Datasheet
40 V 600 mA 1ch Constant Current Driver
for Automotive LED Lamps
BD18336NUF-M
Key Specifications
General Description
The BD18336NUF-M is a constant current driver IC for
driving automotive LED lamp, that can withstand up to 40
V. Small-size package is suitable for use in socket LED
driver applications.
The BD18336NUF-M offers high reliability with built-in
functions for the thermal de-rating function, the LED open
detection, the output short circuit protection, the SET pin
short circuit protection, the over-voltage mute function, the
current bypass function at reduced-voltage, the output for
fault flag function and the input for output current OFF
control signal.
Input Voltage Range:
Output Current Accuracy:
Maximum Output Current:
5.5 V to 20 V
±5 %
400 mA (DC)
600 mA (ON Duty: 50 %)
Operating Temperature Tj:
-40 °C to +150 °C
Package
W (Typ) x D (Typ) x H (Max)
VSON10FV3030
3.0 mm x 3.0 mm x 1.0 mm
Features
AEC-Q100 Qualified(Note 1)
CR Timer for PWM Dimming
Thermal De-rating Function (THD)
LED Open Detection
Output Short Circuit Protection (OUT SCP)
SET Pin Short Circuit Protection (SET SCP)
Over Voltage Mute Function (OVM)
Current Bypass Function at Reduced-Voltage
Disable LED Open Detection Function
at Reduced-Voltage (OPM)
Output for Fault Flag / Input for Output Current OFF
Control Signal (PBUS)
(Note 1) Grade1
Applications
Automotive LED Exterior Lamps
(Rear Lamp, Turn Lamp, DRL/Position Lamp, Fog
Lamp)
Automotive Interior Lamps
(Air Conditioner Lamp, Interior Light, Cluster Light
etc.)
Typical Application Circuit
PWM
SW
D1
OUT
VIN
D2
DC
SW
COUT
BD18336NUF-M
CVIN
D3
CRT
+B
RDCIN
CCRT
RCRT
EXP-PAD
ISINK
DISC
THD
RBP1
RBP2
〇Product structure: Silicon integrated circuit
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RBP3
PBUS
SET
BPCNT
GND
RSET
NTC
〇This product has no designed protection against radioactive rays.
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Pin Configuration
7.SET
6.THD
4.CRT
5.DISC
8.GND
9.ISINK
10.OUT
(TOP VIEW)
3.PBUS
2.BPCNT
1.VIN
EXP-PAD
Pin Descriptions
Pin No.
Pin Name
Function
1
VIN
2
BPCNT
3
PBUS
4
CRT
CR timer setting 1(Note 3)
5
DISC
CR timer setting 2(Note 3)
6
THD
Thermal de-rating setting(Note 4)
7
SET
Output current setting(Note 1)
8
GND
GND
9
ISINK
Current sink pin for current bypass function at reduced-voltage
10
OUT
Current output
-
EXP-PAD
Power supply input
Current bypass function at reduced-voltage setting(Note 1)
Output for fault flag / Input for output current OFF control signal(Note 2)
Heat radiation pad. The EXP-PAD is connected to GND.
(Note 1) Do not connect external capacitor.
(Note 2) Open the PBUS pin when not in use output for fault flag / input for output current OFF control signal.
(Note 3) Short the CRT pin to the VIN pin and open the DISC pin when in use at DC mode only.
(Note 4) Open the THD pin when not in use thermal de-rating function.
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Block Diagram
VIN
Bandgap
VREG
OVM
V BG
TSD
to Current
Setting
Block
UVLO
V BG
Current
Driver
100 mA
to 600 mA
OUT
OPM
LED Open
Detection
PBUS
Control
Logic
V IN
1 mA
V BG
VBG
VI N
PBUS
0.05 V
OUT SCP
BPCNT
VREG
0.6 V
↔ 0.8 V
VBG
ISINK
Bypass
Control
CRT
V BG
CR
TIMER
LED Open
Detection
(ISINK)
DISC
VREG
SET
SCP
Current
Setting
VBG
GND
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ITHD
THD
from OVM
Block
SET
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BD18336NUF-M
Description of Blocks
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
1.
Table of Operations
The BD18336NUF-M has a built-in CR timer for PWM dimming and it is possible to change between PWM dimming
mode and DC mode. Once the VIN pin voltage VIN is 17.4 V (Typ) or more, the output current IOUT is limited to
suppress the heat generation from the IC.
It is possible to detect the LED open state or short circuit state by monitoring the OUT pin voltage. In case of the LED
abnormality detection, it can notify the abnormality to the outside by changing the PBUS pin voltage to low.
The output current is also turned OFF when the Low signal is input to the PBUS pin.
In addition, under voltage lock out (UVLO) and thermal shutdown circuit (TSD) are built-in, which further increase
system reliability.
The correspondence table is given below. For details, refer to functional description of each block.
Operation
Mode
CRT Pin
DC
Detecting Condition
Output
Current
(IOUT)
PBUS Pin
[Detect]
[Release]
VCRT ≥
2.0 V (Typ)
-
-
100 mA
to 400 mA
-
PWM Dimming
Refer to
Description of
Blocks 4
-
-
Refer to
Description of
Blocks 4
-
Thermal
De-rating
(THD)
-
VTHD ≤ 0.8 V (Typ)
VTHD > 0.8 V (Typ)
Refer to
Description of
Blocks 9
-
Over Voltage
Mute
(OVM)
-
VIN ≥ 17.4 V (Typ)
VIN < 17.4 V (Typ)
Refer to
Description of
Blocks 10
-
LED
Open Detection
(OUT Pin)
-
VOUT ≥
VIN - 0.050 V (Typ)
and
VIN ≥ 11.0 V (Typ)
VOUT <
VIN - 0.050 V (Typ)
or
VIN < 11.0 V (Typ)
OFF
Low
LED
Open Detection
(ISINK Pin)
-
VISINK ≥
4.1 V (Typ)
VISINK <
4.1 V (Typ)
-
-
Output
Short Circuit
Protection
(OUT SCP)
-
VOUT ≤ 0.6 V (Typ)
VOUT ≥ 0.8 V (Typ)
OFF
Low
ISET ≤ 0.5 mA (Typ)
ISET > 0.5 mA (Typ)
OFF
Low
SET Pin Short
Circuit Protection
(SET SCP)
Input for Output
Current OFF
Control Signal
(PBUS)
-
VPBUS ≤ 0.6 V (Typ)
VPBUS ≥ 2.4 V (Typ)
OFF
VPBUS ≤
0.6 V (Typ)
input
Under Voltage
Lock Out
(UVLO)
-
VIN ≤ 4.75 V (Typ)
VIN ≥ 5.25 V (Typ)
OFF
High
Thermal
Shutdown Circuit
(TSD)
-
Tj ≥ 175 C (Typ)
Tj ≤ 150 C (Typ)
OFF
Low
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
2.
