Datasheet
Single-Output LDO Regulators
35V Voltage Resistance
2A LDO Regulators
BDxxFD0 series
Packages
Description
The BDxxFD0 series are low-saturation regulators. The
series’ output voltages are Variable, and fixed type.
These series have a built-in over-current protection
circuit that prevents the destruction of the IC due to
output short circuits and a thermal shutdown circuit that
protects the IC from thermal damage due to overloading.
W(Typ) x D(Typ) x H(Max)
HRP5
9.395mm x 10.540mm x 2.005mm
TO263-5
10.16mm×15.10mm×4.70mm
Features
Output current capability: 2A
Output voltage: Variable, Fixed
(1.5V / 1.8V / 2.5V / 3.0V / 3.3V / 5.0V / 8.0V
/ 9.0V / 12V / 15V / 16V)
±1% (±1.5%:BD15/18/25FD0W)
High output voltage accuracy (Ta=25°C)
Low saturation with PDMOS output
Built-in over-current protection circuit that prevents
the destruction of the IC due to output short circuits
Built-in thermal Shutdown circuit for protecting the
IC from thermal damage due to overloading
Low ESR Capacitor
HRP5/TO263-5 package
Key Specifications
Supply Voltage(Vo ≥ 3.0V):
Supply Voltage(Vo < 3.0V):
Output Voltage(BD00FD0W):
Output Current:
Output Voltage Precision(Note 1):
Operating Temperature Range:
Vo+1.0V to 32.0V
4.0V to 32.0V
1.5V to 16.0V
2A
±1%(Ta=25°C)
-40°C to +105°C
(Note 1) BD15/18/25FD0W are ±1.5% (Ta=25°C)
Applications
General Purpose
Ordering Part Number
B
D
x
Output voltage
00: Variable
15:1.5V
18:1.8V
25:2.5V
30:3.0V
33:3.3V
50:5.0V
80:8.0V
90:9.0V
J2:12.0V
J5:15.0V
J6:16.0V
x
F
D
Input Voltage,
Current capacity
FD0: 35V, 2A
○Product structure：Silicon monolithic integrated circuit
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TSZ22111・14・001
0
W
Enable
W: With CTL(Enable)
x
x
x
Package
HFP: HRP5
FP2: TO263-5
-
x
x
Packaging and forming
specification
TR: Embossed tape and
reel(HRP5)
E2: Embossed tape and
reel(TO263-5)
○This product is not designed protection against radioactive rays.
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Contents
Description............................................................................................................................................................................ 1
Features ................................................................................................................................................................................ 1
Packages............................................................................................................................................................................... 1
Key Specifications ................................................................................................................................................................ 1
Applications .......................................................................................................................................................................... 1
Ordering Part Number........................................................................................................................................................... 1
Contents ................................................................................................................................................................................ 2
Lineup ................................................................................................................................................................................... 3
Typical Application Circuits .................................................................................................................................................. 3
Pin Configurations/Pin Descriptions .................................................................................................................................... 4
Block diagrams ..................................................................................................................................................................... 5
Description of Blocks ........................................................................................................................................................... 6
Absolute Maximum Ratings .................................................................................................................................................. 7
Recommended Operating Conditions .................................................................................................................................. 7
Electrical Characteristics...................................................................................................................................................... 8
Thermal Resistance .............................................................................................................................................................. 9
Reference Data.................................................................................................................................................................... 10
Measurement setup for reference data .............................................................................................................................. 14
Linear Regulators Surge Voltage Protection ...................................................................................................................... 15
1. Applying positive surge to the input ........................................................................................................................ 15
2. Applying negative surge to the input ....................................................................................................................... 15
Linear Regulators Reverse Voltage Protection................................................................................................................... 15
1. about Input /Output Voltage Reversal ...................................................................................................................... 15
2. Protection against Input Reverse Voltage ................................................................................................................ 16
3. Protection against Output Reverse Voltage when Output Connect to an Inductor ................................................. 17
