BD00C0AWFP-E2

Datasheet Single-Output LDO Regulator 1A Variable Output LDO Regulators BD00C0AWxx series ●General Description The BD00C0AW Series is a low-saturation regulator. The output voltage can be arbitrarily configured depending on the external resistor combination. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuit and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. ●Key Specifications  Supply Voltage range:  Output voltage range:  Output Current:  Output voltage Precision:  Operating temperature range: ●Packages TO252-5 TO220CP-V5 ●Features  Output Current capability : 1A  High Output Voltage Precision : ±1%  Low saturation with PDMOS output  Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuit  Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading  Low ESR Capacitor 4.0V to 26.5V 3.0V to 15.0V 1A ±1% -40℃≤Ta≤+105℃ W (Typ.) x D (Typ.) x H (Max.) 6.50mm x 9.50mm x 2.50mm 10.00mm x 20.12mm x 4.60mm ●Applications Audiovisual equipment, FPD’s, televisions, personal computers or any other consumer device TO252-5 TO220CP-V5 ●Typical Application Circuit Vcc Vo R2 Vcc Cin CTL Cout ADJ GND R1 Figure 1. Typical Application Circuit ●Ordering Information B Part Number D 0 0 Output voltage 00:Variable C 0 Current capacity C0A：1A A W - Package E2 Packaging specification E2: Embossed tape and reel Orderable Part Number TO252-5 Reel of 2000 BD00C0AWFP-E2 TO220CP-V5 Reel of 500 BD00C0AWCP-V5E2 ○Product structure : Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 x Shutdown Package switch FP : TO252-5 W : With switch CP-V5:TO220CP-V5 ●Lineup Maximum output current (Max.) 1A x ○This product is not designed for protection against radioactive rays 1/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Pin Configurations TO252-5 (TOP VIEW) TO220CP-V5 (TOP VIEW) 3 1 2 4 5 1 2 3 4 5 Figure 2. Pin Configurations ●Pin Description Pin No. Symbol (BD00C0AWFP / BD00C0AWCP-V5) Function 1 CTL Output Control Pin 2 VCC Power Supply Pin 3 N.C. / GND N.C. Pin / GND 4 VO Output Pin 5 ADJ Variable Pin Fin GND / － GND / - ※N.C.Pin can be open. Because it isn't connect it inside of IC. ●Block Diagram GND / - FIN GND VREF :基準電圧回路 OCP :過電流保護回路 VREF: Bandgap Reference TSD :温度保護回路 Driver :出力ドライブ回路 OCP: Over Current Protection Circuit VREF TSD: Thermal Shut-Down Circuit Driver: Power Transistor Driver Driver OCP TSD 1 2 CTL Vcc 3 N.C.(TO252-5） N.C. / GND GND(HRP5) 4 5 Vo ADJ Figure 3. Block Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit Supply Voltage *1 VCC -0.3 to +35.0 V Output Control Voltage *2 VCTL -0.3 to +35.0 V Power Dissipation (TO252-5) *3 Pd 1.3 W Power Dissipation (TO220CP-V5) *4 Pd 1.85 W Operating Temperature Range Topr -40 to +105 ℃ Storage Temperature Range Tstg -55 to +150 ℃ Tjmax +150 ℃ Maximum Junction Temperature *1 Not to exceed Pd. *2 The order of starting up power supply (VCC) and CTL pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. *3 TO252-5:Reduced by 10.4mW / ℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm. *4 TO220CP-V5: Reduced by 14.8mW / °C over Ta = 25°C without heatsink. ●Recommended Operating Ratings (Ta=25℃) Parameter Symbol Min. Max. Unit Supply Voltage VCC 4.0 26.5 V Output Control Voltage VCTL 0 26.5 V Output Current IO 0 1.0 A Output Voltage VO 3.0 15.0 V ●Electrical Characteristics Unless otherwise specified, Ta=25℃, VCC=10V, VCTL=5V, IO=0mA, VO=5.0Vsetting ( Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ) Guaranteed Limits Parameter Symbol Unit Min. Typ. Max. Conditions Shutdown Current Isd － 0 10 µA Circuit Current Ib － 0.5 1.0 mA ADJ Terminal Voltage VADJ 0.742 0.750 0.758 V IO=50mA Dropout Voltage ΔVd － 0.3 0.5 V VCC=VO×0.95, IO=500mA Ripple Rejection R.R. 45 55 － dB f=120Hz,ein =1Vrms, IO=100mA Line Regulation Reg.I － 20 60 mV VCC=6→25V Load Regulation Reg.L － VO×0.010 VO×0.015 V IO=5mA→1A Temperature Coefficient of Output Voltage Tcvo.1 － +0.04 － %/℃ IO=5mA,Tj=-40℃ to -20℃ Tcvo.2 － ±0.005 － %/℃ IO=5mA,Tj=-20℃ to +105℃ CTL ON Mode Voltage VthH 2.0 － － V ACTIVE MODE CTL OFF Mode Voltage VthL － － 0.8 V OFF MODE CTL Bias Current ICTL － 25 50 µA