Secondary LDO Regulator Series for Local Power Supplies
500mA Secondary LDO Regulators for Local Power Supplies
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
No.09024EAT01
●General Description The BD□□KA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage precision is ±1%. These secondary LDO regulators are offered in several output voltages and package lineups with or without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit. ●Features 1) Maximum output current : 500mA 2) Output voltage precision : ±1% 3) Low-saturation voltage with PMOS output : 0.12V Typ.(Io=200mA) 4) Built-in over-current protection circuit 5) Built-in thermal shutdown circuit 6) Shutdown switch(BD□□KA5WFP and BD□□KA5WF series) 7) TO252-3,TO252-5 and SOP8 package lineup 8) Operating temperature range : -40℃ to +105℃ 9) Ceramic capacitor compatible(recommended capacitance : 1μF or greater) ●Applications Microcontrollers and all electronic devices that use logic circuits ●Product line up Part Number BD□□KA5WFP BD□□KA5WF BD□□KA5FP
1.0 ○ ○ ○
1.2 ○ ○ ○
1.5 ○ ○ ○
1.8 ○ ○ ○
2.5 ○ ○ ○
3.0 ○ ○ ○
3.3 ○ ○ ○
Variable ○ ○ -
Package TO252-5 SOP8 TO252-3
Part Number:BD□□KA5□ □ a bc Symbol □□ 10 12 15 18 Switch
a
Details Output Voltage Designation Output Voltage(V) □□ 1.0V(Typ.) 25 1.2V(Typ.) 30 1.5V(Typ.) 33 1.8V(Typ.) 00
Output Voltage(V) 2.5V(Typ.) 3.0V(Typ.) 3.3V(Typ.) Variable Output Typ
b Package
“W” included:Built-in shutdown switch “W” not included:No shutdown switch FP:TO252-5 / TO252-3 F:SOP8
c
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1/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Absolute Maximum Ratings(Ta=25℃) Parameter Power Supply Voltage Output Control Terminal Voltage TO252-3 Power Dissipation TO252-5 SOP8 Operating Temperature Range Ambient Storage Temperature Maximum Junction Temperature
*1 *2 *3 *4
Technical Note
Symbol Vcc VCTL Pd Topr Tstg Tjmax
Limits -0.3~+7.0*1 -0.3~Vcc*1 1200*2 1300*3 687.6*4 -40~+105 -55~+150 150
Unit. V V mW ℃ ℃ ℃
Must not exceed Pd When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃. When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃. When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.
●Recommended Operating Range (Ta=25℃) Parameter Symbol Input Power Supply Voltage Vcc Output Current Io *5 Output Voltage Configuration Range Vo Output Control Terminal Voltage VCTL
*5 Only BD00KA5WFP and BD00KA5WF
Min. 2.3 0 1.0 0
Max. 5.5 500 4.0 Vcc
Unit. V mA V V
●Electrical Characteristics (abridged) BD□□KA5WFP / WF / FP (Unless specified otherwise,Ta=25℃,VCTL=2V,Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V),Vcc=3.3V(Vo=2.5V),Vcc=5.0V(Vo=3.0V,3.3V)) Parameter Symbol Min. Typ. Max. Unit. Conditions Output Voltage Circuit Current at Shutdown Minimum I/O Voltage Difference*6 Output Current Capacity Input Stability*7 Load Stability Output Voltage *8 Temperature Coefficient Vo Isd ΔVd Io Reg.I Reg.L Tcvo Vo(T)-0.015 Vo(T)×0.99 500 Vo(T) Vo(T) 0 0.12 10 25 ±100 Vo(T)+0.015 Vo(T)×1.01 1 0.20 35 75 V V μA V mA mV mV ppm/℃ Io=200mA (Vo=1.0V,1.2V) Io=200mA (Vo≧1.5V) VCTL =0V,Io=0mA (during OFF mode) Io=200mA,Vcc=0.95×Vo Vcc=Vo+0.5V→5.5V,Io=200mA Io=0mA→500mA Io=5mA,Tj=0~125℃
Vo(T):Preset output voltage value *6 When Vo≧2.5V *7 When 1.0≦Vo≦1.8V, Vcc=2.3V→5.5V *8 Design guarantee(100% shipping inspection not performed)
