Datasheet
4-Channel Charge Pump
White LED Driver with 64
Dimming Steps and 1-wire Serial Interface
BD1601MUV
●General Description
The multi-level brightness control white LED driver not
only ensures efficient boost by automatically changing
the boost rate but also works as a constant current
driver in 64 steps, so that the driving current can be
adjusted finely. This IC is best suited to turn on white
LEDs that require high-accuracy LED brightness
control.
●Key Specifications
Operating power supply voltage range: 2.7V to 5.5V
LED maximum current:
30mA (Typ.)
Oscillator frequency:
1.0MHz(Typ.)
Quiescent Current:
0.1μA (Typ.)
Operating temperature range:
-30℃ to +85℃
●Package W(Typ.) x D(Typ.) x H(Max.)
●Features
Built-in parallel LED driver for 4 lamps.
64-step LED current adjusts function.
Inter-LED relative current accuracy: 3% or less
Lighting/dimming control via a single-line digital
control interface.
Automatic transition charge pump type DC/DC
converter (×1,×1.5 and ×2).
High efficiency achieved (90% or more at
maximum).
Various protection functions such as output voltage
protection, over current limiter and thermal shutdown
circuit are mounted.
VQFN016V3030
3.00mm x 3.00mm x 1.00mm
●Applications
This driver is applicable for various fields such as
mobile phones, portable game machines and white
goods.
9 C1N
10 C2N
7 VBAT
LED3 15
6 VOUT
LED4 16
5 NC
GND 4
LED2 14
EN 3
8 C1P
NC 2
LED1 13
NC 1
○Product structure：Silicon monolithic integrated circuit
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11 C2P
●Pin Configuration [Top View]
12 GND
●Typical Application Circuit
White LED Application (Recommended)
○This product is not designed protection against radioactive rays
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Datasheet
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
VMAX
7
V
Operating temperature range
Topr
-30 to +85
℃
Storage temperature range
Tstg
-55 to +150
℃
Pd
700 (*1)
mW
Power supply voltage
Power dissipation
(*1) When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted,
this loss will decrease 5.6mW/℃ if Ta is higher than or equal to 25℃.
●Recommended Operating Ratings (Ta = -30 to 85℃)
Parameter
Operating power supply voltage
Symbol
Ratings
Unit
Vin
2.7 to 5.5
V
●Electrical Characteristics Unless otherwise noted, Ta = +25℃, VBAT=3.6V
Parameter
Symbol
Limits
Units
Condition
Min.
Typ.
Max.
Iq
-
0.1
1
μA
EN=0V
Current Consumption1
Idd1
-
1.0
2.4
mA
x1.0 Mode, Except LED current
Current Consumption2
Idd2
-
2.5
3.5
mA
x2.0 Mode, Except LED current
fOSC
0.8
1.0
1.2
MHz
LED maximum current
ILED-max
28.5
30
31.5
mA
LED current accuracy
ILED-diff
-
-
5.0
%
ILED-match
-
0.5
3.0
%
VLED
-
0.2
0.25
V
Low threshold voltage
VIL
-
-
0.4
V
High threshold voltage
VIH
1.4
-
-
V
High level Input current
IIH
-
0.1
2
μA
EN=VBAT
Low level Input current
IIL
-2
-0.1
-
μA
EN=0V
Minimum EN High time
THI
50
-
-
ns
Minimum EN Low time
TLO
0.05
-
100
μs
EN Off Timeout
TOFF
-
512
640
μs
Overall
Quiescent Current
Charge Pump
Oscillator frequency
Current Source
LED current matching (*1)
LED control voltage
When LED current 15.5mA setting
and LED terminal voltage 1.0V
When LED current 15.5mA setting
and LED terminal voltage 1.0V
minimum voltage
at LED1 to LED4 pins
Logic control terminal
(*1) The following expression is used for calculation:
ILED-match={(Imax-Imin)/(Imax+Imin)} × 100
Imax= Current value in a channel with the maximum current value among all channels
Imin=Current value in a channel with the minimum current value among all channels
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Datasheet
●Pin Descriptions
Pin No.