Thermal design ................................................................................................................................................................... 18
I/O equivalence circuit ........................................................................................................................................................ 20
Output Voltage Configuration Method (BD00FD0WHFP/FP2) ............................................................................................ 20
Operational Notes ............................................................................................................................................................... 21
1. Reverse Connection of Power Supply......................................................................................................................... 21
2. Power Supply Lines ..................................................................................................................................................... 21
3. Ground Voltage ............................................................................................................................................................ 21
4. Ground Wiring Pattern ................................................................................................................................................. 21
5. Thermal Consideration ................................................................................................................................................ 21
6. Inrush Current.............................................................................................................................................................. 21
7. Testing on Application Boards .................................................................................................................................... 21
8. Inter-pin Short and Mounting Errors ........................................................................................................................... 21
9. Unused Input Pins ....................................................................................................................................................... 21
10. Regarding the Input Pin of the IC .............................................................................................................................. 22
11. Ceramic Capacitor ..................................................................................................................................................... 22
12. Thermal Shutdown Circuit (TSD) ............................................................................................................................... 22
13. Over Current Protection Circuit (OCP) ...................................................................................................................... 22
14. Vcc Pin ....................................................................................................................................................................... 22
15. Output Pin .................................................................................................................................................................. 23
16. CTL Pin....................................................................................................................................................................... 24
17. Rapid variation in Vcc Voltage and load Current CTL Pin ......................................................................................... 24
18. Minute variation in output voltage ............................................................................................................................. 24
19. Regarding the Input Pin and Vcc voltage .................................................................................................................. 24
Physical Dimension, Tape and Reel Information ................................................................................................................ 25
Marking Diagrams ............................................................................................................................................................... 27
Revision History.................................................................................................................................................................. 28
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Lineup
Ordering Part Number
Output
Voltage
Ordering Part Number
Output
Voltage
BD00FD0WHFP-TR
Variable
BD00FD0WFP2-E2
Variable
BD15FD0WHFP-TR
1.5V
BD15FD0WFP2-E2
1.5V
BD18FD0WHFP-TR
1.8V
BD18FD0WFP2-E2
1.8V
BD25FD0WHFP-TR
2.5V
BD25FD0WFP2-E2
2.5V
BD30FD0WHFP-TR
3.0V
BD30FD0WFP2-E2
3.0V
BD33FD0WHFP-TR
3.3V
BD33FD0WFP2-E2
3.3V
BD50FD0WHFP-TR
5.0V
BD50FD0WFP2-E2
5.0V
BD80FD0WHFP-TR
8.0V
BD80FD0WFP2-E2
8.0V
BD90FD0WHFP-TR
9.0V
BD90FD0WFP2-E2
9.0V
BDJ2FD0WHFP-TR
12V
BDJ2FD0WFP2-E2
12V
BDJ5FD0WHFP-TR
15V
BDJ5FD0WFP2-E2
15V
BDJ6FD0WHFP-TR
16V
BDJ6FD0WFP2-E2
16V
Package
HRP5
2000pcs/Reel
Package
TO263-5
500pcs/Reel
Typical Application Circuits
Vcc
Vo
R2
Vcc
Cin
CTL
Cout
ADJ
GND
R1
Figure 1. Typical Application Circuit
Output Voltage Variable Type
Vcc
Vcc
Vo
Cin
CTL
N.C.
Cout
GND
Figure 2. Typical Application Circuit
Output Voltage Fixation Type
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Pin Configurations/Pin Descriptions
HRP5
(TOP VIEW)
TO263-5
(TOP VIEW)
FIN
FIN
1 2
3
4 5
1 2 3 4 5
Figure 3. Pin Configurations
Variable output voltage type
Pin No
Terminal
Name
1
CTL
2
Vcc
3
GND
4
Vo
5
ADJ
FIN
FIN
Function
Control terminal
By setting this pin to High, you can turn the device on. By setting this pin to Low, you can
turn the device off.
Input Power source terminal
Connect a ceramic capacitor between Vcc and GND. Place the capacitor close to the
terminal.
Ground
It is connected to the FIN terminal at the ground of the circuit.
Output terminal
Connect a capacitor between Vo and GND. Place the capacitor close to the terminal. Refer
to Operational Notes 15 for capacitance and ESR value.
Output voltage setting terminal
Connect a resistor between Vo and ADJ,ADJ and GND.
Heat dissipating FIN
It is recommended that FIN is soldered to a copper foil part with a large area.
It is electrically connected to GND inside the package.
Fixed output voltage type
Pin No
Terminal
Name
1
CTL
2
Vcc
3
GND
4
Vo
5
N.C.