BD00KA5WFP / WF *9 (Unless specified otherwise, Ta=25℃, Vcc=2.5V,VL=2V,R1=30kΩ,R2=30kΩ ) Parameter Symbol Min. Typ. Max. Circuit Current at Shutdown Reference Voltage Minimum I/O Voltage Difference*10 Output Current Capacity Input Stability Load Stability Output Voltage Temperature Coefficient*11
*9 *10 *11
Unit. μA V V mA mV mV ppm/℃
Isd VADJ ΔVd Io Reg.I Reg.L Tcvo
0.742 500 -
0 0.750 0.12 10 25 ±100
1 0.758 0.20 35 75 -
Conditions VCTL =0V, Io=0mA (during OFF mode) Io=50mA Io=200mA,Vcc=0.95×Vo Vcc=Vo+0.5V→5.5V,Io=200mA Io=0mA→500mA Io=5mA,Tj=0~125℃
VOUT=VADJ×(R1+R2)÷R1(V) VADJ×0.75V(Typ.) When Vo≧2.5V Design guarantee(100% shipping inspection not performed)
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2/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Reference Data (Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)
0.5
Technical Note
2.0
2.0
[BD15KA5WFP]
1.8
[BD15KA5WFP]
1.8
[BD15KA5WFP]
OUTPUT VOLTAGE:VOUT[V]
1.4 1.2 1.0 0.8 0.6 0.4 0.2
OUTPUT VOLTAGE:VOUT[V]
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
CIRCUIT CURRENT:ICC[mA]
0.4
1.6
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.3
0.2
0.1
0 .0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.0
SUPPLY VOLTAGE:VCC[V]
SUPPLY VOLTAGE:VCC[V]
SUPPLY VOLTAGE:VCC[V]
Fig.1 Circuit current
2.0 1.8 OUTPUT VOLTAGE:VOUT[V] 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 OUTPUT CURRENT:IOUT[A]
[BD15KA5WFP]
300
Fig.2 Input Stability (Io=0mA)
[BD33KA5WFP]
60 55 50 RIPPLE REJECTION:R.R[dB] 45 40 35 30 25 20 15 10 5
Fig.3 Input Stability (Io=500mA)
[BD15KA5WFP]
DROPOUT VOLTAGE:ΔVd[mV]
250
200
150
100
50
0 0 50 100 150 200 250 300 350 400 450 500
0
00 10000 10 15 20 25 130 35 40 45100055 60 65 70 75 80 100000 50 85 90
OUTPUT CURRENT:IOUT[mA]
FREQUENCY:f[Hz]
Fig.4 Load Stability
1.6 1.6
Fig.5 Input/Output Voltage Difference (Vcc=3.135V)
1.0 0.9
10
Fig.6 Ripple Rejection (ein=10dBV,Io=100mA)
[BD15KA5WFP]
[BD15KA5WFP]
[BD15KA5WFP]
OUTPUT VOLTAGE:VOUT[V]
CIRCUIT CURRENT:Icc[mA]
1.5 1.5 1.5 1.5 1.5 1.4 1.4 1.4 -40 -20 0 20 40 60 80 100
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 .0 -40 -20 0 20 40 60 80 100
CIRCUIT CURRENT:Icc[mA]
1.6
0.8
8
6
4
2
0 0.0 0.1 0.2 0.3 0.4 0.5
TEMPERATURE:Ta[℃]
TEMPERATURE:Ta[℃]
OUTPUT CURRENT:IOUT[A]
2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 .0 0.0 0.5
Fig.7 Output Voltage (Io=5mA)
[BD15KA5WFP]
Fig.8 Circuit Current Temperature Characteristics
200 180 160 140 120 100 80 60 40 20 0
Fig.9 Circuit Current by load Level
2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 .0 100 120 140
[BD15KA5WFP]
[BD15KA5WFP]
OUTPUT VOLTAGE:VOUT[V]
CONTROL CURRENT:ICTL[μA]
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
OUTPUT VOLTAGE:VOUT[V]
160
180
200
CONTROL VOLTAGE:VCTL[V]
CONTROL VOLTAGE:VCTL[V]
TEMPERATURE:[℃]
Fig.10 CTL Voltage vs. Output Voltage
Fig.11 CTL Voltage vs. Output Current
Fig.12 Thermal Shutdown Circuit Characteristics (Io=5mA)
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3/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Block diagrams, Standard circuit examples [BD00KA5WFP]
GND(FIN) *Output voltage configuration
1μ F
Technical Note
[BD00KA5WF]
VOUT=VADJ×(R1+R2)÷R1(V) :VADJ=0.75V(Typ.) :A value of approximately 30kΩ is recommended for R1.
