Datasheet
1A Variable Output
LDO Regulator with Power Good
BD00JC0MNUX-M
General Description
Key Specifications
◼ Input Power Supply Voltage Range
Input Voltage 1 (VCC):
3.0V to 5.5V
Input Voltage 2 (VIN):
0.95V to 4.5V
◼ Output Voltage Range:
0.65V to 2.7V
◼ Output Current:
1.0A
◼ Operating Temperature Range:
-40°C to +105°C
BD00JC0MNUX-M is a low-voltage output 1ch linear
regulator IC that operates from a very low input supply
and offers an ideal performance in low input voltage to
low output voltage applications. It has built-in
N-MOSFET power transistor that minimizes the
input-to-output voltage differential producing very
small ON
resistance
(RON=200mΩ) level. By
lowering the dropout voltage in this way, the IC can
operate even at high current (Iomax=1A) with very low
power loss. As a result, this eliminates the need for
switching regulator and its associated components.
BD00JC0MNUX-M is designed for small packages that
causes cost reduction. Its output voltage can be varied
from 0.65V to 2.7V and it has a soft start (NRCS)
function that enables an output voltage ramp-up which
can be set to whatever power supply sequence is
required.
Package
W(Typ) x D(Typ) x H(Max)
3.0mm x 3.0mm x 0.6mm
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
High Output Voltage Accuracy : ±1%
Built-in VCC Under Voltage Lock Out circuit
With Soft Start Function (NRCS)
Low ON Resistance
Built-in Over-Current Protection Circuit
Built-in Thermal Shut Down circuit (TSD)
Variable Output
With Tracking Function
Small package VSON010X3030
VSON010X3030
Typical Application Circuit
4
1
PGDLY
EN
VCC
VO
PG
FB
2
6,7
R2
100kΩ
3
5
1µF
VIN
NRCS
8
22µF
R1
9
0.01µF
22µF
GND
10
○Product structure：Silicon monolithic integrated circuit
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○This product has no designed protection against radioactive rays.
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Datasheet
BD00JC0MNUX-M
Block Diagram
VCC
C1
1
EN
2
UVLO
CL
Reference
Block
VIN
VIN
Current
Limit
5
C2
VCC
CL
UVLO
TSD
Thermal
Shutdown
6 Vo
Vo
CFB
EN
7
Vo
R2
FB
R1
C3
8
NRCS
TSD
Power
Good
NRCS
9
10
GND
CNRCS
4
PGDLY
CPGDLY
3
PG
Figure 1. Block Diagram
Pin Description
Pin No.
1
2
3
4
5
6
7
8
9
10
Pin name
VCC
EN
PG
PGDLY
VIN
VO
VO
FB
NRCS
GND
Pin Function
Power supply pin
Enable input pin
Power Good pin
Power Good Delay capacitor connection pin
Input voltage pin
Output voltage pin
Output voltage pin
Reference voltage feedback pin
In-rush current protection (NRCS) capacitor connection pin
Ground pin
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BD00JC0MNUX-M
Description of Blocks
・AMP
This is an error amp that compares the reference voltage (0.65V) with Vo to drive the output Nch FET (Ron=200mΩ).
Frequency optimization helps to adjusts on rapid transient response, and to support the use of ceramic capacitors on the
output. AMP input voltage ranges from GND to 2.7V, while the AMP output ranges from GND to VCC. When EN is OFF, or
when UVLO is active, output goes LOW and the output of the NchFET switches OFF.
・EN
The EN block controls the regulators ON/OFF state through the EN logic input pin. When OFF, circuit current is
maintained at 0µA, thus minimizing current consumption at standby. The FET is switched ON to enable discharge of the
NRCS pin and Vo, thereby draining the excess charge and preventing the IC on the load side from malfunctioning. Since
no electrical connection is required (e.g., between the VCC pin and the ESD prevention Diode), operation is independent
of the input sequence.
