Datasheet
Automotive LED Driver Series
50 V 1.5 A 1ch LED Driver for 2 Wheeler Turn
Indicator
BD18327EFV-M
General Description
BD18327EFV-M is 50 V-withstanding 1.5 A 1ch LED Driver
for 2 Wheeler Turn Indicator. It has built-in CR Timer for LED
blinking control. The IC provides high reliability because it
has LED open detection, short circuit protection, over
voltage protection. In case of LED open detection, output
blinking rate is doubled. Under high input voltage condition,
output PWM ON Duty reduces to control heat dissipation
across the IC and protect the LED load.
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
Key Specifications
◼
◼
◼
◼
◼
◼
Input Voltage Range:
6.0 V to 18.0 V
OUT Pin Maximum Output Current:
1.5 A
OUT Pin ON Resistance for High Mode: 0.8 Ω (Max)
Circuit Current at Power Saving Mode:
100 μA (Max)
CR Timer Frequency Range:
150 Hz to 1 kHz
Operating Temperature Range:
-40 °C to 125 °C
Package
AEC-Q100 Qualified(Note 1)
Functional Safety Supportive Automotive Products
Flasher SW Resistance Detection
Power Saving Mode
Built-in CR Timer
LED Open Detection
Disable LED Open Detection Function
at Reduced-voltage
Short Circuit Protection (SCP)
Over Voltage Protection (OVP)
Output PWM ON Duty Control
during High Input Voltage
W (Typ) x D (Typ) x H (Max)
HTSSOP-B20
6.5 mm x 6.4 mm x 1.0 mm
(Note 1) Grade1
Applications
◼
2 Wheeler Turn Indicator
Typical Application Circuit
Flasher SW
RSE
DIN
VIN
RSSE
OUT
SOURCE
SE
OUTS
SSE
VREG
VIN
VREG
CVREG
RCRT1
DISC
+B
ZD
CVIN
RVDR1
VDR
ZD_OP
RVOP1
RVOP2
BD18327EFV-M
Left
Rear
Right
Front
Right
Rear
RCRT2
CRT
VREG
RVDR2
VSCP
CCRT
RVSCP1
RVSCP2
VOP
PSSW
Left
Front
GND
TEST
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
www.rohm.com
TSZ02201-0T1T0B300400-1-2
© 2021 ROHM Co., Ltd. All rights reserved.
1/28
TSZ22111 • 14 • 001
25.Nov.2021 Rev.002
BD18327EFV-M
Pin Configuration
HTSSOP-B20
(TOP VIEW)
SOURCE
1
20
OUT
SE
2
19
OUTS
N.C.
3
18
N.C.
SSE
4
17
VREG
N.C.
5
16
N.C.
VIN
6
15
DISC
N.C.
7
14
CRT
VDR
8
13
VSCP
VOP
9
12
TEST
PSSW
10
11
GND
EXP-PAD
Pin Description
Pin No.
Pin Name
Function
1
SOURCE
2
SE
3
N.C.
No internal connection(Note 1)
4
SSE
Output current sense input in Low Mode
5
N.C.
No internal connection(Note 1)
6
VIN
Power supply input
7
N.C.
No internal connection(Note 1)
8
VDR
PWM ON Duty setting
9
VOP
Open detection threshold setting pin
10
PSSW
11
GND
GND
12
TEST
The test pin connects to GND
13
VSCP
Short detection threshold setting pin
14
CRT
CR timer setting1
15
DISC
CR timer setting2
16
N.C.
No internal connection(Note 1)
17
VREG
18
N.C.
19
OUTS
20
OUT
-
EXP-PAD
Power PMOS source pin
Output current sense input pin
Programmable ground pin
Regulated voltage pin
No internal connection(Note 1)
Output sense pin
Output pin
The EXP-PAD connect to GND.
(Note 1) Leave this pin unconnected.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Block Diagram
SOURCE
SE
LED Open Det.
/ SCP
OUT
High Mode
DRV
SSE
VIN
VIN
VB G
Bandgap
Ref (BG)
PSM
VB G
VREG
Low Mode
DRV
Flasher SW
Monitor
VREG
OUTS
V RE G
VDR
0.95 V
/ 1.0 V
PWM ONDuty
Control
PSSW
V RE G
CRT
DISC
PSSW
LOGIC
CR TIMER
&
DIVIDER
VREG
40 mV
VIN
VBG
UVLO
VBG
TSD
V IN
VOP
VS E
VSCP
LED OPEN Det. / SCP
TEST
GND
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Description of Blocks
(Unless otherwise specified, Ta = 25 °C, VIN = 13 V, and numbers are “Typical” values.)
1
Operation mode description
1.1 Power Saving Mode (PS Mode)
After power on, the IC starts up in power saving mode. The current consumption of the IC is limited to 100 μA or less,
and it is possible to reduce the power consumption when the Flasher SW is off. In the PS mode, the MOSFET built into
the PSSW pin can be turned off to shut off the current flowing to the external resistor. When the Power Saving Mode is
released, the IC monitors the VIN pin voltage, and when the UVLO VIN Release Voltage (5.0 V (Typ)) is exceeded, the
IC shifts to Flasher SW Monitor Mode. The release condition for the power saving mode is expressed by the following
equation.
