermal Resistance (Typ)
Symbol
1s(Note 3)
2s2p(Note 4)
Unit
MSOP8
Junction to Ambient
θJA
284.1
135.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
21
11
°C/W
θJA
197.4
109.8
°C/W
ΨJT
21
19
°C/W
θJA
166.5
108.1
°C/W
ΨJT
26
22
°C/W
SOP8
Junction to Ambient
(Note 2)
Junction to Top Characterization Parameter
SOP14
Junction to Ambient
(Note 2)
Junction to Top Characterization Parameter
SSOP-B14
θJA
159.6
92.8
°C/W
(Note 2)
ΨJT
13
9
°C/W
Junction to Ambient
θJA
118.5
67.2
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
10
10
°C/W
Junction to Ambient
θJA
185.4
98.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
16
14
°C/W
Junction to Ambient
Junction to Top Characterization Parameter
SOP-J14
TSSOP-B14J
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
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Electrical Characteristics
○BA82904Yxxx-C (Unless otherwise specified VCC=5V, VEE=0V)
Parameter
Symbol
Temperature
Range
25°C
Input Offset Voltage(Note 1)
Input Offset Current(Note 1)
Input Bias Current(Note 1)
Supply Current
Maximum Output
Voltage (High)
Unit
Min
Typ
Max
-
2
6
VIO
Full range
-
-
9
25°C
-
2
40
Full range
-
-
50
25°C
-
20
60
Full range
-
-
100
25°C
-
0.5
1.2
Full range
-
-
1.2
25°C
3.5
-
-
3.2
-
-
27
28
-
Full range
-
5
20
25°C
25
100
-
IB
ICC
VOH
VOUT=1.4V
VCC=5V to 30V, VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
RL=2kΩ
V
Full range
VOL
Large Signal Voltage Gain
AV
Conditions
mV
IIO
Maximum Output Voltage(Low)
Input Common-mode
Voltage Range
Limits
Full range
25
-
-
25°C
0
-
VCC-1.5
VICM
Full range
0
-
VCC-2.0
VCC=30V, RL=10kΩ
mV
RL=∞, All Op-Amps
V/mV
RL≥2kΩ, VCC=15V
VOUT=1.4V to 11.4V
V
(VCC-VEE)=5V
VOUT=VEE+1.4V
Common-mode Rejection
Ratio
CMRR
Full range
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
Full range
70
100
-
dB
VCC=5V to 30V
25°C
20
30
-
Output Source Current(Note 2)
ISOURCE
mA
V+IN=1V, V-IN=0V
VOUT=0V
1CH is short circuit
mA
V+IN=0V, V-IN=1V
VOUT=5V
1CH is short circuit
Output Sink Current(Note 2)
Slew Rate
Gain Bandwidth Product
Channel Separation
Full range
10
-
-
25°C
10
20
-
Full range
2
-
-
25°C
12
40
-
SR
25°C
-
0.2
-
GBW
25°C
-
0.5
-
CS
25°C
-
120
-
ISINK
V+IN=0V, V-IN=1V
VOUT=200mV
VCC=15V, AV=0dB
V/μs
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
μA
dB
f=1kHz, input referred
(Note 1) Absolute value
(Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current.
When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating.