・UVLO
To prevent malfunctions that can occur during a momentary decrease in VCC, the UVLO circuit switches the output to OFF,
and (like the EN block) discharges NRCS and Vo. Once the UVLO threshold voltage (TYP2.5V) is reached, the power-on
reset is triggered and output continues.
・CURRENT LIMIT
When output is ON, the current limit monitors the internal IC output current against the designed value (2.0A). When
current exceeds this level, the current limit circuit lowers the output current to protect the IC. When the overcurrent state
is eliminated, output voltage is restored.
・NRCS (Non Rush Current on Start-up)
The soft start function is enabled by connecting an external capacitor between the NRCS pin and GND pin. Output
ramp-up can be set for any period up to the time the NRCS pin reaches VFB (0.65V). During startup, the NRCS pin serves
as a 20μA (TYP) constant current source to charge the external capacitor. Output start time is calculated via formula (1)
below.
t=C
0.65V
20μA
・・・(1)
Tracking sequence is available by connecting the output voltage of external power supply instead of external capacitor.
And then, ratio-metric sequence is also available by changing the resistor divider network of external power supply output
voltage. (See next page)
・TSD (Thermal Shut Down)
The shutdown (TSD) circuit automatically switches the output OFF when the chip temperature gets too high, thus
protecting the IC against “thermal runaway” and heat damage. Because the TSD circuit is provided to shut down the IC in
the presence of extreme heat, in order to avoid potential problems with the TSD, it is crucial that the Tj (max) parameter
not be exceeded in the thermal design.
・VIN
The VIN line acts as the major current supply line, and is connected to the output NchFET drain. Since no electrical
connection (such as between the VCC pin and the ESD protection Diode) is necessary, VIN operates independent of the
input sequence. However, since an output NchFET body Diode exists between VIN and Vo, a VIN-Vo electric (Diode)
connection is present. Note, therefore, that when output is switched ON or OFF, reverse current may flow to VIN from Vo.
・PGOOD
It outputs the output voltage (Vo). PGOOD pin (open drain) is used to pull up the 100kΩ resistor. PGOOD is HIGH when
FB voltage is between 0.585V(TYP) to 0.715V(TYP), and LOW if the voltage is out of range.
・PGDLY
It is available to set PGOOD output delay. PGDLY pin should be connected to 100pF capacitor.
PGOOD delay time is determined by the following formula.
tPGDLY=
C(pF)×0.75
IPGDLY (μA)
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BD00JC0MNUX-M
Timing Chart
EN ON/OFF
VIN
VCC
EN
0.65V(TYP)
NRCS
Startup
Vo×0.9V(TYP)
VO
40μs (TYP@ C=100pF)
PGOOD
t
VCC ON/OFF
VIN
UVLO
VCC
Hysteresis
VOPR
EN
0.65V(TYP)
NRCS
Startup
Vo×0.9V(TYP)
VO
40μs (TYP@100pF)
PGOOD
t
Tracking sequence
1.7V Output
1.2V Output
DC/DC
(R1=3.9kΩ, R2=3.3kΩ)
NRCS
VO
1.7V
Tracking sequence
VO
R2
1.7V Output
R1
1.2V
3.3kΩ
FB
3.9kΩ
1.2V Output
Ratio-metric sequence
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BD00JC0MNUX-M
Absolute Maximum Ratings
Parameter
Symbol
Limit
Unit
(Note 1)
Input Voltage 1
Input Voltage 2
VCC
VIN
+6.0
+6.0 (Note 1)
V
V
Enable Input Voltage
PGOOD Input Voltage
VEN
V
V
VPGOOD
-0.3 to +6.0
+6.0 (Note 1)
Power Dissipation 1
Power Dissipation 2
Pd1
Pd2
0.575 (Note 2)
1.8 (Note 3)
W
W
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-40 to +105
-55 to +150
°C
°C
Tjmax
+150
°C
Junction Temperature
(Note 1) Not to exceed Power dissipation (Pd)
(Note 2) Reduced by 4.6mW/℃ for temperature above 25℃ (when mounted on a 1-layer glass epoxy board with 74.2mm×74.2mm×1.6mm dimension,
and copper foil dimension = 6.28mm2).
