BD1206GUL-E2

Datasheet 6-Channel Charge Pump White LED Driver with 16 Dimming Steps and 1-wire Serial Interface BD1206GUL ●General Description BD1206GUL is 5ch or 6ch parallel LED driver for the portable instruments. This IC is equipped with an automatic transition charge pump and 16-step LED drivers. Hence this IC realizes high efficiency and high accuracy drive of LEDs. Additionally, this IC can synchronize LED drive with external PWM signal. This IC is best suited to turn on white LEDs that require high-accuracy LED brightness control. ●Key Specification Operating power supply voltage range: 2.7V to 5.5V LED maximum current: 20mA (Typ.) Oscillator frequency: 0.85MHz(Typ.) Quiescent Current: 0.1μA (Typ.) Operating temperature range: -30℃ to +85℃ ●Package VCSP50L2: ●Features 5ch or 6ch parallel LED driver is mounted 16-step LED current adjust function LED current matching is 5% or less Driving control via a single-line digital control interface Automatic transition charge pump type DC/DC converter (×1, ×1.5, ×2) High efficiency achieved (Maximum over 93%) It transits for the most suitable power operating by the LED terminal process of the 6th light when only 5 lights driving Various protection functions such as output voltage protection and thermal shutdown circuit are mounted. The input external PWM is possible and the back light control interlocked with the motion picture is possible. Package: VCSP50L2 (Thick 0.55mm MAX, Pin pitch 0.5mm) CSP15pin package ●Typical Application Circuit (6 light with PWM) W(Typ.) x D(Typ.) x H (Max.) 2.00mm x 2.00mm x 0.55mm ●Pin Configuration [Bottom View] BD1206GUL Figure 1. Pin Configuration ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays 1/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Absolute Maximum Ratings (Ta=25ºC) Parameter Symbol Ratings Unit VMAX 7 V Vdin GND-0.3 to VBAT+0.3 V Pd 900 mW Operating temperature range Topr -30 to +85 ºC Storage temperature range Tstg -55 to +150 ºC Power supply voltage Input voltage ( EN , PWMIN ) Power dissipation (Note) Power dissipation deleting is 7.2mW/ ºC, when it’s used in over 25 ºC.(It’s deleting is on the board that is ROHM’s standard) Dissipation by LSI should not exceed tolerance level of Pd. o ●Recommended Operating Rating (Ta = -30 to 85 C) Parameter Symbol Limits Unit VBAT 2.7 to 5.5 V Operating power supply voltage ●Electrical Characteristics (Unless otherwise noted, Ta = +25oC, VBAT=3.6V) Parameter Symbol Limits Units Condition Min. Typ. Max. Iq - 0.1 1 μA Current Consumption1 Idd1 - 62 64 mA Current Consumption2 Idd2 - 123 126 mA fOSC 0.56 0.85 1.14 MHz LED maximum current ILED-max 18 20 22 mA LED current accuracy ILED-diff - - 10.0 % LED current matching ILED-match - 0.5 5.0 % VLED - 0.15 0.25 V Low threshold voltage VIL - - 0.4 V EN, PWMIN High threshold voltage VIH 1.4 - - V EN, PWMIN High level Input current IIH - 0 1 μA EN = VBAT, PWMIN = VBAT Low level Input current IIL -1 0 - μA EN = 0V, PWMIN = 0V Minimum EN High time THI 0.05 - 100 μs Described in Figure 4. Minimum EN Low time TLO 0.3 - 100 μs Described in Figure 4. EN Off Timeout TOFF 1 - - ms Described in Figure 4. Latch time TLAT 1 - - ms Described in Figure 4. Access available time Tacc 1 - 5 ms Described in Figure 4. Current Consumption Quiescent Current EN=0V x 1.0 Mode Include LED current (60mA) x 2.0 Mode Include LED current (60mA) Charge Pump Oscillator frequency Current Source LED control voltage VBAT≥3.2V LED current setting is 10.0mA, LED terminal voltage is 1.0V LED current setting is 10.0mA, LED terminal voltage is 1.0V Minimum voltage from LED1 to LED6 pins Logic control terminal www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Pin Descriptions Pin No. Terminal No. Pin Name In/Out Type Function 1 D4 VBAT - A Power supply 2 B4 C1P In/Out A Flying capacitor pin positive (+) side 3 C4 C1N In/Out B Flying capacitor pin negative (-) side 4 A4 C2P In/Out A Flying capacitor pin positive (+) side 5 B3 C2N In/Out B Flying capacitor pin negative (-) side 6 A3 VOUT Out A Charge pump output 7 C3 EN In C ON/OFF and dimming control 8 D1 LED1 Out B LED current driver output 