𝐼𝑂𝑈𝑇_𝑃𝑆𝑀 × 𝑅𝑃𝑆𝑀 ×> 𝑉𝑃𝑆𝑀_𝑅𝐸𝐿
𝑎𝑛𝑑
𝑉𝐼𝑁 > 𝑉𝑈𝑉𝐿𝑂𝑅
𝐼𝑂𝑈𝑇_𝑃𝑆𝑀 = 𝑅
where:
𝐼𝑂𝑈𝑇_𝑃𝑆𝑀
𝑅𝑃𝑆𝑀
𝑉𝑃𝑆𝑀_𝑅𝐸𝐿
𝑉𝐼𝑁
𝑉𝑈𝑉𝐿𝑂𝑅
𝑅𝐿𝐸𝐷
𝑅𝑆𝑊
𝑉𝐼𝑁
𝑃𝑆𝑀 +𝑅𝑆𝑊 +𝑅𝐿𝐸𝐷
is the OUT pin current in Power Saving Mode.
is the Power Saving Mode Internal Resistance.
is the Power Saving Mode Release Threshold.
is the VIN pin voltage.
is the UVLO VIN Release Voltage.
is the LED board resistance.
is the Flasher SW resistance.
Solving above equation for RSW
𝑅𝑆𝑊 < 𝑅𝑃𝑆𝑀 × 𝑉
𝑉𝐼𝑁
𝑃𝑆𝑀_𝑅𝐸𝐿
− 𝑅𝑃𝑆𝑀 − 𝑅𝐿𝐸𝐷
VIN
VIN
VDR
VIN
RA
VOP
to Logic
OUT
Flasher
SW
Left Side
RB
RSW
PSSW
PSSW
RPSM = RA+RB
RF Lamp
RR Lamp
RLED
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1
Operation mode description – continued
1.2 Flasher SW Monitor Mode
When PS Mode is released, the IC shifts to Flasher SW Monitor Mode. When the IC shifts to Flasher SW monitor mode,
the constant current source for SW resistance monitoring turns on and monitoring of the OUTS pin voltage starts.
The constant current source turns ON only in the ON Duty section set by CR timer, and the judgment of the SW monitor
also becomes only in this section. After switching from PS mode, if the OUTS pin voltage is V OUTS_ON (0.95 V (Typ)) or
more within 8 CLK cycle, the IC returns to PS mode again.
Condition for IC to go from Flasher SW Monitor Mode to Blinking High Mode:
After switching from PS mode, if the OUTS pin voltage falls below VOUTS_ON (0.95 V (Typ)) within 8 CLK cycles, the IC
shifts to the blinking High mode. The Blinking High Mode transition conditions are as follows.
𝑉𝑂𝑈𝑇𝑆 = 𝐼𝑂𝑈𝑇_𝑆𝑊𝑀𝑂𝑁𝐼 × (𝑅𝑆𝑊 + 𝑅𝐿𝐸𝐷 ) < 𝑉𝑂𝑈𝑇𝑆_𝑂𝑁
𝐼𝑂𝑈𝑇_𝑆𝑊𝑀𝑂𝑁𝐼 =
(𝑅𝑆𝑊 +𝑅𝐿𝐸𝐷 )
𝑅𝑆𝑆𝐸
where:
𝑉𝑂𝑈𝑇𝑆
𝐼𝑂𝑈𝑇_𝑆𝑊𝑀𝑂𝑁𝐼
𝑉𝑆𝑆𝐸_𝐹𝐵
𝑅𝑆𝑆𝐸
𝑅𝑆𝑊
𝑅𝐿𝐸𝐷
𝑉𝑂𝑈𝑇𝑆_𝑂𝑁
𝐾𝐵𝐿𝑂𝑁
𝑉𝑆𝑆𝐸_𝐹𝐵
𝑅𝑆𝑆𝐸
< 𝐾𝐵𝐿𝑂𝑁
is the OUTS pin voltage.
is the OUT pin current in Flasher SW Monitor Mode.
is the SSE pin Feedback Voltage.
is the Constant Current Setting Resistor.
is the Flasher SW resistance.
is the LED board resistance.
is the Blinking ON Threshold Voltage.
is the Blinking ON Threshold Constant. ( KBLON = VOUTS_ON / VSSE_FB )
RSSE
+B
VIN
SSE
RSE
SE
Internal MOSFET
for Blinking High Mode
VSSE_F B
: 0.95 V
OFF
Constant Current Source
for Flasher SW Monitor
OUT
From Logic
CR TIMER
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Flasher
SW
Left Side
IOUT_SWMONI
OUTS
RSW
RF Lamp
to Logic
VOUTS_ON: 0.95 V
/ V OUTS_OFF: 1.0 V
5/28.
RR Lamp
RLED
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1
Operation mode description – continued
1.3 Blinking High Mode
The Blinking High mode continues for 256 CLK cycles. During Blinking High Mode, the constant current source for
Flasher SW monitoring and the comparator built into the OUTS Pin turn off. During this period, the IC performs LED
Open Detection, SW Open Detection and Short Circuit Protection. After 256 CLK cycles, the IC shifts to Blinking Low
Mode.
RSSE
+B
VIN
RSE
SSE
SE
Internal MOSFET
for Blinking High Mode
VSSE_F B
: 0.95 V
Flasher
SW
OUT
OFF
From Logic
RSW
OUTS
RF Lamp
to Logic
OFF
Left Side
RR Lamp
VOUTS_ON: 0.95 V
/ V OUTS_OFF: 1.0 V
RLED
1.4 Blinking Low Mode
When the IC enters Blinking Low Mode, the internal counter starts counting. After 256 CLK cycles, the IC shifts to
Blinking High Mode. If the OUTS pin voltage reaches V OUTS_OFF (1.0 V (Typ)) or more before 256 CLK cycles elapse,
the IC returns to Flasher SW Resistance Monitor Mode again. The Flasher Switch Monitor Mode transition conditions
are as follows.