(Note 3) Reduced by 14.4mW/℃ for temperature above 25℃ (when mounted on a 4-layer glass epoxy board with 74.2mm×74.2mm×1.6mm dimension,
and copper foil dimension = 6.28mm2).
Recommended Operating Conditions
Parameter
Input Voltage 1
Input Voltage 2
Output Current
Symbol
VCC
VIN
IO
Min
3.0
0.95
-
Max
5.5
VCC-1 (Note 4)
1.0
Unit
V
V
A
PGOOD Input Voltage
Output Voltage Setting Range
VPGOOD
VO
-0.3
VFB
5.5
VIN-dVo (Note 5)
V
V
VEN
-0.3
5.5
V
Enable Input Voltage
(Note 4) No power-ON sequence for VCC and VIN.
(Note 5) Minimum dropout voltage (Electrical Characteristics).
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BD00JC0MNUX-M
Electrical Characteristics
(Unless otherwise specified Ta=-40 to 105°C, VCC=5V, VEN=3V, VIN=1.7V, R1=3.9kΩ, R2=3.3kΩ)
Parameter
Symbol
Min
Typ
Max
Unit
Circuit Current
ICC
0.7
1.0
mA
VCC Shutdown Mode Current
Output Voltage
Conditions
ISTB
VOUT
-
0
1.200
10
-
µA
V
Output Voltage Temperature
Coefficient
TCVO
-
0.01
-
%/°C
Feedback Voltage 1
Feedback Voltage 2
VFB1
VFB2
0.643
0.637
0.650
0.650
0.657
0.663
V
V
Load Regulation
Line Regulation 1
Reg.L
Reg.l1
-
0.5
0.1
10
0.5
mV
%/V
IO=0A to 1.0A
VCC=3.0V to 5.5V
Line Regulation 2
Standby Discharge Current
Reg.l2
IdEN
1
0.1
-
0.5
-
%/V
mA
VIN=1.5V to 3.3V
VEN=0V, VO=1V
[ENABLE]
Enable Pin Input Voltage High
ENHI
2
-
-
V
Enable Pin Input Voltage Low
Enable Input Bias Current
ENLOW
IEN
0
-
7
VCC×0.15
10
V
μA
VEN=3V
INRCS
14
20
26
μA
VNRCS=0.5V
VSTB
-
0
50
mV
VEN=0V
VCCUVLO
2.3
2.5
2.7
V
VCCHYS
50
100
150
mV
Low-side Threshold Voltage
High-side Threshold Voltage
VTHPGL
VTHPGH
VO×0.87
VO×1.07
VO×0.9
VO×1.1
VO×0.93
VO×1.13
V
V
PGDLY charge current
Ron
IPGDLY
RPG
1.4
30
2.0
75
2.6
150
μA
Ω
dVO
-
200
300
mV
[NRCS]
NRCS Charge Current
NRCS Standby Voltage
[UVLO]
VCC Undervoltage Lockout
Threshold Voltage
VCC Undervoltage Lockout
Hysteresis Voltage
[PGOOD]
[AMP]
Minimum dropout voltage
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VEN=0V
Tj=25°C
Tj=-40 to 105°C
VCC:Sweep-up
VCC:Sweep-down
IO=1.0A, VIN=1.2V
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Datasheet
BD00JC0MNUX-M
Typical Performance Curves
(Unless otherwise specified VCC=5V, VEN=3V, VIN=1.7V, R1=3.9kΩ, R2=3.3kΩ)
Vo
50mV/div
Vo
50mV/div
Io
1A/div
1.0A
Io
1A/div
1.0A
10µsec/div
10µsec/div
Figure.2 Transient Response
(Io=0 → 1.0A, Ta=-40°C)
CO=100uF, CFB=1000pF
Vo
50mV/div
Io
1A/div
Figure.3 Transient Response
(Io=0 → 1.0A, Ta=25°C)
CO=100uF, CFB=1000pF
Vo
50mV/div
1.0A
Io
1A/div
10µsec/div
10µsec/div
Figure.5 Transient Response
(Io=0 → 1.0A, Ta=-40°C)
CO=47uF, CFB=1000pF
Figure.4 Transient Response
(Io=0 → 1.0A, Ta=105°C)
CO=100uF, CFB=1000pF
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1.0A
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Typical Performance Curves - continued
Vo
50mV/div
Vo
50mV/div
Io
1A/div
1.0A
Io
1A/div
1.0A
10µsec/div
10µsec/div
Figure.7 Transient Response
(Io=0 → 1.0A, Ta=105°C)
CO=47uF, CFB=1000pF
Figure.6 Transient Response
(Io=0 → 1.0A, Ta=25°C)
CO=47uF, CFB=1000pF
Vo
50mV/div
Io
1A/div
Vo
50mV/div
1.0A
Io
1A/div
20µsec/div