FIN
FIN
Function
Control terminal
By setting this pin to High, you can turn the device on. By setting this pin to Low, you can
turn the device off.
Input Power source terminal
Connect a ceramic capacitor between Vcc and GND. Place the capacitor close to the
terminal.
Ground
It is connected to the FIN terminal at the ground of the circuit.
Output terminal
Connect a capacitor between Vo and GND. Place the capacitor close to the terminal. Refer
to Operational Notes 15 for capacitance and ESR value.
Unused terminal
Connect to open or GND.
Heat dissipating FIN
It is recommended that FIN is soldered to a copper foil part with a large area.
It is electrically connected to GND inside the package.
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Block diagrams
< BD00FD0WHFP/FP2 (Output Voltage Variable Type) >
■HRP5/TO263-5
FIN
VREF : 基準電圧回路
OCP : 過電流保護回路
TSD : 温度保護回路
Driver : 出力ドライブ回路
PREREG
VREF
AMP
Driver
OCP
TSD
1
2
3
4
5
CTL
Vcc
GND
Vo
ADJ
Figure 4. Block diagram
BD00FD0WHFP/FP2 (Output Voltage Variable Type)
< BDxxFD0WHFP/FP2 (Output Voltage Fixation Type) >
■HRP5/TO263-5
FIN
VREF : 基準電圧回路
OCP : 過電流保護回路
TSD : 温度保護回路
Driver : 出力ドライブ回路
PREREG
VREF
AMP
Driver
OCP
TSD
1
2
CTL
Vcc
3
4
GND
Vo
5
N. C.
Figure 5. Block diagram
BDxxFD0WHFP/FP2(Output Voltage Fixation Type)
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Description of Blocks
Block Name
Function
PREREG
Internal Power Supply
TSD
Thermal Shutdown Protection
VREF
Reference Voltage
AMP
Error Amplifier
Driver
Output MOS FET Driver
Drive the Output MOS FET
OCP
Over Current Protection
To protect the device from damage caused by over current.
If the output current reaches current ability ( Typ : 2500mA ),
the output is turned off.
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Description of Blocks
A logical “High” ( VthH ≥ 2.0 V ) at the CTL enables
Power Supply for Internal Circuit
To protect the device from overheating.
If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ ),
the output is turned off.
Generate the Reference Voltage
The Error Amplifier amplifies the difference between the feed
back voltage of the output voltage and the reference v.
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Absolute Maximum Ratings
Parameter
Supply Voltage (Note 1)
Output Control Voltage (Note 2)
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Symbol
Vcc
VCTL
Ta
Tstg
Tjmax
Ratings
-0.3 to +35.0
-0.3 to +35.0
-40 to +105
-55 to +150
150
Unit
V
V
°C
°C
°C
(Note 1) Do not exceed Tjmax.
(Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within
the range of the operation power-supply voltage ahead.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage
can either be a short circuit between pins or an open circuit between pins and the internal circuitry.
Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (-40°C ≤ Ta ≤ +105°C)
Parameter
Supply Voltage (Vo ≥ 3.3V)
Supply Voltage (Vo ≤ 3.0V)
Startup Voltage (Io=0mA)
Output Control Voltage
Output Current
Output Voltage (BD00FD0W) (Note 3)
Symbol
Vcc
Vcc
Vcc
VCTL
Io
Vo
Min
Vo+1
4.0
0
0
1.5
Max.
32.0
32.0
3.8
32.0
2.0
18.0
Unit
V
V
V
V
A
V
(Note 3) Refer to Notes15 for use when you use BD00FD0W by output voltage 1.5V ≤ Vo < 3.0V.