𝑉𝑂𝑈𝑇𝑆 > 𝑉𝑂𝑈𝑇𝑆_𝑂𝐹𝐹
(𝑅𝑆𝑊 +𝑅𝐿𝐸𝐷 )
𝑅𝑆𝑆𝐸
where:
𝑉𝑂𝑈𝑇𝑆_𝑂𝐹𝐹
𝐾𝐵𝐿𝑂𝐹𝐹
> 𝐾𝐵𝐿𝑂𝐹𝐹
is the Blinking OFF Threshold Voltage.
is the Blinking OFF Threshold Constant. ( KBLOFF = VOUTS_OFF / VSSE_FB )
RSSE
+B
VIN
RSE
SSE
SE
Internal MOSFET
for Blinking High Mode
VSSE_F B
: 0.95 V
OFF
Constant Current Source
for Flasher SW Monitor
OUT
From Logic
CR TIMER
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Flasher
SW
Left Side
IOUT_SWMONI
OUTS
RSW
RF Lamp
to Logic
VOUTS_ON: 0.95 V
/ V OUTS_OFF: 1.0 V
RR Lamp
RLED
6/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1
Operation mode description – continued
1.5 Flasher SW Open Detection (SWOP)
If voltage drop across external resistance RSE drops below a certain value, Flasher SW open is detected.
When the Flasher SW open is detected, the IC shifts from Blinking High mode to Power Saving Mode.
Flasher SW Open detection can only be detected in Blinking High Mode.
The Flasher SW Open Detection condition can be calculated by the following formula.
𝑉𝐼𝑁_𝑆𝐸 > 𝑉𝑆𝑊𝑂𝑃
where:
𝑉𝐼𝑁_𝑆𝐸
𝑉𝑆𝑊𝑂𝑃
is the VIN to SE voltage.
is the Flasher SW Open Detection Threshold.
VIN
R SE
VIN
SE
SOURCE
LOGIC
VSWOP:
40 mV
DRV
OUT
Hi-Z
Hi-Z
R SW < RPSM × VIN / VPSM_REL - RPSM - RLED
R SW > RPSM × VIN / VPSM_DET - RPSM - R LED
RSW
RSW < KBL_ON ×R SSE - RLE D
R SW > KBL_OFF ×R SSE - R LED
VIN_SE
ON : 256 CLK
cycles
OFF : 256 CLK
cycles
ON : 256 CLK
cycles
OFF
VOUT < V IN - VPSM_REL (1.0 V)
VIN
VIN
VOUT =
VOUTS
V OUT < VIN - VPSM_DET (0.9 V)
VOUTS < VOUTS_ON (0.95 V)
Power
Saving
Mode
VOUTS > VOUTS_OFF (1.0 V)
8 CLK
Cycles
Flasher SW
Monitor
Mode
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Blinking Mode
(High / Low)
7/28.
Flasher
SW
Monitor
Mode
Power
Saving
Mode
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1.5 Flasher SW Open Detection (SWOP) – continued
Hi-Z
Hi-Z
RSW > RPSM × VIN / VPSM_DET - RPSM - RLE D
R SW < RPSM × VIN / VPSM_REL - RPSM - RLED
RSW
RSW < KBL_ON ×R SSE - RLE D
VIN_SE
VIN_SE < 50 mV
ON : 256 CLK
cycles
ON : 256 CLK
cycles
VOUT < V IN - VPSM_REL (1.0 V)
VIN
VOUT =
VOUTS
OFF : 256 CLK
cycles
OFF : 256 CLK
cycles
ON
V OUT < VIN - VPSM_DET (0.9 V)
VIN
V OUTS < VOUTS_ON (0.95 V)
8 CLK
Cycles
Power
Saving
Mode
Flasher SW
Monitor
Mode
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Blinking Mode
(High / Low)
8/28.
Flasher
SW
Monitor
Mode
Power
Saving
Mode
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1
Operation mode description – continued
1.6 LED Open Detection Mode (LEDOP)
This LSI can detect LED open. In case of LED open inform the fault condition to user by double blinking. On detection
of fault IC starts operating the outputs on almost 1/2 blinking period (double blink operation). If voltage drop across
external resistance RSE drops below a certain value, LED open is detected. The LED open detection condition can be
calculated by the following formula.
𝑉𝐼𝑁_𝑆𝐸 < 𝑉𝑂𝑃𝐸𝑁 & 𝑉𝐼𝑁 > 𝑉𝐼𝑁_𝑂𝑃𝑀
𝑉𝑂𝑃𝐸𝑁 =
𝑉𝑂𝑃
10
𝑉𝑂𝑃 = (𝑉𝐼𝑁 − 𝑉𝑍𝐷_𝑂𝑃 ) × 𝑅
where:
𝑉𝐼𝑁_𝑆𝐸
𝑉𝑂𝑃𝐸𝑁
𝑉𝐼𝑁
𝑉𝐼𝑁_𝑂𝑃𝑀
𝑉𝑂𝑃
𝑉𝑍𝐷_𝑂𝑃
𝑅𝑉𝑂𝑃1
𝑅𝑉𝑂𝑃2
𝑅𝑉𝑂𝑃2
𝑉𝑂𝑃1 +𝑅𝑉𝑂𝑃2
is the VIN to SE voltage.
is the LED Open Detection Threshold Voltage.
is the VIN pin voltage.
is the Disable LED Open Detection Function at Reduced-voltage.
is the VOP pin voltage.
is the characteristic Zener voltage of diode ZD_OP (chosen based on output voltage).
is the LED Open Detection Threshold Setting Resistor 1.
is the LED Open Detection Threshold Setting Resistor 2.