20µsec/div
Figure.8 Transient Response
(Io=0 → 1.0A, Ta=-40°C)
CO=22uF, CFB=1000pF
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1.0A
Figure.9 Transient Response
(Io=0 → 1.0A, Ta=25°C)
CO=22uF, CFB=1000pF
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Typical Performance Curves - continued
Vo
50mV/div
Vo
50mV/div
1.0A
Io
1A/div
Io
1A/div
1.0A
20µsec/div
100µsec/div
Figure.11 Transient Response
(Io=1.0A → 0, Ta=-40°C)
CO=100uF, CFB=1000pF
Figure.10 Transient Response
(Io=0 → 1.0A, Ta=105°C)
CO=22uF, CFB=1000pF
Vo
50mV/div
Io
1A/div
Vo
50mV/div
1.0A
Io
1A/div
100µsec/div
100µsec/div
Figure.13 Transient Response
(Io=1.0A → 0, Ta=105°C)
CO=100uF, CFB=1000pF
Figure.12 Transient Response
(Io=1.0A → 0, Ta=25°C)
CO=100uF, CFB=1000pF
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1.0A
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BD00JC0MNUX-M
Typical Performance Curves - continued
Vo
50mV/div
Io
1A/div
Vo
50mV/div
1.0A
Io
1A/div
1.0A
100µsec/div
100µsec/div
Figure.14 Transient Response
(Io=1.0A → 0, Ta=-40°C)
CO=47uF, CFB=1000pF
Vo
50mV/div
Io
1A/div
Figure.15 Transient Response
(Io=1.0A → 0, Ta=25°C)
CO=47uF, CFB=1000pF
Vo
50mV/div
1.0A
Io
1A/div
40µsec/div
100µsec/div
Figure.17 Transient Response
(Io=1.0A → 0, Ta=-40°C)
CO=22uF, CFB=1000pF
Figure.16 Transient Response
(Io=1.0A → 0, Ta=105°C)
CO=47uF, CFB=1000pF
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1.0A
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BD00JC0MNUX-M
Typical Performance Curves - continued
Vo
50mV/div
Io
1A/div
Vo
50mV/div
1.0A
Io
1A/div
40µsec/div
40µsec/div
Figure.18 Transient Response
(Io=1.0A → 0, Ta=25°C)
CO=22uF, CFB=1000pF
Figure.19 Transient Response
(Io=1.0A → 0, Ta=105°C)
CO=22uF, CFB=1000pF
VEN
2V/div
VEN
2V/div
NRCS
1V/div
NRCS
1V/div
Vo
1V/div
Vo
1V/div
200µsec/div
200µsec/div
Figure.20 Start-up Sequence 1
(Ta=-40°C)
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1.0A
Figure.21 Start-up Sequence 1
(Ta=25°C)
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BD00JC0MNUX-M
Typical Performance Curves - continued
VEN
2V/div
VEN
2V/div
NRCS
1V/div
NRCS
1V/div
Vo
1V/div
Vo
1V/div
200µsec/div
1msec/div
Figure.23 OFF Sequence
(Ta=-40°C)
Figure.22 Start-up Sequence 1
(Ta=105°C)
VEN
2V/div
VEN
2V/div
NRCS
1V/div
NRCS
1V/div
Vo
1V/div
Vo
1V/div
1msec/div
Figure.24 OFF Sequence
(Ta=25°C)
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1msec/div
Figure.25 OFF Sequence
(Ta=105°C)
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BD00JC0MNUX-M
Typical Performance Curves - continued
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.27 Start-up Sequence 2
(VCC → VIN → VEN)
Ta=25°C
Figure.26 Start-up Sequence 2
(VCC → VIN → VEN)
Ta=-40°C
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.28 Start-up Sequence 2
(VCC → VIN → VEN)
Ta=105°C
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Figure.29 Start-up Sequence 3
(VCC → VEN → VIN)
Ta=-40°C
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BD00JC0MNUX-M
Typical Performance Curves - continued