Vcc(8PIN) GND(7PIN) GND(6PIN) CTL (5PIN)
Vref
Driver
Vref TSD
Vcc (2PIN) CTL (1PIN) N.C.(3PIN)
1μ F 1μ F
Driver
*Output voltage configuration VOUT=VADJ×(R1+R2)÷R1(V) :VADJ=0.75V(Typ.) :A value of approximately 30kΩ is recommended for R1.
OCP
OUT (4PIN) R2 ADJ(5PIN) R1
TOP VIEW FIN
OUT(1PIN)
TSD
OCP
TO252-5(BD00KA5WFP) Pin No. 1 2 3 4 5 FIN PinName CTL Vcc N.C. OUT ADJ GND
Fig.13
Function Output voltage ON/OFF control Power supply voltage input Unconnected terminal Voltage output Output voltage configuration terminal GND
ADJ(2PIN)
1μ F
R2
R1
N.C.(3PIN) N.C.(4IN)
Fig.16
3 12 45
TO252-5
SOP8(BD00KA5WF) Pin No. 1 2 3 4 5 6 7 8 Pin Name OUT ADJ N.C. CTL GND Vcc Function Voltage output Output voltage configuration terminal Unconnected terminal Output voltage ON/OFF control GND Power supply voltage input
TOP VIEW
8
5
1
4
SOP8
[BD□□KA5WFP]
Vref
GND(FIN)
Driver
R2 R1
[BD□□KA5WF]
1μ F
TSD
Vcc CTL (1PIN) (2PIN)
OCP
OUT (4PIN)
TOP VIEW FIN
Vcc(8PIN)
GND(7PIN)
GND(6PIN)
CTL (5PIN)
N.C.(3PIN)
1μ F 1μ F
N.C.(5PIN)
Fig.14
TO252-5(BD□□KA5WFP) Pin No. 1 2 3 4 5 FIN Pin Name CTL Vcc N.C. OUT N.C. GND Function Output voltage ON/OFF control Power supply voltage input Unconnected terminal
Vref TSD
Driver OCP
R2 R1
3 12 45
TO252-5
OUT(1PIN) N.C.(3PIN)
1μ F
Voltage output
Unconnected terminal GND
N.C.(3PIN) N.C.(4IN)
Fig.17
SOP8(BD□□KA5WF) Pin No. 1 2 Pin Name OUT N.C. CTL GND Vcc Function Voltage output
TOP VIEW
8
5
Vref
1
Unconnected terminal Output voltage ON/OFF control GND Power supply voltage input
4
Driver
R2 R1
3 4 5 6 7 8
SOP8
TSD
N.C.(2PIN) Vcc (1PIN)
1μ F
OCP
OUT (3PIN)
1μ F
TOP VIEW FIN
Fig.15
TO252-5(BD□□KA5FP) Pin No. 1 2 3 FIN Pin Name Vcc N.C. OUT GND Function Power supply voltage input Unconnected terminal Voltage output GND
N.C. pins are electrically open to the inside of the IC chip.