Output Current IOUT Setting
The output current IOUT can be set by the value of the output current setting resistor R SET.
𝐼𝑂𝑈𝑇 =
where:
𝐾𝑆𝐸𝑇
𝑅𝑆𝐸𝑇
𝐾𝑆𝐸𝑇
[mA]
𝑅𝑆𝐸𝑇
is the output current setting coefficient, 2400 (Typ).
is the output current setting resistor. [kΩ]
VIN
Current
Driver
+B
100 mA
to 600 mA
OUT
IOUT
Current
Setting
GND
SET
RSET
Output Current Setting
2.1
Relationship between VIN Pin Voltage VIN and Output Current IOUT
Set the VIN pin voltage VIN and output current IOUT to satisfy the following relationship.
𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝐷𝑅
Where:
𝑉𝐼𝑁
𝑉𝑓_𝐿𝐸𝐷
𝑁
𝑉𝐷𝑅
3.
[V]
is the VIN pin voltage.
is the forward voltage of LED.
is the number of LED.
is the drop voltage between the VIN pin and the OUT pin.
SET Pin Short Circuit Protection (SET SCP)
Once the current which flows through the SET pin is more than or equal to the SET pin short circuit protection threshold
current ISET_SH (0.50 mA (Typ)), the output current IOUT is turned off to prevent thermal damage of the IC, and it can
notify the abnormality to the outside by changing the PBUS pin output to low.
VIN
Current
Driver
PBUS
PBUS
100 mA
to 600 mA
Control
Logic
SET
SCP
OUT
Current
Setting
GND
SET
RSET
SET Pin Short Circuit Protection
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
4.
PWM Dimming Operation
PWM dimming is performed by connecting external parts to the CRT pin and the DISC pin as shown below. PWM
dimming frequency and ON duty width can be set by the values of the external resistor RCRT and the external capacitor
CCRT. When use the DC mode only, connect the CRT pin to the VIN pin and open the DISC pin.
A triangular waveform is generated when the DC SW is open as shown below. Output current IOUT is turned OFF
while the CRT pin voltage ramps up and IOUT is turned ON while the CRT pin voltage is ramp down.
Once the CRT pin voltage is VCRT_DIS1 (2.0 V (Typ)) or more, it turns to DC mode. And once the CRT pin voltage is
more than VCRT_DIS2 (2.4 V (Typ)), the DISC pin ON resistance changes from RDISC1 (50 Ω (Typ)) to RDISC2 (5 kΩ (Typ))
and the power consumption of the IC is reduced by reducing the inflow current of the DISC pin.
VIN
CRTIMER
V REG
DC SW
Current
Driver
100 mA
to 600 mA
ICRT
OUT
CRT
CCRT
IOUT
RCRT
Control
Logic
VCRT_DIS1
GND
VCRT_DIS2
DISC
R DISC1
Ramp up
RDISC 2
Ramp down
V CRT_DIS1
2.0 V (Typ)
CRT Pin
Voltage
ΔVCRT
VCRT_CHA
0.8 V (Typ)
t OFF
tOFF =
Output Current
IOUT
t ON
ΔVCRT x CCRT
= RCHA x CCRT
ICRT
I OUT
OFF
I OUT
ON
tON = - (R CRT + RDISC1) x CCRT x l n
(VV
I OUT
OFF
I OUT
ON
)
CRT_CHA
CRT_DIS1
I OUT
OFF
I OUT
ON
PWM Dimming Operation
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4.
PWM Dimming Blocks – continued
4.1
CRT Pin Voltage Ramp Up Time tOFF and Ramp Down Time tON
CRT pin voltage ramp up time tOFF and ramp down time tON can be set by the following equations.
Make sure that tON is set PWM minimum pulse width tMIN to 50 μs or more.
𝑡𝑂𝐹𝐹 =
∆𝑉𝐶𝑅𝑇 × 𝐶𝐶𝑅𝑇
= 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇
𝐼𝐶𝑅𝑇
[ms]
𝑉
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (𝑉 𝐶𝑅𝑇_𝐶𝐻𝐴 )
[ms]
𝐶𝑅𝑇_𝐷𝐼𝑆1
where:
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1
𝐼𝐶𝑅𝑇
𝐶𝐶𝑅𝑇
𝑅𝐶𝑅𝑇
𝑅𝐶𝐻𝐴
𝑅𝐷𝐼𝑆𝐶1
4.2
0.8 V (Typ).
2.0 V (Typ).
40 μA (Typ).
[μF].
[kΩ].
30 kΩ (Typ).
25 Ω (Typ).
PWM Dimming Frequency fPWM
PWM frequency is defined by tON and tOFF.
𝑓𝑃𝑊𝑀 =
4.3
is the CRT pin charge voltage,
is the CRT pin discharge voltage 1,
is the CRT pin charge current,
is the capacitor for setting CR timer,
is the resistor for setting CR timer,
is the CRT pin charge resistor,
is the DISC pin ON resistor 1,
1
[Hz]
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
ON Duty (DON)
PWM ON duty is defined by tON and tOFF.
𝐷𝑂𝑁 =
𝑡𝑂𝑁
× 100
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
[%]
(Example) In case of RCRT = 3.6 kΩ (Typ), CCRT = 0.1 μF (Typ)
𝑡𝑂𝐹𝐹 = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 = 30 × 0.1 = 3.0
𝑅𝐷𝐼𝑆𝐶1
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (
)
1000
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1
𝑡𝑂𝑁 = − (𝑅𝐶𝑅𝑇 +
25
= − (3.6 +
𝑓𝑃𝑊𝑀 =
𝐷𝑂𝑁 =
4.4
[ms]
0.8
) × 0.1 × 𝐼𝑛 (2.0) = 0.332
1000
1
=
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
𝑡𝑂𝑁
𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹
1
3.0 + 0.332
× 100 =
[ms]
= 300
0.332
3.0 + 0.332
[Hz]
× 100 = 10.0
[%]
PWM Dimming Operation Using External Signal
If input the external pulse signal to the CRT pin as shown below, make sure that input pulse signal high voltage ≥
2.2 V and pulse signal low voltage ≤ 0.72 V. Also, open the DISC pin.
VREG
μ-Con
CRT
VBG
CR
TIMER
Control
Logic
DISC
GND
In Case External Pulse Signal Input to the CRT Pin
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4.
PWM Dimming Blocks – continued
4.5
About the Deviation of the CRT Pin Voltage Ramp Up/Down Time Due to Reverse Current Characteristics
of Reverse Connection Protection Diodes
If this IC is used to drive LED as shown below, there is a possibility of the deviation of the CRT pin voltage ramp
up/down time from the settings depends on reverse current characteristics of connected reverse current
protection diodes (D2, D3).