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Electrical Characteristics - continued
○BA82902Yxxx-C (Unless otherwise specified VCC=5V, VEE=0V)
Parameter
Symbol
Temperature
Range
25°C
Input Offset Voltage(Note 1)
Input Offset Current(Note 1)
Input Bias Current(Note 1)
Supply Current
Maximum Output
Voltage (High)
Unit
Min
Typ
Max
-
2
6
VIO
Full range
-
-
9
25°C
-
2
40
Full range
-
-
50
25°C
-
20
60
Full range
-
-
100
25°C
-
0.7
2
Full range
-
-
3
25°C
3.5
-
-
3.2
-
-
27
28
-
Full range
-
5
20
25°C
25
100
-
IB
ICC
VOH
VOUT=1.4V
VCC=5V to 30V, VOUT=1.4V
nA
VOUT=1.4V
nA
VOUT=1.4V
mA
RL=∞, All Op-Amps
RL=2kΩ
V
Full range
VOL
Large Signal Voltage Gain
AV
Conditions
mV
IIO
Maximum Output Voltage(Low)
Input Common-mode
Voltage Range
Limits
Full range
25
-
-
25°C
0
-
VCC-1.5
VICM
Full range
0
-
VCC-2.0
VCC=30V, RL=10kΩ
mV
RL=∞, All Op-Amps
V/mV
RL≥2kΩ, VCC=15V
VOUT=1.4V to 11.4V
V
(VCC-VEE)=5V
VOUT=VEE+1.4V
Common-mode Rejection
Ratio
CMRR
Full range
70
80
-
dB
VOUT=1.4V
Power Supply Rejection Ratio
PSRR
Full range
70
100
-
dB
VCC=5V to 30V
25°C
20
30
-
Output Source Current(Note 2)
ISOURCE
mA
V+IN=1V, V-IN=0V
VOUT=0V
1CH is short circuit
mA
V+IN=0V, V-IN=1V
VOUT=5V
1CH is short circuit
Output Sink Current(Note 2)
Slew Rate
Gain Bandwidth Product
Channel Separation
Full range
10
-
-
25°C
10
20
-
Full range
2
-
-
25°C
12
40
-
SR
25°C
-
0.2
-
GBW
25°C
-
0.5
-
CS
25°C
-
120
-
ISINK
V+IN=0V, V-IN=1V
VOUT=200mV
VCC=15V, Av=0dB
V/μs
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
μA
dB
f=1kHz, input referred
(Note 1) Absolute value
(Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current.
When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating.
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Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s or general
document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded even momentarily. Applying of voltage in
excess of absolute maximum rating or use at outside the temperature range which is provided in the absolute maximum
ratings may cause deteriorating the characteristics of the IC or destroying it.
1.1 Supply Voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply pin and negative power
supply pin without deteriorating the characteristics of internal circuit or destroying the IC.
1.2 Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting pin and inverting pin without deteriorating
the characteristics of the IC or without destroying it.
1.3 Input Common-mode Voltage Range (VICM)
Indicates the voltage range that can be applied to the non-inverting pin and inverting pin without deteriorating the
characteristics of the IC or without destroying it. Input common-mode voltage range of the maximum ratings does not
assure normal operation of the IC. For normal operation, use the IC within the input common-mode voltage range of
electrical characteristics.
1.4 Storage Temperature Range (Tstg)
The storage temperature range denotes the range of temperatures the IC can be stored without causing excessive
deteriorating the characteristics of the IC.
2. Electrical Characteristics
2.1 Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated as the input voltage
difference required for setting the output voltage at 0V.
2.2 Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
2.3 Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
2.4 Supply Current (ICC)
Indicates the current that flows within the IC under no-load conditions.
2.5 Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage High and maximum output voltage Low. Maximum output voltage (High) indicates the upper limit of output
voltage while maximum output voltage (Low) indicates the lower limit.
2.6 Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage regarding the voltage difference between non-inverting pin and
inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output Voltage) / (Differential Input Voltage)
2.7 Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
2.8 Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input Common-mode Voltage) / (Input Offset Voltage Fluctuation)
2.9 Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC.
PSRR = (Change of Power Supply Voltage) / (Input Offset Voltage Fluctuation)
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Description of Electrical Characteristics - continued
2.10 Output Source Current / Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. It is typically divided into
output source current and output sink current. The output source current indicates the current flowing out from the IC,
and the output sink current indicates the current flowing into the IC.
2.11 Slew Rate (SR)
This parameter indicates the operation speed of the Op-Amps. Indicates the rate at which the output voltage can
change per specified unit time.
2.12 Gain Bandwidth Product (GBW)
This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of 6 dB/octave.
2.13 Channel Separation (CS)
Indicates the fluctuation in the output voltage of the other channel regarding the change of output voltage of the
channel which is driven.