2 1 3
TO252-3
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4/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Input / Output Equivalent Circuit Diagrams
Vcc Vcc Vcc Vcc
Technical Note
※
31.25kΩ 2kΩ CTL 25kΩ R2 OUT
With BD00KA5WFP/WF,R1and R2 are connected outside the IC between ADJ and GND and between OUT and ADJ.
ADJ
Fig.18 ●Thermal Design
2.0
R1
(BD00KA5WFP/WF)
Fig.19
TO252-5
Rohm standard board mounting Board size:70×70×1.6mm 2 Copper foil area:7×7mm θja=96.2(℃/W)
2.0
TO252-3
Rohm standard board mounting Board size:70×70×1.6mm 2 Copper foil area:7×7mm θja=104.2(℃/W)
1000
SOP8
(1)When using a standard board: θj-c=181.8(℃/W) (2) When using an IC alone θj-a=222.2(℃/W)
1.6
1.6
800
Power Dissipation:Pd(W) Power Dissipation:
Power Dissipation:Pd(W) 許容損失:Pd(W)
1.30
1.2
Power Dissipation:Pd(W)
許容損失:Pd(W)
1.20
1.2
687.6mW
600
(1)
400
0.8
0.8
562.6mW (2)
0.4
0.4
200
0.0 0 25 50 75 100 125 150
0.0 0 25 50 75 100 125 150
0 0 25 50 75 100 125 150
Ambient temperature:Ta(℃)
周囲温度:Ta(℃) Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃) 周囲温度:Ta(℃)
Fig.20 Power Dissipation heat reducing characteristics
Fig.21 Power Dissipation heat reducing characteristics
Fig.22 Power Dissipation heat reducing characteristics
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22. The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX. Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high, so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows : Pc = (Vcc-Vo)×Io+Vcc×Icca Acceptable loss Pd≧Pc Solving for the load current IO in order to operate within the acceptable loss, Io≦ Pd – Vcc×Icca Vcc-Vo Vcc:Input voltage Vo:Output voltage Io:Load current Icca:Circuit current
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design. Calculation Example Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V 0.676-2.5×Icca Io≦ 2.5-1.0 Io≦440mA (Icca : 2mA) BA10KA5WFP(TO252-5 packaging) θja=96.2℃/W → -10.4mW/℃ 25℃=1300mW → 85℃=676mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Icca+Ishort)
*Ishort : Short circuit current
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5/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
Technical Note
●Terminal Vicinity Settings and Cautions ・Vcc Terminal Please attach a capacitor (greater than 1μF) between Vcc and GND. The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the operation on actual board. ・GND Terminal Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns as wide as possible and reducing the distance between the set ground and the IC ground as much as possible. ・CTL Terminal 31.25kΩ The CTL terminal is turned ON at 2.0V and higher, and OFF at 0.8V and lower, within the operating power supply voltage CTL range.The power supply and the CTL terminal may be started up and shut down in any order without problems. 25kΩ
Fig.23 Input equivalent circuit ●Vo Terminal Please be sure to attach an anti-oscillation capacitor between Vo and GND.
ESR (Ω) 100
発振領域
Oscillation region
OUT
10
Stable region
IC 1μF
1
Vcc 1μF VCTL 2V Cin
安定領域
ESR Vcc OUT 1μF
CTL GND ADJ R2 R1 R1=30kΩ,R2=2kΩ
Io(ROUT)
0.1
0.01 0 100 200 Iout(mA) 300 400 500 Io(mA)
Fig.24 Output Equivalent Circuit
Fig.25 ESR-Io Characteristics
Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after sufficiently confirming its properties according to its specifications in the actual application.