Consider a diode which is recommended by ROHM or a diode which is 1 μA (Max) or less of reverse current
characteristics because reverse current Ir of a diode especially increases at high temperature.
Since reverse current flows even with the recommended diodes, connect a resistor of R DCIN of 10 kΩ or less
between Point A and GND so that the voltage at point A does not rise.
●Mechanism of the deviation of the CRT pin voltage ramp up/down time from the settings.
A) During the PWM dimming mode, Point A on the below figure is in the high impedance (Hi-Z) state.
↓
B) Reverse current Ir of D2 and D3 flow to Point A.
(Power supply voltage is being input into the cathode of D2, so mainly reverse current of D2 flows to C1.)
→Reverse current Ir of D3 is added to the CRT pin charge current and discharge current, so the CRT pin
voltage ramp up/down time deviates from the settings.
↓
C) C1 gets charged, voltage at Point A rises.
↓
D) Point A voltage is the CRT pin voltage of each IC or more.
↓
E) Forward voltage Vf is generated to the diode D3.
↓
F) D3 flows forward current If.
→Forward current If of D3 is added to the CRT pin charge current and discharge current, so the CRT pin
voltage ramp up/down time deviates from the settings.
↓
Repetition of B) to F).
D1
VIN
BD18336NUF-M
D2
Point A
RDCIN
Ir
D3
C1
OUT
CRT
If
Vf
GND
DISC
Mechanism of the Deviation of the CRT Pin Voltage Ramp Up/Down Time
due to Reverse Connection Protection Diodes
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
5.
LED Open Detection
• In case any of Point A to Point C is in the open state
Once the OUT pin voltage VOUT becomes more than or equal to LED open detection voltage VOPD (VIN - 0.050 V
(Typ)), it can notify the abnormality to the outside by changing the PBUS pin output to low.
• In case any of Point D or Point E is in the open state
Once the ISINK pin voltage becomes 4.1 V (Typ) or more, the ISINK pin current IISINK is turned OFF(Note 1). After that,
once the OUT pin voltage VOUT becomes more than or equal to LED open detection voltage VOPD (VIN - 0.050 V
(Typ)), it can notify the abnormality to the outside by changing the PBUS pin output to low.
(Note 1) While output current bypass function at reduced-voltage (Refer to Description of Function 13) is activated, the LED is lighted because the
output current flows to the two upper side LEDs.
6.
Disable LED Open Detection Function at Reduced-Voltage (OPM)
The disable LED open detection function serves to prevent LED open erroneous detection at the reduced-voltage
during the ramp up/down of the VIN pin voltage. Even if the LED is in the open state, LED open is not detected until
the VIN pin voltage becomes more than disable LED open detection voltage at reduced-voltage VIN_OPM (11.0 V (Typ)).
Set VIN_OPM to satisfy the following formula.
𝑉𝐼𝑁_𝑂𝑃𝑀 > 𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅
𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 = 𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷 × 𝑁 + (𝑉𝐼𝑁 − 𝑉𝑂𝑃𝐷 )
where:
𝑉𝐼𝑁_𝑂𝑃𝑀
𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅
𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷
𝑁
𝑉𝑂𝑃𝐷
[V]
is the VIN pin disable LED open detection voltage at reduced-voltage.
is the VIN pin LED open erroneous detection voltage at reduced-voltage.
is the LED Vf at LED open release.
is the number of LED.
is the LED open detection voltage.
VIN
Current
Driver
+B
100 mA
to 600 mA
OUT
OPM
PBUS
Control
Logic
Point A
Point B
V IN
PBUS
IOUT
LED Open
Detection
0.050 V
ISINK
LED Open Detection
(ISINK)
VIN_OPM
VIN_OPERR
IISINK
Bypass
Control
Point C
Point D
Point E
VIN_OPM
VIN_OPERR
VIN
Disable
LED Open
Detection
Area
VOUT
VIN
VOP = VIN - 0.050 V
Disable
LED Open
Detection
Area
VOUT = V f_LED x N
LED Open
Erroneous
Detection
Area
I OUT
LED Open
Erroneous
Detection
Area
I OUT
4.5 V
VPBUS
VIN Pin Disable LED Open Detection Voltage at Reduced-Voltage
and LED Open Erroneous Detection Voltage at Reduced-Voltage
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
7.
Output Short Circuit Protection (OUT SCP)
Once the OUT pin voltage is less than or equal to the OUT pin short circuit protection voltage VSCP (0.6 V (Typ)), then
the short circuit protection is activated when SCP delay time tSCP1 (25 μs (Typ)) passes. At that time output current
IOUT is turned off to prevent the thermal damage of the IC and it can notify the abnormality to the outside by changing
the PBUS pin output to low.
In order to avoid the malfunction when the power is turned on, the short circuit protection is not activated until the CRT
pin voltage is more than 2.0 V (Typ) after UVLO is released.
In addition, in case it is in the output short circuit state (VOUT < 0.6 V (Typ)) since the power is turned on, the output
short circuit protection is activated when VCRT > 2.0 V (Typ) condition is reached and tIOUT_ON (40 μs (Typ)) and tSCP2 (85
μs (Typ)) pass, after UVLO is released.
VIN
40 µs Filter
(at Start-Up)
PBUS
Control
Logic
100 mA
to 600 mA
OUT
SHOR T
VIN
1.2 mA
PBUS
Current
Driver
OUT SCP
1.0 V ⇔1.1 V
25 µs
Filter
GND
85 µs
Filter
0.6 V ⇔0.8 V
Output Short
Circuit State
Output Short
Circuit State
5.25 V
VIN
2.0 V
VCRT
0.8 V
ON
IOUT
40 μs 85 μs
OFF
0.8 V
0.6 V
VOUT
ON
ON
25 μs
OFF
High
OFF
High
High
Lo w
VPBUS
Lo w
Output Short Circuit Protection (OUT SCP)
7.1
Current at OUT Pin Short Circuit
The OUT pin sources the OUT pin short circuit current IOUT_SCP (1.2 mA (Typ)) once its voltage is less than 1.0 V
(Typ) in order to prevent the malfunction of the short circuit protection.
VIN
1.0 V (Typ)
Current
Driver
100 mA
to 600 mA
OUT
VOUT
SHORT
0V
VIN
1.2 mA
OUT SCP
1.0 V ⇔1.1 V
1.2 mA (Typ)
IOUT_SCP
0 mA
Current at OUT Pin Short Circuit
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
8.
Caution of Using LED Open Detection and Output Short Circuit Protection
8.1
Connection Method of LEDs to the OUT Pin
Protection functions could be enabled or disabled based on how LEDs are connected to the OUT pin.
OUT
OUT
OUT
・・・
1 string
in series
・・・
2 or more
strings in parallel
2 or more strings in parallel
Matrix connection
Connection Method of LEDs
Connection Method
Output Short Circuit Protection
LED Open Detection
1 string in series
Detectable
Detectable
2 or more strings in parallel
Detectable
Not detectable(Note 1)
2 or more strings in parallel
(Matrix connection)
Detectable
Not detectable (Note 2)
(Note 1) Detectable only when 1 or more LEDs are open in all strings.