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Electrical Characteristics
Unless otherwise specified, Ta=25°C, Vcc= 13.5V(Note 1), Io=0mA, VCTL=5.0V
The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00FD0W)
Limits
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Shutdown Current
Isd
-
0
10
μA
Circuit Current
Ib
-
0.5
1.0
mA
ADJ Terminal Voltage
(BD00FD0W)
VADJ
0.742
0.750
0.758
V
Io=500mA, Vcc=13.5V
Output Voltage
(BD15/18/25FD0W)
Vo
V
Io=500mA
Vo ≤ 2.5V
Output Voltage
(BD30 to J6FD0W) (Note 2)
Vo
V
Io=500mA
Vo ≥ 3.0V
Vo
×
0.985
Vo
×
0.99
Vo
Vo
Vo
×
1.015
Vo
×
1.01
VCTL=0V, Vcc10V, Vcc=Vo+5V
(Note 2) BD30/33/50/80/90/J2/J5/J6FD0W
(Note 3) BD00/15/18/25/30/33/50FD0W
(Note 4) BD80/90/J2/J5/J6FD0W
(Note 5) BD00/33/50/80/90/J2/J5/J6FD0W
(Note 6) BD15/18/25/30FD0W
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Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s (Note 3)
2s2p (Note 4)
θJA
119.3
22.0
°C/W
ΨJT
8
3
°C/W
θJA
80.7
20.3
°C/W
ΨJT
8
2
°C/W
HRP5
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
TO263-5
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
4 Layers
Thermal Via (Note 5)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Pitch
1.20mm
Diameter
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.
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Reference Data
BD00FD0WHFP/FP2 (Vo=5.0V)
Unless otherwise specified, Ta=25°C, Vcc=13.5V, VCTL=5.0V, Io=0mA, Vo=5.0V
(The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10.0kΩ)
Figure 6. Circuit Current
(IFEEDBACK_R ≈ 75µA)
Figure 7. Shutdown Current
(VCTL=0V)
Figure 9. Line Regulation
(Io=1.0A)
Figure 8. Line Regulation
(Io=0mA)
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Reference Data - Continue
Figure 10. Start up voltage characteristic
(Io=1.0A, Vcc=0 to 6V)
Figure 11. Load regulation
(Io=0 to 2A)
Figure 12. Over Current Protection Characteristic
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Figure 13. Dropout Voltage
(Vcc=4.75V)
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Reference Data - Continue
Figure 15. Output Voltage
Temperature Characteristic
Figure 14. Ripple Rejection
(Io=500mA)
Figure 17. CTL voltage vs CTL current
Figure 16. Output Current vs Circuit Current
(0mA ≤ Io ≤ 1000mA, IFEEDBACK_R ≈ 75µA)
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Reference Data - Continue
Figure 18. CTL voltage vs. Output Voltage
Figure 19. CTL voltage vs. Output Voltage
(VCTL=0 to 2V)
Figure 20. Thermal Shutdown Protection Characteristic
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Measurement setup for reference data
BD00FD0WHFP/FP2 (Vo=5.0V)
Vcc
Vo
Vcc
Vcc
Vo
Vo
56.7kΩ
2.2µF
2.2µF
56.7kΩ
CTL
ADJ
CTL
2.2µF
2.2µF
56.7kΩ
GND
ADJ
CTL
2.2µF
5V
10kΩ
ADJ
GND
GND
2.2µF
10kΩ
5V
10kΩ
FEEDBACK _R
Measurement setup for
Figure 6.
Vcc
Measurement setup for
Figure 7.
Vcc
Vo
Measurement setup for
Figure 8.
Vo
Vcc
56.7kΩ
2.2µF
56.7kΩ
2.2µF
CTL
ADJ
2.2µF
CTL
13.5V
2.2µF
GND
Vo
56.7kΩ
ADJ
2.2µF
GND
1.0A
10kΩ
5V
CTL
4.75V
5V
Measurement setup for
Figure 9,10.
ADJ
Measurement setup for
Figure 11,12.
Vo
Vcc
Measurement setup for
Figure 13.
2.2µF
2.2µF
CTL
2.2µF
GND
CTL
13.5V
500mA
10kΩ
ADJ
ADJ
5V
10kΩ
2.2µF
10kΩ
GND
2.2µF
GND
5V
CTL
13.5V
V
ADJ
13.5V
FEEDBACK _R
5V
Measurement setup for
Figure 14.
Vcc
Measurement setup for
Figure 15.
Vcc
Vo
Measurement setup for
Figure 16.
Vcc
Vo
56.7kΩ
2.2µF
2.2µF
2.2µF
CTL
ADJ
GND
Vo
56.7kΩ
56.7kΩ
13.5V
56.7kΩ
56.7kΩ
2.2µF
Vo
Vo
56.7kΩ
1Vrms
10kΩ
5V
Vcc
Vcc
2.2µF
GND
10kΩ
2.2µF
10kΩ
13.5V
CTL
ADJ
GND
2.2µF
CTL
13.5V
ADJ
GND
10kΩ
2.2µF
10kΩ
5V
Measurement setup for
Figure 17.
