BD1606MVV_11

LED Drivers for LED Backlights Backlight LED Driver for Small LCD Panels (Charge Pump Type) BD1606MVV No.11040EAT24 ●Description The multi-level brightness control white LED driver not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver in 64 steps, so that the driving current can be adjusted finely. This IC is best suited to turn on white LEDs that require high-accuracy LED brightness control. ●Features 1) A 6 parallel LED driver is mounted 2) 64-step LED current adjust function 3) Inter-LED relative current accuracy: 3% or less 2 4) LED individual lighting/dimming control via a I C BUS interface 5) Automatic transition charge pump type DC/DC converter (×1,×1.5 and ×2) 6) High efficiency achieved (90% or more at maximum) 7) Various protection functions such as output voltage protection, overcurrent limiter and thermal shutdown circuit are mounted. 8) Small QFN package ●Applications This driver is applicable for various fields such as mobile phones, portable game machines and white goods. ●Absolute Maximum Rating (Ta=25℃) Parameter Power supply voltage Operating temperature range Storage temperature range Power dissipation Symbol VMAX Topr Tstg Pd Limits 7 -30 ~ +85 -55 ~ +150 780 (*1) Unit V ℃ ℃ mW (*1) When a glass epoxy substrate (70mm × 70mm × 1.6mm) has been mounted, this loss will decrease 6.2mW/℃ if Ta is higher than or equal to 25℃. ●Recommended Operation Range (Ta=-30℃ to +85℃) Parameter Operating power supply voltage Symbol VCC Limits 2.7~5.5 Unit V www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/11 2011.04 - Rev.A BD1606MVV ●Electrical Characteristics (Unless otherwise stated, Ta is 25℃ and Vin is 3.6V) Limits Parameter Symbol Min. Typ. Max. Input voltage range Quiescent current Circuit current 1 [Charge pump] Output current Oscillation frequency [LED driver] LED current absolute precision LED current relative precision LED control voltage [Logic interface] Input ‘L’ voltage Input ‘H’ voltage Input ‘H’ current Input ‘L’ current ‘L’ level SDA output [I C BUS interface (standard mode)] SCL clock frequency SCL Low duration SCL High duration Data hold time Data setup time Setup time – restart condition Hold time – restart condition Setup time – stop condition Bus free tine between start and stop [I C BUS interface (fast mode)] SCL clock frequency SCL Low duration SCL High duration Data hold time Data setup time Setup time – restart condition Hold time – restart condition Setup time – stop condition Bus free time between start and stop Interface startup time *1) 2 2 Technical Note Unit V μA mA mA MHz Vin pin Condition Vin Iq IDD1 IOUT fOSC 2.7 0.8 3.6 0 1.0 1.0 5.5 7 2.6 120 1.2 EN=0V, Vin=3.6V ×1 mode, Iout=0mA, Vin =3,6V VOUT =4.0V, Vin=3.6V Add=0x03, D6=’0’ ILED =16.5mA(LEDxCNT=0x20), LED pin voltage 1.0 V ILED =16.5mA(LEDxCNT=0x20) , LED pin voltage 1.0V ILEDA*/B*/C* EN, SCL, SDA EN, SCL, SDA EN, SCL, SDA=Vin EN, SCL, SDA=GND SDA, 3mA source SDA, 6mA source ILED-ERR ILED-to-LED VLED VIL VIH IIH IIL VOL 1.6 -10 0 4.7 4.0 0 250 4.7 4.0 4.0 4.7 0 1.3 0.6 0 100 0.6 0.6 0.6 1.3 - 0.5 0.2 - ±6.5 ±3.75*1) 0.25 0.4 10 0.4 0.6 100 3.45 400 0.9 350 % % V V V μA μA V V kHz μs μs μs ns μs μs μs μs kHz μs μs μs ns μs μs μs μs μs fSCLC tLOW tHIGH tHD;DAT tSU;DAT tSU;STA tHD;STA tSU;STO tBUF fSCL tLOW tHIGH tHD;DAT tSU;DAT tSU;STA tHD;STA tSU;STO tBUF TEN Bus startup time (after En=‘H’) The following expression is used for calculation: ILED-match={(Imax-Imin)/(Imax+Imin)} × 100 Imax= Current value in a channel with the maximum current value among all channels