BD1601MUV_11

LED Drivers for LCD Backlights Backlight LED Driver for Small LCD Panels (Charge Pump Type) BD1601MUV No.11040EBT22 ●Description The multi-level brightness control white LED driver not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver in 64 steps, so that the driving current can be adjusted finely. This IC is best suited to turn on white LEDs that require high-accuracy LED brightness control. ●Features 1) Built-in parallel LED driver for 4 to 6 lamps. 2) 64-step LED current adjust function. 3) Inter-LED relative current accuracy: 3% or less 4) Lighting/dimming control via a single-line digital control interface. 5) Automatic transition charge pump type DC/DC converter (×1,×1.5 and ×2). 6) High efficiency achieved (90% or more at maximum). 7) Various protection functions such as output voltage protection, over current limiter and thermal shutdown circuit are mounted. 8) Small QFN package. ●Applications This driver is applicable for various fields such as mobile phones, portable game machines and white goods. ●Absolute Maximum Ratings (Ta=25℃) Parameter Power supply voltage Operating temperature range Storage temperature range Power dissipation Symbol VMAX Topr Tstg Pd Ratings 7 -30 ~ +85 -55 ~ +150 700 (*1) Unit V ℃ ℃ mW (*1) When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted, this loss will decrease 5.6mW/℃ if Ta is higher than or equal to 25℃. ●Operating Conditions (Ta = -30 ~ 85℃) Parameter Operating power supply voltage Symbol VCC Ratings 2.7~5.5 Unit V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/12 2011.06 - Rev.B BD1601MUV ●Electrical Characteristics Unless otherwise noted, Ta = +25℃, VBAT=3.6V Parameter Overall Input voltage range Quiescent Current Current Consumption1 Current Consumption2 Charge Pump Oscillator frequency Current Source LED maximum current LED current accuracy LED current matching (*1) LED control voltage Logic control terminal Low threshold voltage High threshold voltage High level Input current Low level Input current Minimum EN High time Minimum EN Low time EN Off Timeout VIL VIH IIH IIL THI TLO TOFF 1.4 -2 50 0.05 0.1 -0.1 512 0.4 2 100 640 V V μA μA nsec μsec μsec EN=Vin EN=0V ILED-max ILED-diff ILED-match VLED 28.5 30 0.5 0.2 31.5 5.0 3.0 0.25 mA % % V fOSC 0.8 1.0 1.2 MHz Vin Iq Idd1 Idd2 2.7 3.6 0.1 1.0 2.5 5.5 1 2.4 3.5 V μA mA mA VBAT terminal EN=0V Symbol Limits Min. Typ. Max. Units Technical Note Condition x1.0 Mode, Except LED current x2.0 Mode, Except LED current When LED current 15.5mA setting and LED terminal voltage 1.0V When LED current 15.5mA setting and LED terminal voltage 1.0V minimum voltage at LED1~LED4 pins (*1) The following expression is used for calculation: ILED-match={(Imax-Imin)/(Imax+Imin)} × 100 Imax= Current value in a channel with the maximum current value among all channels Imin=Current value in a channel with the minimum current value among all channels www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/12 2011.06 - Rev.B BD1601MUV ●Block Diagram Technical Note C1N C1P C2N C2P VBAT ×1, ×1.5, ×2 Charge pump Over Voltage Protect Charge Pump Mode Control OSC VOUT EN Enable/ Brightness Control Vout Control TSD LED1 LED2 LED3 6 LED4 Current DAC GND Fig.1 Block Diagram ●Pin Configuration 12 GND 10 C2N 11 C2P 9 C1N LED1 13 LED2 14 LED3 15 LED4 16 8 C1P 7 VBAT 6 VOUT 5 NC NC 1 NC 2 EN 3 Fig. 2 Pin Configuration www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. GND 4 3/12 2011.06 - Rev.B BD1601MUV ●Pin Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pin name NC NC EN GND NC VOUT VBAT C1P C1N C2N C2P GND LED1 LED2 LED3 LED4 In/Out In Out In/Out In/Out In/Out In/Out Out Out Out Out Type C D A A A B B A D B B B No connect No connect ON/OFF and dimming control GND No connect Charge pump output Power supply Flying capacitor pin positive (+) side Flying capacitor pin negative (-) side Flying capacitor pin negative (-) side Flying capacitor pin positive (+) side GND LED current driver output 1 LED current driver output 2 LED current driver output 3 LED current driver output 4 Function Technical Note Type-A Type-B VBAT Type-C VBAT PAD GND Type-D VBAT PAD GND PAD GND PAD Fig.3 Equivalent circuit diagram for ESD www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/12 2011.06 - Rev.B BD1601MUV ●Typical Application Circuit White LED Application(Recommended) C1 C1N C1P C2N C2 C2P Technical Note Battery VBAT Cin =1μF ×1, ×1.5, ×2 Charge pump Over Voltage Protect Charge Pump Mode Control VOUT Cout =1μF EN Pulse Generator OSC Enable/ Brightness Control Vout Control TSD LED1 LED2 LED3 6 Current DAC LED4 Vf GND Fig. 4 Block Diagram and Recommended Circuit Example. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/12 2011.06 - Rev.B BD1601MUV ●Reference Data 2.0 1.6 1.2 Ta=85 oC Ta=-30 oC 0.4 0.0 2.5 3 3.5 4 4.5 5 5.5 Input voltage: Vin[V] Ta=25 C o Technical Note 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2.5 3 3.5 4 4.5 5 5.5 Input voltge: Vin[V] 100 90 EFFICIENCY [%] Current Consumption: Idd1[mA] Quiescent current: Iq[μ A] Ta=85 oC Down 80 70 60 50 40 2.5 0.8 Ta=25 C o Ta=-30 oC Up 3 3.5 4 4.5 5 5.5 Input voltage: Vin[V] Fig.5 Circuit Current (Standby) Fig.6 Circuit Current (operation in × 1.0Mode) Fig.7 Efficiency (20mA × 4Lights) 100 90 80 EFFICIENCY [%] 70 60 50 40 30 20 10 0 2.5 3.0 3.5 4.0 4.5 5.0 Input voltage: Vin[V] 5.5 100 Ta=-30 oC EFFICIENCY [%] 90 80 60 50 40 30 20 10 0 2.5 3.0 70 Ta=-30 oC 100 90 80 70 60 50 40 30 20 10 Ta=25 oC Ta=-30 oC Ta=25 oC Ta=85 oC Ta=85 oC Ta=25 oC EFFICIENCY [%] Ta=85 oC 3.5 4.0 4.5 5.0 Input voltage: Vin[V] 5.5 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 Input voltage: Vin[V] Fig.8 Efficiency (5mA × 4Lights) 20.0 17.5 15.0 LED current [mA] DNL [LSB] 12.5 10.0 7.5 5.0 2.5 0.0 0.0 0.4 0.8 1.2 1.6 LED voltage: VLED [V] 2.0 2.0 1.5 1.0 0.5 0.0 Fig.9 Efficiency (15mA × 4 Lights) 2.0 1.5 Fig.10 Efficiency (30mA × 4Lights Ta=-30 oC Ta=25 oC Ta=85 oC INL [LSB] Ta=-30 oC Ta=25 oC Ta=85 oC 1.0 0.5 0.0 Ta=-30 oC Ta=25 oC Ta=85 oC -0.5 -1.0 -1.5 -2.0 0 10 20 30 40 50 STATE[DEC] 60 -0.5 -1.0 -1.5 - 2.0 0 10 20 30 40 50 STATE[DEC] 60 Fig.11 LED Current Characteristics (LED current 15.5mA) Fig.12 LED Current Characteristics (Differential Linearity error) Fig.13 LED Current Characteristics (Integral Linearity Error) 5.0 4.5 LED current matching [%] 4.0 LED current [mA] 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20.0 17.5 15.0 Ta=-30 oC Ta=-30 oC Ta=25 C o 12.5 10.0 o Ta=25 oC Ta=85 C 7.5 5.0 2.5 Ta=85 oC 20 30 40 50 STATE[DEC] 60 0.0 2.5 3 3.5 4 4.5 5 Input voltage: Vin[V] 5.5 Fig.14 LED current matching Fig.15 LED Current – Input voltage (LED current 15.5mA) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/12 2011.06 - Rev.B BD1601MUV Technical Note ●Function Description (1) LED driver ▪ UPIC interface BD1601MUV is a single line digital interface control (Uni-port Interface Control=UPIC) that can control the power ON/OFF and LED current value through the EN pin only. The LED current increments by about 0.5mA depending on the number of leading edges. When the number of leading edge is added at the maximum output current of 30mA (64 leading edges), the current is almost equal to 0.5mA at startup time. To maintain any output current, the EN pin must be kept at “H” level. To power off, the EN pin must be kept at “L” level for more than 640µsec. THI EN (Internal) TLO TOFF State C1 C2 C3 C3 C4 C5 C63 C64 C1 C2 29.5mA 30mA ILED OFF Soft Start 1.4mA 2.3mA 1.4mA 1.9mA 0.5mA 0.9mA OFF Fig.16 Brightness Control Method THI EN TLO TOFF Fig.17 UPIC Interface ▪ LED current level The LED current state can be changed by the EN control signal. When the current level is Cn, the basic LED current (ILED) can be obtained from the following expression (where, n indicates a state number). ILED = 30 / 64 ×n [mA] State Output current State Output current State Output current State Output current [mA]] [mA] [mA] [mA] C1 0.5 C14 8.0 C33 15.5 C49 23.0 C2 0.9 C18 8.4 C34 15.9 C50 23.4 C3 1.4 C19 8.9 C35 16.4 C51 23.9 C4 1.9 C20 9.4 C36 16.9 C52 24.4 C5 2.3 C21 9.8 C37 17.3 C53 24.8 C6 2.8 C22 10.3 C38 17.8 C54 25.3 C7 3.3 C23 10.8 C39 18.3 C55 25.8 C8 3.8 C24 11.3 C40 18.8 C56 26.3 C9 4.2 C25 11.7 C41 19.2 C57 26.7 C10 4.7 C26 12.2 C42 19.7 C58 27.2 C11 5.2 C27 12.7 C43 20.2 C59 27.7 C12 5.6 C28 13.1 C44 20.6 C60 28.1 C13 6.1 C29 13.6 C45 21.1 C61 28.6 C14 6.6 C30 14.1 C46 21.6 C62 29.1 C15 7.0 C31 14.5 C47 22.0 C63 29.5 C16 7.5 C32 15.0 C48 22.5 C64 30.0 