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.31 Start-up Sequence 3
(VCC → VEN → VIN)
Ta=105°C
Figure.30 Start-up Sequence 3
(VCC → VEN → VIN)
Ta=25°C
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.32 Start-up Sequence 4
(VIN → VCC → VEN)
Ta=-40°C
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Figure.33 Start-up Sequence 4
(VIN → VCC → VEN)
Ta=25°C
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BD00JC0MNUX-M
Typical Performance Curves - continued
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.35 Start-up Sequence 5
(VIN → VEN → VCC)
Ta=-40°C
Figure.34 Start-up Sequence 4
(VIN → VCC → VEN)
Ta=105°C
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.36 Start-up Sequence 5
(VIN → VEN → VCC)
Ta=25°C
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Figure.37 Start-up Sequence 5
(VIN → VEN → VCC)
Ta=105°C
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Typical Performance Curves - continued
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.39 Start-up Sequence 6
(VEN→ VCC → VIN)
Ta=25°C
Figure.38 Start-up Sequence 6
(VEN → VCC → VIN)
Ta=-40°C
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
Figure.40 Start-up Sequence 6
(VEN → VCC → VIN)
Ta=105°C
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20msec/div
Figure.41 Start-up Sequence 7
(VEN → VIN → VCC)
Ta=-40°C
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BD00JC0MNUX-M
Typical Performance Curves - continued
VCC
5V/div
VCC
5V/div
VEN
2V/div
VEN
2V/div
VIN
2V/div
VIN
2V/div
VO
1V/div
VO
1V/div
20msec/div
20msec/div
Figure.43 Start-up Sequence 7
(VEN → VIN → VCC)
Ta=105°C
1.25
0.8
1.23
0.7
1.21
0.6
ICC (mA)
Vo (V)
Figure.42 Start-up Sequence 7
(VEN → VIN → VCC)
Ta=25°C
1.19
0.5
1.17
0.4
1.15
0.3
1.13
0.2
-40
-10
20
50
80
105
-40
Ta (°C)
20
50
80
105
Ta (°C)
Figure.44 Ta-Vo
(IO=0mA)
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Figure.45 Ta-ICC
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Datasheet
BD00JC0MNUX-M
0.12
1.80
0.10
1.75
0.08
1.70
IIN (mA)
ICC (uA)
Typical Performance Curves - continued
0.06
1.65
0.04
1.60
0.02
1.55
0.00
1.50
-40
-10
20
50
80
105
-40
-10
50
80
105
Ta (°C)
Ta (°C)
Figure.46 Ta-ISTB
Figure.47 Ta-IIN
30.0
27.0
25.0
25.0
20.0
23.0
INRCS (uA)
IIN (uA)
20
15.0
21.0
10.0
19.0
5.0
17.0
15.0
0.0
-40
-10
20
50
80
105
-40
-10
20
50
Ta (°C)
Ta (°C)
Figure.48 Ta-IINSTB
Figure.49 Ta-INRCS
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Datasheet
BD00JC0MNUX-M
15.0
12.0
10.0
10.0
5.0
8.0
Ien (uA)
IFB (nA)
Typical Performance Curves - continued
0.0
6.0
-5.0
4.0
-10.0
2.0
-15.0
0.0
-40
-10
20
50
80
105
-40
-10
20
Ta (°C)
180
200
160
180
Ron (mΩ)
Ron (mΩ)
220
140
Ta=25°C
140
100
120
80
100
50
80
Ta=-40°C
2
105
3
4
5
6
7
8
VCC (V)
Ta (°C)
Figure.52 Ta-RON
(VCC=5V, VO=1.2V)
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Ta=105°C
160
120
20
105
Figure.51 Ta-IEN
200
-10
80
Ta (°C)
Figure.50 Ta-IFB
-40
50
Figure.53 VCC-RON
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Datasheet
BD00JC0MNUX-M
Evaluation Board
■ Evaluation Board Schematic
BD00JC0MN
BD00JC0MNUX-M
(VSON010X3030)
UX-M