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Typical Performance Curves
1.0
1.0
0.8
0.8
Ta=+25ºC
Ta=-40ºC
0.6
Supply Current: Icc[mA]
Supply Current: Icc[mA]
○BA82904Yxxx-C
0.4
Ta=+125ºC
0.2
VCC=5V
0.4
VCC=3V
0.2
0.0
0.0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 2. Supply Current vs Supply Voltage
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 3. Supply Current vs Ambient Temperature
5
30
Maximum Output Voltage: VOH[V]
40
Maximum Output Voltage: VOH[V]
VCC=36V
0.6
Ta=+25ºC
Ta=+125ºC
20
Ta=-40ºC
10
4
3
2
1
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 4. Maximum Output Voltage vs Supply Voltage
(RL=10kΩ)
-25
0
25
50
75 100 125
Ambient Temperature: Ta[°C]
150
Figure 5. Maximum Output Voltage vs Ambient Temperature
(VCC=5V, RL=2kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82904Yxxx-C
50
50
Output Source Current: I SOURCE[mA]
Output Source Current: I SOURCE[mA]
Ta=-40ºC
40
Ta=+25ºC
30
20
Ta=+125ºC
10
VCC=5V
VCC=36V
30
VCC=3V
20
10
0
0
0
1
2
3
4
Output Voltage: V OUT [V]
-50
5
Figure 6. Output Source Current vs Output Voltage
(VCC=5V)
100
50
10
40
Ta=+125ºC
1
Ta=+25ºC
0.1
Ta=-40ºC
0.01
0.001
0.0
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 7. Output Source Current vs Ambient Temperature
(VOUT=0V)
Output Sink Current: I SINK[mA]
Output Sink Current: I SINK[mA]
40
VCC=36V
30
VCC=5V
20
VCC=3V
10
0
1.0
2.0
3.0
4.0
Output Voltage: V OUT [V]
-50
5.0
Figure 8. Output Sink Current vs Output Voltage
(VCC=5V)
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 9. Output Sink Current vs Ambient Temperature
(VOUT=VCC)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82904Yxxx-C
80
80
70
Ta=+25ºC
Output Sink Current: I SINK[uA]
Output Sink Current: I SINK[uA]
70
60
Ta=-40ºC
50
40
Ta=+125ºC
30
20
50
VCC=5V
40
VCC=3V
30
20
10
10
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
8
6
6
Ta=-40ºC
Input Offset Voltage: VIO[mV]
8
4
Ta=+25ºC
2
0
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 11. Output Sink Current vs Ambient Temperature
(VOUT=0.2V)
Figure 10. Output Sink Current vs Supply Voltage
(VOUT=0.2V)
Input Offset Voltage: VIO[mV]
VCC=36V
60
Ta=+125ºC
-2
-4
4
VCC=5V
VCC=36V
2
VCC=3V
0
-2
-4
-6
-6
-8
-8
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25
50
75 100 125
Ambient Temperature: Ta[°C]
150
Figure 13. Input Offset Voltage vs Ambient Temperature
(VICM=0V, VOUT=1.4V)
Figure 12. Input Offset Voltage vs Supply Voltage
(VICM=0V, VOUT=1.4V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
50
50
40
40
Input Bias Current: IB[nA]
Input Bias Current: IB[nA]
○BA82904Yxxx-C
30
Ta=+25ºC
Ta=-40ºC
20
Ta=+125ºC
10
30
VCC=36V
20
VCC=3V
VCC=5V
10
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 14. Input Bias Current vs Supply Voltage
(VICM=0V, VOUT=1.4V)
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 15. Input Bias Current vs Ambient Temperature
(VICM=0V, VOUT=1.4V)
50
10
8
6
Input Offset Voltage: VIO [mV]
Input Bias Current: IB[nA]
40
30
20
10
0
Ta=-40ºC
4
Ta=+25ºC
2
0
Ta=+125ºC
-2
-4
-6
-8
-10
-10
-50
-25
-1
0
25
50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 16. Input Bias Current vs Ambient Temperature
(VCC=30V, VICM=28V, VOUT=1.4V)
0
1
2
3
4
5
Input Common-mode Voltage: VICM [V]
Figure 17. Input Offset Voltage vs
Input Common-mode Voltage
(VCC=5V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82904Yxxx-C
10
Input Offset Current: IIO[nA]
Input Offset Current: IIO[nA]
10
5
Ta=-40ºC
Ta=+25ºC
0
Ta=+125ºC
-5
5
VCC=36V
VCC=5V
0
VCC=3V
-5
-10
-10
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
140
130
130
Large Signal Voltage Gain: AV[dB]
Large Signal Voltage Gain: AV[dB]
140
120
Ta=+25ºC
110
100
90
0
25
50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 19. Input Offset Current vs