Imin=Current value in a channel with the minimum current value among all channels www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/11 2011.04 - Rev.A BD1606MVV ●Reference Data 2.0 1.6 3.0 2.5 2.0 IDD1[mA] 1.5 1.0 0.5 0.0 2 3 4 Vin[V] 5 6 7 2 3 4 Vin[V] 5 6 7 EFFICIENCY [%] 100 90 Technical Note DOWN 80 70 60 50 40 2 3 4 5 Vin[V] (Ta=25oC) 6 7 1.2 Iq [μA] 0.8 Ta=25℃ Ta=85℃ Ta=-30℃ Ta=25 ℃ Ta=-30℃ Ta=85 ℃ 0.4 0.0 UP Fig.1 Circuit Current (Standby) 100 90 80 EFFICIENCY [%] 70 60 50 40 30 20 10 0 2.5 3 3.5 4 4.5 5 5.5 Vin[V] 6 6.5 7 100 90 80 EFFICIENCY [%] 60 50 40 30 20 10 0 2.5 Fig.2 Circuit Current (Operation in ×1.0 Mode) 100 90 80 EFFICIENCY [%] Fig.3 Efficiency Hysteresis (13mA × 6 Lights) Ta=-30 ℃ Ta=-30 ℃ 70 Ta=-30 ℃ 70 60 50 40 30 20 10 0 2.5 Ta=25 ℃ Ta=85 ℃ Ta=25 ℃ Ta=85 ℃ Ta=25 ℃ Ta=85 ℃ 3 3.5 4 4.5 5 5.5 Vin[V] 6 6.5 7 3 3.5 4 4.5 5 5.5 Vin[V] 6 6.5 7 Fig.4 Efficiency (3.5mA x 6 Lights) 20.0 17.5 LED current [mA] 15.0 Fig.5 Efficiency (10mA x 6 Lights) 2.0 1.5 1.0 Fig.6 Efficiency (20mA x 6 Lights) 2.0 Ta=25 ℃ Ta=-30 ℃ Ta=85 ℃ INL [LSB] 1.5 1.0 0.5 0.0 Ta=25 ℃ Ta=-30 ℃ Ta=85 ℃ Ta=25 ℃ Ta=85 ℃ Ta=-30 ℃ 10.0 7.5 5.0 2.5 0.0 0.0 0.4 0.8 DNL [LSB] 12.5 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -0.5 -1.0 -1.5 -2.0 1.2 VLED [V] 1.6 2.0 0 10 20 30 40 50 STATE[DEC] 60 0 10 20 30 40 50 STATE[DEC] 60 Fig.7 LED Current Characteristics (LED current 16.5mA) Fig.8 LED Current Characteristics (Differential Linearity Error) Fig.9 LED Current Characteristics (Integral Linearity Error) 5.0 4.5 4.0 3.5 3.0 [%] 2.5 2.0 1.5 1.0 0.5 0.0 0 10 20 30 40 50 STATE[DEC] 60 20.0 17.5 LED current [mA] 15.0 12.5 Ta=-30 ℃ Ta=85 ℃ Ta=25 ℃ Ta=-30 ℃ 7.5 5.0 2.5 0.0 0 1 2 3 4 Vin[V] 5 6 7 10.0 Ta=25 ℃ Ta=85 ℃ Fig.10 LED Current matching Fig.11 LED Current vs. VIN (LED current 16.5mA) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/11 2011.04 - Rev.A BD1606MVV ●Block Diagram and Recommended Circuit Example C1 = 1μF C1N C2 = 1μF C2P Technical Note Battery Cin = 1μF VIN ×1, ×1.5, ×2 Charge Pump Over Voltage Protect Charge Pump Mode Control C1P C2N VOUT COUT = 1μF OSC EN TSD SCL 2 I C I/F & Control Logic VOUT Control ILEDA1 LEDA1 ILEDA2 LEDA1 ILEDB1 LEDB1 LEDB2 LEDC1 LEDC2 LEDACNT Current SDA 6 DAC LEDBCNT Current 6 DAC ILEDB2 ILEDC2 LEDCCNT Current 6 DAC ILEDC2 GND Fig.12 Block Diagram and Recommended Circuit Example ●Pin Table Pin Pin name number 1 2 3 4 5 6 7 8 LEDA1 SDA SCL EN VOUT VIN C1N C1P In/Out Out In In In Out In/Out Function LED current driver output I2C BUS control pin I2C BUS control pin ON/OFF control Charge pump output Power supply Pin Pin name number 9 10 11 12 13 14 15 16 C2N C2P GND LEDC2 LEDC1 LEDB2 LEDB1 LEDA2 In/Out In/Out Function Flying capacitor pin negative (-) side Flying capacitor pin positive In/Out (+) side Out Out Out Out Out GND LED current driver output LED current driver output LED current driver output LED current driver output LED current driver output Flying capacitor pin negative (-) side Flying capacitor pin positive In/Out (+) side www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/11 2011.04 - Rev.A BD1606MVV Technical Note ●Description of Operations (1) LED driver 2 ・I C BUS interface BD1606MVV can control the LED ON/OFF, brightness and charge pump switching frequency change by writing to the 2 2 register via the I C BUS interface. Control by the I C BUS interface is effective when EN is at ‘H’ kevel. When EN is at ‘L’ level, this LSI is completely shut down and control and associated functions via the I2C BUS interface are all stopped. 