VIN
R SE
VIN
VOPEN
ZD_OP
R VOP1
R VOP2
VIN
SE
SOURCE
LOGIC
VOP
DRV
PSSW
OUT
Transition when
VIN_SE < VOP /10
Normal Blinking
ON:
256 CLK cycles
VIN_SE
VOP /10
LED Open Detection
Threshold
OFF:
256 CLK cycles
Transition when
VIN_SE > VOP /10
LED Open
ON:
256 CLK cycles
LED Open
Detection Masked
OFF: 112
CLK cycles
Masked
Normal Blinking
ON: 112
CLK cycles
VIN_SE
increases
OFF: 112
CLK cycles
ON:
256 CLK cycles
OFF: 256
CLK cycles
Masked
V IN_SE decreases
CLK
PWM
VOUT
Completes previous pattern of 256
cycles, before double blinking
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
1
Operation mode description – continued
1.7 Short Circuit Protection Mode (SCP)
When voltage drop across RSE rises above a certain value, short circuit is detected.
When short circuit is detected, the MOSFET connected to the OUT pin is turned off to prevent overcurrent from flowing
into the IC. The Short Circuit Protection condition can be calculated by the following formula.
𝑉𝐼𝑁_𝑆𝐸 > 𝑉𝑆𝐻𝑂𝑅𝑇
𝑉𝑆𝐻𝑂𝑅𝑇 =
𝑉𝑆𝐶𝑃
2
𝑉𝑆𝐶𝑃 = 𝑉𝑅𝐸𝐺 × 𝑅
where:
𝑉𝐼𝑁_𝑆𝐸
𝑉𝑆𝐻𝑂𝑅𝑇
𝑉𝑆𝐶𝑃
𝑅𝑉𝑆𝐶𝑃1
𝑅𝑉𝑆𝐶𝑃2
𝑅𝑉𝑆𝐶𝑃2
𝑉𝑆𝐶𝑃1 +𝑅𝑉𝑆𝐶𝑃2
is the VIN to SE voltage.
is the Short Circuit Protection Threshold Voltage .
is the VSCP pin voltage.
is the SCP Threshold Setting Resistor 1.
is the SCP Threshold Setting Resistor 2.
VIN
R SE
VIN
SE
SOURCE
VSHORT
LOGIC
VREG
R VSCP1
DRV
VSCP
R VSCP2
OUT
Transition when
VIN_SE > VSCP /2
Transition when
VIN_SE < VSCP /2
Normal Blinking
ON:
256 CLK cycles
Short Circuit
OFF:
256 CLK cycles
ON:
256 CLK cycles
Normal Blinking
OFF:
256 CLK cycles
ON:
256 CLK cycles
VIN_SE increases
VIN_SE
Short Circuit
Protection Masked
VSCP / 2
Short Circuit
Protection Threshold
Short Circuit
Protection Masked
CLK
PWM
VOUT
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Short Circuit detected
on rising edge of
Blinking ON cycle
10/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Description of Blocks – continued
2
State Transition Diagram
Power Saving Mode
(IVIN_PS < 100 μA)
VOUTS < VIN - VPSM_REL (1.0 V)
Under Voltage
Lock out (UVLO)
VIN > VUVLOR (5.0 V)
VIN < VUVLOD (4.5 V)
Flasher
SW Monitor
Mode
Yes
8 Counts starts
check if
VOUTS < VOUTS_ON (0.95 V)
in every CLK ON cycle
No
check if
VOUTS > VIN - VPSM_DET (0.9 V)
Monitor RSW
1 Count starts
No
Yes
LED Open
Detection Mode
Flasher SW
Open Detection
VIN_SE > VOP / 10
VIN_SE < VSWOP (40 mV)
each
"ON"
cycles
112 cycles
over
112 OFF cycles
112 cycles
over
Blinking High Mode
: 256 ON cycles
112 cycles
over
Double Blink Low Mode:
112 OFF cycles
VIN_SE < VOP / 10 and 256 cycles over
VIN_SE > VSCP / 2
V OUTS > VOUTS_OFF (1.0 V)
each
"OFF"
cycles
Double Blink High Mode:
112 ON cycles
256
cycles
over
256
cycles
over
Blinking High Mode:SCP
(Internal MOSFET OFF)
Blinking Low Mode
: 256 OFF cycles
256 cycles
over
OVP/TSD
Release
256 OFF cycles
Short Circuit
Protection Mode
OVP/TSD
Detect
OVP/TSD: Driver Shutdown
(Internal MOSFET OFF)
State transitions uninterrupted
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Description of Blocks – continued
3
CR Timer
This IC determines the flasher cycle from the internal clock generated by CR timer. The CR timer period, ON Duty, can be
set by the external resistor RCRT1, RCRT2 and the capacitance CCRT.
(1)
CRT ramp up Time t1 and CRT ramp down Time t2
CRT ramp up Time t1 and CRT ramp down Time t2 can be defined from the following equations.
Make sure that t2 is set PWM Minimum Pulse Width tMIN (100 μs) or more.