■ Evaluation Board Standard Component List
Component Rating
Manufacturer Product Name
Component Rating
Manufacturer Product Name
U1
-
ROHM
BD00JC0MNUX-M
C2
22uF
KYOCERA
C1
1uF
MURATA
GRM188B11A105KD
C13
1000pF MURATA
GRM188B11H102KD
C10
0.01uF
MURATA
GRM188B11H103KD
R1
3.9kΩ
ROHM
MCR03EZPF3901
C11
100pF
MURATA
GRM188B11H101KD
R2
3.3kΩ
ROHM
MCR03EZPF3301
R8
0Ω
-
Jumper
R4
100kΩ
ROHM
MCR03EZPF
C5
22uF
KYOCERA
CM32X5R226M10A
CM32X5R226M10A
■ Evaluation Board Layout
(2nd layer and 3rd layer are GND Line)
Silkscreen
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Datasheet
BD00JC0MNUX-M
Recommended Circuit Example
VCC
C1
EN
R4
1
10
2
9
3
8
GND
VCC
C4
R1
FB
R5
4
7
R2
C5
VO(1.2V)
C6
VIN
Component
C2
Recommended
Value
R1/R2
3.9k/3.3k
C3
22μF
C1
1μF
C2
22μF
C4
0.01μF
C5
-
C6
100pF
R5
100k
R4
Several kΩ
～several 10kΩ
6
5
C3
Programming Notes and Precautions
IC output voltage can be set with a configuration formula using the values for the internal
reference output voltage (VFB) and the output voltage resistors (R1, R2). Select resistance
values that will avoid the impact of the VREF current (±100nA). The recommended total
resistance value is 10KΩ.
To assure output voltage stability, there should be capacitor connected across VO pins and
the GND pin. Output capacitor plays a role in loop gain phase compensation and in
mitigating output fluctuation during rapid changes in load level. Insufficient capacitance
may cause oscillation, while high equivalent series reisistance (ESR) will exacerbate
output voltage fluctuation under rapid load change conditions. While a 22μF ceramic
capacitor is recomended, actual stability is highly dependent on temperature and load
conditions. Also, note that connecting different types of capacitors in series may result in
insufficient total phase compensation, thus causing oscillation. In light of this information,
please confirm operation across a variety of temperature and load conditions.
Input capacitor reduce the output impedance of the voltage supply source connected to
the (VCC) input pin. If the impedance of this power supply increases, input voltage (VCC)
could become unstable, leading to oscillation or lowered ripple rejection function. While a
low-ESR 1μF capacitor with minimal susceptibility to temperature is recommended,
stability is highly dependent on the input power supply characteristics and the substrate
wiring pattern. In light of this information, please confirm operation across a variety of
temperature and load conditions.
Input capacitor reduce the output impedance of the voltage supply source connected to
the (VIN) input pin. If the impedance of this power supply increases, input voltage (VIN)
could become unstable, leading to oscillation or lowered ripple rejection function. While a
low-ESR 22μF capacitor with minimal susceptibility to temperature is recommended,
stability is highly dependent on the input power supply characteristics and the substrate
wiring pattern. In light of this information, please confirm operation across a variety of
temperature and load conditions.