(Note 2) Detectable only when all LEDs from any string are open.
8.2
The Enable Zone of LED Open Detection and Output Short Circuit Protection, and Hi-Z Zone of the OUT
Pin
The enable zone of LED open detection and output short circuit protection is different between DC mode and
PWM dimming mode.
DC mode
PWM dimming mode
: LED open detection and output short circuit protection are enable in all zone.
: LED open detection is enable in only CRT ramp down zone.
Output short circuit protection is enable in all zone.
There is a zone which the OUT pin becomes Hi-Z at PWM dimming mode. During this time noise(Note 3) may
affect the decrease of the OUT pin voltage and cause malfunction of output short circuit protection. To prevent
this, consider measurements such as connecting a capacitor COUT(Note4) between the OUT pin and GND nearby
IC. (Recommended value by ROHM: COUT = 0.1 μF GCM188L81H104KA42 murata)
(Note 3) Conducted noise, Radiated noise, Crosstalk of wiring and connecter etc.
(Note 4) In case connecting a capacitor with 0.1 μF or more, do evaluation of a delay time from the power-on of VIN until output current IOUT flows
and pulse width of output current IOUT at PWM dimming mode. (Refer to example of evaluation: Description of Blocks 8.3)
[DC Mode]
VCRT
0V
VOUT
IOUT
[PWM Dimming Mode]
VCRT
VOUT
0V
IOUT
0mA
0mA
OUT pin Hi-Z
Zone
None
OUT pin Hi-Z
Zone
LED Open
Detection
Enable
LED Open
Detection
Enable
Output Short
Circuit Protection
Output Short
Circuit Protection
Hi-Z
Hi-Z
E nable
Hi-Z
E nable
E nable
Enable
The Enable Zone of LED Open Detection, Output Short Circuit Protection,
and Hi-Z Zone of the OUT Pin
OUT
COUT
BD18336NUF-M
Capacitor Connected to the OUT Pin
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8. Caution of Using LED Open Detection and Output Short Circuit Protection – continued
8.3
Evaluation Example of PWM Dimming IOUT Pulse Width
Evaluation condition: VIN = 13 V, Tj = 25 °C, 3 White LEDs in series, PWM ON Duty = 3.2 %, Pulse width = 0.105
ms, PWM Frequency = 300 Hz
COUT = 0.10 μF
COUT = 0.47 μF
VCRT
1.0 V / div
VCRT
1.0 V / div
LED Anode
2.0 V / div
LED Anode
2.0 V / div
IOUT = 100 mA
IOUT
200 mA / div
50 μs / div
IOUT
200 mA / div
VCRT
1.0 V / div
VCRT
1.0 V / div
LED Anode
2.0 V / div
LED Anode
2.0 V / div
50 μs / div
IOUT = 240 mA
IOUT
200 mA / div
50 μs / div
IOUT
200 mA / div
VCRT
1.0 V / div
VCRT
1.0 V / div
LED Anode
2.0 V / div
LED Anode
2.0 V / div
50 μs / div
IOUT = 400 mA
IOUT
200 mA / div
50 μs / div
IOUT
200 mA / div
VCRT
1.0 V / div
VCRT
1.0 V / div
LED Anode
2.0 V / div
LED Anode
2.0 V / div
50 μs / div
IOUT = 600 mA
IOUT
200 mA / div
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IOUT
200 mA / div
50 μs / div
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8. Caution of Using LED Open Detection and Output Short Circuit Protection – continued
8.4
Maximum Capacitance Value Connected to the OUT Pin (COUT)
When the capacitance connected to the OUT pin is above the recommended range (1.0 μF or more), the delay
time of output rise time could be in around hundreds of microseconds. Below are examples of evaluation data
for reference.
Measurement conditions: VIN = 13 V, Tj = 25 °C, DC mode, 3 LEDs in series
COUT = 0.10 μF
COUT = 0.47 μF
VIN
10 V / div
VIN
10 V / div
VPBUS
10 V / div
VPBUS
10 V / div
IOUT
200 mA / div
200 μs / div
IOUT
200 mA / div
COUT = 1.00 μF
COUT = 10.00 μF
VIN
10 V / div
VIN
10 V / div
VPBUS
10 V / div
VPBUS
10 V / div
IOUT
200 mA / div
200 μs / div
200 μs / div
IOUT
200 mA / div
200 μs / div
Capacitor Connected to the OUT Pin
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
9.
Thermal De-rating Function (THD)
It is possible to reduce the output current IOUT at high temperature and suppress the degradation of the LED by
connecting a thermistor to the THD pin. Once the THD pin voltage is less than or equal to thermal de-rating start
voltage VTHDS (0.8 V (Typ)), the output current IOUT is reduced according to the THD pin voltage.
Open the THD pin when not using thermal de-rating function.
In case variation of the THD pin voltage is steep, take measures such as connecting a capacitor to the THD pin to
prevent the output current chattering. In addition, evaluate IOUT waveform on actual board because the output
amplifier may not follow the steep variation.
The thermal de-rating function can be set by the following formula.
𝑉𝑇𝐻𝐷 = 𝐼𝑇𝐻𝐷 × 𝑅𝑁𝑇𝐶
[V]
𝐼𝑂𝑈𝑇 (𝑉𝑇𝐻𝐷 ≤ 0.8 𝑉) =
Where:
𝐼𝑇𝐻𝐷
𝑅𝑁𝑇𝐶
𝐼𝑂𝑈𝑇
𝑉𝑇𝐻𝐷
𝑉𝑆𝐸𝑇
𝐾𝑆𝐸𝑇
𝑉𝑇𝐻𝐷
×
𝑅𝑆𝐸𝑇
𝑉𝑆𝐸𝑇
is the THD pin source current, 200 μA (Typ).
is the resistance of NTC thermistor.
is the output current.
is the THD pin voltage.
is the SET pin voltage, 0.8 V (Typ).
VIN
+B
I OUT
100 %
Current
Driver
100 mA
to 600 mA
OUT
VREG
50 %
ITHD
Current
Setting
I OUT
THD
RNTC
GND
0.4
SET
0.8
VTHD [V]
Thermal De-rating Function
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
10. Over Voltage Mute Function (OVM)
Once the VIN pin voltage VIN is over voltage mute start voltage VOVMS 17.4 V (Typ) or more, the over voltage mute
function is activated to decrease the output current IOUT in order to suppress the heat generation from the IC.
The output current IOUT will decay at -20 %/V (Typ).