VCTL=0V *1 *1 ein : Input Voltage Ripple www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Typical Performance Curves BD00C0AW Series (VO=5.0V output setting) Unless otherwise specified, Ta=25℃, VCC=10V, VCTL=5V, IO=0mA, VO=5.0V (Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ) 18 Circuit Current:Ib + IFEEDBACK_R [mA] 1.0 15 Shutdown Current:Isd [μA] 0.8 0.6 0.4 0.2 12 9 6 3 0 0.0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 2 4 8 10 12 14 16 18 20 22 24 26 Figure 5. Shutdown Current Figure 4. Circuit Current (IFEEDBACK_R≒75µA) 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 6 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] 4 3 2 4 3 2 1 1 0 0 0 2 4 6 0 8 10 12 14 16 18 20 22 24 26 4 6 8 10 12 14 16 18 20 22 24 26 Figure 7. Line Regulation (IO=500mA) Figure 6. Line Regulation (IO=0mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2 Supply Voltage:Vcc [V] Supply Voltage:Vcc [V] 4/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Typical Performance Curves - Continued 6 1,000 900 Dropout Voltage : ΔVd [mV] Output Voltage:Vo [V] 5 4 3 2 1 800 700 600 500 400 300 200 100 0 0 0 400 800 1200 1600 2000 0 2400 200 600 800 1000 Output Current:Io [mA] Output Current:Io [mA] Figure 8. Load Regulation Figure 9. Dropout Voltage (VCC=4.75V) (lO=0mA→1000mA) 6 80 70 5 Output Voltage: Vo [V] Ripple Rejection:R.R. [dB] 400 60 50 40 30 4 3 2 20 1 10 0 10 100 1000 10000 0 100000 1000000 -40 Frequency: f [Hz] 0 20 40 60 80 100 Ambient Temperature: [℃] Figure 11. Output Voltage Temperature Characteristic Figure 10. Ripple Rejection (lO=100mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 -20 5/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Typical Performance Curves - Continued 160 1.0 CTL Bias Current:ICTL [μA] Circuit Current:Ib+IFEEDBACK_R [mA] 140 0.8 0.6 0.4 100 80 60 40 0.2 20 0 0.0 0 200 400 600 800 0 1000 2 4 6 8 10 12 14 16 18 20 22 24 26 Output Current:Io [mA] Control Voltage: VCTL[V] Figure 12. Circuit Current (lO=0mA→1000 mA) (IFEEDBACK_R≒75µA) Figure 13. CTL Voltage vs CTL Current 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] 120 4 3 2 1 4 3 2 1 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 130 Control Voltage: VCTL[V] 150 160 170 180 190 Ambient Temperature:Ta [℃] Figure 15. Thermal Shutdown Circuit Characteristic Figure 14. CTL Voltage vs Output Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 140 6/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Measurement Circuit for Reference Data A Vo Vcc Vo Vcc 56.7kΩ 1µF CTL 56.7kΩ 1µF 1µF GND CTL ADJ 10kΩ 5V Vo Vcc 56.7kΩ 1µF 1µF GND CTL ADJ 10kΩ A 1µF GND ADJ V 10kΩ 5V IFEEDBACK _R Measurement Circuit Fig.14 Measurement Circuit of of Figure MeasurementCircuit Circuitof ofFigure Fig.2 5 Measurement Measurement Circuit of Figure 6 Measurement Circuit of Fig.3 V Vo Vcc Vo Vcc 56.7kΩ 56.7kΩ 1µF 1µF CTL GND 56.7kΩ 1µF 1µF ADJ CTL V GND ADJ ～ CTL 56.7kΩ 56.7kΩ 1µF 1µF CTL ADJ GND ADJ GND ADJ 10V 10kΩ 5V 1µF CTL V 10V 100mA 10V Vo Vcc 1µF 1µF GND 10kΩ Measurement Circuit of of Figure Measurement Circuit Fig.69 Vo Vcc 1µF A ADJ 5V Measurement MeasurementCircuit CircuitofofFigure Fig.5 8 56.7kΩ 1Vrms GND 4.75V Vo Vcc CTL 10kΩ 5V Measurement MeasurementCircuit CircuitofofFigure Fig.4 7 1µF 1µF A 10V 500mA 10kΩ 5V Vo Vcc 10kΩ 10kΩ 5V IFEEDBACK _R 5V A Measurement Circuit of Fig.7 Figure 10 Measurement Circuit of Fig.811 Measurement Circuit of Figure Vo Vcc Vo Vcc 56.7kΩ 1µF A GND Vcc Vo CTL ADJ 56.7kΩ 1µF CTL Measurement Circuit of Fig.912 Measurement Circuit of Figure CTL 10V 56.7kΩ 1µF 1µF ADJ GND ADJ V www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 GND V 10V 10V 10kΩ Measurement Circuit of Figure 13 Measurement Circuit of Fig.10 1µF 1µF 10kΩ Measurement MeasurementCircuit CircuitofofFigure Fig.1114 7/18 5V 10kΩ Measurement Measurement Circuit of Fig.12 Figure 15 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Application Examples ・Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V on the VCC pin. VCC GND Figure 16. ・Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. VCC GND Figure 17. ・Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. protection diode should be inserted on the output to protect the IC. In such cases, a Vo Figure 18. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Power Dissipation TO252-5 5 Mounted on a Rohm standard board Board size : 70mm×70mm×1.6mm Copper foil area :7mm×7mm Power dissipation Pd(W) 4 TO252-5 θja=96.2(℃/W) 3 2 1.30 1 0 0 25 50 75 100 125 150 Ambient Temperature Ta(℃) Figure 19. TO252-5 5 IC mounted on a ROHM standard board Board size：70mm×70mm×1.6mm Copper area：7mm×7mm ③4.80 Power dissipation Pd(W) 4 ②3.50 ①:2-layer PCB (Copper foil area on the reverse side of PCB:15mm×15mm) ②:2-layer PCB (Copper foil area on the reverse side of PCB:70mm×70mm) ③:4-layer PCB (Copper foil on the reverse side of PCB:70mm×70mm) 3 ①1.85 2 1 ①:θja=67.6℃/W ②:θja=35.7℃/W ③:θja=26.0℃/W 0 0 25 50 75 100 125 Ambient Temperature Ta(℃) Figure 20. 150 TO220CP-V5 25 ①:IC Only θja=67.6(℃/W) ②:Aluminum heat dissipation board θja=6.3(℃/W) (Reference Data) ②20.0 (Reference data)) Power dissipation Pd (W) 20 15 10 5 ①1.85 0 0 25 50 75 100 125 Ambient Temperature Ta(℃) Figure 21. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 150 9/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series When operating at temperature more than Ta=25℃, please refer to the power dissipation characteristic curve shown in Figure 19 to Figure 21. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Figure 19 to Figure 21 show the acceptable power dissipation characteristic curves of TO252-5 package and TO220CP-V5 package. Even when the ambient temperature (Ta) is at normal temperature (25℃), the chip junction temperature (Tj) may be quite high so please operate the IC at temperatures less than the acceptable power dissipation. The calculation method for power consumption Pc(W) is as follows :(Figure 20③ and Figure 21) Pc=(VCC-VO)×IO+VCC×Ib Acceptable loss Pd≥Pc VCC: Input voltage VO: Output voltage Solving this for load current IO in order to operate within the acceptable loss, IO: Load current Circuit current Ib: Pd－VCC×Ib (Please refer to Figure 12 for Ib.) I O≤ Ishort: Short current VCC－VO It is then possible to find the maximum load current Io Max with respect to the applied voltage VCC at the time of thermal design. Calculation Example) When TO252-5, Ta=85℃, VCC=10V, VO=5V I O≤ 2.496－10×Ib 5 IO≤498.2mA Figure 20③: θja=26.0℃/W → -38.4mW/℃ 25℃=4.80W → 85℃=2.496W (Ib: 0.5mA) Calculation Example) When TO220CP-V5, Ta=85℃, VCC=25V, VO=5V I O≤ 10.4－25×Ib 20 IO≤ 519.4mA Figure 21 (Aluminium heat dissipation board) θja=6.3℃/W → -160mW/℃ 25℃=20W → 85℃=10.4W (Ib:0.5mA) Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between V O and GND) is: Pc=VCC×(Ib+Ishort) (Please refer to Figure 8 for Ishort.) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Input / Output Equivalent Circuit Diagrams VCC terminal CTL terminal 200kΩ Vcc 1kΩ CTL 200kΩ IC VO terminal ADJ terminal Vcc Vo 1kΩ 15kΩ ADJ Vo 35kΩ Figure 22. ●Output Voltage Configuration Method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 23. Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R1. Vo R2 ADJ≒0.75V VADJ≒0.75V (TYP.) IC VO ≒ VADJ × (R1+R2) / R1 ADJ pin R1 Figure 23. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Operational Notes 1. Absolute maximum ratings Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. Transient characteristics should be sufficiently verified.. 3. GND electric potential Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that, including the transient, none of the pin’s voltages are less than the GND pin voltage. 4. Ground wiring pattern When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. 5. Inter-pin shorting and mounting errors Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging the IC. 6. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7. Inspection using the set board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8. Power dissipation (Pd) Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm×70mm×1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 9. Thermal design The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the Pd rating. Tjmax: Maximum junction temperature=150[℃], Ta: Peripheral temperature [℃], θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc: Power dissipation [W], VCC: Input Voltage, VO: Output Voltage, IO: Load, Ib : Circuit Current Package Power dissipation Power dissipation : Pd (W) = (Tjmax-Ta) / θja : Pc (W) = (VCC-VO) × IO+VCC×Ib 10. VCC pin Insert a capacitor(VO≥5.0V:capacitor≥1µF, 3.0≤VO＜5.0V:capacitor≥2.2µF) between the VCC and GND pins. Choose the capacitance according to the line between the power smoothing circuit and the V CC pin. Selection of the capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. Electric capacitance IC Ceramic capacitors, Low ESR capacitor www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series 11. Output pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 1μF. Electrolytic, tantalum and ceramic capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 1μF is maintained at the intended applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor refer to the Cout ESR vs. IO. The stable operation range given in the reference data is based on the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 6.0V≤VCC≤26.5V 5.0V≤VO≤15.0V 4.0V≤VCC≤26.5V 3.0V≤VO≤15.0V 4.0V≤VCC≤26.5V 3.0V≤VO≤15.0V -40℃≤Ta≤+105℃ 0A≤IO≤1A -40℃≤Ta≤+105℃ -40℃≤Ta≤+105℃ 0A≤IO≤1A 5kΩ ≤ R ≤ 10kΩ 5kΩ≤R1≤10kΩ 5kΩ≤R1≤10kΩ 1 2.2µF≤Cin≤100µF 1µF≤Cout≤100µF 100 100 100 Unstable operating region Stable operating region 0.1 Stable operating region 10 0.01 2.2 0.001 1 Cin（μ F） 1 Cin（μF） Cout_ESR(Ω ） 10 10 Stable operating region Unstable operating region 0 200 400 600 800 1000 1 1 10 Io(mA) 1 100 Cout_ESR vs. IO(reference data) 10 100 Cout(μ F) Cout（μF） Cin vs. Cout(reference data) Cout (1µF or higher) ESR (0.001Ω or higher) Vcc Vcc (4.0V to 26.5V) Vo Cin (1µF or higher) R2 CTL ADJ GND VCTL (5.0V) Io (Rout) R1 (5k to 10kΩ) ※Operation Note 11 Measurement circuit 12. CTL pin Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 13. Rapid variation in VCC voltage and load current In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current and temperature are also possible causes. In case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 14. Minute variation in output voltage In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 15. Over current protection circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 16. Thermal shutdown circuit (TSD) This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series 17. In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, while the external capacitor is charged, the V CC shorts to the GND. Use a capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a bypass between all pins and the VCC pin. 18. This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: ○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor. ○ Also, when GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the other adjacent elements to operate as a parasitic NPN transistor. Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than th e (P substrate) GND. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ N P N P+ N Parasitic Element N P+ GND www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 N P N P+ B N C E Parasitic Element P Substrate P Substrate Parasitic Element Pin B B GND Parasitic Element 14/18 GND GND Parasitic element or Transistor TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Marking Diagrams TO220CP-V5 (TOP VIEW) TO252-5 (TOP VIEW) Part Number Marking Part Number Marking LOT Number 0 0 C 0 AW D00C 0W CP 5 LOT Number www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TO252-5 16/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TO220CP-V5 17/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 BD00C0AWxx series ●Revision History Date Revision 08.Feb.2013 14.Apr.2015 001 002 Changes New Release P.1 Figure of package image (TO220CP-V5) was corrected. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/18 TSZ02201-0G1G0AZ00440-1-2 14 Apr 2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001