The Non Rush Current on Startup (NRCS) function is built into the IC to prevent rush
current from going through the load (VIN to VO) and impacting output capacitors at power
supply start-up. Constant current comes from the NRCS pin when EN is HIGH or the
UVLO function is deactivated. The temporary reference voltage is proportionate to time,
due to the current charge of the NRCS pin capacitor, and output voltage start-up is
proportionate to this reference voltage. Capacitors with low susceptibility to temperature
are recommended, in order to assure a stable soft-start time.
This component is employed when the C3 capacitor causes, or may cause, oscillation. It
provides more precise internal phase correction.
Capacitor to set delay of power good. 100pF is recommended.
It is pull-up resistance of Open Drain pin. 100kΩ is recommended.
It is recommended that a resistance (several kΩ to several 10kΩ) be place in R4, in case
negative voltage is applied in EN pin.
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Datasheet
BD00JC0MNUX-M
I/O Equivalent Circuit Diagram
(Resistance value is Typical)
VIN
VOUT
VOUT
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Notes for Use
1.
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
2.
GND Voltage
The potential of GND pin must be minimum potential in all operating conditions.
3.
Thermal design
Use a thermal design that allows for a sufficient margin considering the power dissipation (Pd) in actual operating
conditions.
4.
Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
5.
ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
6.
Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit: Latch type). The thermal shutdown circuit (TSD
circuit: Latch type) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this
circuit is assumed.
Hysteresis temperature [℃]
(typ.)
15
TSD ON temperature
[℃](typ.)
175
7.
Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components.
8.
Output voltage resistance setting (R1, R2)
Output voltage is adjusted with resistor R1 and R2. Output voltage is calculated as VFB×(R1+R2) / R1. Total 10kΩ is
recommended so that the output voltage is not affected by the VFB bias current.
9.
Output capacitor (C3)
To assure output voltage stability, there should be capacitor connected across VO pins and the GND pin. Output
capacitors play a role in loop gain phase compensation and in mitigating output fluctuation during rapid changes in load
level. Insufficient capacitance may cause oscillation, while high equivalent series resistance (ESR) will exacerbate output
voltage fluctuation under rapid load change conditions. While a 47uF ceramic capacitor is recommended, actual stability
is highly dependent on temperature and load conditions. Also, note that connecting different types of capacitors in series
may result in insufficient total phase compensation, thus causing oscillation. In light of this information, please confirm
operation across a variety of temperature and load conditions.
10. Input capacitors setting (C1, C2)
Input capacitors reduce the impedance of the voltage supply source connected to the (VCC, VIN) input pins. If the
impedance of this power supply increases, input voltage (VCC, VIN) could become unstable, leading to oscillation or
lowered ripple rejection function. Stability highly depends on the input power supply characteristic and the substrate
wiring pattern. Please confirm operation across a variety of temperature and load conditions.
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11. NRCS pin capacitors setting (CNRCS)
The Non Rush Current on Startup (NRCS) function is built in the IC to prevent rush current from going through the load
(VIN to VO) and impacting output capacitors at power supply start-up. The constant current comes from the NRCS pin
when EN is HIGH or the UVLO function is deactivated. The temporary reference voltage is proportionate to time, due to
the current charge of the NRCS pin capacitor, and output voltage start-up is proportionate to this reference voltage. To
obtain a stable NRCS delay time, capacitors with low susceptibility to temperature are recommended.
12. Input pins (VCC, VIN, EN)
This IC’s EN pin, VIN pin, and VCC pin are isolated, and the UVLO function is built in the V CC pin to prevent undervoltage
lockout. It does not depend on the Input pin order. Output voltage starts up when V CC and EN reach the threshold voltage.
However, note that when putting in VIN pin lastly, VO may result in overshooting.
13. Heat sink (FIN)
Since the heat sink (FIN) is connected to with the Sub, short it to the GND. It is possible to minimize the thermal
resistance by soldering it to substrate. Please solder properly.
