BA82902YFV-CE2

Datasheet Operational Amplifier Series Automotive Excellent EMI Characteristics Ground Sense Operational Amplifiers BA82904Yxxx-C BA82902Yxxx-C Key Specifications General Description  BA82904Yxxx-C and BA82902Yxxx-C are high-gain, ground sense input Op-Amps. These ICs are monolithic ICs integrated dual or quad independent Op-Amps on a single chip. These Op-Amps have some features of low power consumption, and can operate from 3V to 36V (single power supply). BA82904Yxxx-C and BA82902Yxxx-C are manufactured for automotive requirements of engine control unit, electric power steering, and so on. Furthermore, they have the advantage of EMI tolerance dose. It is easy to replace with conventional products, and the EMI design is simple.     Operating Supply Voltage Range Single Supply: 3V to 36V Dual Supply: ±1.5V to ±18.0V Low Supply Current BA82904Yxxx-C 0.5mA (Typ) BA82902Yxxx-C 0.7mA (Typ) Input Bias Current: 20nA (Typ) 2nA (Typ) Input Offset Current: Operating Temperature Range: -40°C to +125°C Packages Features           SOP8 SOP14 SSOP-B14 MSOP8 SOP-J14 TSSOP-B14J AEC-Q100 Qualified(Note 1) Single or Dual Power Supply Operation Wide Operating Supply Voltage Range Standard Op-Amp Pin-assignments Operable from Almost GND Level for Both Input and Output Low Supply Current High Open Loop Voltage Gain Internal ESD Protection Circuit Wide Operating Temperature Range Integrated EMI Filter W(Typ) x D(Typ) x H(Max) 5.00mm x 6.20mm x 1.71mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm 2.90mm x 4.00mm x 0.90mm 8.65mm x 6.00mm x 1.65mm 5.00mm x 6.40mm x 1.20mm (Note 1) Grade 1 Applications     Engine Control Unit Electric Power Steering (EPS) Anti-Lock Braking System (ABS) Automotive Electronics Selection Guide Maximum Operating Temperature Output Current Source / Sink Automotive Supply Current 125°C BA82904YF-C BA82904YFVM-C Dual 30mA / 20mA 0.5mA Quad 30mA / 20mA 0.7mA 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 BA82902YF-C BA82902YFV-C BA82902YFJ-C BA82902YFVJ-C 〇This product has no designed protection against radioactive rays 1/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Equivalent Circuit VCC -IN OUT +IN VEE Figure 1. Equivalent Circuit (One Channel Only) Pin Configuration BA82904YF-C: SOP8 BA82904YFVM-C: MSOP8 (TOP VIEW) OUT1 1 -IN1 2 Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VEE 5 +IN2 8 VCC 7 OUT2 CH1 - + +IN1 3 CH2 + - 6 -IN2 6 -IN2 7 OUT2 8 VCC Pin No. Pin Name 1 OUT1 5 +IN2 VEE 4 BA82902YF-C: SOP14 BA82902YFV-C: SSOP-B14 BA82902YFJ-C: SOP-J14 BA82902YFVJ-C: TSSOP-B14J (TOP VIEW) 2 -IN1 14 OUT4 3 +IN1 13 -IN4 4 VCC +IN1 3 12 +IN4 5 +IN2 VCC 4 11 VEE OUT1 1 -IN1 2 CH1 - + CH4 + - 10 +IN3 +IN2 5 -IN2 6 - + CH2 + CH3 OUT2 7 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6 -IN2 7 OUT2 8 OUT3 9 -IN3 9 -IN3 8 OUT3 10 +IN3 11 VEE 12 +IN4 13 -IN4 14 OUT4 2/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit VCC-VEE 36 V Differential Input Voltage VID 36 V Input Common-mode Voltage Range VICM (VEE-0.3) to (VEE+36) V II -10 mA Tstg -55 to +150 °C Tjmax 150 °C Supply Voltage (Note 1) Input Current Storage Temperature Range Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then the input pin voltage is set to VEE or more. Recommended Operating Conditions Parameter Symbol Operating Supply Voltage Vopr Operating Temperature Topr www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Min Typ Max 3 (±1.5) -40 5 (±2.5) +25 36 (±18) +125 3/35 Unit V °C TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Thermal Resistance(Note 1) Parameter Thermal Resistance (Typ) Symbol 1s(Note 3) 2s2p(Note 4) Unit MSOP8 Junction to Ambient θJA 284.1 135.