𝑡1 =
𝑡2 =
(𝑅𝐶𝑅𝑇1 +𝑅𝐶𝑅𝑇2 )×𝐶𝐶𝑅𝑇
𝑁𝐶𝐻𝐴
(𝑅𝐶𝑅𝑇2 +𝑅𝐷 )×𝐶𝐶𝑅𝑇
[s]
[s]
𝑁𝐷𝐼𝑆
When RCRT2 >> RD
𝑡2 =
𝑅𝐶𝑅𝑇2 ×𝐶𝐶𝑅𝑇
where:
𝑅𝐶𝑅𝑇1
𝑅𝐶𝑅𝑇2
𝑅𝐷
𝐶𝐶𝑅𝑇
𝑁𝐶𝐻𝐴
𝑁𝐷𝐼𝑆
(2)
𝑁𝐷𝐼𝑆
[s]
is the CR Timer Time Setting Resistor 1.
is the CR Timer Time Setting Resistor 1.
is the DISC Pin ON Resistance.
is the CR Timer Time Setting Capacitor.
is the CR Timer Charge Constant.
is the CR Timer Discharge Constant.
Internal clock frequency fCLK and ON Duty DON
Internal clock frequency and internal clock ON Duty is defined by t1 and t2.
𝑓𝐶𝐿𝐾 = 𝑡
1
1 +𝑡2
𝐷𝑂𝑁 = 𝑡
𝑡2
1 +𝑡2
VCRT_DIS = 1.75 V (Typ)
[Hz]
[%]
CRT voltage ramp up
CRT voltage ramp down
VREG
CRT pin
waveform
RCRT1
⊿VCRT
RCRT2
V CRT_CHA = 0.95 V (Typ)
t1
t2
to Logic
CRT
CCRT
Internal
Clock
Waveform
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DISC
0.95 V /
1.75 V
12/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Description of Blocks – continued
4
Output PWM ON Duty Control during high input voltage
This IC has built in Output PWM ON Duty Control during high input voltage which protects the output LEDs.
VDR pin voltage which is generated externally by dividing VIN pin voltage is compared with CRT pin voltage to generate
PWM signal. When VDR > VCRT, the internal MOSFET for Blinking High Mode is turned off and the increase in average
current flowing to the LED can be reduced.
Output PWM ON Duty DON_PWM is represented by following expression.
𝐷𝑂𝑁 = 𝑉
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆 −𝑉𝐷𝑅
𝐶𝑅𝑇_𝐷𝐼𝑆 −𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
𝑉𝐷𝑅 = 𝑉𝐼𝑁 × 𝑅
where:
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
𝑉𝐷𝑅
𝑉𝐼𝑁
𝑅𝑉𝐷𝑅1
𝑅𝑉𝐷𝑅2
𝑅𝑉𝐷𝑅2
𝑉𝐷𝑅1 +𝑅𝑉𝐷𝑅2
[%]
[%]
is the CRT Pin Discharge Voltage.
is the CRT Pin Charge Voltage.
is the VDR pin voltage.
is the VIN pin voltage.
is the Output ON Duty Setting Resistor 1.
is the Output ON Duty Setting Resistor 2.
However,
VDR ≤ VCRT_CHA
VDR ≥ VCRT_DIS
: ON Duty = 100 %
: ON Duty = 0 %
Make sure to connect resistors for voltage division of VIN to fix the voltage on the VDR pin as shown in figure.
ExampleFor RVDR1 = 47 kΩ and RVDR2 = 3.4 kΩ
When VIN = 14 V,
VDR = 0.944 V & ON Duty = 100 %
When VIN = 18 V,
VDR = 1.214 V & ON Duty = 66 %
So as VIN increases the PWM duty cycle decreases.
VIN
VDR
VCRT
VCRT & V DR
VIN
RVDR1
PWM
Signal
VDR
to Logic
RVDR2
Internal Cloc k
(CLK) Signal
VREG
RCRT1
1 CLK Cycle
Blinking Cycle
RCRT2
256 CLK Cycles
256 CLK Cycles
One Blinking Cycle = 512 CLK cycles
LED
Current
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DISC
to Logic
CRT
CCRT
0.95 V /
1.75 V
13/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Description of Blocks – continued
5
Reference Voltage (VREG)
Reference voltage VREG 5.0 V (Typ) is generated from VIN input voltage. This voltage is used as power source for the
internal circuit, and also used to fix the voltage of pins outside LSI to HIGH side. The VREG pin must be connected with C VREG
= 1.0 μF to 10 μF to ensure capacity for the phase compensation. If CVREG is not connected, the circuit behavior would become
extraordinarily unstable, for example with the oscillation of the reference voltage.
The VREG pin voltage must not be used as power source for other devices than this LSI.
VREG circuit has a built-in UVLO function. The IC is activated when the VREG pin voltage rises to 3.5 V (Typ) or higher, and
shuts down when the VREG pin voltage drops to 2.0 V (Typ) or lower.
6
Under Voltage Lock-Out (UVLO)
This IC has built-in under voltage lock-out function (UVLO).
For VIN ramp-up UVLO is active till VIN = 5.0 V (Typ). For VIN ramp down UVLO gets active when VIN = 4.5 V (Typ).
UVLO shuts down all circuit blocks other than regulator (VREG) block.
UVLO is also dependent on VREG voltage. At ramp-up UVLO is released when VREG > 3.5 V and at ramp down UVLO is
enabled when VREG = 2.0 V.
7
Over Voltage protection (OVP)
This LSI has a function to turn off output and prevent deterioration of load when VIN Pin voltage exceeds 25.5 V (Typ).