Ambient Temperature
(VICM=0V, VOUT=1.4V)
Figure 18. Input Offset Current vs
Supply Voltage
(VICM=0V, VOUT=1.4V)
Ta=-40ºC
-25
Ta=+125ºC
80
120
VCC=36V
110
100
VCC=5V
90
VCC=3V
80
70
70
60
60
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 21. Large Signal Voltage Gain vs
Ambient Temperature
(RL=2kΩ)
Figure 20. Large Signal Voltage Gain vs
Supply Voltage
(RL=2kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82904Yxxx-C
140
Common Mode Rejection Ratio: CMRR[dB]
Common Mode Rejection Ratio: CMRR[dB]
140
120
Ta=+25ºC
Ta=-40ºC
100
80
Ta=+125ºC
60
120
VCC=36V
100
VCC=5V
80
VCC=3V
60
40
40
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 22. Common Mode Rejection Ratio vs
Supply Voltage
(VOUT=1.4V)
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 23. Common Mode Rejection Ratio vs
Ambient Temperature
(VOUT=1.4V)
Power Supply Rejection Ratio: PSRR[dB]
140
130
120
110
100
90
80
70
60
-50
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 24. Power Supply Rejection Ratio vs
Ambient Temperature
(VCC=5V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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BA82904Yxxx-C BA82902Yxxx-C
Typical Performance Curves - continued
2.0
2.0
1.6
1.6
Supply Current: Icc[mA]
Supply Current: Icc[mA]
○BA82902Yxxx-C
1.2
Ta=+25ºC
Ta=-40ºC
0.8
Ta=+125ºC
1.2
0.8
VCC=5V
0.4
0.4
VCC=3V
0.0
0.0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 26. Supply Current vs Ambient Temperature
Figure 25. Supply Current vs Supply Voltage
5
30
Maximum Output Voltage: VOH[V]
40
Maximum Output Voltage: VOH[V]
VCC=36V
Ta=+25ºC
Ta=+125ºC
20
Ta=-40ºC
10
4
3
2
1
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 27. Maximum Output Voltage vs Supply Voltage
(RL=10kΩ)
-25
0
25
50
75 100 125
Ambient Temperature: Ta[°C]
150
Figure 28. Maximum Output Voltage vs Ambient Temperature
(VCC=5V, RL=2kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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BA82904Yxxx-C BA82902Yxxx-C
Typical Performance Curves - continued
○BA82902Yxxx-C
50
50
Output Source Current: I SOURCE[mA]
Output Source Current: I SOURCE[mA]
Ta=-40ºC
40
Ta=+25ºC
30
20
Ta=+125ºC
10
VCC=5V
VCC=36V
30
VCC=3V
20
10
0
0
0
1
2
3
4
Output Voltage: V OUT [V]
-50
5
50
10
40
Output Sink Current: I SINK[mA]
100
Ta=+125ºC
1
Ta=+25ºC
0.1
Ta=-40ºC
0.01
0.001
0.0
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 30. Output Source Current vs Ambient Temperature
(VOUT=0V)
Figure 29. Output Source Current vs Output Voltage
(VCC=5V)
Output Sink Current: I SINK[mA]
40
VCC=36V
30
VCC=5V
20
VCC=3V
10
0
1.0
2.0
3.0
4.0
Output Voltage: V OUT [V]
-50
5.0
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 32. Output Sink Current vs Ambient Temperature
(VOUT=VCC)
Figure 31. Output Sink Current vs Output Voltage
(VCC=5V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82902Yxxx-C
80
80
70
Ta=+25ºC
Output Sink Current: I SINK[uA]
Output Sink Current: I SINK[uA]
70
60
Ta=-40ºC
50
40
Ta=+125ºC
30
20
50
VCC=5V
40
VCC=3V
30
20
10
10
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 33. Output Sink Current vs Supply Voltage
(VOUT=0.2V)
8
8
6
6
4
Ta=-40ºC
Ta=+25ºC
2
0
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 34. Output Sink Current vs Ambient Temperature
(VOUT=0.2V)
Input Offset Voltage: VIO[mV]
Input Offset Voltage: VIO[mV]
VCC=36V
60
Ta=+125ºC
-2
-4
4
VCC=5V
VCC=36V
2
VCC=3V
0
-2
-4
-6
-6
-8
-8
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25
50
75 100 125
Ambient Temperature: Ta[°C]
150
Figure 36. Input Offset Voltage vs Ambient Temperature
(VICM=0V, VOUT=1.4V)
Figure 35. Input Offset Voltage vs Supply Voltage
(VICM=0V, VOUT=1.4V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
50
50
40
40
Input Bias Current: IB[nA]