120
Rate of change in electrostatic capacitance (%) Rate of change in electrostatic capacitance (%)
120
50V Max.Input Rate of change in electrostatic capacitance (%)
120
100
50V Max.Input
100
100
静電容量変化率(%)
静電容量変化率(%)
80
80
16V Max.Input
静電容量変化率(%)
80
Y5V X7R X5R
60
60
10V Max.Input
60
40
10V Max.Input
16V Max.Input
40
40
Vdc=0
20
20
20
0 0 1 2 3 4
0 0 1 2 3 4
0 -25 0 25 50 75
直流バイアスVdc(V)
(a) Capacitance-bypass characteristics (Y5V)
DC bypass Vdc(V)
直流バイアスVdc(V)
(b)Capacitance-bypass characteristics(X5R,X7R)
DC bypass Vdc(V)
Temp(℃)
(C)Capacitance-temperature characteristics(X5R,X7R,Y5V)
Temp(℃)
Fig.26 :General characteristics of ceramic capacitors
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6/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
Technical Note
●Other Caution ○Protection Circuits Over-current Protection Circuit A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the over-current protection circuit has negative current capacity characteristics with regard to temperature. ○Thermal Shutdown Circuit (Thermal Protection) This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 for the temperatures at which the temperature protection circuit operates). There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to avoid leaving the IC in the overloaded state. ○Reverse Current In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).
Reverse current
Vcc
OUT
CTL
GND
Fig.27 : Bypass diode ○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as : - a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, or - a parasitic transistor when the electric potential relationship is Terminal B > GND> Terminal A. Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board) to the input terminal.
(Pin B) O Transistor (NPN) B E GND N P+ N P N P Parasitic element or transistor P+ N P N P+ N P P+ N Parasitic element GND GND (Pin A) Parasitic element
GND
Resistor (Pin A) (Pin B) B C E
GND
Parasitic element or transistor
Fig. 28 : Basic structure example
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7/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
●Ordering part number
Technical Note
B
D
1
8
K
A
5
W
W : Include
F
FP F
P
:TO252-3 TO252-5 : SOP8
-
E
2
Part number
Output voltage 00:Variable Other:Fixed
Current capacity 500mA
Shutdown switch パッケージ
Packaging and forming specification E2: Embossed tape and reel
TO252-3
6.5±0.2
1.5±0.2
Tape
C0.5 2.3±0.2 0.5±0.1
Embossed carrier tape 2000pcs E2
The direction is the 1pin of product is at the lower left when you hold
+0.2 5.1 -0.1
Quantity Direction of feed
FIN
5.5±0.2 9.5±0.5
( reel on the left hand and you pull out the tape on the right hand
)
0.65 0.75 2.3±0.2
0.8
0.65
0.5±0.1
2.3±0.2
1.0±0.2
2.5
1
2
3
1.5
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-5
6.5±0.2 +0.2 5.1 -0.1 2.3±0.2 C0.5 0.5±0.1
Tape Quantity Direction of feed
Embossed carrier tape 2000pcs E2
The direction is the 1pin of product is at the lower left when you hold
1.5±0.2
FIN
5.5±0.2 9.5±0.5
( reel on the left hand and you pull out the tape on the right hand
)
0.8
0.5±0.1 0.5 1.27 1.0±0.2
2.5
123
45
1.5
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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8/9
2009.04 - Rev.A
BD□□KA5,BD□□KA5W Series,BD00KA5W Series
Technical Note
SOP8
5.0±0.2 (MAX 5.35 include BURR)
8 7 6 5
+6° 4° −4°
Tape Quantity
0.9±0.15 0.3MIN
Embossed carrier tape 2500pcs E2
The direction is the 1pin of product is at the upper left when you hold
6.2±0.3
4.4±0.2
Direction of feed
( reel on the left hand and you pull out the tape on the right hand
)
12
3
4
0.595
1.5±0.1
+0.1 0.17 -0.05 S
0.11
1.27 0.42±0.1
1pin
(Unit : mm)
Direction of feed
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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9/9
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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