Pin name
In/Out
Type
1
NC
-
-
No connect
2
NC
-
-
No connect
3
EN
In
C
ON/OFF and dimming control
4
GND
-
D
GND
5
NC
-
-
No connect
6
VOUT
Out
A
Charge pump output
7
VBAT
-
A
Power supply
8
C1P
In/Out
A
Flying capacitor pin positive (+) side
Function
9
C1N
In/Out
B
Flying capacitor pin negative (-) side
10
C2N
In/Out
B
Flying capacitor pin negative (-) side
11
C2P
In/Out
A
Flying capacitor pin positive (+) side
12
GND
-
D
GND
13
LED1
Out
B
LED current driver output 1
14
LED2
Out
B
LED current driver output 2
15
LED3
Out
B
LED current driver output 3
16
LED4
Thermal
PAD
Out
B
-
D
LED current driver output 4
Heat radiation PAD of back side
Connect to GND
●Pin ESD Type
Type-A
Type-B
PAD
PAD
GND
VBAT
Type-C
VBAT
PAD
GND
GND
Type-D
VBAT
PAD
Figure 1. Pin ESD Type
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Datasheet
●Block Diagram
C1N C1P C2N C2P
×1, ×1.5, ×2
Charge pump
VBAT
VOUT
Over Voltage
Protect
Charge Pump
Mode Control
OSC
EN
Enable/
Brightness
Control
Vout Control
LED1
TSD
LED2
LED3
6
LED4
Current
DAC
GND
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Datasheet
●Typical Performance Curves
Figure 3. Circuit Current
(Operation in × 1.0Mode)
Figure 2. Circuit Current
(Standby)
Figure 5. Efficiency
(5mA × 4Lights)
Figure 4. Efficiency
(20mA × 4Lights)
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Datasheet
●Typical Performance Curves - continued
Figure 7. Efficiency
(30mA × 4Lights)
Figure 6. Efficiency
(15mA × 4 Lights)
Figure 9. LED Current Characteristics
(Differential Linearity error)
Figure 8. LED Current Characteristics
(LED current 15.5mA)
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Datasheet
●Typical Performance Curves - continued
Figure 11. LED current matching
Figure 10. LED Current Characteristics
(Integral Linearity Error)
Figure 12. LED Current – Input voltage
(LED current 15.5mA)
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Datasheet
●Function Description
(1) LED driver
▪ UPIC interface
BD1601MUV is a single line digital interface control (Uni-port Interface Control=UPIC) that can control the power
ON/OFF and LED current value through the EN pin only. The LED current increments by about 0.5mA depending on
the number of leading edges. When the number of leading edge is added at the maximum output current of 30mA (64
leading edges), the current is almost equal to 0.5mA at startup time. To maintain any output current, the EN pin must
be kept at “H” level. To power off, the EN pin must be kept at “L” level for more than 640µsec.
THI
TLO
TOFF
EN
(Internal)
C1
State
C2
C3
C3
C4
C5
C63
C64
C1
C2
29.5mA 30mA
ILED
Soft Start
1.4mA
2.3mA
1.4mA 1.9mA
OFF
0.5mA 0.9mA
OFF
Figure 13. Brightness Control Method
THI
TLO
TOFF
EN
Figure 14. UPIC Interface
▪ LED current level
The LED current state can be changed by the EN control signal. When the current level is Cn, the basic LED current
(ILED) can be obtained from the following expression (where, n indicates a state number).
ILED = 30 / 64 ×n [mA]
State
Output current
State
Output current
State
Output current
State
Output current
[mA]
[mA]
[mA]
[mA]
C1
0.5
C14
8.0
C33
15.5
C49
23.0
C2
0.9
C18
8.4
C34
15.9
C50
23.4
C3
1.4
C19
8.9
C35
16.4
C51
23.9
C4
1.9
C20
9.4
C36
16.9
C52
24.4
C5
2.3
C21
9.8
C37
17.3
C53
24.8
C6
2.8
C22
10.3
C38
17.8
C54
25.3
C7
3.3
C23
10.8
C39
18.3
C55
25.8
C8
3.8
C24
11.3
C40
18.8
C56
26.3
C9
4.2
C25
11.7
C41
19.2
C57
26.7
C10
4.7
C26
12.2
C42
19.7
C58
27.2
C11
5.2
C27
12.7
C43
20.2
C59
27.7
C12
5.6
C28
13.1
C44
20.6
C60
28.1
C13
6.1
C29
13.6
C45
21.1
C61
28.6
C14
6.6
C30
14.1
C46
21.6
C62
29.1
C15
7.0
C31
14.5
C47
22.0
C63
29.5
C16
7.5
C32
15.0
C48
22.5
C64
30.0
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Datasheet
(2) Charge pump
a) Description of operations
Pin voltage comparison takes place at VOUT control section, and then VOUT generation takes place so that the LED
cathode voltage with the highest Vf is set to 0.2V. A boost rate is changed automatically to a proper one at the Charge
Pump Mode Control section so that operation can take place at possible low boost rate. When the current taken from
VBAT exceeds 600mA, the overcurrent limiter is activated and this IC is reset. In addition, if the output voltage falls
below 1.5V, this IC is reset for short-circuit at output.