When OVP is detected, after the supply voltage drops more than hysteresis width of 500 mV (Typ) below OVP, it returns to
normal state.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/28.
SDWN_DRV
SWOPDET
P_SCP
OPENDET
TSD/OVP
SW_OP
SHORT
OPEN
OUTON
CLK_SEL
START
SW_ON
PWM
CLK
SW_DETECT
BLOCKEN
VREG
PSM_OL
OUT
SWITCH STATE
VIN
5V
UVLO
VIN
VIN - 1.0 V
OFF
V IN = 13 V
SWITCH OPEN
PSM Mode
8 CLK Buffer
8 CLK PSM mask
0.95 V
ON
8 CLK
DELAY
LOW
MODE
2 56 CLK Cycles ON
256 CLK Cy cle s O FF
Normal Blinking
256 CLK Cycles ON
2 56 CLK Cycles OFF
Output Ground Short
256 CLK Cy cle s O N
112
Cycles
112
Cycles
Single Lamp Open
112
Cycles
2 56 CLK Cycles ON
256 CLK Cy cles O FF
Normal Blinking
256 CLK Cycles ON
V IN > 25.5 V
2 56 CLK Cycles OFF
TSD / OVP
256 CLK Cyc les ON
256 CLK Cycles OFF
Normal Blinking
VIN - 0.9 V
Switch Open
PSM Mode
BD18327EFV-M
Timing Chart
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +50.0
V
-0.3 to +VIN+0.3 V
V
-0.3 to +5.0
V
VREG
-0.3 to +7.0
V
VDISC, VCRT, VSCP, VTEST
-0.3 to VREG+0.3 V
V
Tstg
-55 to +150
°C
Tjmax
150
°C
VIN Voltage
SOURCE, SE, SSE, OUT, OUTS,
PSSW, VDR, VOP Voltage
VIN to SOURCE, VIN to SE,
VIN to SSE Voltage
VSOURCE, VSE, VSSE, VOUT, VOUTS,
VPSSW, VDR, VOP
VIN_SOURCE,
VIN_SE,
VIN_SSE
VREG Voltage
DISC, CRT, VSCP, TEST
Voltage
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
103.50
31.40
°C/W
ΨJT
10.00
4.00
°C/W
HTSSOP-B20
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1) Based on JESD51-2A (Still-Air), using a BD18327 Chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top centre of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VIN
6.0
13.0
18.0
V
IOUT_MAX
-
-
1.5
A
PWM Minimum Pulse Width
tMIN
100
-
-
µs
PWM Frequency
fPWM
150
-
1000
Hz
Operating Temperature
Topr
-40
-
+125
°C
Supply Voltage(Note 1)
OUT Pin Maximum Output Current
(Note 1) ASO should not be exceeded.
Recommended Setting Parts Range
Parameter
Symbol
Min
Max
Unit
CVIN
1.0
10.0
μF
Reference Voltage Output Pin Capacitor
CVREG
1.0
10.0
μF
Constant Current Setting Resistor
RSSE
0.04
10
kΩ
Output Current Sense Resistor
RSE
0.065
10
Ω
CR Timer Time Setting Resistor 1
RCRT1
1.0
100
kΩ
CR Timer Time Setting Resistor 2
RCRT2
1.0
100
kΩ
CR Timer Time Setting Capacitor
CCRT
0.01
1.00
μF
SCP Threshold Setting Resistor 1
RVSCP1
10
100
kΩ
SCP Threshold Setting Resistor 2
RVSCP2
4.7
100
kΩ
RVOP1
10
100
kΩ
RVOP2
4.7
100
kΩ
Output PWM ON Duty Setting Resistor 1
RVDR1
4.7
100
kΩ
Output PWM ON Duty Setting Resistor 2
RVDR2
4.7
100
kΩ
Power Supply Input Capacitor
LED Open Detection Threshold Setting
Resistor 1
LED Open Detection Threshold Setting
Resistor 2
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Electrical Characteristics
(Unless otherwise specified VIN = 13 V Ta = -40 °C to + 125 °C, CVREG = 4.7 µF)
Parameter
Symbol
Min
Typ
Max
Unit
IVIN_NOM
-
-
10
mA
IVIN_PS
-
-
100
μA
OUT: OPEN
VREG
4.750
5.000
5.250
V
IL = 2 mA
VSSE_FB
-
0.95
-
V
VOUTS_ON
-
0.95
-
V
VOUTS = Sweep down
VOUTS_OFF
-
1.00
-
V
VOUTS = Sweep up
KBLON
0.95
1.00
1.05
-
KBLON = VOUTS_ON / VSSE_FB
KBLOFF
1.00
1.05
1.11
-
KBLOFF = VOUTS_OFF / VSSE_FB
VPSM_REL
0.5
1.0
1.5
V
VOUT = Sweep down
VPSM_DET
0.4
0.9
1.4
V
VOUT = Sweep up
RPSM
8
15
21
kΩ
RON_OUT
-
0.4
0.8
Ω
IOUT = 0.5 A
RLON_OUT
-
10
-
Ω
IOUT = 20 mA
ILEAK_OUT
-
-
10
µA
VOUT = 13 V
VREG x
0.18
VREG x
0.33
VREG x
0.19
VREG x
0.35
VREG x
0.20
VREG x
0.37
V
VCRT = Sweep down
V
VCRT = Sweep up
RD
-
10
20
Ω
IL = 10 mA
CR Timer Charge Constant
NCHA
4.31
4.54
4.77
-
CR Timer Discharge Constant
NDIS
1.55
1.64
1.73
-
NCOUNT
7
-
10
-
1 / fCLK
x 511
1 / fCLK
x 223
1 / fCLK
x 512
1 / fCLK
x 224
1 / fCLK
x 513
1 / fCLK
x 225
49
50
51
Circuit Current
at Normal Mode
Circuit Current
at Power Saving Mode
[VREG]
Reference Voltage
Condition
[Current Driver for Low Mode]
SSE Pin Feedback Voltage
[Flasher SW Resistance Monitor Mode]
Blinking ON Threshold
Voltage
Blinking OFF Threshold
Voltage
Blinking ON Threshold
Constant
Blinking OFF Threshold
Constant
[Power Saving Mode]
Power Saving Mode
Release Threshold
Power Saving Mode
Detect Threshold
Power Saving Mode
Internal Resistance
[Output Section]
OUT Pin ON Resistance
for High Mode
OUT Pin ON Resistance
for Low Mode
OUT Pin Leakage Current
[CR Timer Section]
CRT Pin Charge Voltage
VCRT_CHA
CRT Pin Discharge Voltage
VCRT_DIS
DISC Pin ON Resistance
[COUNTER Section]
Flasher SW Resistance
Detection Circuit Count Number
Blinking Cycle Time
at Normal Mode
Blinking Cycle Time
at LED Open Detection
Blinking ON Duty
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TBL_NOM
TBL_LEDOP
DON
18/28.