14. Please add a protection diode when a large inductance
component is connected to the output terminal,
and reverse-polarity power is possible at start-up
or in output OFF condition.
(e.g.)
OUTPUT PIN
15. Short-circuits between pins and mounting errors
Please be sure to install the IC in correct position and orientation. Mounting errors, such as incorrect positioning or
orientation, or connecting of the power supply in reverse polarity can also destroy the IC. Short-circuit between pins or
pin and the power supply, or between ground may also damage to the IC.
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Datasheet
BD00JC0MNUX-M
Heat Loss
Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits, and thermal design should allow sufficient margin from the limits.
1. Ambient temperature Ta can be no higher than 105°C.
2. Chip junction temperature (Tj) can be no higher than 150°C.
Chip junction temperature can be determined as follows:
①Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a X W
< Reference values >
θj-a:VSON010X3030
215°C/W
1-layer substrate (Bottom copper foil area: 6.28mm2)
69.4°C/W
4-layer substrate (Bottom copper foil area: 6.28mm2)
PCB size: 74.2mm×74.2mm×1.6mm (substrate with thermal via)
It is recommended to layout the VIA for heat radiation in the GND pattern of reverse (of IC) when there is the GND pattern
in the inner layer (in using multiplayer substrate). This package is so small (size: 3.0mm×3.0mm) that it is not available to
layout the VIA in the bottom of IC. Spreading the pattern and being increased the number of VIA like the figure below)
enables to get the superior heat radiation characteristic. (The figure below shows the recommended VIA size and the
number suitable for the actual situation.)
Most of the heat loss that occurs in the BD00JC0MNUX-M is generated from the output Nch FET. Power loss is determined
by the total VIN-Vo voltage and output current. Be sure to confirm the system’s input and output voltage and the output
current conditions in relation to the heat dissipation characteristics of the VIN and Vo in the design. Bearing in mind that
heat dissipation may vary substantially depending on the substrate employed (due to the power package incorporated in
the BD00JC0MNUX-M) considering other factor such as substrate size into the thermal design.
Power consumption (W) = { Input voltage (VIN)- Output voltage (Vo) (Vo≒VREF) } x Io(Ave)
Example: When VIN=1.7V, VO=1.2V, Io(Ave) = 1A,
Power consumption (W) = { 1.7(V)-1.2(V) } x 1.0(A)
= 0.5(W)
Power Dissipation
VSON010X3030
[W]
Power Dissipation [Pd]
3.0
2.0
(1) Mounted on 1-layer board
Bottom copper foil area: 6.28mm2
θj-a=215.5°C/W
(2) Mounted on 4-layer board
Bottom copper foil area: 6.28mm2
θj-a=69.4°C/W
(2) 1.8W
1.0
(1) 0.575W
0
0
25
45
65
85
105
Ambient Temperature [Ta]
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125
150
[°C]
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Datasheet
BD00JC0MNUX-M
Ordering Information
B
D
0
0
Part
Output
Number voltage
00:Variable
J
C
0
M
N
U
X
Package
-
M E 2
Input
Voltage
Output
Current
Automotive
Packaging and forming
specification
J:6V
C0:1A
“M”:M-series NUX:VSON010X3030 E2:Emboss tape reel
Marking Diagram
VSON010X3030 (TOP VIEW)
Part Number Marking
J C 0
LOT Number
MNX
Pin 1 Mark
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Datasheet
BD00JC0MNUX-M
Physical Dimension and Packing Information
Package Name
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Datasheet
BD00JC0MNUX-M
Revision History
Date
Revision
2.Dec.2013
001
19.Apr.2022
002
Changes
New Release
P4: A writing errors of Timing Chart was corrected.
P11 and P12: A writing errors of Figure.20 to Figure.25 was corrected.
P22: I/O Equivalent Circuit Diagram was fixed.
P22: Reference landing pattern was removed.
P25: A writing errors of Heat Loss was corrected.
P25: A writing errors of Power Dissipation was corrected.
P26: Add Marking Diagram.
P27: Add Physical Dimension and Packing Information.
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
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Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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