Input Bias Current: IB[nA]
○BA82902Yxxx-C
30
Ta=+25ºC
Ta=-40ºC
20
Ta=+125ºC
10
30
VCC=36V
20
VCC=3V
VCC=5V
10
0
0
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25
50
75 100 125 150
Ambient Temperature: Ta[°C]
Figure 38. Input Bias Current vs Ambient Temperature
(VICM=0V, VOUT=1.4V)
Figure 37. Input Bias Current vs Supply Voltage
(VICM=0V, VOUT=1.4V)
50
10
8
6
Input Offset Voltage: VIO [mV]
Input Bias Current: IB[nA]
40
30
20
10
0
Ta=-40ºC
4
Ta=+25ºC
2
0
Ta=+125ºC
-2
-4
-6
-8
-10
-10
-50
-25
-1
0
25
50 75 100 125 150
Ambient Temperature: Ta[°C]
0
1
2
3
4
5
Input Common-mode Voltage: VICM [V]
Figure 40. Input Offset Voltage vs
Input Common-mode Voltage
(VCC=5V)
Figure 39. Input Bias Current vs Ambient Temperature
(VCC=30V, VICM=28V, VOUT=1.4V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
○BA82902Yxxx-C
10
Input Offset Current: IIO[nA]
Input Offset Current: IIO[nA]
10
5
Ta=-40ºC
Ta=+25ºC
0
Ta=+125ºC
-5
5
VCC=36V
VCC=5V
0
VCC=3V
-5
-10
-10
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
140
140
130
130
120
Ta=-40ºC
Ta=+25ºC
110
100
90
0
25
50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 42. Input Offset Current vs
Ambient Temperature
(VICM=0V, VOUT=1.4V)
Large Signal Voltage Gain: AV[dB]
Large Signal Voltage Gain: AV[dB]
Figure 41. Input Offset Current vs
Supply Voltage
(VICM=0V, VOUT=1.4V)
-25
Ta=+125ºC
80
120
VCC=36V
110
100
VCC=5V
90
VCC=3V
80
70
70
60
60
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 44. Large Signal Voltage Gain vs
Ambient Temperature
(RL=2kΩ)
Figure 43. Large Signal Voltage Gain vs
Supply Voltage
(RL=2kΩ)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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BA82904Yxxx-C BA82902Yxxx-C
Typical Performance Curves - continued
○BA82902Yxxx-C
140
Common Mode Rejection Ratio: CMRR[dB]
Common Mode Rejection Ratio: CMRR[dB]
140
120
Ta=+25ºC
Ta=-40ºC
100
80
Ta=+125ºC
60
120
VCC=36V
100
VCC=5V
80
VCC=3V
60
40
40
0
10
20
30
Supply Voltage: Vcc[V]
-50
40
Figure 45. Common Mode Rejection Ratio vs
Supply Voltage
(VOUT=1.4V)
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 46. Common Mode Rejection Ratio vs
Ambient Temperature
(VOUT=1.4V)
Power Supply Rejection Ratio: PSRR[dB]
140
130
120
110
100
90
80
70
60
-50
-25
0
25 50 75 100 125 150
Ambient Temperature: Ta[°C]
Figure 47. Power Supply Rejection Ratio vs
Ambient Temperature
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Application Information
Test Circuit 1: Measurement Condition
VCC, VEE, VEK, VICM Unit: V
Parameter
VF
SW1
SW2
SW3
VCC
VEE
VEK
VICM
Calculation
Input Offset Voltage
VF1
ON
ON
OFF
5 to 30
0
-1.4
0
1
Input Offset Current
VF2
OFF
OFF
OFF
5
0
-1.4
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
5
0
-1.4
0
3
ON
ON
ON
15
0
-1.4
0
15
0
-11.4
0
ON
ON
OFF
5
0
-1.4
0
5
0
-1.4
3.5
ON
ON
OFF
5
0
-1.4
0
30
0
-1.4
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
VF8
VF9
Power Supply Rejection Ratio
VF10
5
6
0.1µF
- Calculation 1. Input Offset Voltage (VIO)
V IO
4
RF=50kΩ
V F1
1 + RF / RS
500kΩ
[V]
SW1
2. Input Offset Current (IIO)
V F2 - V F1
I IO
R I × (1 + R F / R S )
15V
VEK
RS=50Ω
0.1µF
VCC
VO
RI=10kΩ
500kΩ
DUT
[A]
RI=10kΩ
1000pF
RL
VICM
3. Input Bias Current (IB)
V F4 - V F3
IB
2 × R I × (1 + R F / R S )
NULL
SW3
RS=50Ω
50kΩ
SW2
VEE
V
VF
-15V
[A]
Figure 48. Test Circuit 1 (One Channel Only)
4. Large Signal Voltage Gain (AV)
AV 20 × Log
ΔV EK × (1 + R F /RS )
V F5 - V F6
[dB]
5. Common-mode Rejection Ration (CMRR)
CMRR 20 × Log
ΔV ICM × (1 + R F /RS )
V F8 - V F7
[dB]
6. Power Supply Rejection Ratio (PSRR)
PSRR 20 × Log
ΔVCC × (1 + R F /RS )
[dB]
V F10 - V F9
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Application Information - continued
Test Circuit 2: Switch Condition
SW
1
SW No.