1 9 D2 LED2 Out B LED current driver output 2 10 C1 LED3 Out B LED current driver output 3 11 C2 LED4 Out B LED current driver output 4 12 B1 LED5 Out B LED current driver output 5 13 A1 LED6 Out A LED current driver output 6 14 D3 PWMIN In C PWM Control 15 A2 GND - D GND ●Pin ESD Type Type A Type B PAD PAD GND VBAT Type C VBAT PAD GND GND Type D VBAT PAD Figure 2. Pin ESD Type www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet C2P C2N C1P C1N ●Block Diagram ×1, ×1.5, ×2 Charge pump VBAT VOUT Over Voltage Protect Charge Pump Mode Control EN PWMIN OSC Enable/ Brightness Control Vout Control LED1 TSD LED2 LED3 LED4 LED5 4 LED6 DET LED6 Current DAC GND Figure 3. Block Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Separate Function Description (1) LED driver a) Register access control protocol LED current is controlled by only EN terminal. It is possible to access the register inside of this chip by using the protocol below. Accessing the registers with using this protocol operates LED driver ON/OFF and selecting the mode. Moreover, MAX current can be outputted without Clock input to EN terminal by holding H zone of fixed time after EN terminal starting. < When setting current level > TLAT THI Tacc TOFF TLO Tpulse EN 1 LED Current Setting (N≦16) n n-1 2 0 n (Notes) TaccMIN < Tpulse < 0 TaccMAX Please input a pulse on this condition < When starting by MAX setup > TaccMAX TOFF EN LED Current Setting １ 0 0 Figure 4. Register access protocol Tacc TLAT TLAT TLAT TLAT EN 16pulse 15pulse 14pulse 13pulse 1mA 0.5mA LED Current OFF 0.125mA 0.25mA Figure 5. Slope control example (Note) ・In the case of N > 16, BD1206GUL selects the mode of N = 16. ・LED current is changed by the pulse of EN pin. Be careful to noise of EN signal. ・Reset BD1206GUL when the set is unusual. (Keep EN=L over Toff time.) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet b) LED current level The interface records rising edges of the EN pin and decodes them into 16 different indicated in following table. Data Output current [mA] Data Output current [mA] 1 20.0 9 5.0 2 17.0 10 4.0 3 14.0 11 3.0 4 12.0 12 2.0 5 10.0 13 1.0 6 8.5 14 0.5 7 7.0 15 0.25 8 6.0 16 0.125 (2) Charge pump a) Description of operations Pin voltage comparison takes place at Vout control section, and then Vout generation takes place so that the LED cathode voltage with the highest Vf is set to 0.15V. A boost rate is changed automatically to a proper one at the Charge Pump Mode Control section so that operation can take place at possible low boost rate. In addition, when the VOUT output is short-circuited to GND, the leak current is suppressed via the over current protection function. b) Soft start function BD1206GUL have a soft start function that prevents the rush current. TOFF EN/LED* VOUT ILED Soft Start Ordinal mode * EN/LED is an internal enable Figure 6. Soft Start c) Automatic boost rate change The boost rate automatically switches to the best mode. * (×1 mode ×1.5 mode) or (×1.5 mode ×2 mode) If a battery voltage drop occurs BD1206GUL cannot maintain the LED constant current, and then mode transition begins. * (×1.5 mode ×1 mode) or (×2 mode ×1.5 mode) If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins. (3) UVLO (Under Voltage Lock Out) If the input voltage falls below 2.2V(Typ.), BD1206GUL is shut down to prevent malfunction due to ultra-low voltage. (4) OVP (Over Voltage Protection) This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external factors. (5) Thermal shutdown (TSD) To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the chip temperature rises over 175ºC. In addition, it turns on the output if the temperature returns to the normal temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown detection temperature must be set to below 175ºC in thermal design. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet (6) Power sequence EN signal must be released after VBAT voltage enough rise up. Prohibit the VBAT rise up during EN=”H”. VBAT EN Figure 7. Power sequence (7) PWM control PWM control by the external terminal (PWMIN) is possible. It becomes PWM operation, which used LED current by a register setup as the base and is the best for the brightness compensation by external control. If the application with is not use PWM, PWMIN pin must be short to VBAT. E N /L E D * In te rn a l S o ft-S ta rt T im e VOUT N o n -P W M P W M IN in p u t L E D C u rre n t PWMIN P W M IN in p u t L E D C u rre n t LED Current L Compulsion OFF H Normal operation Figure 8. External PWM input solution It is possible to make it a PWMIN input before EN/LED* is “H”. A PWM drive becomes effective after the time of LED current standup. When rising during PWM operation, as for the standup time of VOUT, only the rate of PWM Duty becomes late. Appearance may be influenced when extremely late frequency and extremely low Duty are inputted. Please secure over 120 μs “H” sections at the time of PWM pulse Force. EN/LED* is an internal enable signal www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Application Circuit Example (6 light with PWM) C2=1μF C2P C1N C1P C2N C1=1μF Battery ×1, ×1.5, ×2 Charge pump VBAT Cin =1μF VOUT Cout =1μF Over Voltage Protect Charge Pump Mode Control EN OSC From CPU Enable/ Brightness Control PWMIN Vout Control LED1 TSD LED2 From LCM LED3 LED4 LED5 LED6 DET 4 LED6 Current DAC GND Figure 9. Application Circuit Example 1 ●Application Circuit Example (5 light with PWM) C2=1μF C2P C1P C2N C1N C1=1μF Battery ×1, ×1.5, ×2 Charge pump VBAT Cin =1μF VOUT Cout =1μF Over Voltage Protect Charge Pump Mode Control EN OSC From CPU PWMIN Enable/ Brightness Control Vout Control LED1 TSD LED2 From LCM LED3 LED4 LED5 LED6DET 4 LED6 Current DAC GND Figure 10. Application Circuit Example 2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Application Circuit Example (6 light without PWM) C2=1μF C2P C1P C2N C1N C1=1μF Battery ×1, ×1.5, ×2 Charge pump VBAT Cin =1μF VOUT Cout =1μF Over Voltage Protect Charge Pump Mode Control EN OSC From CPU Enable/ Brightness Control Battery PWMIN Vout Control LED1 LED2 TSD LED3 LED4 LED5 LED6 DET 4 LED6 Current DAC GND Figure 11. Application Circuit Example 3 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Operational Notes (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power Supply and Ground Line Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) Ground Voltage Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) Short Circuit between Pins and Erroneous Mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down. (5)Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6)Input Pins In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External Capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8)Thermal Shutdown Circuit This LSI builds in a thermal shutdown circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal Design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd)in actual states of use. (10) About the Pin for the Test, the un-use pin Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to this Datasheet. And, as for the pin that doesn't specially have an explanation, ask our company person in charge. (11) About the Rush Current For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of wiring. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Ordering Information B D 1 2 0 6 Part Number G U L - Package GUL: VCSP50L2 E2 Packaging and forming specification E2: Embossed tape and reel ●Marking Diagram VCSP50L2(TOP VIEW) 1PIN MARK Part Number Marking LOT Number 1206 ●Physical Dimension Tape and Reel Information VCSP50L2(BD1206GUL) A (φ0.15)INDEX POST D B C B Embossed carrier tape (heat sealing method) Quantity 3000pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand A 1 0.25±0.05 2 3 ) P=0.5×3 0.06 S 0.05 A B Tape 0.25±0.05 15- φ 0.25±0.05 0.55MAX 2.00±0.05 2.00±0.05 0.1±0.05 1PIN MARK 1pin 4 P=0.5×3 (Unit : mm) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Reel 11/12 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 BD1206GUL Datasheet ●Revision History Date Revision 02.Oct.2012 001 Changes New Release www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/12 TSZ02201-0G3G0C200020-1-2 02.Oct.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001