s
s
%
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Electrical Characteristics - continued
(Unless otherwise specified VIN = 13 V Ta = -40 °C to + 125 °C, CVREG = 4.7 µF)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
RPSSW
-
4
10
Ω
7.85
8.25
8.65
V
8.00
8.45
8.90
V
-
0.20
-
V
1.0
-
VIN – 4.0
V
VIN < 14 V
1.0
-
10.0
V
VIN > 14 V
1.0
-
2.5
V
[PSSW Section]
PSSW ON Resistance
IPSSW = 30 mA
[LED Open Detection/ Short Circuit Protection]
Disable LED Open Detection
Function at Reduced-voltage
VOP Pin
Input Voltage Range
VSCP Pin
Input Voltage Range
LED Open Detection
Threshold Voltage 1
LED Open Detection
Threshold Voltage 2
Flasher SW Open Detection
Threshold Voltage
Short Circuit Protection
Threshold Voltage
VIN_OPM
VOP
_RANGE
VSCP
_RANGE
VOPEN1
VOPEN2
(VOP /10)
-5
(VOP /10)
- 6.5
VOP /10
VOP /10
(VOP /10)
+5
(VOP /10)
+ 6.5
mV
mV
VIN = Sweep down
Detect
VIN = Sweep up
Release
VIN
Hysteresis
VIN_SE = Sweep down
VOP ≤ 2.5 V
VIN_SE = Sweep down
VOP > 2.5 V
VSWOP
27
40
53
mV
VIN_SE = Sweep down
VSHORT
VSCP/2
-0.065
VSCP/2
VSCP/2
+0.065
V
VIN_SE = Sweep up
VUVLOD
4.0
4.5
5.0
V
VIN = Sweep down
VUVLOR
4.5
5.0
5.5
V
VIN = Sweep up,
VREG > 3.5 V
VOVP
22.95
25.50
28.05
V
VIN = Sweep up
VOVPHYS
250
500
750
[VIN UVLO]
UVLO VIN
Detect Voltage
UVLO VIN
Release Voltage
[Overvoltage Protection]
Over Voltage Protection
Threshold Voltage
Over Voltage Protection
Hysteresis Voltage
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/28.
mV
VIN = Sweep down
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Typical Performance Curve
(Unless otherwise specified VIN = 13 V Ta = -40 °C to + 125 °C, CVREG = 4.7 µF)
1.10
CRT Pin Chage Voltage: VCRT_CHA [V]
Reference Voltage: VREG [V]
5.3
5.2
5.1
5.0
4.9
VIN = 6 V
VIN = 12 V
VIN = 24 V
4.8
4.7
4.6
4.5
-25
0
25 50 75
Temperature [°C]
VIN = 12 V
VIN = 24 V
0.90
0.80
-50
100 125
-50
-25
0
25
50
75
100 125
Temperature [°C]
Figure 1. Reference Voltage vs Temperature
Figure 2. CRT Pin Charge Voltage vs Temperature
0.8
1.90
Out Pin ON Resistance: RON_OUT [Ω]
CRT Pin Dischage Voltage: VCRT_DIS [V]
1.00
1.80
1.70
VIN = 12 V
VIN = 24 V
1.60
1.50
-50
-25
0
25 50 75
Temepature [°C]
0.4
VIN = 4 V
VIN = 12 V
VIN = 24 V
0.2
0.0
100 125
Figure 3. CRT Pin Discharge Voltage vs Temperature
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.6
-50 -25
0
25 50 75 100 125 150
Temperature [°C]
Figure 4. Out Pin ON Resistance for High Mode
vs Temperature
20/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Typical Performance Curve - continued
(Unless otherwise specified VIN = 13 V Ta = -40 °C to + 125 °C, CVREG = 4.7 µF)
155.0
LED Open Detection Threshold Voltage:
VOPEN [mV]
LED Open Detection Threshold Voltage:
VOPEN [mV]
105.0
153.0
103.0
151.0
101.0
VIN = 9 V
VIN = 12 V
VIN = 24 V
149.0
147.0
145.0
-50 -25
0
VIN = 9 V
VIN = 12 V
VIN = 24 V
99.0
97.0
95.0
25 50 75 100 125 150
Temperature [°C]
-50 -25
0
25 50 75 100 125 150
Temperature [°C]
0.600
1.350
Short Circuit Protection Threshold Voltage:
VSHORT [V]
Figure 6. LED Open Detection Threshold Voltage
at VOP = 1.0 V, VOPEN = 100 mV
vs Temperature
Short Circuit Protection Threshold Voltage:
VSHORT [V]
Figure 5. LED Open Detection Threshold Voltage
at VOP = 1.5 V, VOPEN = 150 mV
vs Temperature
0.550
1.300
0.500
1.250
VIN = 6 V
VIN = 12 V
VIN = 24 V
0.450
0.400
1.200
1.150
-50 -25
0
25 50 75 100 125 150
Temperature [°C]
Figure 7. Short Circuit Protection Threshold Voltage
at VSCP = 1.0 V, VSHORT = 0.500 V
vs Temperature