2 As shown in Fig.13 below, the I C BUS interface of BD1606MVV operates using the Ven voltage (buffering the EN pin 2 voltage) as supply voltage. For this reason, it is desirable that the ‘H’ voltage in the I C BUS interface is equal to the EN pin voltage. Ven EN Ven I2C interface buffer SDA SCL Fig.13 I2C BUS Interface Buffer S DA t BUF tf t L OW t SU;DAT t HD;STA tr S CL t HD;STA S t S U;STA t HIGH Sr t SU;STO t HD;DAT P S Fig.14 I2C BUS Interface Timing BD1606MVV operates as a slave device for the I2C BUS interface. a) Slave address A7 A6 1 1 A5 0 A4 0 A3 1 A2 1 A1 0 R/W 1/0 b) Data format The data format is shown below. Write format: S Slave address 7 bit W As One-byte register address 8 bit One-byte register address 8 bit One-byte register address 8 bit As Sr Slave address 7 bit R As One-byte register data As P 8 bit Or S Slave address 7 bit W As As One-byte register data As P 8 bit Read format: S Slave address 7 bit W As As Sr Slave address 7 bit R As One-byte register data Am P 8 bit Note) S: Start condition W: ‘0=Write R: ‘1=Read As: Acknowledge (slave -> master) Am: No acknowledge Sr: Repeated start condition P: Stop condition www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/11 2011.04 - Rev.A BD1606MVV Technical Note ・Register table a) Register map Address Register Hex name 0x00 0x01 0x02 0x03 Note) LEDACNT LEDBCNT LEDCCNT LEDPWR CNT D7 - D6 - D5 D4 D3 D2 D1 D0 Function Current setting of ILEDA1/2 Current setting of ILEDA1/2 Current setting of ILEDA1/2 LEDACNT LEDBCNT LEDCCNT FREQNT Current driver LEDC2 LEDC1 LEDB2 LEDB1 LEDA2 LEDA1 1/0 ON/OFF control ‘-’ : Invalid at write time ‘-’ : ‘L’ at read time b) Description of registers * LEDACNT (initial value: undefined) --- * LEDBCNT (initial value: undefined) --- * LEDCCNT (initial value: undefined) --- LED current values are controlled. LEDA1/A2, LEDB1/B2 and LEDC1/C2 are controlled via the registers LEDACNT, LEDBCNT and LEDCCNT respectively, and the current setting can be switched every 2 channels. For the current setting value in each register setting, refer to ‘LED Current Setting Table’ on page 11. * * * * * * LEDA1 (initial value: ‘0) --- LEDA2 (initial value: ‘0) --- LEDB1 (initial value: ‘0) --- LEDB2 (initial value: ‘0) --- LEDC1 (initial value: ‘0) --- LEDC2 (initial value: ‘0) --- The ON/OFF setting of each LED driver channel is as follows: ’0’: OFF ‘1’ :ON *FREQCNT (initial value: ‘0) --- The switching frequency of a charge pump is set as follows: ’0’: 1MHz ‘1’ :250kHz When ‘250kHz’ is selected, the flying capacitor of C1, C2 and Cout must be set to 10µF. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/11 2011.04 - Rev.A BD1606MVV Technical Note c) LED current setting table The following table lists the current setting values in respective register settings. Initially, these registers have not been initialized. For this reason, they are not initialized under EN= ‘0. D5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Output current (mA) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 D5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Output current (mA) 16.5 17.0 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0 29.5 30.0 30.5 31.0 31.5 32.0 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/11 2011.04 - Rev.A BD1606MVV Technical Note (2) Charge pump a) Description of operations Pin voltage comparison takes place at Vout control section, and then Vout generaton takes place so that the LED cathode voltage with the highest Vf is set to 0.1V. A boost rate is changed automatically