BD12734FV-GE2

Datasheet Operational Amplifiers Low Supply Current Input/Output Full Swing Operational Amplifier BD12730G BD12732xxx BD12734xxx General Description Key Specifications BD12730G/BD12732xxx/BD12734xxx are input/output full swing operational amplifiers. They have the features of low operating supply voltage, low supply current, low input referred noise voltage and high phase margin. These are suitable for audio applications and battery management.  Operating Supply Voltage (Single Supply): +1.8V to +5.5V  Operating Temperature Range: -40°C to +85°C  Input Offset Voltage: 5mV (Max)  Supply Current: BD12730G(Single) 550µA (Max) BD12732xxx(Dual) 900µA (Max) BD12734xxx(Quad) 1800µA (Max)  Input Referred Noise Voltage: 10 nV/ Hz (Typ)  Adequate Phase Margin: 75°(Typ) Features      Low Operating Supply Voltage Input/Output Full Swing Low Supply Current High Phase Margin Low Input Referred Noise Voltage Packages SSOP5 SOP8 SOP-J8 SSOP-B8 TSSOP-B8 MSOP8 TSSOP-B8J SOP14 SOP-J14 SSOP-B14 TSSOP-B14J Applications  Audio Application  Battery Management  General Purpose W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm 3.00mm x 6.40mm x 1.35mm 3.00mm x 6.40mm x 1.20mm 2.90mm x 4.00mm x 0.90mm 3.00mm x 4.90mm x 1.10mm 8.70mm x 6.20mm x 1.71mm 8.65mm x 6.00mm x 1.65mm 5.00mm x 6.40mm x 1.35mm 5.00mm x 6.40mm x 1.20mm Pin Configuration BD12730G : SSOP5 +IN GND 2 -IN 5 1 Pin No. V+ + - 3 4 OUT ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Pin Name 1 +IN 2 GND 3 -IN 4 OUT 5 V+ ○This product has no designed protection against radioactive rays. 1/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx BD12732F BD12732FJ BD12732FV BD12732FVT BD12732FVM BD12732FVJ Datasheet BD12734xxx : SOP8 : SOP-J8 : SSOP-B8 : TSSOP-B8 : MSOP8 : TSSOP-B8J OUT1 1 -IN1 2 8 V+ CH1 - + + +IN1 3 7 OUT2 CH2 + - 6 -IN2 GND 4 BD12734F BD12734FJ BD12734FV BD12734FVJ 5 +IN2 Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 GND 5 +IN2 6 -IN2 7 OUT2 8 V+ Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 : SOP14 : SOP-J14 : SSOP-B14 : TSSOP-B14J OUT1 1 -IN1 2 14 OUT4 CH1 - + 13 -IN4 CH4 + - +IN1 3 12 +IN4 V+ 4 11 GND +IN2 5 -IN2 6 OUT2 7 10 +IN3 - + CH2 + CH3 9 -IN3 8 OUT3 4 V+ 5 +IN2 6 -IN2 7 OUT2 8 OUT3 9 -IN3 10 +IN3 11 GND 12 +IN4 13 -IN4 14 OUT4 Ordering Information B D 1 2 7 Part Number BD12730G BD12732xxx BD12734xxx www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3 x x x x Package G : SSOP5 F : SOP8 FJ : SOP-J8 FV : SSOP-B8 FVT : TSSOP-B8 FVM : MSOP8 FVJ : TSSOP-B8J F : SOP14 FJ : SOP-J14 FV : SSOP-B14 FVJ : TSSOP-B14J 2/50 - x x Packaging and Forming Specification TR: Embossed tape and reel (SSOP5/MSOP8) E2: Embossed tape and reel (SOP8/SOP-J8/SSOP-B8/TSSOP-B8/ TSSOP-B8J/SOP14/SOP-J14/SSOP-B14/ TSSOP-B14J) TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Line-up Operating Temperature Channels Package 1ch 2ch -40°C to +85°C 4ch Orderable Part Number SSOP5 Reel of 3000 BD12730G-TR SOP8 Reel of 2500 BD12732F-E2 SOP-J8 Reel of 2500 BD12732FJ-E2 SSOP-B8 Reel of 2500 BD12732FV-E2 TSSOP-B8 Reel of 3000 BD12732FVT-E2 MSOP8 Reel of 3000 BD12732FVM-TR TSSOP-B8J Reel of 2500 BD12732FVJ-E2 SOP14 Reel of 2500 BD12734F-E2 SOP-J14 Reel of 2500 BD12734FJ-E2 SSOP-B14 Reel of 2500 BD12734FV-E2 TSSOP-B14J Reel of 2500 BD12734FVJ-E2 Absolute Maximum Ratings (TA=25°C) Parameter Rating Symbol Supply Voltage BD12730G V+ +7.0 - - SOP8 - 0.68 (Note 2,9) - SOP-J8 - 0.67 (Note 1,9) - - 0.62 (Note 3,9) - (Note 3,9) - Differential Input Voltage - 0.62 MSOP8 - 0.58 (Note 4,9) TSSOP-B8J - (Note 4,9) SOP14 - - 0.56(Note 5,9) SOP-J14 - - 1.02(Note 6,9) SSOP-B14 - - 0.87(Note 7,9) TSSOP-B14J - - 0.85(Note 8,9) 0.58 Unit V 0.67 (Note 1,9) TSSOP-B8 PD (Note 10) BD12734xxx SSOP5 SSOP-B8 Power Dissipation BD12732xxx W - VID ±3.0 V VICM GND to V+ V II ±10 mA Operating Supply Voltage Vopr +1.8 to +5.5 V Operating Temperature Topr - 40 to +85 °C Tstg - 55 to +150 °C TJmax +150 °C Input Common-mode Voltage Range Input Current (Note 11) Storage Temperature Maximum Junction Temperature (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) (Note 9) (Note 10) To use at temperature above TA=25°C, reduce by 5.4mW/°C. To use at temperature above TA=25°C, reduce by 5.5mW/°C. To