IOUT
VIN
17.4 V (Typ)
+B
OVM
Current
Driver
100 %
100 mA
to 600 mA
OUT
-20 %/V (Typ)
IOUT
Current
Setting
GND
SET
0
VOVMS
VIN
Over Voltage Mute Function (OVM)
11. Under Voltage Lock Out (UVLO)
UVLO is a protection circuit to prevent malfunction of the IC when the power is turned on or when the power is
suddenly shut off. When the VIN pin voltage VIN is 4.75 V (Typ) or less, the output current IOUT is turned OFF, and
when the VIN pin voltage VIN increases to 5.25 V (Typ) or more, normal operation starts.
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
12. Output for Fault Flag / Input for Output Current OFF Control Signal (PBUS)
When abnormality such as LED open or output short circuit occurs, it can notify the abnormality to the outside by
changing the PBUS pin output from high to low. In addition, by externally controlling the PBUS pin from high to low,
the output current IOUT is turned off. When using multiple ICs to drive multiple LED strings, it is possible to turn off all
LED strings at once by connecting the PBUS pins of each CH as shown in the figure below, even if LED open or output
short circuit occurs.
Caution of Using the PBUS Pin
Do not connect to the PBUS pins other than below list items due to the difference of ratings, internal threshold voltages,
and so on.
(BD18340FV-M, BD18341FV-M, BD18342FV-M, BD18343FV-M, BD18345EFV-M, BD18337EFV-M, BD18347EFV-M)
VIN
OUT
VIN
CH1
OUT
CH2
PBUS
PBUS
LED
OPEN
GND
LED
OFF
GND
Mutual Communication via PBUS Line
PBUS Function
12.1
Example of Protective Operation Due to LED Open
A) CH1 LED
Open
CH1 VOUT
ON
CH1 IOUT
OFF
B) V PBUS: High→ Low
VPBUS
The OUT pin of CH2 is clampled
to 1.4 V at PBUS is low.
CH2 VOUT
ON
1.4 V
ON
CH2 IOUT
OFF
Example of Protective Operation
When CH1 is the LED open state, the PBUS pin of CH1 is changed from High to Low output. As the PBUS pin
becomes Low, LED driver of CH2 turns OFF its output current. The OUT pin voltage is clamped to 1.4 V (Typ) during
the OFF period, in order to prevent malfunction of output short circuit.
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
13. Current Bypass Function at Reduced-Voltage
The BD18336NUF-M is built-in current bypass function at reduced-voltage.
When the VIN_DIV which is the resistor divider of the VIN pin voltage VIN is more than the BPCNT reference voltage VBP
(2.0 V (Typ)), the ISINK pin sink current IISINK decreases. The output current IOUT changes linearly.
The ISINK pin sink current IISINK can be set by the following formula.
𝐼𝐼𝑆𝐼𝑁𝐾 =
𝐼𝐵𝑃𝐶𝑁𝑇 =
𝐾𝑆𝐼𝑁𝐾
𝑅𝑆𝐸𝑇
1
𝑅𝐵𝑃3
𝐼𝐼𝑆𝐼𝑁𝐾_𝑀𝐴𝑋 =
Where:
𝐾𝑆𝐼𝑁𝐾
𝑅𝑆𝐸𝑇
𝐺𝑆𝐼𝑁𝐾
𝐼𝐵𝑃𝐶𝑁𝑇
𝑅𝐵𝑃1
𝑅𝐵𝑃2
𝑅𝐵𝑃3
𝑉𝐵𝑃
𝐼𝐼𝑆𝐼𝑁𝐾_𝑀𝐴𝑋
− 𝐺𝑆𝐼𝑁𝐾 × 𝐼𝐵𝑃𝐶𝑁𝑇 ÷ 103
[mA]
𝑅𝐵𝑃2 × (𝑅𝐵𝑃1 × 𝑉𝐵𝑃 + 𝑅𝐵𝑃3 × 𝑉𝐼𝑁 )
𝐵𝑃1 × 𝑅𝐵𝑃2 + 𝑅𝐵𝑃3 × (𝑅𝐵𝑃1 + 𝑅𝐵𝑃2 )
{𝑅
− 𝑉𝐵𝑃 } × 103 ≥ 0 [μA]
𝐾𝑆𝐼𝑁𝐾
[mA]
𝑅𝑆𝐸𝑇
is the ISINK current setting coefficient,
is the output current setting resistor,
is the ISINK current gain,
is the BPCNT pin input current,
is the resistor for setting current bypass 1,
is the resistor for setting current bypass 2,
is the resistor for setting current bypass 3,
is the BPCNT reference voltage,
is the ISINK pin maximum sink current,
3000 (Typ).
[kΩ]
-7300 (Typ).
[μA]
[kΩ]
[kΩ]
[kΩ]
2.00 V (Typ)
[mA]
VIN
VIN_DIV
VBP (2.00 V)
VIN
IOUT
Current
Driver
+B
OUT
100 mA
to 600 mA
RBP1
BPCNT
RBP2
RBP3
IBPCNT
IBPCNT
IOUT
IISINK_MAX
V IN_DIV
ISET
V BP
ISINK
KSINK +
-
IISINK
IOUTA
IISINK = I OUT
IISINK
KSINK
- G SINK x I BPCNT
RSET
GSINK
IOUTA
Current Bypass Function at Reduced-Voltage
When not using the current bypass function at reduced-voltage, the ISINK pin is connected to the GND and the
BPCNT pin is connected with pull-down resistor or to the GND. In case the BPCNT pin is connected to the GND,
over current may flow when the BPCNT pin is shorted to the VIN pin. Do enough evaluation including external parts.
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Description of Blocks – continued
(Unless otherwise specified, Tj = 25 °C, VIN = 13 V)
14. Output Current Rise/Fall Time Fixed Function
The BD18336NUF-M has built-in output current rise/fall time fixed function.
It can suppress the noise generated to the power supply line by fixing the output current rise/fall time to 20 μs (Typ).
VCRT
I OUT
20 μs 20 μs
Output Current Rise/Fall Time Fixed Function
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Absolute Maximum Ratings (Ta = 25 °C)
No.
Parameter
A-1
VIN Pin Voltage
A-2
CRT, DISC Pin Voltage
A-3
OUT Pin Voltage
A-4
PBUS, BPCNT, ISINK Pin
Voltage
A-5
SET, THD Pin Voltage
A-6
Storage Temperature Range
A-7
Maximum Junction Temperature
Symbol
Rating
Unit
VIN
-0.3 to +42.0
V
VCRT, VDISC
-0.3 to +42.0
V
VOUT
-0.3 to VIN+0.3 < +42.0
V
VPBUS, VBPCNT, VISINK
-0.3 to +20.0
V
VSET, VTHD
-0.3 to +7.0
V
Tstg
-55 to +150
°C
Tjmax
150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
158.00
46.00
°C/W
ΨJT
23.00
12.00
°C/W
VSON10FV3030
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
No.