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
SW
12
SW
13
SW
14
Supply Current
OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage (High)
OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF
Maximum Output Voltage (Low)
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF
Output Source Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Output Sink Current
OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON
Slew Rate
OFF OFF OFF ON OFF OFF OFF ON
Gain Bandwidth Product
Equivalent Input Noise Voltage
ON
ON
ON OFF OFF OFF
OFF ON OFF OFF ON
ON OFF OFF ON
ON
ON OFF OFF OFF
ON OFF OFF OFF ON
ON OFF OFF OFF OFF ON OFF OFF OFF
SW4
SW5
Input voltage
R2
VH
VCC
A
VL
－
SW1
SW2
Output voltage
＋
Input wave
time
SW3
SR＝ΔV/Δt
RS
SW7
SW6
R1
SW8
SW9
SW10 SW11 SW12 SW13 SW14
90%
VH
ΔV
VEE
C
A
～ V
IN-
～
VIN+
RL
V
～
CL
V
10%
VL
VOUT
Δt
Output wave
Figure 49. Test Circuit 2 (One Channel Only)
time
Figure 50. Slew Rate Waveform
Test Circuit 3: Channel Separation Measurement Condition
VCC
VCC
R1//R2
OTHER
CH
R1//R2
VEE
R1
VEE
R2
V
VIN
40dB amplifier
VOUT1
=0.5[Vrms]
R1
R2
V
VOUT2
40dB amplifier
CS＝20×log
100×VOUT1
VOUT2
(R1=1kΩ, R2=100kΩ)
Figure 51. Test Circuit 3
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Application Information - continued
EMI Immunity
BA82904Yxxx-C and BA82902Yxxx-C have high tolerance for electromagnetic interference from the outside because they
have EMI filter, and the EMI design is simple. The data of the IC simple substance on ROHM board are as follows. They
are most suitable to replace from conventional products. The test condition is based on ISO11452-2.
Based on ISO11452-2
Test Circuit: Voltage Follower
VCC: 12V
VIN+: 6V
Test Method: Substituted Law
(Progressive Wave)
Field Intensity: 200V/m
Test Wave: CW (Continuous Wave)
Frequency: 200MHz – 1000MHz (2% step)
Conventional Product
BA82904Yxxx-C,
BA82902Yxxx-C
Figure 52. EMI Characteristics
Figure 53. EMI Evaluation Board (BA82904Yxxx-C)
Figure 54. EMI Evaluation Board (BA82902Yxxx-C)
Figure 55. Measurement Circuit of EMI Evaluation
(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed.
Design and Evaluate in actual application before use.
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Application Information - continued
VCC
1. Unused Circuits
When there are unused circuits, it is recommended that they are
connected as in Figure 56, and set the non-inverting input pin to electric
potential within the input common-mode voltage range (VICM).
2. Input Voltage
Applying VEE+36V to the input pin is possible without causing deterioration
of the electrical characteristics or destruction, regardless of the supply
voltage. However, this does not ensure normal circuit operation. Note that
the circuit operates normally only when the input voltage is within the
common-mode input voltage range of the electric characteristics.