use at temperature above TA=25°C, reduce by 5.0mW/°C. To use at temperature above TA=25°C, reduce by 4.7mW/°C. To use at temperature above TA=25°C, reduce by 4.5mW/°C. To use at temperature above TA=25°C, reduce by 8.2mW/°C. To use at temperature above TA=25°C, reduce by 7.0mW/°C. To use at temperature above TA=25°C, reduce by 6.8mW/°C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than GND. (Note 11) An excessive input current will flow when input voltages of more than Supply Voltage(V+)+0.6V or less than GND-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Electrical Characteristics ○BD12730G (Unless otherwise specified V+=+5V, GND=0V, TA=25°C) Parameter Symbol Limit Min Typ Max Unit Conditions Supply Current IDD - 320 550 µA Input Offset Voltage(Note 12) VIO - 1 5 mV - Input Bias Current(Note 12) IB - 50 250 nA - Input Offset Current(Note 12) IIO - 5 100 nA - Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 13) Common-mode Rejection Ratio CMRR 55 70 - dB - Power Supply Rejection Ratio PSRR 70 85 - dB - VOH1 4.9 4.95 - V RL=20kΩ(Note 13) VOH2 4.75 4.85 - V RL=2kΩ(Note 13) VOL1 - 0.05 0.1 V RL=20kΩ(Note 13) VOL2 - 0.15 0.25 V RL=2kΩ(Note 13) ISOURCE - 12 - mA OUT=0V Output Sink Current ISINK - 5 - mA OUT=5V Input Common-mode Voltage Range VICM 0 - 5 V Gain Bandwidth GBW - 1 - MHz f=10kHz Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 13) Phase Margin θ - 75 - deg RL=2kΩ(Note 13) - 10 - nV/ Hz f=1kHz - 1.2 - μVrms RS=100Ω, DIN-AUDIO - 0.4 - V/µS Maximum Output Voltage (High) Maximum Output Voltage (Low) Output Source Current Input Referred Noise Voltage VN Slew Rate SR RL=∞, +IN=2.5V CMRR>55dB RL=2kΩ(Note 13) (Note 12) Absolute value (Note 13) Output load resistance connect to a half of V+ www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Electrical Characteristics – continued ○BD12732xxx (Unless otherwise specified V+=+5V, GND=0V, TA=25°C) Parameter Symbol Limit Min Typ Max Unit Conditions RL=∞, +IN=2.5V All Op-Amps Supply Current IDD - 580 900 µA Input Offset Voltage(Note 14) VIO - 1 5 mV - Input Bias Current(Note 14) IB - 50 250 nA - Input Offset Current(Note 14) IIO - 5 100 nA - Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 15) Common-mode Rejection Ratio CMRR 55 70 - dB - Power Supply Rejection Ratio PSRR 70 85 - dB - VOH1 4.9 4.95 - V RL=20kΩ(Note 15) VOH2 4.75 4.85 - V RL=2kΩ(Note 15) VOL1 - 0.05 0.1 V RL=20kΩ(Note 15) VOL2 - 0.15 0.25 V RL=2kΩ(Note 15) ISOURCE - 12 - mA OUT=0V Output Sink Current ISINK - 5 - mA OUT=5V Input Common-mode Voltage Range VICM 0 - 5 V Gain Bandwidth GBW - 1 - MHz f=10kHz Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 15) Phase Margin θ - 75 - deg RL=2kΩ(Note 15) - 10 - nV/ Hz f=1kHz - 1.2 - μVrms RS=100Ω, DIN-AUDIO Maximum Output Voltage (High) Maximum Output Voltage (Low) Output Source Current CMRR>55dB Input Referred Noise Voltage VN Slew Rate SR - 0.4 - V/µS Channel Separation CS - 90 - dB RL=2kΩ(Note 15) f=1kHz, RL=2kΩ(Note 15) OUT=1.2Vrms (Note 14) Absolute value (Note 15) Output load resistance connect to a half of V+ www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Electrical Characteristics – continued ○BD12734xxx (Unless otherwise specified V+=+5V, GND=0V, TA=25°C) Parameter Symbol Limit Min Typ Max Unit Conditions RL=∞, +IN=2.5V All Op-Amps Supply Current IDD - 1200 1800 µA Input Offset Voltage(Note 16) VIO - 1 5 mV - Input Bias Current(Note 16) IB - 50 250 nA - Input Offset Current(Note 16) IIO - 5 100 nA - Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 17) Common-mode Rejection Ratio CMRR 55 70 - dB - Power Supply Rejection Ratio PSRR 70 85 - dB - VOH1 4.9 4.95 - V RL=20kΩ(Note 17) VOH2 4.75 4.85 - V RL=2kΩ(Note 17) VOL1 - 0.05 0.1 V RL=20kΩ(Note 17) VOL2 - 0.15 0.25 V RL=2kΩ(Note 17) ISOURCE - 12 - mA OUT=0V Output Sink Current ISINK - 5 - mA OUT=5V Input Common-mode Voltage Range VICM 0 - 5 V Gain Bandwidth GBW - 1 - MHz f=10kHz Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 17) Phase Margin θ - 75 - deg RL=2kΩ(Note 17) - 10 - nV/ Hz f=1kHz - 1.2 - μVrms RS=100Ω, DIN-AUDIO Maximum Output Voltage (High) Maximum Output Voltage (Low) Output Source Current CMRR>55dB Input Referred Noise Voltage VN Slew Rate SR - 0.4 - V/µS Channel Separation CS - 133 - dB RL=2kΩ(Note 17) f=1kHz, RL=2kΩ(Note 17) OUT=1.2Vrms (Note 16) Absolute value (Note 17) Output load resistance connect to a half of V+ www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Description of electrical characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general documents. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (V+/GND) Indicates the maximum voltage that can be applied between the V+ terminal and GND terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (2) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (5) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. AV = (Output voltage) / (Differential Input voltage) (6) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (7) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage)/(Input offset fluctuation) (8) Maximum Output Voltage (High/Low Level Output Voltage) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (9) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that can be output from the IC under specific output conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (10) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (11) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. (12) Unity Gain Frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. (13) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (14) Input Referred Noise Voltage (VN) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (15) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (16) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves ○BD12730G 400 0.8 85℃ 0.6 25℃ 300 Supply Current [µA] Power Dissipation [W] 350 BD12730G 0.4 0.2 250 -40℃ 200 150 100 50 0.0 0 25 0 85 50 75 100 125 Ambient Temperature [℃] 150 1 2 3 4 5 6 Supply Voltage [V] Figure 2. Supply Current vs Supply Voltage Figure 1. Power Dissipation vs Ambient Temperature (Derating Curve) 6 400 5.0V Maximum Output Voltage (High) [V] 350 3.0V Supply Current [µA] 300 250 1.8V 200 150 100 50 5 -40℃ 25℃ 4 85℃ 3 2 1 0 0 -50 -25 0 25 50 75 1 100 Ambient Temperature [℃] Figure 3. Supply Current vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 4. Maximum Output Voltage (High) vs Supply Voltage (RL=20kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 6 18 5 15 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] ○BD12730G 5.0V 4 3 3.0V 2 1.8V 1 0 12 85℃ 25℃ 9 -40℃ 6 3 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 1 18 6 15 5 12 9 5.0V 6 3.0V 1.8V 3 3 4 Supply Voltage [V] 5 6 Figure 6. Maximum Output Voltage (Low) vs Supply Voltage (RL=20kΩ) Maximum Output Voltage (High) [V] Maximum Output Voltage (Low) [mV] Figure 5. Maximum Output Voltage (High) vs Ambient Temperature (RL=20kΩ) 2 0 -40℃ 25℃ 4 85℃ 3 2 1 0 -50 -25 0 25 50 75 100 1 2 3 4 5 6 Ambient Temperature [℃] Supply Voltage [V] Figure 7. Maximum Output Voltage (Low) vs Ambient Temperature (RL=20kΩ) Figure 8. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 6 120 5 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] ○BD12730G 5.0V 4 3 3.0V 2 1.8V 1 0 80 25℃ 60 40 -40℃ 20 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 1 3 100 2 Input Offset Voltage [mV] 120 80 60 5.0V 40 3.0V 1.8V 20 2 3 4 Supply Voltage [V] 5 6 Figure 10. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) Figure 9. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) Maximum Output Voltage (Low) [V] 85℃ -40℃ 1 85℃ 0 25℃ -1 -2 -3 0 -50 -25 0 25 50 75 100 1 Ambient Temperature [°C] Figure 11. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) 2 3 4 Supply Voltage [V] 5 6 Figure 12. Input Offset Voltage vs Supply Voltage (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 5 5 4 4 3 3 1.8V 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○BD12730G 3.0V 1 0 5.0V -1 -2 -1 -2 -4 -4 -5 -5 0 25 50 75 Ambient Temperature [°C] 85℃ 0 -3 -25 25℃ 1 -3 -50 -40℃ 2 -1 100 0 1 2 3 4 Input Voltage [V] 5 6 Figure 14. Input Common Mode Voltage Range (V+=5V) Figure 13. Input Offset Voltage vs Ambient Temperature 60 15 50 10 5.0V Input Offset Current [nA] Input Bias Current [nA] 1.8V 40 5.0V 3.0V 30 1.8V 20 5 3.0V 0 -5 10 -10 0 -15 -50 -25 0 25 50 75 Ambient Temperature [℃] -50 100 Figure 15. Input Bias Current vs Ambient Temperature -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 16. Input Offset Current vs Ambient Temperature (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 100 100 90 90 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] ○BD12730G 5.0V 80 3.0V 70 1.8V 60 50 5.0V 80 70 3.0V 1.8V 60 50 40 40 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 18. Common Mode Rejection Ratio vs Ambient Temperature Figure 17. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) 100 80 90 60 80 40 200 70 60 50 150 100 Gain 20 50 0 0 -20 -50 -40 40 -50 -25 0 25 50 75 100 102 1.E-01 Ambient Temperature [°C] 103 1.E+00 104 1.E+01 105 1.E+02 -100 7 106 10 1.E+03 1.E+04 Frequency [Hz] Figure 19. Power Supply Rejection Ratio vs Ambient Temperature (V+=1.8V to 5.0V) Figure 20. Voltage Gain・Phase vs Frequency (V+=5V, RL=2kΩ, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 Phase [deg] Voltage Gain [dB] Power Supply Rejection Ratio [dB] Phase BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 1 1 0.8 0.8 Slew Rate H-L [V/µs] Slew Rate L-H [V/µs] ○BD12730G 0.6 5.0V 3.0V 0.4 0.6 5.0V 0.4 3.0V 1.8V 0.2 0.2 0 0 -50 -25 0 25 50 75 100 1.8V -50 Ambient Temperature [℃] 1.6 80 Phase Margin [deg] Unity Gain Frequency [MHz] . 100 1.2 0.8 50 75 100 60 40 0.4 20 0 0 1000 25 Figure 22. Slew Rate H-L vs Ambient Temperature (RL=2kΩ) 2 100 0 Ambient Temperature [℃] Figure 21. Slew Rate L-H vs Ambient Temperature (RL=2kΩ) 10 -25 10000 10 Load Capacitance [pF] 100 1000 10000 Load Capacitance [pF] Figure 23. Unity Gain Frequency vs Load Capacitance (V+=5V, TA=25°C) Figure 24. Phase Margin vs Load Capacitance (V+=5V, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12730G 1.0000 Total Harmonic Distortion + Noise [%] . Input Referred Noise Voltage [µVrms] . 2.0 1.6 1.2 0.8 0.4 0.1000 1kHz 0.0100 20Hz 0.0010 20kHz 0.0001 0.0 1 2 3 4 5 0.01 6 0.10 1.00 10.00 Output Voltage [Vrms] Supply Voltage [V] Figure 25. Input Referred Noise Voltage vs Supply Voltage (TA=25°C) Figure 26. Total Harmonic Distortion + Noise vs Output Voltage (V+=5V, RL=2kΩ, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12732xxx 0.8 800 BD12732F 700 85℃ BD12732FJ 600 Supply Current [µA] Power Dissipation [W] 0.6 BD12732FV BD12732FVT 0.4 BD12732FVJ BD12732FVM 25℃ 500 -40℃ 400 300 200 0.2 100 0.0 0 25 85 50 75 100 125 Ambient Temperature [°C] 0 1 150 Figure 27. Power Dissipation vs Ambient Temperature (Derating Curve) 3 4 Supply Voltage [V] 5 6 Figure 28. Supply Current vs Supply Voltage 6 800 Maximum Output Voltage (High) [V] 5.0V 700 3.0V 600 Supply Current [µA] 2 500 1.8V 400 300 200 100 0 5 -40℃ 25℃ 4 85℃ 3 2 1 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 Figure 29. Supply Current vs Ambient Temperature 1 2 3 4 5 Ambient Temperature [℃] 6 Figure 30. Maximum Output Voltage (High) vs Supply Voltage (RL=20kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12732xxx 18 5 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5.0V 4 3 3.0V 2 1.8V 1 15 12 25℃ 6 -40℃ 3 0 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 1 100 Figure 31. Maximum Output Voltage (High) vs Ambient Temperature (RL=20kΩ) 18 6 15 5 12 9 5.0V 6 3.0V 1.8V 3 2 3 4 Supply Voltage [V] 5 6 Figure 32. Maximum Output Voltage (Low) vs Supply Voltage (RL=20kΩ) Maximum Output Voltage (High) [V] Maximum Output Voltage (Low) [mV] 85℃ 9 -40℃ 25℃ 4 85℃ 3 2 1 0 0 -50 -25 0 25 50 75 100 1 2 3 4 5 6 Ambient Temperature [℃] Supply Voltage [V] Figure 33. Maximum Output Voltage (Low) vs Ambient Temperature (RL=20kΩ) Figure 34. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 6 120 5 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] ○BD12732xxx 5.0V 4 3 3.0V 2 1.8V 1 80 85℃ 40 -40℃ 20 0 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 1 100 Figure 35. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) 120 3 100 2 80 60 5.0V 40 3.0V 1.8V 20 2 3 4 Supply Voltage [V] 5 6 Figure 36. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) Input Offset Voltage [mV] Maximum Output Voltage Low [mV] 25℃ 60 -40℃ 1 85℃ 0 25℃ -1 -2 0 -3 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 1 Figure 37. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) 2 3 4 Supply Voltage [V] 5 6 Figure 38. Input Offset Voltage vs Supply Voltage (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 5 5 4 4 3 3 1.8V 2 Input Offset Voltage [mV] Input Offset Voltage [mV] ○BD12732xxx 3.0V 1 0 5.0V -1 -2 -1 -2 -4 -4 -5 -5 0 25 50 75 Ambient Temperature [℃] 85℃ 0 -3 -25 25℃ 1 -3 -50 -40℃ 2 100 -1 0 1 2 3 4 Input voltage [V] 5 6 Figure 40. Input Common Mode Voltage Range (V+=5V) Figure 39. Input Offset Voltage vs Ambient Temperature 60 15 50 10 Input Offset Current [nA] Input Bias Current [nA] 1.8V 40 30 20 3.0V 10 3.0V 5 0 5.0V -5 -10 1.8V 5.0V -15 0 -50 -25 0 25 50 75 Ambient Temperature [℃] -50 100 Figure 41. Input Bias Current vs Ambient Temperature -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 42. Input Offset Current vs Ambient Temperature (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 100 100 90 90 5.0V 3.0V 80 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] ○BD12732xxx 70 1.8V 60 50 5.0V 80 3.0V 70 1.8V 60 50 40 40 -50 -25 0 25 50 75 Ambient Temperature [℃] -50 100 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 44. Common Mode Rejection Ratio vs Ambient Temperature Figure 43. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) 100 80 90 60 80 40 200 70 60 50 150 100 Gain 20 50 0 0 -20 40 -50 -40 -50 -25 0 25 50 75 102 1.E-01 100 Ambient Temperature [℃] 103 1.E+00 104 1.E+01 105 1.E+02 106 1.E+03 -100 107 1.E+04 Frequency [Hz] Figure 45. Power Supply Rejection Ratio vs Ambient Temperature (V+=1.8V to 5.0V) Figure 46. Voltage Gain・Phase vs Frequency (V+=5V, RL=2kΩ, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 Phase [deg] Voltage Gain [dB] Power Supply Rejection Ratio [dB] Phase BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 1 1 0.8 0.8 0.6 5.0V Slew Rate H-L [V/µs] Slew Rate L-H [V/µs] ○BD12732xxx 3.0V 0.4 1.8V 0.6 5.0V 0.4 3.0V 0.2 0.2 0 0 -50 -25 0 25 50 75 1.8V -50 100 Figure 47. Slew Rate L-H vs Ambient Temperature (RL=2kΩ) 0 25 50 75 100 Figure 48. Slew Rate H-L vs Ambient Temperature (RL=2kΩ) 2 100 1.6 80 Phase Margin [deg] Unity Gain Frequency [MHz] . -25 Ambient Temperature [℃] Ambient Temperature [℃] 1.2 0.8 0.4 60 40 20 0 0 10 100 1000 10000 10 Load Capacitance [pF] 100 1000 10000 Load Capacitance [pF] Figure 49. Unity Gain Frequency vs Load Capacitance (V+=5V, TA=25°C) Figure 50. Phase Margin vs Load Capacitance (V+=5V, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Typical Performance Curves Datasheet BD12734xxx – Continued ○BD12732xxx 1.0000 Total Harmonic Distortion + Noise [%] . Input Referred Noise Voltage [µVrms] . 2.0 1.6 1.2 0.8 0.4 0.1000 1kHz 0.0100 20Hz 0.0010 20kHz 0.0001 0.0 1 2 3 4 5 0.01 6 0.10 1.00 10.00 Output Voltage [Vrms] Supply Voltage [V] Figure 51. Input Referred Noise Voltage vs Supply Voltage (TA=25°C) Figure 52. Total Harmonic Distortion + Noise vs Output Voltage (V+=5V, RL=2kΩ, TA=25°C) Channel Separation [dB] 120 110 -40ºC 100 25ºC 85ºc 90 80 1 2 3 4 Supply Voltage [V] 5 6 Figure 53. Channel Separation vs Supply Voltage (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12734xxx 1.2 1600 1400 1.0 0.8 BD12734FV 0.6 BD12734FVJ BD12734F 0.4 85℃ 1200 Supply Current [µA] Power Dissipation [W] BD12734FJ 25℃ 1000 -40℃ 800 600 400 0.2 200 0.0 0 25 85 50 75 100 125 Ambient Temperature [℃] 0 1 150 Figure 54. Power Dissipation vs Ambient Temperature (Derating Curve) 3 4 Supply Voltage [V] 5 6 Figure 55. Supply Current vs Supply Voltage 6 1600 Maximum Output Voltage (High) [V] 5.0V 1400 3.0V 1200 Supply Current [µA] 2 1000 1.8V 800 600 400 200 5 -40℃ 25℃ 4 85℃ 3 2 1 0 0 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 Figure 56. Supply Current vs Ambient Temperature 1 2 3 4 Supply Voltage [V] 5 6 Figure 57. Maximum Output Voltage (High) vs Supply Voltage (RL=20kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 6 18 5 15 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] ○BD12734xxx 5.0V 4 3 3.0V 2 1.8V 1 0 12 85℃ 25℃ 9 -40℃ 6 3 0 -50 -25 0 25 50 75 100 1 2 Ambient Temperature [℃] 6 15 5 12 5.0V 9 3.0V 6 1.8V 3 5 6 Figure 59. Maximum Output Voltage (Low) vs Supply Voltage (RL=20kΩ) 18 Maximum Output Voltage (High) [V] Maximum Output Voltage (Low) [mV] Figure 58. Maximum Output Voltage (High) vs Ambient Temperature (RL=20kΩ) 3 4 Supply Voltage [V] -40℃ 25℃ 4 85℃ 3 2 1 0 0 -50 -25 0 25 50 75 100 1 Ambient Temperature [℃] 2 3 4 5 6 Supply Voltage [V] Figure 60. Maximum Output Voltage (Low) vs Ambient Temperature (RL=20kΩ) Figure 61. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 6 120 5 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] ○BD12734xxx 5.0V 4 3 3.0V 2 1.8V 1 0 80 85℃ 60 25℃ 40 20 0 -50 -25 0 25 50 75 100 1 2 Ambient Temperature [℃] Figure 62. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) 120 3 100 2 80 60 5.0V 40 3.0V 3 4 Supply Voltage [V] 5 6 Figure 63. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) Input Offset Voltage [mV] Maximum Output Voltage (Low) [mV] -40℃ 1 25℃ 0 85℃ -40℃ -1 1.8V 20 -2 0 -3 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 1 Figure 64. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) 2 3 4 Supply Voltage [V] 5 6 Figure 65. Input Offset Voltage vs Supply Voltage (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 5 5 4 4 3 3 Input Offset Voltage [mV] Input Offset Voltage [mV] ○BD12734xxx 2 1.8V 1 3.0V 0 5.0V -1 -2 1 0 -2 -4 -4 -5 -5 0 25 50 75 Ambient Temperature [℃] -40℃ -1 -3 -25 25℃ 2 -3 -50 85℃ -1 100 15 50 10 Input Offset Current [nA] Input Bias Current [nA] 60 40 5.0V 3.0V 20 1.8V 5 5.0V 6 1.8V 3.0V 0 -15 0 25 50 75 Ambient Temperature [℃] 5 -5 -10 -25 2 3 4 Input Voltage [V] 0 10 -50 1 Figure 67. Input Common Mode Voltage Range (V+=5V) Figure 66. Input Offset Voltage vs Ambient Temperature 30 0 -50 100 Figure 68. Input Bias Current vs Ambient Temperature -25 0 25 50 75 Ambient temperature [°C] 100 Figure 69. Input Offset Current vs Ambient Temperature (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12734xxx 100 140 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 90 5.0V 80 3.0V 70 1.8V 60 50 120 5.0V 100 3.0V 80 1.8V 60 40 40 -50 -25 0 25 50 75 Ambient Temperature [℃] 100 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 71. Common Mode Rejection Ratio vs Ambient Temperature Figure 70. Large Signal Voltage Gain vs Ambient Temperature (RL=2kΩ) 100 80 90 60 80 40 200 70 60 20 50 0 0 -20 40 -40 -25 0 25 50 75 100 Gain 50 -50 150 102 1.E-01 100 -50 -100 103 1.E+00 104 1.E+01 105 1.E+02 106 1.E+03 Ambient temperature [℃] Frequency [Hz] Figure 72. Power Supply Rejection Ratio vs Ambient Temperature (V+=1.8V to 5.0V) Figure 73. Voltage Gain・Phase vs Frequency (V+=5V, RL=2kΩ, TA=25°C) 107 1.E+04 (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 Phase [deg] Voltage Gain [dB] Power Supply Rejection Ratio [dB] Phase BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued 1 1 0.8 0.8 Slew Rate H-L [V/µs] Slew Rate L-H [V/µs] ○BD12734xxx 0.6 5.0V 3.0V 0.4 1.8V 0.2 0.6 5.0V 0.4 3.0V 0.2 1.8V 0 0 -50 -25 0 25 50 75 -50 100 Figure 74. Slew Rate L-H vs Ambient Temperature (RL=2kΩ) 0 25 50 75 100 Figure 75. Slew Rate H-L vs Ambient Temperature (RL=2kΩ) 2 100 1.6 80 Phase Margin [deg] Unity Gain Frequency [MHz] . -25 Ambient Temperature [℃] Ambient Temperature [℃] 1.2 0.8 0.4 60 40 20 0 0 10 100 1000 10000 10 Load Capacitance [pF] 100 1000 10000 Load Capacitance [pF] Figure 77. Phase Margin vs Load Capacitance (V+=5V, TA=25°C) Figure 76. Unity Gain Frequency vs Load Capacitance (V+=5V, TA=25°C) (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Typical Performance Curves – Continued ○BD12734xxx 1.0000 Total Harmonic Distortion + Noise [%] . Input Referred Noise Voltage [µVrms] . 2.0 1.6 1.2 0.8 0.4 0.0 0.1000 1kHz 0.0100 20Hz 0.0010 20kHz 0.0001 1 2 3 4 5 6 0.01 Supply Voltage [V] 0.10 1.00 10.00 Output Voltage [Vrms] Figure 78. Input Referred Noise Voltage vs Supply Voltage (TA=25°C) Figure 79. Total Harmonic Distortion + Noise vs Output Voltage (V+=5V, RL=2kΩ, TA=25°C) Channel Separation [dB] 120 110 85℃ 100 25℃ -40℃ 90 80 1 2 3 4 Supply Voltage [V] 5 6 Figure 80. Channel Separation vs Supply Voltage (*)The data above are measurement values of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Application Information NULL method condition for Test Circuit 1 V+, GND, VRL, EK, VICM Unit: V Parameter Input Offset Voltage VF S1 S2 VF1 ON ON OFF 5.0 0 - ON ON 5.0 0 2.5 ON ON OFF 5.0 0 - open -2.5 ON ON OFF 0 - open -0.9 VF2 Large Signal Voltage Gain VF3 Common Mode Rejection Ratio (Input Common-mode Voltage Range) VF4 