b) Soft start function
BD1601MUV have a soft start function that prevents the rush current.
TOFF
EN/LED*
VOUT
ILED
Soft Start
Ordinal mode
Figure 15. Soft Start
c) Automatic boost rate change
The boost rate automatically switches to the best mode.
* (×1 mode -> ×1.5 mode) or (×1.5 mode -> ×2 mode)
If a battery voltage drop occursBD1601MUV cannot maintain the LED constant current, and then mode transition begins.
* (×1.5 mode -> ×1 mode) or (×2 mode -> ×1.5 mode)
If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins.
(3) UVLO (Ultra low Voltage Lock Out)
If the input voltage falls below 2.2V, BD1601MUV is shut down to prevent malfunction due to ultra-low voltage.
(4) OVP (Over Voltage Protection)
This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external factors.
(5) Thermal shutdown (TSD)
To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the
chip temperature rises over 175℃. In addition, it turns on the output if the temperature returns to the normal temperature.
(6) Power sequence
VBAT
EN
*VBAT voltage ≧ EN voltage
Figure 16. Power sequence
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Datasheet
●Application Circuit Example
White LED Application(VOUT not used)
C2P
C2N
C1P
C1N
Battery
×1, ×1.5, ×2
Charge pump
VBAT
Cin
=1μF
VOUT
Cout
=1μF
Over Voltage
Protect
Charge Pump
Mode Control
EN
Pulse
Generator
OSC
VDD
Enable/
Brightness
Control
Vout Control
LED1
TSD
LED2
LED3
6
LED4
Current
DAC
Vf
GND
Figure 17. Block Diagram and Circuit Example
●Selection of Components Externally Connected
Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.)
Symbol
Recommended value
Recommended parts
Type
Cout,Cin,C1,C2
1μF
GRM188B11A105KA61B(MURATA)
Ceramics capacitor
Connect an input bypass capacitor Cin between VBAT and GND pin and an output capacitor Cout between VOUT and GND
pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramics
capacitor with a sufficient rating for voltage to be applied.
When the parts not listed above are used, the equivalent parts must be used.
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Datasheet
●Recommended PCB Layout
In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if
needed. Heat radiation of back side PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane of board using via as shown in the patterns of below page.
The efficiency of heat radiation improves according to the area of ground plane.
To substrate
GND
GND
Cout
GND
C2
C2
GND
VBAT
VOUT
EN
C1
Cin
CIN
C1
Cout
To substrate
VCC
VOUT
Figure 18. Application Layout Image (Top View)
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VBAT
Figure 19. BD1601MUV Front (Top View)
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Datasheet
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore,
for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same
time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating
or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
●Ordering Information
B
D
1
6
0
1
Part Number
M
U
V
Package
MUV: VQFN016V3030
-
E2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VQFN016V3030 (TOP VIEW)
Part Number Marking
B D 1
6
0
LOT Number
1
1PIN MARK
●Physical Dimension Tape and Reel Information
VQFN016V3030
3.0±0.1
3.0±0.1
0.5
5
13
0.75
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
16
8
12
E2
9
1.4±0.1
0.4±0.1
1
3000pcs
(0.22)
1.4±0.1
+0.03
0.02 −0.02
1.0MAX
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
+0.05
0.25 −0.04
1pin
(Unit : mm)
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0G3G0C200030-1-2
05.Nov.2012 Rev.001
BD1601MUV
Datasheet
●Revision History
Date
Revision
05.Nov.2012
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
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Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