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 21 11 °C/W θJA 197.4 109.8 °C/W ΨJT 21 19 °C/W θJA 166.5 108.1 °C/W ΨJT 26 22 °C/W SOP8 Junction to Ambient (Note 2) Junction to Top Characterization Parameter SOP14 Junction to Ambient (Note 2) Junction to Top Characterization Parameter SSOP-B14 θJA 159.6 92.8 °C/W (Note 2) ΨJT 13 9 °C/W Junction to Ambient θJA 118.5 67.2 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 10 10 °C/W Junction to Ambient θJA 185.4 98.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 16 14 °C/W Junction to Ambient Junction to Top Characterization Parameter SOP-J14 TSSOP-B14J (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Electrical Characteristics ○BA82904Yxxx-C (Unless otherwise specified VCC=5V, VEE=0V) Parameter Symbol Temperature Range 25°C Input Offset Voltage(Note 1) Input Offset Current(Note 1) Input Bias Current(Note 1) Supply Current Maximum Output Voltage (High) Unit Min Typ Max - 2 6 VIO Full range - - 9 25°C - 2 40 Full range - - 50 25°C - 20 60 Full range - - 100 25°C - 0.5 1.2 Full range - - 1.2 25°C 3.5 - - 3.2 - - 27 28 - Full range - 5 20 25°C 25 100 - IB ICC VOH VOUT=1.4V VCC=5V to 30V, VOUT=1.4V nA VOUT=1.4V nA VOUT=1.4V mA RL=∞, All Op-Amps RL=2kΩ V Full range VOL Large Signal Voltage Gain AV Conditions mV IIO Maximum Output Voltage(Low) Input Common-mode Voltage Range Limits Full range 25 - - 25°C 0 - VCC-1.5 VICM Full range 0 - VCC-2.0 VCC=30V, RL=10kΩ mV RL=∞, All Op-Amps V/mV RL≥2kΩ, VCC=15V VOUT=1.4V to 11.4V V (VCC-VEE)=5V VOUT=VEE+1.4V Common-mode Rejection Ratio CMRR Full range 70 80 - dB VOUT=1.4V Power Supply Rejection Ratio PSRR Full range 70 100 - dB VCC=5V to 30V 25°C 20 30 - Output Source Current(Note 2) ISOURCE mA V+IN=1V, V-IN=0V VOUT=0V 1CH is short circuit mA V+IN=0V, V-IN=1V VOUT=5V 1CH is short circuit Output Sink Current(Note 2) Slew Rate Gain Bandwidth Product Channel Separation Full range 10 - - 25°C 10 20 - Full range 2 - - 25°C 12 40 - SR 25°C - 0.2 - GBW 25°C - 0.5 - CS 25°C - 120 - ISINK V+IN=0V, V-IN=1V VOUT=200mV VCC=15V, AV=0dB V/μs RL=2kΩ, CL=100pF VCC=30V, RL=2kΩ MHz CL=100pF μA dB f=1kHz, input referred (Note 1) Absolute value (Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current. When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Electrical Characteristics - continued ○BA82902Yxxx-C (Unless otherwise specified VCC=5V, VEE=0V) Parameter Symbol Temperature Range 25°C Input Offset Voltage(Note 1) Input Offset Current(Note 1) Input Bias Current(Note 1) Supply Current Maximum Output Voltage (High) Unit Min Typ Max - 2 6 VIO Full range - - 9 25°C - 2 40 Full range - - 50 25°C - 20 60 Full range - - 100 25°C - 0.7 2 Full range - - 3 25°C 3.5 - - 3.2 - - 27 28 - Full range - 5 20 25°C 25 100 - IB ICC VOH VOUT=1.4V VCC=5V to 30V, VOUT=1.4V nA VOUT=1.4V nA VOUT=1.4V mA RL=∞, All Op-Amps RL=2kΩ V Full range VOL Large Signal Voltage Gain AV Conditions mV IIO Maximum Output Voltage(Low) Input Common-mode Voltage Range Limits Full range 25 - - 25°C 0 - VCC-1.5 VICM Full range 0 - VCC-2.0 VCC=30V, RL=10kΩ mV RL=∞, All Op-Amps V/mV RL≥2kΩ, VCC=15V VOUT=1.4V to 11.4V V (VCC-VEE)=5V VOUT=VEE+1.4V Common-mode Rejection Ratio CMRR Full range 70 80 - dB VOUT=1.4V Power Supply Rejection Ratio PSRR Full range 70 100 - dB VCC=5V to 30V 25°C 20 30 - Output Source Current(Note 2) ISOURCE mA V+IN=1V, V-IN=0V VOUT=0V 1CH is short circuit mA V+IN=0V, V-IN=1V VOUT=5V 1CH is short circuit Output Sink Current(Note 2) Slew Rate Gain Bandwidth Product Channel Separation Full range 10 - - 25°C 10 20 - Full range 2 - - 25°C 12 40 - SR 25°C - 0.2 - GBW 25°C - 0.5 - CS 25°C - 120 - ISINK V+IN=0V, V-IN=1V VOUT=200mV VCC=15V, Av=0dB V/μs RL=2kΩ, CL=100pF VCC=30V, RL=2kΩ MHz CL=100pF μA dB f=1kHz, input referred (Note 1) Absolute value (Note 2) Under high temperatures, it is important to consider the Tjmax and Thermal Resistance when selecting the output current. When the output pin is continuously shorted, the output current may reduce because of the internal temperature rise by heating. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s or general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the condition which must not be exceeded even momentarily. Applying of voltage in excess of absolute maximum rating or use at outside the temperature range which is provided in the absolute maximum ratings may cause deteriorating the characteristics of the IC or destroying it. 1.1 Supply Voltage (VCC-VEE) Indicates the maximum voltage that can be applied between the positive power supply pin and negative power supply pin without deteriorating the characteristics of internal circuit or destroying the IC. 1.2 Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting pin and inverting pin without deteriorating the characteristics of the IC or without destroying it. 1.3 Input Common-mode Voltage Range (VICM) Indicates the voltage range that can be applied to the non-inverting pin and inverting pin without deteriorating the characteristics of the IC or without destroying it. Input common-mode voltage range of the maximum ratings does not assure normal operation of the IC. For normal operation, use the IC within the input common-mode voltage range of electrical characteristics. 1.4 Storage Temperature Range (Tstg) The storage temperature range denotes the range of temperatures the IC can be stored without causing excessive deteriorating the characteristics of the IC. 2. Electrical Characteristics 2.1 Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated as the input voltage difference required for setting the output voltage at 0V. 2.2 Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting pins. 2.3 Input Bias Current (IB) Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. 2.4 Supply Current (ICC) Indicates the current that flows within the IC under no-load conditions. 2.5 Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage High and maximum output voltage Low. Maximum output voltage (High) indicates the upper limit of output voltage while maximum output voltage (Low) indicates the lower limit. 2.6 Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage regarding the voltage difference between non-inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output Voltage) / (Differential Input Voltage) 2.7 Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. 2.8 Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input Common-mode Voltage) / (Input Offset Voltage Fluctuation) 2.9 Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of Power Supply Voltage) / (Input Offset Voltage Fluctuation) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Description of Electrical Characteristics - continued 2.10 Output Source Current / Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. It is typically divided into output source current and output sink current. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. 2.11 Slew Rate (SR) This parameter indicates the operation speed of the Op-Amps. Indicates the rate at which the output voltage can change per specified unit time. 2.12 Gain Bandwidth Product (GBW) This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of 6 dB/octave. 2.13 Channel Separation (CS) Indicates the fluctuation in the output voltage of the other channel regarding the change of output voltage of the channel which is driven. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves 1.0 1.0 0.8 0.8 Ta=+25ºC Ta=-40ºC 0.6 Supply Current: Icc[mA] Supply Current: Icc[mA] ○BA82904Yxxx-C 0.4 Ta=+125ºC 0.2 VCC=5V 0.4 VCC=3V 0.2 0.0 0.0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 2. Supply Current vs Supply Voltage -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 3. Supply Current vs Ambient Temperature 5 30 Maximum Output Voltage: VOH[V] 40 Maximum Output Voltage: VOH[V] VCC=36V 0.6 Ta=+25ºC Ta=+125ºC 20 Ta=-40ºC 10 4 3 2 1 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 4. Maximum Output Voltage vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 100 125 Ambient Temperature: Ta[°C] 150 Figure 5. Maximum Output Voltage vs Ambient Temperature (VCC=5V, RL=2kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82904Yxxx-C 50 50 Output Source Current: I SOURCE[mA] Output Source Current: I SOURCE[mA] Ta=-40ºC 40 Ta=+25ºC 30 20 Ta=+125ºC 10 VCC=5V VCC=36V 30 VCC=3V 20 10 0 0 0 1 2 3 4 Output Voltage: V OUT [V] -50 5 Figure 6. Output Source Current vs Output Voltage (VCC=5V) 100 50 10 40 Ta=+125ºC 1 Ta=+25ºC 0.1 Ta=-40ºC 0.01 0.001 0.0 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 7. Output Source Current vs Ambient Temperature (VOUT=0V) Output Sink Current: I SINK[mA] Output Sink Current: I SINK[mA] 40 VCC=36V 30 VCC=5V 20 VCC=3V 10 0 1.0 2.0 3.0 4.0 Output Voltage: V OUT [V] -50 5.0 Figure 8. Output Sink Current vs Output Voltage (VCC=5V) -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 9. Output Sink Current vs Ambient Temperature (VOUT=VCC) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82904Yxxx-C 80 80 70 Ta=+25ºC Output Sink Current: I SINK[uA] Output Sink Current: I SINK[uA] 70 60 Ta=-40ºC 50 40 Ta=+125ºC 30 20 50 VCC=5V 40 VCC=3V 30 20 10 10 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 8 6 6 Ta=-40ºC Input Offset Voltage: VIO[mV] 8 4 Ta=+25ºC 2 0 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 11. Output Sink Current vs Ambient Temperature (VOUT=0.2V) Figure 10. Output Sink Current vs Supply Voltage (VOUT=0.2V) Input Offset Voltage: VIO[mV] VCC=36V 60 Ta=+125ºC -2 -4 4 VCC=5V VCC=36V 2 VCC=3V 0 -2 -4 -6 -6 -8 -8 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 Ambient Temperature: Ta[°C] 150 Figure 13. Input Offset Voltage vs Ambient Temperature (VICM=0V, VOUT=1.4V) Figure 12. Input Offset Voltage vs Supply Voltage (VICM=0V, VOUT=1.4V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued 50 50 40 40 Input Bias Current: IB[nA] Input Bias Current: IB[nA] ○BA82904Yxxx-C 30 Ta=+25ºC Ta=-40ºC 20 Ta=+125ºC 10 30 VCC=36V 20 VCC=3V VCC=5V 10 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 14. Input Bias Current vs Supply Voltage (VICM=0V, VOUT=1.4V) -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 15. Input Bias Current vs Ambient Temperature (VICM=0V, VOUT=1.4V) 50 10 8 6 Input Offset Voltage: VIO [mV] Input Bias Current: IB[nA] 40 30 20 10 0 Ta=-40ºC 4 Ta=+25ºC 2 0 Ta=+125ºC -2 -4 -6 -8 -10 -10 -50 -25 -1 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 16. Input Bias Current vs Ambient Temperature (VCC=30V, VICM=28V, VOUT=1.4V) 0 1 2 3 4 5 Input Common-mode Voltage: VICM [V] Figure 17. Input Offset Voltage vs Input Common-mode Voltage (VCC=5V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82904Yxxx-C 10 Input Offset Current: IIO[nA] Input Offset Current: IIO[nA] 10 5 Ta=-40ºC Ta=+25ºC 0 Ta=+125ºC -5 5 VCC=36V VCC=5V 0 VCC=3V -5 -10 -10 0 10 20 30 Supply Voltage: Vcc[V] -50 40 140 130 130 Large Signal Voltage Gain: AV[dB] Large Signal Voltage Gain: AV[dB] 140 120 Ta=+25ºC 110 100 90 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 19. Input Offset Current vs Ambient Temperature (VICM=0V, VOUT=1.4V) Figure 18. Input Offset Current vs Supply Voltage (VICM=0V, VOUT=1.4V) Ta=-40ºC -25 Ta=+125ºC 80 120 VCC=36V 110 100 VCC=5V 90 VCC=3V 80 70 70 60 60 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 21. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) Figure 20. Large Signal Voltage Gain vs Supply Voltage (RL=2kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82904Yxxx-C 140 Common Mode Rejection Ratio: CMRR[dB] Common Mode Rejection Ratio: CMRR[dB] 140 120 Ta=+25ºC Ta=-40ºC 100 80 Ta=+125ºC 60 120 VCC=36V 100 VCC=5V 80 VCC=3V 60 40 40 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 22. Common Mode Rejection Ratio vs Supply Voltage (VOUT=1.4V) -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 23. Common Mode Rejection Ratio vs Ambient Temperature (VOUT=1.4V) Power Supply Rejection Ratio: PSRR[dB] 140 130 120 110 100 90 80 70 60 -50 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 24. Power Supply Rejection Ratio vs Ambient Temperature (VCC=5V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued 2.0 2.0 1.6 1.6 Supply Current: Icc[mA] Supply Current: Icc[mA] ○BA82902Yxxx-C 1.2 Ta=+25ºC Ta=-40ºC 0.8 Ta=+125ºC 1.2 0.8 VCC=5V 0.4 0.4 VCC=3V 0.0 0.0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 26. Supply Current vs Ambient Temperature Figure 25. Supply Current vs Supply Voltage 5 30 Maximum Output Voltage: VOH[V] 40 Maximum Output Voltage: VOH[V] VCC=36V Ta=+25ºC Ta=+125ºC 20 Ta=-40ºC 10 4 3 2 1 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 27. Maximum Output Voltage vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 100 125 Ambient Temperature: Ta[°C] 150 Figure 28. Maximum Output Voltage vs Ambient Temperature (VCC=5V, RL=2kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82902Yxxx-C 50 50 Output Source Current: I SOURCE[mA] Output Source Current: I SOURCE[mA] Ta=-40ºC 40 Ta=+25ºC 30 20 Ta=+125ºC 10 VCC=5V VCC=36V 30 VCC=3V 20 10 0 0 0 1 2 3 4 Output Voltage: V OUT [V] -50 5 50 10 40 Output Sink Current: I SINK[mA] 100 Ta=+125ºC 1 Ta=+25ºC 0.1 Ta=-40ºC 0.01 0.001 0.0 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 30. Output Source Current vs Ambient Temperature (VOUT=0V) Figure 29. Output Source Current vs Output Voltage (VCC=5V) Output Sink Current: I SINK[mA] 40 VCC=36V 30 VCC=5V 20 VCC=3V 10 0 1.0 2.0 3.0 4.0 Output Voltage: V OUT [V] -50 5.0 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 32. Output Sink Current vs Ambient Temperature (VOUT=VCC) Figure 31. Output Sink Current vs Output Voltage (VCC=5V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82902Yxxx-C 80 80 70 Ta=+25ºC Output Sink Current: I SINK[uA] Output Sink Current: I SINK[uA] 70 60 Ta=-40ºC 50 40 Ta=+125ºC 30 20 50 VCC=5V 40 VCC=3V 30 20 10 10 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 33. Output Sink Current vs Supply Voltage (VOUT=0.2V) 8 8 6 6 4 Ta=-40ºC Ta=+25ºC 2 0 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 34. Output Sink Current vs Ambient Temperature (VOUT=0.2V) Input Offset Voltage: VIO[mV] Input Offset Voltage: VIO[mV] VCC=36V 60 Ta=+125ºC -2 -4 4 VCC=5V VCC=36V 2 VCC=3V 0 -2 -4 -6 -6 -8 -8 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 Ambient Temperature: Ta[°C] 150 Figure 36. Input Offset Voltage vs Ambient Temperature (VICM=0V, VOUT=1.4V) Figure 35. Input Offset Voltage vs Supply Voltage (VICM=0V, VOUT=1.4V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued 50 50 40 40 Input Bias Current: IB[nA] Input Bias Current: IB[nA] ○BA82902Yxxx-C 30 Ta=+25ºC Ta=-40ºC 20 Ta=+125ºC 10 30 VCC=36V 20 VCC=3V VCC=5V 10 0 0 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 