to a proper one at the Charge Pump Mode Control section so that operation can take place at possible low boost rate. When the current taken from VBAT exceeds 600mA, the overcurrent limiter is activated and this IC is reset. In addition, if the output voltage falls below 1.5V, this IC is reset for short-circuit at output. b) Soft start function BD1606MVV have a soft start function that prevents the rush current. TOFF EN/LED* VOUT ILED Soft Start Ordinal mode Fig.15 Soft Start c) Automatic boost rate change The boost rate automatically switches to the best mode. * (×1 mode -> ×1.5 mode) or (×1.5 mode -> ×2 mode) If a battery voltage drop occurs BD1606MVV cannot maintain the LED constant current, and then mode transition begins. * (×1.5 mode -> ×1 mode) or (×2 mode -> ×1.5 mode) If a battery voltage rise occurs, VOUT and VIN detection are activated, and then mode transition begins. (3) UVLO (Ultra low Voltage Lock Out) If the input voltage falls below 2.2V, BD1606MVV is shut down to prevent malfunction due to ultra-low voltage. (4) OVP (Over Voltage Protection) This circuit protects this IC against damage when the C/P output voltage (Vout) rises extremely for some external factors. (5) Thermal shutdown (TSD) To protect this IC against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the chip temperature rises over 150℃. In addition, it turns on the output if the temperature returns to the normal temperature. Because the built-in thermal protection circuit is intended to protect the IC itself, the thermal shutdown detection temperature must be set to below 150℃ in thermal design. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/11 2011.04 - Rev.A BD1606MVV Technical Note ●Recommended PCB layout In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if needed. To substrate GND SDA GND SDA SCL VOUT VBAT EN EN SCL C2 VOUT C1 Cout Cin Cout Cin C1 VCC Rear-side GND Fig.17 Front (Top View) To substrate VCC Fig.16 Application Layout Image (Top View) ●Application Parts Selection Method Capacitor (Use a ceramics capacitor with good frequency and temperature characteristics.) Symbol Recommended value Recommended parts Cout,Cin,C1,C2 1μF GRM188B11A105KA61B(MURATA) Type Ceramics capacitor Connect an input bypass capacitor CIN between VBAT/VIN and GND pin and an output capacitor between VOUT and GND pin in proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip Furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied. When other than these parts are used, the equivalent parts must be used. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/11 2011.04 - Rev.A C2 BD1606MVV Technical Note ●N otes for Use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (14) Coil selection To reduce the loss, select a coil with a small wound resistor for DC/DC converter output. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/11 2011.04 - Rev.A BD1606MVV ●Ordering part number Technical Note B Part No. D 1 Part No. 1606 6 0 6 M V V - E 2 Package MVV: SQFN016V4040 Packaging and forming specification E2: Embossed tape and reel SQFN016V4040 4.0±0.1 4.0±0.1 Tape Quantity Direction of feed Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 1PIN MARK 1.0MAX S +0.03 0.02 −0.02 (0.22) ( reel on the left hand and you pull out the tape on the right hand ) 0.08 S 2.1±0.1 C0.2 0.55±0.1 1 16 13 12 9 4 5 8 0.65 2.1±0.1 1.025 +0.05 0.3 −0.04 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/11 2011.04 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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