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Measurement setup for
Figure 18,19.
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Measurement setup for
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BDxxFD0 series
Linear Regulators Surge Voltage Protection
The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs.
1. Applying positive surge to the input
If the possibility exists that surges higher than absolute maximum ratings 35 V will be applied to the input, a Zener Diode
should be placed to protect the device in between the VIN and the GND as shown in the figure 21.
IN
VIN
D1
OUT
GND
CIN
VOUT
COUT
Figure 21. Surges Higher than 35 V will be Applied to the Input
2. Applying negative surge to the input
If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky
Diode should be place to protect the device in between the VIN and the GND as shown in the figure 22.
IN
VIN
D1
OUT
GND
CIN
VOUT
COUT
Figure 22. Surges Lower than -0.3 V will be Applied to the Input
Linear Regulators Reverse Voltage Protection
A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that
reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can
also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage
polarity protection for ICs.
1. about Input /Output Voltage Reversal
In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power
MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The
inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic
body diode is usually disregarded for the regulator behavior (Figure 23).
IR
VOUT
VIN
Error
AMP.
VREF
Figure 23. Reverse Current Path in an MOS Linear Regulator
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An effective solution to this is an external bypass diode connected in-between the input and output to prevent the
reverse current flow inside the IC (see Figure 24.). Note that the bypass diode must be turned on before the internal
circuit of the IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage V F. Some
ICs are configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing
large leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that
has a small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output
voltage differential and rated forward current greater than the reverse current during use.
D1
IN
VIN
OUT
VOUT
GND
CIN
COUT
Figure 24. Bypass Diode for Reverse Current Diversion
The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the
main drawback is found in the level of their reverse current (I R), which is relatively high. So, one with a low reverse
current is recommended when choosing a Schottky diode. The VR-IR characteristics versus temperatures show
increases at higher temperatures.
If VIN is open in a circuit as shown in the following Figure 25. with its input/output voltage being reversed, the only current
that flows in the reverse current path is the bias current of the IC. Because the amperage is too low to damage or
destroy the parasitic element, a reverse current bypass diode is not required for this type of circuit.
ON→OFF
IBIAS
VIN
IN
VOUT
OUT
GND
CIN
COUT
Figure 25. Open VIN
2. Protection against Input Reverse Voltage
Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown
protection between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 26.).
A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 27. is the
simplest solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by batteries
because there is a power loss calculated as VF × IOUT, as the forward voltage VF of the diode drops in a correct
connection. The lower VF of a Schottky barrier diode than that of a rectifier diode gives a slightly smaller power loss.
Because diodes generate heat, care must be taken to select a diode that has enough allowance in power dissipation. A
reverse connection allows a negligible reverse current to flow in the diode.
VIN
IN
OUT
VOUT
D1
-
VIN
CIN
GND
COUT
CIN
+
GND
OUT
GND
VOUT
COUT
GND
Figure 26. Current Path in Reverse Input Connection
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Figure 27. Protection against Reverse Polarity 1
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09.Sep.2019 Rev.003
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Figure 28. shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located in the
drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a correct
connection is calculated by multiplying the resistance of the MOSFET being turned on by the output current IOUT,
therefore it is smaller than the voltage drop by the diode (see Figure 27.) and results in less of a power loss. No current
flows in a reverse connection where the MOSFET remains off.
If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower the
gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 29.
Q1
VIN
Q1
VIN
IN
CIN
OUT
GND
VOUT
VOUT
IN
R1
COUT
R2
CIN
OUT
GND
COUT
Figure 29. Protection against Reverse Polarity 3
Figure 28. Protection against Reverse Polarity 2
3. Protection against Output Reverse Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon the
output voltage turning off. In-between the IC output and ground pins is a diode for preventing electrostatic breakdown, in
which a large current flows that could destroy the IC. To prevent this from happening, connect a Schottky barrier diode in
parallel with the diode (see Figure 30.).
Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the waveform
on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed for a motor load
that is affected by its counter electromotive force, as it produces an electrical current in a similar way.