O-1
O-2
O-3
Parameter
Supply Voltage(Note 1)
OUT Pin Maximum Output Current
(DC)
OUT Pin Maximum Output Current
(ON Duty: 50 %)
Symbol
Min
Typ
Max
Unit
VIN
5.5
13.0
20.0
V
IOUT(DC)
-
-
400
mA
IOUT(50%DUTY)
-
-
600
mA
O-4
PWM Dimming Frequency
fPWM
200
-
750
Hz
O-5
PWM Minimum Pulse Width (Note 2)
tMIN
50
-
-
µs
O-6
Operating Temperature
Topr
-40
-
+150
°C
Symbol
Min
Typ
Max
Unit
(Note 1) ASO should not be exceeded.
(Note 2) It is the same as when the pulse input to the CRT pin.
External Parts Setting Range
No.
Parameter
P-1
Capacitor Connecting The VIN Pin
at Operating DC Mode Only(Note 3)
CVIN_DC
0.47
-
-
μF
P-2
Capacitor Connecting The VIN Pin
at Operating PWM Mode(Note 3)
CVIN_PWM
1.0
-
-
μF
P-3
Capacitor
Connecting The OUT Pin(Note 4)
(No need at ILED < 400 mA)
(Need at ILED ≥ 400 mA)
COUT
0.1
-
1.0
μF
P-4
Capacitor for Setting CR Timer
CCRT
0.047
0.100
0.220
μF
P-5
Resistor for Setting CR Timer
RCRT
0.1
-
50.0
kΩ
P-6
Resistor for Setting Output Current
RSET
4.0
-
24.0
kΩ
P-7
Resistor for DCIN Pull-down
RDCIN
-
-
10
kΩ
P-8
Resistor for Setting BPCNT 1
RBP1
10.5
-
46.7
kΩ
P-9
Resistor for Setting BPCNT 2
RBP2
3.3
-
30.0
kΩ
P-10
Resistor for Setting BPCNT 3
RBP3
0.24
-
96.50
kΩ
(Note 3) Connect CVIN_DC or CVIN_PWM within 10 mm from the IC. If they are connected more than 10 mm from the IC, there is a possibility of unstable operation
such as oscillation of output current IOUT etc. So consider with enough evaluation on actual board
(Note 4) If a long wire connects from the OUT pin to the LED anode, there is a possibility of output current IOUT oscillation.
After consideration with enough evaluation, connect a capacitor connecting to the OUT pin COUT between the OUT pin and GND to prevent oscillation.
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Electrical Characteristics
(Unless otherwise specified Tj = -40 °C to +150 °C, VIN = 13 V)
Limit
No.
Parameter
Symbol
Unit
Min
Typ
Max
IVIN1
-
2.6
5.0
mA
IVIN2
-
2.4
5.0
mA
IVIN3
-
2.7
5.0
mA
IOUT_OFF
-
-
1.0
μA
VDR1
-
-
0.77
V
VDR2
-
-
0.88
V
VDR3
-
-
1.10
V
Conditions
Circuit Current
E-1
E-2
E-3
VIN Pin Circuit Current
at Normal Mode
VIN Pin Circuit Current
at LED Open Detection
VIN Pin Circuit Current
at PBUS = Low
RSET = 24 kΩ
VOUT = Open
RSET = 24 kΩ
VPBUS = 0 V
RSET = 24 kΩ
Output Current
E-4
E-5
E-6
E-7
OUT OFF Current
Drop Voltage
Between VIN Pin and OUT Pin 1
Drop Voltage
Between VIN Pin and OUT Pin 2
Drop Voltage
Between VIN Pin and OUT Pin 3
E-8
Output Current Rise Time
IOUT_RISE
10
20
30
µs
E-9
Output Current Fall Time
IOUT_FALL
10
20
30
µs
E-10
The Difference Between Output
Current Rise Time and Fall Time
ΔIRISEFALL
-5
0
5
µs
VOPD
VIN
- 0.080
VIN
- 0.050
VIN
- 0.020
V
VOPISINK
3.8
4.1
4.5
V
IOUT_SCP
0.2
1.2
2.0
mA
VSCP
0.5
0.6
0.7
V
VSCPR
0.7
0.8
0.9
V
VISCPON
0.9
1.0
1.2
V
E-17 SCP Delay Time
tSCP1
10
25
50
µs
E-18 SCP Disable Time at Power On
tSCP2
-
85
-
µs
2280
2400
2520
VOUT = 2.0 V
VCRT = 0 V, Tj = 25 °C
Tj = -40 °C
IOUT = 600 mA
Tj = +25 °C
IOUT = 600 mA
Tj = +150 °C
IOUT = 600 mA
IOUT = 20 %→80 %
RSET = 10 kΩ
IOUT = 80 %→20 %
RSET = 10 kΩ
RSET = 10 kΩ
LED Open Detection
OUT Pin
LED Open Detection Voltage
ISINK Pin
E-12
LED Open Detection Voltage
E-11
Output Short Circuit Protection (OUT SCP)
E-13 Current at OUT Pin Short Circuit
OUT Pin Short Circuit Protection
Voltage
OUT Pin Short Circuit Protection
E-15
Release Voltage
Current ON Voltage at OUT Pin
E-16
Short Circuit
E-14
Output Current Setting 1
E-19
Output Current Setting
Coefficient
KSET
2160
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2400
2640
RSET =
4 kΩ
to 10 kΩ
RSET =
10 kΩ
to 24 kΩ
Tj =
-40 °C
to +150 °C
Tj =
-40 °C
to +150 °C
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BD18336NUF-M
Electrical Characteristics – continued
(Unless otherwise specified Tj = -40 °C to +150 °C, VIN = 13 V)
Limit
No.