VF5 VF6 Power Supply Rejection Ratio VF7 S3 V+ GND VRL RL Ω EK ON 5.0 1.8 open -2.5 2k -4.5 -0.5 VICM Calculation 2.5 1 2.5 2 0 5.0 0.9 3 4 － Calculation － |VF1| 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR= 20Log ΔVICM × (1+RF/RS) |VF4 - VF5| [dB] 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log ΔV+ × (1+ RF/RS) |VF6 - VF7| [dB] [V] 1+RF/RS ∆EK × (1+RF/RS) |VF2-VF3| [dB] 0.1µF RF=50kΩ SW1 EK RS=50Ω 0.01µF 500kΩ V+ RI=10kΩ 15V Vo 500kΩ 0.1µF 0.1µF DUT NULL SW3 RS=50Ω VICM 50kΩ RI=10kΩ 1000pF RL SW2 GND VRL VF -15V Figure 81. Test Circuit 1 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Application Information – continued Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON ON OFF OFF OFF OFF OFF ON ON ON OFF OFF ON ON OFF OFF OFF ON ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON Input voltage SW3 SW4 R2 100kΩ ● VH ● V+ VL － SW1 SW2 SW5 SW6 t Input wave ＋ SW8 SW7 SW9 SW10 SW11 SW12 Output voltage R1 1kΩ GND 90% SR=∆V/∆t VH RL -IN CL +IN VRL ∆V Vo 10% VL ∆t t Output wave Figure 82. Test Circuit 2 Figure 83. Slew Rate Input Output Wave R2=100kΩ V+ R1=1kΩ IN R2=100kΩ R1//R2 GND V+ R1=1kΩ OUT1 =1Vrms R1//R2 CS=20Log OUT2 GND 100×OUT1 OUT2 Figure 84. Test Circuit 3 (Channel separation) www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Application Example ○Voltage follower Voltage gain is 0dB. V+ Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT IN OUT=IN GND Figure 85. Voltage Follower ○Inverting amplifier R2 V+ For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression R1 IN OUT OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. R1// R2 GND Figure 86. Inverting Amplifier Circuit ○Non-inverting amplifier R1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is -INphase with the input voltage (IN) and is shown in the next expression. V+ OUT=(1 + R2/R1)・IN OUT IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. GND Figure 87. Non-inverting Amplifier Circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 88(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax－TA) / PD °C/W The Derating curve in Figure 88(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 88(c) to € shows an example of the derating curve for BD12730G, BD12732xxx and BD12734xxx. Power dissipation of LSI [W] PDmax Power dissipation of IC θJA=(TJmax-TA)/ PD °C/W Ambient temperature TA [ °C ] P2 θJA2 < θJA1 θJA2 P1 TJmax θJA1 0 Chip surface temperature TJ [ °C ] 25 50 75 100 125 150 Ambient temperature TA [ °C ] (b) Derating Curve (a) Thermal Resistance 0.8 0.8 BD12732F(Note 19) 0.6 0.6 Power Dissipation [W] Power Dissipation [W] BD12732FJ(Note 18) BD12730G(Note 18) 0.4 0.2 0.0 0 25 85 50 75 100 125 Ambient Temperature [℃] BD12732FVT(Note 20) 0.4 BD12732FVJ(Note 21) BD12732FVM(Note 21) 0.2 0.0 150 (c) BD12730G www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 BD12732FV(Note 20) 0 25 85 50 75 100 125 Ambient Temperature [°C] 150 (d) BD12732xxx 32/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx 1.2 Power Dissipation [W] 1.0 BD12734FJ(Note 23) 0.8 BD12734FVJ(Note 25) BD12734FV(Note 24) 0.6 BD12734F(Note 22) 0.4 0.2 0.0 0 25 85 50 75 100 125 Ambient Temperature [℃] 150 (e) BD12734xxx (Note 18) (Note 19) (Note 20) (Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit 5.4 5.5 5.0 4.7 4.5 8.2 7.0 6.8 mW/°C When using the unit above TA=25°C, subtract the value above per °C. Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted Figure 88. Thermal Resistance and Derating Curve www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 33/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 34/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 89. Example of monolithic IC structure 13. Applied voltage to the input terminal For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage V+ + 0.3V. Then, regardless of power supply voltage, GND-0.3V can be applied to input terminals without deterioration or destruction of its characteristics. 14. Power supply (single / dual) The operational amplifiers operate when the voltage supplied is between V+ and GND. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 15. Power dissipation (Pd) Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 16. IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 17. The IC destruction caused by capacitive load The transistors in circuits may be damaged when V+ terminal and GND terminal is shorted with the charged output terminal capacitor.When IC is used as a operational amplifier or as an application circuit, where oscillation is not activated by an output capacitor, the output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above. 18. Latch up Be careful in the application of input voltage that exceeds the V+ and GND. For CMOS device, sometimes latch up operation occurs. Also protect the IC from abnormal noise. 19. Decoupling capacitor Insert a decoupling capacitor between V+ and GND for a stable operation of the operational amplifier. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 35/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Operational Notes – continued 20. Unused circuits When there are unused Op-amps, it is recommended that they are connected as in Figure 90, setting the non-inverting input terminal to a potential within the Input Common-mode Voltage Range (VICM). V+ Keep this potential in VICM VICM GND Figure 90. Example of Application Circuit for Unused Op-Amp www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 36/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 37/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 38/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SOP-J8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 39/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SSOP-B8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 40/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name TSSOP-B8 Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 41/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name MSOP8 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ∗ Order quantity needs to be multiple of the minimum quantity. 42/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name TSSOP-B8J Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 43/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 44/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SOP-J14 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 45/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name SSOP-B14 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 46/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Physical Dimension, Tape and Reel Information - continued Package Name TSSOP-B14J Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 47/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Marking Diagram SSOP5(TOP VIEW) Part Number Marking LOT Number SOP8(TOP VIEW) SOP-J8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SSOP-B8(TOP VIEW) TSSOP-B8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8J(TOP VIEW) MSOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 48/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Marking Diagram - continued SOP14(TOP VIEW) SOP-J14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B14J (TOP VIEW) SSOP-B14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Product Name BD12730 BD12732 Package Type G SSOP5 F SOP8 D2732 FJ SOP-J8 D2732 FV SSOP-B8 K7 2732 FVT TSSOP-B8 D2732 FVM MSOP8 D2732 FVJ TSSOP-B8J D2732 F BD12734 Marking SOP14 BD12734F FJ SOP-J14 D2734 FV SSOP-B14 D2734 TSSOP-B14J D2734 FVM www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 49/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 BD12730G BD12732xxx Datasheet BD12734xxx Revision History Date Revision Changes 30.Nov.2013 001 New Release 11.Feb.2013 002 Added BD12732F and BD12734F 1.Apr.2014 003 4.July.2016 004 14.July.2016 005 BD12732FJ/FV/FVT/FVM/FVJ and BD12734FJ/FV/FVJ package variation added Change Operating Voltage Range Before:1.8V to 5V After:1.8V to 5.5V, Correction of erroneous description(P.28) Key Specifications : Temperature Range → Operating Temperature Range(P.1) Line-up : Topr → Operating Temperature(P.3) Delete Land Pattern Data(P.50) Correction of erroneous description (P.49 Diagr-m → Diagram) www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 50/50 TSZ02201-0GMG0G200600-1-2 14.July.2016.Rev004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001