38. Input Bias Current vs Ambient Temperature (VICM=0V, VOUT=1.4V) Figure 37. Input Bias Current vs Supply Voltage (VICM=0V, VOUT=1.4V) 50 10 8 6 Input Offset Voltage: VIO [mV] Input Bias Current: IB[nA] 40 30 20 10 0 Ta=-40ºC 4 Ta=+25ºC 2 0 Ta=+125ºC -2 -4 -6 -8 -10 -10 -50 -25 -1 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] 0 1 2 3 4 5 Input Common-mode Voltage: VICM [V] Figure 40. Input Offset Voltage vs Input Common-mode Voltage (VCC=5V) Figure 39. Input Bias Current vs Ambient Temperature (VCC=30V, VICM=28V, VOUT=1.4V) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82902Yxxx-C 10 Input Offset Current: IIO[nA] Input Offset Current: IIO[nA] 10 5 Ta=-40ºC Ta=+25ºC 0 Ta=+125ºC -5 5 VCC=36V VCC=5V 0 VCC=3V -5 -10 -10 0 10 20 30 Supply Voltage: Vcc[V] -50 40 140 140 130 130 120 Ta=-40ºC Ta=+25ºC 110 100 90 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 42. Input Offset Current vs Ambient Temperature (VICM=0V, VOUT=1.4V) Large Signal Voltage Gain: AV[dB] Large Signal Voltage Gain: AV[dB] Figure 41. Input Offset Current vs Supply Voltage (VICM=0V, VOUT=1.4V) -25 Ta=+125ºC 80 120 VCC=36V 110 100 VCC=5V 90 VCC=3V 80 70 70 60 60 0 10 20 30 Supply Voltage: Vcc[V] -50 40 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 44. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) Figure 43. Large Signal Voltage Gain vs Supply Voltage (RL=2kΩ) (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Typical Performance Curves - continued ○BA82902Yxxx-C 140 Common Mode Rejection Ratio: CMRR[dB] Common Mode Rejection Ratio: CMRR[dB] 140 120 Ta=+25ºC Ta=-40ºC 100 80 Ta=+125ºC 60 120 VCC=36V 100 VCC=5V 80 VCC=3V 60 40 40 0 10 20 30 Supply Voltage: Vcc[V] -50 40 Figure 45. Common Mode Rejection Ratio vs Supply Voltage (VOUT=1.4V) -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 46. Common Mode Rejection Ratio vs Ambient Temperature (VOUT=1.4V) Power Supply Rejection Ratio: PSRR[dB] 140 130 120 110 100 90 80 70 60 -50 -25 0 25 50 75 100 125 150 Ambient Temperature: Ta[°C] Figure 47. Power Supply Rejection Ratio vs Ambient Temperature (Note) The above data is measurement value of typical sample, it is not guaranteed. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Application Information Test Circuit 1: Measurement Condition VCC, VEE, VEK, VICM Unit: V Parameter VF SW1 SW2 SW3 VCC VEE VEK VICM Calculation Input Offset Voltage VF1 ON ON OFF 5 to 30 0 -1.4 0 1 Input Offset Current VF2 OFF OFF OFF 5 0 -1.4 0 2 VF3 OFF ON VF4 ON OFF OFF 5 0 -1.4 0 3 ON ON ON 15 0 -1.4 0 15 0 -11.4 0 ON ON OFF 5 0 -1.4 0 5 0 -1.4 3.5 ON ON OFF 5 0 -1.4 0 30 0 -1.4 0 Input Bias Current VF5 Large Signal Voltage Gain VF6 VF7 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF8 VF9 Power Supply Rejection Ratio VF10 5 6 0.1µF - Calculation 1. Input Offset Voltage (VIO) V IO  4 RF=50kΩ V F1 1 + RF / RS 500kΩ [V] SW1 2. Input Offset Current (IIO) V F2 - V F1 I IO  R I × (1 + R F / R S ) 15V VEK RS=50Ω 0.1µF VCC VO RI=10kΩ 500kΩ DUT [A] RI=10kΩ 1000pF RL VICM 3. Input Bias Current (IB) V F4 - V F3 IB  2 × R I × (1 + R F / R S ) NULL SW3 RS=50Ω 50kΩ SW2 VEE V VF -15V [A] Figure 48. Test Circuit 1 (One Channel Only) 4. Large Signal Voltage Gain (AV) AV  20 × Log ΔV EK × (1 + R F /RS ) V F5 - V F6 [dB] 5. Common-mode Rejection Ration (CMRR) CMRR  20 × Log ΔV ICM × (1 + R F /RS ) V F8 - V F7 [dB] 6. Power Supply Rejection Ratio (PSRR) PSRR  20 × Log ΔVCC × (1 + R F /RS ) [dB] V F10 - V F9 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Application Information - continued Test Circuit 2: Switch Condition SW 1 SW No. SW 2 SW 3 SW 4 SW 5 SW 6 SW 7 SW 8 SW 9 SW 10 SW 11 SW 12 SW 13 SW 14 Supply Current OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage (High) OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF Maximum Output Voltage (Low) OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF Output Source Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Output Sink Current OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON Slew Rate OFF OFF OFF ON OFF OFF OFF ON Gain Bandwidth Product Equivalent Input Noise Voltage ON ON ON OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF ON ON ON OFF OFF OFF ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF SW4 SW5 Input voltage R2 VH VCC A VL － SW1 SW2 Output voltage ＋ Input wave time SW3 SR＝ΔV/Δt RS SW7 SW6 R1 SW8 SW9 SW10 SW11 SW12 SW13 SW14 90% VH ΔV VEE C A ～ V IN- ～ VIN+ RL V ～ CL V 10% VL VOUT Δt Output wave Figure 49. Test Circuit 2 (One Channel Only) time Figure 50. Slew Rate Waveform Test Circuit 3: Channel Separation Measurement Condition VCC VCC R1//R2 OTHER CH R1//R2 VEE R1 VEE R2 V VIN 40dB amplifier VOUT1 =0.5[Vrms] R1 R2 V VOUT2 40dB amplifier CS＝20×log 100×VOUT1 VOUT2 (R1=1kΩ, R2=100kΩ) Figure 51. Test Circuit 3 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Application Information - continued EMI Immunity BA82904Yxxx-C and BA82902Yxxx-C have high tolerance for electromagnetic interference from the outside because they have EMI filter, and the EMI design is simple. The data of the IC simple substance on ROHM board are as follows. They are most suitable to replace from conventional products. The test condition is based on ISO11452-2. Based on ISO11452-2 Test Circuit: Voltage Follower VCC: 12V VIN+: 6V Test Method: Substituted Law (Progressive Wave) Field Intensity: 200V/m Test Wave: CW (Continuous Wave) Frequency: 200MHz – 1000MHz (2% step) Conventional Product BA82904Yxxx-C, BA82902Yxxx-C Figure 52. EMI Characteristics Figure 53. EMI Evaluation Board (BA82904Yxxx-C) Figure 54. EMI Evaluation Board (BA82902Yxxx-C) Figure 55. Measurement Circuit of EMI Evaluation (Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed. Design and Evaluate in actual application before use. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Application Information - continued VCC 1. Unused Circuits When there are unused circuits, it is recommended that they are connected as in Figure 56, and set the non-inverting input pin to electric potential within the input common-mode voltage range (VICM). 2. Input Voltage Applying VEE+36V to the input pin is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Note that the circuit operates normally only when the input voltage is within the common-mode input voltage range of the electric characteristics. + Connect to VICM VICM VEE Figure 56. Example of Application Circuit for Unused Op-amp 3. Power Supply (single / dual) The Op-Amp operates when the voltage supplied is between the VCC and VEE pin. Therefore, the single supply Op-Amp can be used as dual supply Op-Amp as well. 4. IC Operation The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and charging of the output current. Connecting a resistor between the output pin and the VEE pin, and increasing the bias current for Class A operation will suppress crossover distortion. 5. Output Capacitor When the VCC pin is shorted to VEE(GND) electric potential in a state where electric charge is accumulated in the external capacitor that is connected to the output pin, the accumulated electric charge will flow through parasitic elements or pin protection elements inside the circuit and discharges to the VCC pin. It may cause damage to the elements inside the circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative feedback circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, set the value of the capacitor connected to the output pin to 0.1uF or less to prevent IC damage caused by the accumulation of electric charge as mentioned above. 