Parameter
Symbol
Unit
Min
Typ
Max
VSET_REF
0.72
0.80
0.88
V
ISET_SH
0.24
0.50
1.20
mA
Conditions
Output Current Setting 2
Reference Voltage
for Output Current Setting
SET Pin Short Circuit Protection
E-21
Threshold Current
E-20
Output Current On Delay Time at
E-22
Power On
VSET
VIN = 0 V→13 V
tIOUT_ON =
tIOUT (80 %) –
tIOUT (@VIN = VUVLOR)
RSET = 24 kΩ
tIOUT_ON
-
40
100
µs
ITHD
190
200
210
μA
E-24 Thermal De-Rating Start Voltage
VTHDS
0.76
0.80
0.84
V
E-25 Thermal De-Rating Gain
GTHD
-131.3
-125.0
-118.7
%/V
E-26 CRT Pin Charge Current
ICRT
36
40
44
μA
E-27 CRT Pin Charge Voltage
VCRT_CHA
0.72
0.80
0.88
V
VCRT_DIS1
1.80
2.00
2.20
V
VCRT_DIS2
2.10
2.40
3.00
V
RCHA
28.5
30.0
31.5
kΩ
VCRT_CHA /
VCRT_DIS1
0.38
0.40
0.42
V/V
E-32 DISC Pin ON Resistance 1
RDISC1
10
25
80
Ω
IDISC = 10 mA
E-33 DISC Pin ON Resistance 2
RDISC2
2.5
5
10
kΩ
IDISC = 100 μA
E-34 CRT Pin Leakage Current
ICRT_LEAK
-
-
10
μA
VCRT = VIN
ΔIOUT = -3 %
ΔIOUT =
IOUT (@VIN = VOVM) /
IOUT (@VIN = 13 V) -1
Thermal De-Rating (THD)
E-23 THD Pin Source Current
VTHD
ΔIOUT / ΔVTHD
VTHD: 0.667 V→0.333 V
VIN = 13 V
CR Timer for PWM Dimming
CRT Pin
Discharge Voltage 1
CRT Pin
E-29
Discharge Voltage 2
CRT Pin
E-30
Charge Resistance
E-28
E-31 CRT Discharge Constant
VCRT > VCRT_DIS2
RD1→RD2
Over Voltage Mute Function (OVM)
E-35 Over Voltage Mute Start Voltage
VOVMS
16.0
17.4
18.8
V
E-36 Over Voltage Mute Gain
GOVM
-
-20
-
%/V
ΔIOUT / ΔVIN
VTHD > 1.5 V
Function to Disable LED Open Detection at Reduced-Voltage (OPM)
E-37
Release Voltage for Function to
Disable LED Open Detection
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TSZ22111 • 15 • 001
VIN_OPM
10.5
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11.0
11.5
V
VIN
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BD18336NUF-M
Electrical Characteristics – continued
(Unless otherwise specified Tj = -40 °C to +150 °C, VIN = 13 V)
Limit
No.
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Output for Fault Flag / Input for Output Current OFF Control Signal (PBUS)
E-38 Input High Voltage
VPBUSH
2.4
-
-
V
E-39 Input Low Voltage
VPBUSL
-
-
0.6
V
IPBUS
75
150
300
μA
VPBUS = 0 V
E-41 PBUS Pin Output Low Voltage
VPBUS_OL
-
-
0.6
V
IPBUS_EXT = 3 mA
E-42 PBUS Pin Output High Voltage
VPBUS_OH
3.5
4.5
5.5
V
IPBUS_EXT = -10 μA
E-43 PBUS Pin Leakage Current
IPBUS_LEAK
-
-
10
μA
VPBUS = 5 V
E-44 UVLO VIN Detection Voltage
VUVLOD
4.50
4.75
5.00
V
VIN: Sweep down
E-45 UVLO VIN Release Voltage
VUVLOR
5.00
5.25
5.50
V
VIN: Sweep up
VHYS
-
0.5
-
V
VBP
1.94
2.00
2.06
V
KSINK
2790
3000
3210
V
GSINK
-7519
-7300
-7081
-
VDRIS1
-
-
0.88
V
VDRIS2
-
-
1.00
V
VDRIS3
-
-
1.25
V
E-40 PBUS Pin Source Current
Under Voltage Lock Out (UVLO)
E-46 UVLO VIN Hysteresis Voltage
Current Bypass Function at Reduced-Voltage
E-47 BPCNT Reference Voltage
E-48
ISINK Current Setting
Coefficient
E-49 ISINK Current Gain
Voltage
Between ISINK Pin and GND 1
Voltage
E-51
Between ISINK Pin and GND 2
Voltage
E-52
Between ISINK Pin and GND 3
E-50
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IBPCNT = 10 μA
IBPCNT = 0 μA
KSINK = ISINK x RSET
RSET = 24 kΩ
GSINK =
{IISINK1 (@IBPCNT = 5 μA) IISINK2 (@IBPCNT = 10 μA)} /
5 μA
RSET = 24 kΩ
Tj = -40 °C
IISINK = 600 mA
Tj = +25 °C
IISINK = 600 mA
Tj = +150 °C
IISINK = 600 mA
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BD18336NUF-M
Typical Performance Curves (Reference Data)
(Unless otherwise specified Tj = 25 °C, VIN = 13 V)
800
4.5
Tj = -40 °C
4.0
Tj = +25 °C
Tj = +150 °C
700
Output Current: IOUT [mA]
VIN Pin Circuit Current at Normal Mode:
IVIN1 [mA]
5.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
600
500
400
300
200
100
0.0
0
2
4
6
8
0
10 12 14 16 18 20
4
Supply Voltage: VIN [V]
8
10 12 14 16 18 20 22 24
Resistor for Setting Output Current: RSET [kΩ]
Figure 1. VIN Pin Circuit Current at Normal Mode
vs Supply Voltage
Figure 2. Output Current
vs Resistor for Setting Output Current
600
5.0
4.0
500
3.0
Output Current: IOUT [mA]
Output Current Accuracy: ΔIOUT [%]
6
2.0
1.0
0.0
-1.0
-2.0
IOUT = 400 mA
IOUT = 240 mA
IOUT = 100 mA
-3.0
-4.0
400
300
200
Tj = -40 °C
Tj = +25 °C
Tj = +150 °C
100
0
-5.0
-50
-25
0
25
50
75
0.0
100 125 150
0.4
0.6
0.8
1.0
Drop Voltage between VIN Pin and OUT Pin:
VDR1 to VDR3 [V]
Temperature [°C]
Figure 3. Output Current Accuracy vs Temperature
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TSZ22111 • 15 • 001
0.2
Figure 4. Output Current
vs Drop Voltage between VIN Pin and OUT Pin
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Typical Performance Curves (Reference Data) – continued
(Unless otherwise specified Tj = 25 °C, VIN = 13 V)
500
500
RSET = 6 kΩ
400
Output Current: IOUT [mA]
Output Current: IOUT [mA]
400
300
RSET = 10 kΩ
200
RSET = 24 kΩ
100
0
0
2
4
6
8
300
Tj = -40 °C
Tj = +25 °C
Tj = +150 °C
200
100
0
10 12 14 16 18 20
0
2
Supply Voltage: VIN [V]
Figure 5. Output Current vs Supply Voltage
6
8 10 12 14 16 18 20
Supply Voltage: VIN [V]
Figure 6. Output Current vs Supply Voltage
42.0
210
41.5
THD Pin Source Current: ITHD [μA]
CRT Pin Charge Current: ICRT [μA]
4
41.0
40.5
40.0
39.5
39.0
38.5
205
200
195
190
38.0
-50
-25
0
25
50
75
-50
100 125 150
Temperature [°C]
Figure 7. CRT Pin Charge Current vs Temperature
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TSZ22111 • 15 • 001
-25
0
25 50 75 100 125 150
Temperature [°C]
Figure 8. THD Pin Source Current vs Temperature
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BD18336NUF-M
Typical Performance Curves (Reference Data) – continued
(Unless otherwise specified Tj = 25 °C, VIN = 13 V)
600
700
ISINK Pin Sink Current: IISINK [mA]
ISINK Pin Sink Current: IISINK [mA]
800
600
500
400
300
200
500
400
300
200
Tj = -40 °C
Tj = +25 °C
Tj = +150 °C
100
100
0
0
4
6
8
0.0
10 12 14 16 18 20 22 24
0.2
0.4
0.6
0.8
1.0
Voltage between ISINK Pin and GND:
VDRIS1 to VDRIS3 [V]
Resistor for Setting Output Current: RSET [kΩ]
Figure 9. ISINK Pin Sink Current
vs Resistor for Setting Output Current
Figure 10. ISINK Pin Sink Current
vs Voltage between ISINK Pin and GND
ISINK Pin Sink Current: IISINK [mA]
150
125
Tj = -40 °C
Tj = +25 °C
Tj = +150 °C
100
75
50
25
0
0
5
10
15
20
25
30
BPCNT Pin Input Current: IBPCNT [μA]
Figure 11. ISINK Pin Sink Current
vs BPCNT Pin Input Current
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BD18336NUF-M
Timing Chart
PWM Dimming Mode
LED
Current
De-rating
LED
OPEN
DC Mode
OUTPUT
GND
SHORT
ISET
SHORT
LED
Current
De-rating
LED
OPEN
OUTPUT
GND
SHORT
ISET
SHORT
Current
Bypass
13 V
VIN
5.25 V
4.75 V
13 V
VCRT
0.667 V
VTHD
0.667 V
40 μs
VIN - 0.050 V
VIN - 0.050 V
VOUT
0.6 V
VPBUS
0.6 V
0.8 V
20 μs
0.8 V
20 μs
IOUT
IISINK
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BD18336NUF-M
Application Examples
1.