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/12 2011.06 - Rev.B BD1601MUV Technical Note (2) Charge pump a) Description of operations Pin voltage comparison takes place at Vout control section, and then Vout generaton takes place so that the LED cathode voltage with the highest Vf is set to 0.2V. A boost rate is changed automatically to a proper one at the Charge Pump Mode Control section so that operation can take place at possible low boost rate. When the current taken from VBAT exceeds 600mA, the overcurrent limiter is activated and this IC is reset. In addition, if the output voltage falls below 1.5V, this IC is reset for short-circuit at output. b) Soft start function BD1601MUV have a soft start function that prevents the rush current. TOFF EN/LED* VOUT ILED Soft Start Ordinal mode Fig.18 Soft Start c) Automatic boost rate change The boost rate automatically switches to the best mode. * (×1 mode -> ×1.5 mode) or (×1.5 mode -> ×2 mode) If a battery voltage drop occursBD1601MUV cannot maintain the LED constant current, and then mode transition begins. * (×1.5 mode -> ×1 mode) or (×2 mode -> ×1.5 mode) If a battery voltage rise occurs, VOUT and VBAT detection are activated, and then mode transition begins. (3) UVLO (Ultra low Voltage Lock Out) If the input voltage falls below 2.2V, BD1601MUV is shut down to prevent malfunction due to ultra-low voltage. (4) OVP (Over Voltage Protection) This circuit protects this IC against damage when the C/P output voltage (VOUT) rises extremely for some external factors. (5) Thermal shutdown (TSD) To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the chip temperature rises over 175℃. In addition, it turns on the output if the temperature returns to the normal temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown detection temperature must be set to below 175℃ in thermal design. (6) Power sequence VBAT EN Fig.19 Power sequence www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/12 2011.06 - Rev.B BD1601MUV ●Application Circuit Example White LED Application(VOUT not used) Battery Technical Note C1N C1P C2N VBAT Cin =1μF ×1, ×1.5, ×2 Charge pump Over Voltage Protect Charge Pump Mode Control C2P VOUT Cout =1μF EN Pulse Generator OSC Enable/ Brightness Control VDD LED1 LED2 LED3 Vout Control TSD 6 Current DAC LED4 Vf GND Fig. 20 Block Diagram and Circuit Example ●Application Parts Selection Method Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.) Symbol Cout,Cin,C1,C2 Recommended value 1μF Recommended parts GRM188B11A105KA61B(MURATA) Type Ceramics capacitor Connect an input bypass capacitor Cin between VBAT and GND pin and an output capacitor Cout between VOUT and GND pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied. When the parts not listed above are used, the equivalent parts must be used. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/12 2011.06 - Rev.B BD1601MUV Technical Note ●Recommended PCB Layout In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if needed. To substrate GND Cout C2 GND C2 GND EN VOUT GND Cin C1 Cout To substrate VCC VBAT C1 CIN VOUT VBAT Fig.21 Application Layout Image (Top View) Fig.22 BD1601MUV Front (Top View) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/12 2011.06 - Rev.B BD1601MUV Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6)Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (14) Coil selection To reduce the loss, select a coil with a small wound resistor for DC/DC converter output. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/12 2011.06 - Rev.B BD1601MUV ●Ordering part number Technical Note B D 1 Part No. 6 0 1 M U V - E 2 Part No. Package MUV: VQFN016V3030 Packaging and forming specification E2: Embossed tape and reel VQFN016V3030 3.0±0.1 3.0±0.1 Tape Quantity Direction of feed Embossed carrier tape 3000pcs E2 The direction is the 1pin of product is at the upper left when you hold 1PIN MARK 1.0MAX S +0.03 0.02 −0.02 (0.22) ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S C0.2 0.4±0.1 1.4±0.1 0.5 1 4 5 8 12 9 16 13 0.75 +0.05 0.25 −0.04 1.4±0.1 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/12 2011.06 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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