VIN
IN
VOUT
OUT
GND
CIN
COUT
GND
D1
XLL
GND
Figure 30. Current Path in Inductive Load (Output: Off)
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BDxxFD0 series
Thermal design
HRP5
IC mounted on ROHM standard board based on JEDEC.
8
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
Power Dissipation: Pd[W]
7
②5.68 W
6
5
4
3
2
①1.04W
1
0
0
25
50
75
100
125
150
Ambient Temperature: Ta[ C]
Figure 31. Power Dissipation (HRP5)
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of
PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 119.3 °C/W、ΨJT (top) = 8 °C/W
Condition②: θJA = 22.0 °C/W、ΨJT (top) = 3 °C/W
IC mounted on ROHM standard board based on JEDEC.
TO263-5
① : 1 - layer PCB
(Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
8
Power Dissipation: Pd[W]
7
②6.15 W
6
5
4
3
①1.54W
2
1
0
0
25
50
75
100
125
Ambient Temperature: Ta[ C]
Figure 32. Power Dissipation (TO263-5)
150
② : 4 - layer PCB
(2 inner layers and Copper foil area on the reverse side of
PCB:
74.2 mm x 74.2 mm)
Board material: FR4
Board size: 114.3 mm x 76.2 mm x 1.60 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm x 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm x 74.2 mm, 2 oz. copper.
Condition①: θJA = 80.7 °C/W、ΨJT (top) = 8 °C/W
Condition②: θJA = 20.3 °C/W、ΨJT (top) = 2 °C/W
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When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in
Figure 31.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tjmax.
Figure 31. show the acceptable power dissipation characteristic curves of the HRP5 package. Even when the ambient
temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so please operate the
IC at temperatures less than the acceptable power dissipation.
The calculation method for power consumption Pc(W) is as follows
Pc= (Vcc－Vo)×Io+Vcc×Ib
Acceptable loss Pd ≥ Pc
Solving this for load current Io in order to operate within the acceptable loss
Pd－Vcc×Ib
Io≤ Vcc－Vo
Vcc
Vo
Io
Ib
: Input voltage
: Output voltage
: Load current
: Circuit current
It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example) When HRP5, Ta=85°C, Vcc=13.5V, Vo=5.0V
Io≤ 2.953－13.5×Ib
8.5
Io≤346.5.2 mA (Ib: 0.58mA)
Figure 31 ②θja=22°C /W →-45.5mW/°C
25°C =5.68W → 85°C =2.953W
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
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BDxxFD0 series
I/O equivalence circuit
Vcc Terminal
CTL Terminal
200kΩ
(Typ)
Vcc
1kΩ
(Typ)
CTL
200kΩ
(Typ)
IC
Vo Terminal
BD15/18/25/30/33/50/80/90/J2/J5/J6FD0W
R1 (kΩ)
(Typ)
Vcc
BD15FD0
BD18FD0
BD25FD0
BD30FD0
BD33FD0
BD50FD0
BD80FD0
BD90FD0
BDJ2FD0
BDJ5FD0
BDJ6FD0
R3
Vo
R2
R1
10.0
5.0
4.0
R2 (kΩ)
(Typ)
10.2
14.2
23.6
29.5
33.5
56.1
47.9
54.5
74.5
75.4
80.6
R3 (kΩ)
(Typ)
15.0
20.0
BD00FD0W
Vo Terminal
ADJ Terminal
Vcc
1kΩ
(Typ)
Vo
15kΩ
(Typ)
ADJ
Vo
28kΩ
(Typ)
1kΩ
(Typ)
Figure 33. I/O equivalence circuit
Output Voltage Configuration Method (BD00FD0WHFP/FP2)
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 34.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistor values are
large. Due to this, resistance ranging from 5kΩ to 10kΩ is highly recommended for R1.
Vo
R2
ADJ≈0.75V
(Typ)
IC
ADJ
pin
Vo ≈ ADJ×(R1+R2)/R1
R1
Figure 34. Output Voltage Configuration
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BDxxFD0 series
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging
on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 114.3mm x 76.2mm x 1.57mmt(1S) / 114.3mm x 76.2mm x 1.60mmt(2S2P) glass epoxy board. In
case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd
rating.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 35. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not
be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Vcc Pin
Insert a capacitor (Vo ≥ 5.0V : capacitor ≥ 1µF, 1.5V < Vo ≤ 5.0V : capacitor ≥ 2.2µF) between the Vcc and GND pins.