IOUT = 200 mA, 3 White LEDs in Series, Unused Thermal De-rating Function
SW
D1
OUT
VIN
ZD
CVIN
+B
U1
BD18336NUF-M
CR
RBP1
RBP2
RBP3
Recommended Parts List 1
Parts
No
IC
ISINK
DISC
THD
PBUS
SET
BPCNT
GND
Parts Name
RSET
Value
UNIT
Product Maker
U1
BD18336NUF-M
-
-
ROHM
D1
RFN2LAM6STF
-
-
ZD
TND12H-220KB00AAA0
-
-
Resistor
RSET
MCR03EZPFX1202
12
kΩ
ROHM
NIPPON
CHEMICON
ROHM
Capacitor
CVIN
GCM31CL81H105KA40
1.0
μF
murata
Diode
Caution: About ZD, mount according to test standard of battery line.
2.
IOUT = 387 mA, 3 White LEDs in Series, Thermal De-rating Function
SW
D1
OUT
VIN
ZD
CVIN
+B
U1
BD18336NUF-M
CR
DISC
RBP1
RBP2
Recommended Parts List 2
Parts
No
IC
Diode
RBP3
ISINK
THD
PBUS
SET
BPCNT
GND
Parts Name
RSET
NTC
Value
UNIT
Product Maker
U1
BD18336NUF-M
-
-
ROHM
D1
RFN2LAM6STF
-
-
ZD
TND12H-220KB00AAA0
-
-
ROHM
NIPPON
CHEMICON
ROHM
Resistor
RSET
MCR03EZPFX6201
6.2
kΩ
Thermistor
NTC
NTCG104LH154JTDS
150
kΩ
TDK
Capacitor
CVIN
GCM31CL81H105KA40
1.0
μF
murata
Caution: About ZD, mount according to test standard of battery line.
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Application Examples – continued
3.
IOUT = 387 mA, 3 White LEDs in Series, PWM ON Duty = 10 %, Pulse Width = 0.334 ms, PWM Frequency = 300 Hz
PWM
SW
D1
OUT
VIN
D2
DC
SW
+B
ZD
CVIN
U1
BD18336NUF-M
D3
RDCIN
CR
CCRT
RBP1
RBP2
Recommended Parts List 3
Parts
No
IC
Diode
Resistor
Thermistor
Capacitor
ISINK
RCRT
RBP3
DISC
THD
PBUS
SET
BPCNT
GND
Parts Name
RSET
NTC
Value
UNIT
Product Maker
U1
BD18336NUF-M
-
-
ROHM
D1
RFN2LAM6STF
-
-
ROHM
D2
RFN2LAM6STF
-
-
ROHM
D3
RFN2LAM6STF
-
-
ZD
TND12H-220KB00AAA0
-
-
RSET
MCR03EZPFX6201
6.2
kΩ
ROHM
NIPPON
CHEMICON
ROHM
RCRT
MCR03EZPFX3601
3.6
kΩ
ROHM
RDCIN
MCR03EZPFX3902
39
kΩ
ROHM
NTC
NTCG104LH154JTDS
150
kΩ
TDK
CVIN
GCM31CL81H105KA40
1.0
μF
murata
CCRT
GCM188L81H104KA42
0.1
μF
murata
Caution: About ZD, mount according to test standard of battery line.
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BD18336NUF-M
I/O Equivalence Circuits
No.
Pin
Name
Equivalence Circuit
No.
Pin
Name
6
THD
Equivalence Circuit
BPCNT
(Pin 2)
2
BPCNT
GND
(Pin 8)
3
PBUS
PBUS
(Pin 3)
GND
(Pin 8)
10 Ω
(Typ)
7
SET
VIN
(Pin 1)
CRT
(Pin 4)
CRT
9
ISINK
GND
(Pin 8)
VIN
(Pin 1)
DISC
5.2 V
(Typ)
5 kΩ
(Typ)
10
OUT
OUT
(Pin 10)
GND
(Pin 8)
GND
(Pin 8)
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TSZ22111 • 15 • 001
ISINK
(Pin 9)
GND
(Pin 8)
DISC
(Pin 5)
5
SET
(Pin 7)
GND
(Pin 8)
GND
(Pin 8)
4
THD
(Pin 6)
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BD18336NUF-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 12. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD18336NUF-M
Ordering Information
B
D
1
8
3
3
6
N
U
F
Package
NUF:
VSON10FV3030
-
ME2
Product Rank
M: for Automotive
Packaging Specification
E2: Embossed tape and reel
Marking Diagram
VSON10FV3030 (TOP VIEW)
Part Number Marking
D18
LOT Number
3 3 6
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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VSON10FV3030
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BD18336NUF-M
Revision History
Date
Revision
Changes
25.Dec.2019
001
New Release
04.Jun.2020
002
Page.21 E-19 Output Current Setting Coefficient
Delete the electrical characteristics at Condition: RSET = 10 kΩ to 16 kΩ.
Change condition: RSET = 16 kΩ to 24 kΩ → RSET = 10 kΩ to 24 kΩ
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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