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
VIN = 6 V
VIN = 12 V
VIN = 24 V
-50 -25
0
25 50 75 100 125 150
Temperature [°C]
Figure 8. Short Circuit Protection Threshold Voltage
at VSCP = 2.5 V, VSHORT = 1.250 V
vs Temperature
21/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Application Example
VIN = 13 V, CLK frequency 763 Hz (duty = 100 %), Blinking frequency: 1.49 Hz, IOUT = 687 mA
Flasher SW
RSE
DIN
+B
ZDIN
RSSE
VIN
SOURCE
OUT
SE
OUTS
SSE
VIN
CVIN
CVREG
VDR
Left
Front
Left
Rear
Right
Front
Right
Rear
RCRT2
BD18327EFV-M
CRT
RVDR2
CCRT
VREG
RVOP1
RVOP2
RCRT1
DISC
RVDR1
ZD_OP
VREG
VREG
VSCP
VOP
RVSCP1
RVSCP2
PSSW
TEST
GND
Recommended Parts List:
Parts
No
IC
Diode
Resistor
Capacitor
Parts Name
Value
UNIT
Product Maker
U1
BD18327EFV-M
-
-
ROHM
DIN
RFN2LAM6STFTR
-
-
ROHM
ZDIN
TND12H-220KB00AAA0
43
V
NIPPON CHEMICON
ZD_OP
EDZVFH3.6B
3.6
V
ROHM
RSE
LTR100JZPFLR510
0.51
Ω
ROHM
RSSE
360
Ω
ROHM
RVDR1
MCR03EZPFX3600
MCR03EZPFX6802
68
kΩ
ROHM
RVDR2
MCR03EZPFX5101
5.1
kΩ
ROHM
RCRT1
MCR03EZPFX4702
47
kΩ
ROHM
RCRT2
MCR03EZPFX3301
3.3
MCR03EZPFX3002
30
kΩ
kΩ
ROHM
RVSCP1
RVSCP2
MCR03EZPFX1002
10
kΩ
ROHM
RVOP1
MCR03EZPFX2402
24
kΩ
ROHM
RVOP2
MCR03EZPFX1002
10
kΩ
ROHM
CVIN
GCM31CC71H475KA03
4.7
μF
murata
CVREG
GCM188C71A225KE01
2.2
μF
murata
CCRT
GCM155R11A104KA01
0.1
μF
murata
ROHM
Precautions for board design
① Place CVIN, CVREG in the immediate vicinity of the IC pin. If necessary, connect a bypass capacitor (0.1 μF) close to the IC.
② Select the optimum one for D1 according to the output current.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
I/O Equivalence Circuit
1. SOURCE
2 . SE
VIN
SOURCE
VIN
4 . SSE
OUT
8. VDR
VIN
SSE
SE
9. VOP
VIN VREG VREG
VDR
CLP15V
VIN
VOP
12. TEST
VREG
VIN
14 . CRT
VREG
VSCP
15. DISC
10. PSSW
PSSW
13 . VSCP
TEST
VIN VIN
VREG
CRT
17. VREG
19. OUTS
VIN
DISC
VREG
VREG
OUTS
20. OUT
VIN
OUT
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
24/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 9. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Functional Safety
“ISO 26262 Process Compliant to Support ASIL-*”
A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in
the datasheet.
“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”
A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.
“Functional Safety Supportive Automotive Products”
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to
the functional safety.
Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
25/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Ordering Information
B
D
1
8
3
2
7
Part Number
E
F
V
Package
EFV: HTSSOP-B20
-
M E2
Packing and Forming Specification
M: For Automotive
E2: Embossed Tape and Reel
Marking Diagram
HTSSOP-B20 (TOP VIEW)
Part Number Marking
D18327
LOT Number
Pin 1 Mark
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
26/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Physical Dimension and Packing Information
Package Name
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
HTSSOP-B20
27/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
BD18327EFV-M
Revision History
Date
Version
Changes
26.Apr.2021
001
New Release
25.Nov.2021
002
Page.19 Short Circuit Protection Threshold Voltage
Change limit: Min = VSCP/2 - 0.100 → VSCP/2 - 0.065
Max = VSCP/2 + 0.100 → VSCP/2 + 0.065
www.rohm.com
© 2021 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
28/28.
TSZ02201-0T1T0B300400-1-2
25.Nov.2021 Rev.002
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