Choose the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the
capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We
recommend using a capacitor with excellent voltage and temperature characteristics.
Electric capacitor
IC
Ceramic capacitor, Low ESR capacitor
Figure 36. Input Capacitor
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Operational Notes – continued
15. Output Pin
In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a
capacitor with a capacitance of more than 2.2μF(Min) (3.0V ≤ Vo ≤ 16.0V). Electrolytic, tantalum and ceramic capacitors
can be used. We recommend a capacitor with a capacitance of more than 4.7μF(Min) (1.5V ≤ Vo < 3.0V). Ceramic
capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 2.2μF(Min)(3.0V ≤ Vo ≤
16.0V) or more than 4.7μF(Min)(1.5V ≤ Vo < 3.0V) is maintained at the intended applied voltage and temperature range.
Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the
capacitor refer to the Cout ESR vs Io data. The stable operation range given in the reference data is based on the
standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB
impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is
needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that
the actual application meets with the required specification.
4.0V ≤ Vcc ≤ 26.5V
1.5V ≤ Vo < 3.0V
-40 C ≤ Ta ≤ +105°C
5kΩ ≤ R1 ≤ 10kΩ (BD00FD0W)
2.2µF ≤ Cin ≤ 100µF
4.7µF ≤ Cout ≤ 100µF
4.0V ≤ Vcc ≤ 26.5V
3.0V ≤ Vo ≤ 16.0V
-40 C ≤ Ta ≤ +105°C
5kΩ ≤ R1 ≤ 10kΩ (BD00FD0W)
1.0µF ≤ Cin ≤ 100µF
2.2µF ≤ Cout ≤ 100µF
100
100
4.7µF ≤ Cout ≤ 100µF
Unstable operating region
Cout_ESR(Ω ）
Cout_ESR(Ω ）
Unstable operating region
10
10
1
Stable operating region
0.1
1
Stable operating region
0.1
0.01
0.01
0.001
0.001
0
400
800
1200
1600
0
2000
400
800
1200
1600
2000
Io(mA)
Io(mA)
Cout ESR vs Io
3.0V ≤ Vo ≤ 16.0V
Cout ESR vs Io
1.5V ≤ Vo < 3.0V
Vcc
Vo
Cin
R2
VCC
(4.0V to 26.5V)
CTL
Cout
Io
(Rout)
ADJ
GND
VCTL
(5.0V)
R1
(5k to 10kΩ)
ESR
Measurement circuit (BD00FD0W)
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Operational Notes – continued
16. CTL Pin
Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected,
otherwise, the output voltage would be unstable.
17. Rapid variation in Vcc Voltage and load Current CTL Pin
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output
current and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
18. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
19. Regarding the Input Pin and Vcc voltage
In some applications, the Vcc and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the Vcc shorts to the GND. Use a
capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a
bypass between all pins and the Vcc pin.
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Physical Dimension, Tape and Reel Information
Package Name
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HRP5
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Package Name
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Marking Diagrams
HRP5
HRP5 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Output
Voltage[V]
Part Number
Marking
Variable
1.5
D00FD0WHFP
D15FD0WHFP
1.8
2.5
3.0
D18FD0WHFP
D25FD0WHFP
D30FD0WHFP
3.3
D33FD0WHFP
5.0
8.0
D50FD0WHFP
D80FD0WHFP
9.0
12.0
D90FD0WHFP
DJ2FD0WHFP
15.0
16.0
DJ5FD0WHFP
DJ6FD0WHFP
Output
Voltage[V]
Part Number
Marking
Variable
1.5
00FD0WFP2
15FD0WFP2
1.8
2.5
3.0
3.3
18FD0WFP2
25FD0WFP2
30FD0WFP2
33FD0WFP2
5.0
8.0
50FD0WFP2
80FD0WFP2
9.0
90FD0WFP2
12.0
15.0
16.0
J2FD0WFP2
J5FD0WFP2
J6FD0WFP2
TO263-5
TO263-5 (TOP VIEW)
Part Number Marking
LOT Number
1PIN
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BDxxFD0 series
Revision History
Date
Revision
Changes
21.Mar.2017
001
New Release
15.Mar.2018
002
TO263-5 package added
09.Sep.2019
003
Figure 12 changed
Notation variation fixed
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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