6. Oscillation by Output Capacitor Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop circuit with these ICs. 7. IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 24/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 25/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 57. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Ordering Information B A 8 2 9 0 Part Number BA82904Yxxx BA82902Yxxx x Y x x x - Package F : SOP8 SOP14 FV : SSOP-B14 FVM : MSOP8 FJ : SOP-J14 FVJ : TSSOP-B14J C x x Packaging and forming specification C: Automotive (Engine control unit, EPS, ABS, and so on) E2: Embossed tape and reel (SOP8/SOP14/SSOP-B8/SSOP-B14 /SOP-J14/TSSOP-B14J) TR: Embossed tape and reel (MSOP8) Lineup Operating Temperature Range Operating Supply Voltage Number of Channels Dual -40°C to +125°C 3V to 36V Quad www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Package Orderable Part Number SOP8 Reel of 2500 BA82904YF-CE2 MSOP8 Reel of 3000 BA82904YFVM-CTR SOP14 Reel of 2500 BA82902YF-CE2 SSOP-B14 Reel of 2500 BA82902YFV-CE2 SOP-J14 Reel of 2500 BA82902YFJ-CE2 TSSOP-B14J Reel of 2500 BA82902YFVJ-CE2 27/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Marking Diagrams SOP8(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Pin 1 Mark Pin 1 Mark SOP14(TOP VIEW) SSOP-B14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Pin 1 Mark Pin 1 Mark SOP-J14(TOP VIEW) Product Name BA82904Y BA82902Y TSSOP-B14J (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Pin 1 Mark Pin 1 Mark Package Type Marking 82904 FVM-C SOP8 MSOP8 F-C SOP14 BA82902YF FV-C SSOP-B14 802Y FJ-C SOP-J14 82902YFJ FVJ-C TSSOP-B14J 802YJ F-C www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 82904 28/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimension and Packing Information Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT: mm) PKG: SOP8 Drawing No.: EX112-5001-1 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimension and Packing Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT: mm) PKG: SOP14 Drawing No.: EX113-5001 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimension and Packing Information - continued Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP-B14 31/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimension and Packing Information - continued Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 MSOP8 32/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimensions and Packing Information – continued Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SOP-J14 33/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Physical Dimensions and Packing Information – continued Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 TSSOP-B14J 34/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 BA82904Yxxx-C BA82902Yxxx-C Revision History Date Revision Changes 10.May.2017 001 New Release 01.Jun.2017 002 Correction of erroneous description : P.3 Delete (Note 2) 14.Jun.2017 003 P.3 Update Orderable Parts Number 29.Jun.2017 004 P.1 Update General description P.23 Added application hint 27.Jul.2017 005 Update Physical Dimension and Packing Information 31.Aug.2017 006 P.5, 6 Change Limits 20.Feb.2018 007 Update Lineup (BA82902YFJ-C, BA82902YFVJ-C) 15.Apr.2020 008 Correction of erroneous description : Change Gain units of page 5 and page 6 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/35 TSZ02201-0GLG0G200040-1-2 15.Apr.2020 Rev.008 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001