+
Connect
to VICM
VICM
VEE
Figure 56. Example of Application
Circuit for Unused Op-amp
3. Power Supply (single / dual)
The Op-Amp operates when the voltage supplied is between the VCC and
VEE pin. Therefore, the single supply Op-Amp can be used as dual supply
Op-Amp as well.
4. IC Operation
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected
to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and charging
of the output current. Connecting a resistor between the output pin and the VEE pin, and increasing the bias current for
Class A operation will suppress crossover distortion.
5. Output Capacitor
When the VCC pin is shorted to VEE(GND) electric potential in a state where electric charge is accumulated in the
external capacitor that is connected to the output pin, the accumulated electric charge will flow through parasitic elements
or pin protection elements inside the circuit and discharges to the VCC pin. It may cause damage to the elements inside
the circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative
feedback circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, set the
value of the capacitor connected to the output pin to 0.1uF or less to prevent IC damage caused by the accumulation of
electric charge as mentioned above.
6. Oscillation by Output Capacitor
Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop
circuit with these ICs.
7. IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 57. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all
within the Area of Safe Operation (ASO).
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Ordering Information
B
A
8
2
9
0
Part Number
BA82904Yxxx
BA82902Yxxx
x
Y
x
x
x
-
Package
F
: SOP8
SOP14
FV : SSOP-B14
FVM : MSOP8
FJ : SOP-J14
FVJ : TSSOP-B14J
C
x
x
Packaging and forming specification
C: Automotive (Engine control unit, EPS,
ABS, and so on)
E2: Embossed tape and reel
(SOP8/SOP14/SSOP-B8/SSOP-B14
/SOP-J14/TSSOP-B14J)
TR: Embossed tape and reel
(MSOP8)
Lineup
Operating
Temperature Range
Operating
Supply Voltage
Number of
Channels
Dual
-40°C to +125°C
3V to 36V
Quad
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Package
Orderable Part Number
SOP8
Reel of 2500
BA82904YF-CE2
MSOP8
Reel of 3000
BA82904YFVM-CTR
SOP14
Reel of 2500
BA82902YF-CE2
SSOP-B14
Reel of 2500
BA82902YFV-CE2
SOP-J14
Reel of 2500
BA82902YFJ-CE2
TSSOP-B14J
Reel of 2500
BA82902YFVJ-CE2
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BA82904Yxxx-C BA82902Yxxx-C
Marking Diagrams
SOP8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
Pin 1 Mark
Pin 1 Mark
SOP14(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
Pin 1 Mark
Pin 1 Mark
SOP-J14(TOP VIEW)
Product Name
BA82904Y
BA82902Y
TSSOP-B14J (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
Pin 1 Mark
Pin 1 Mark
Package Type
Marking
82904
FVM-C
SOP8
MSOP8
F-C
SOP14
BA82902YF
FV-C
SSOP-B14
802Y
FJ-C
SOP-J14
82902YFJ
FVJ-C
TSSOP-B14J
802YJ
F-C
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Physical Dimension and Packing Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT: mm)
PKG: SOP8
Drawing No.: EX112-5001-1
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Physical Dimension and Packing Information - continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT: mm)
PKG: SOP14
Drawing No.: EX113-5001
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Physical Dimension and Packing Information - continued
Package Name
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SSOP-B14
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Physical Dimension and Packing Information - continued
Package Name
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© 2017 ROHM Co., Ltd. All rights reserved.
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MSOP8
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Physical Dimensions and Packing Information – continued
Package Name
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SOP-J14
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Physical Dimensions and Packing Information – continued
Package Name
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TSSOP-B14J
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Revision History
Date
Revision
Changes
10.May.2017
001
New Release
01.Jun.2017
002
Correction of erroneous description : P.3 Delete (Note 2)
14.Jun.2017
003
P.3 Update Orderable Parts Number
29.Jun.2017
004
P.1 Update General description
P.23 Added application hint
27.Jul.2017
005
Update Physical Dimension and Packing Information
31.Aug.2017
006
P.5, 6 Change Limits
20.Feb.2018
007
Update Lineup (BA82902YFJ-C, BA82902YFVJ-C)
15.Apr.2020
008
Correction of erroneous description : Change Gain units of page 5 and page 6
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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