BD18345EFV-ME2

Datasheet Constant Current LED Drivers Constant Current Controller for Automotive LED Lamps BD18345EFV-M Key Specifications General Description   BD18345EFV-M is 70 V-withstanding constant current controller for automotive LED lamps. It is able to drive at maximum 10 rows of PNP transistors. It can also contribute to reduction in the consumption power of the set as it has the built-in standby function. The IC provides high reliability because it has two Current de-rating function, LED open detection, short circuit protection, over voltage mute function and LED failure input/output function.    Input Voltage Range: FB Pin Voltage Accuracy: 4.5 V to 19.0 V 650 mV ±3 % @Ta=25 °C to 125 °C Stand-by Current: 0 µA (Typ) LED Current De-rating Accuracy: DCDIM Pin : ±3 % @VDCDIM=0.75 V to 2.00 V THD Pin : ±6 % @VTHD=0.50 V to 0.75 V Operating Temperature Range: -40 °C to +125 °C Package Features           W (Typ) x D (Typ) x H (Max) HTSSOP-B20 6.50 mm x 6.40 mm x 1.00 mm AEC-Q100 Qualified(Note 1) PWM Dimming Function PWM Signal Output LED Current DC Dimming Thermal De-rating Function LED Open Detection Short Circuit Protection (SCP) Over Voltage Mute Function (OVM) Disable LED Open Detection Function at Reduced-Voltage LED Failure Input/Output Functions (PBUS) HTSSOP-B20 (Note 1) Grade1 Applications   Automotive LED Exterior Lamp (Rear Lamp, Turn Lamp, DRL/Position Lamp, Fog Lamp etc.) Automotive LED Interior Lamp (Air Conditioner Lamp, Interior Lamp, Cluster Light etc.) Typical Application Circuit RFB1 RFB2 PWM_in VIN FB D1 ZD1 CVIN1 CVIN2 EN RLIM BASE D2 CRT DC_in D3 CCRT OP RCRT SCP DISC BD18345EFV-M D VREG RDCIN CD CLED CVREG PWMOUT RDCDIM2 OPM PBUS RDCDIM1 DCDIM ROPM GND RTHD THD NTC 〇Product structure : Silicon integrated circuit www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Pin Configuration (TOP VIEW) FB 1 20 VIN BASE 2 19 N.C. N.C. 3 18 EN OP 4 17 N.C. SCP 5 16 DISC GND 6 15 CRT PBUS 7 14 D N.C. 8 13 DCDIM THD 9 12 VREG 10 11 OPM PWMOUT EXP-PAD Pin Description Pin No. Pin Name Function 1 FB 2 BASE Connecting PNP Tr. BASE 3 N.C. No internal connection(Note 1) 4 OP LED open detection input 5 SCP Short circuit protection input 6 GND GND 7 PBUS Output for fault flag / Input to disable output current 8 N.C. No internal connection(Note 1) 9 THD Connecting resistor for thermal de-rating setting 10 PWMOUT 11 OPM Connecting resistor for disable LED open detection voltage setting at reduced voltage 12 VREG Internal reference voltage output 13 DCDIM Connecting resistor for DC dimming setting 14 D 15 CRT Connect capacitor and resistor to set output current ON Duty 16 DISC Connecting resistor to set output current on time 17 N.C. No internal connection(Note 1) 18 EN 19 N.C. No internal connection(Note 1) 20 VIN Power supply input - EXP-PAD Feedback voltage input PWM signal output Connecting capacitor for disable LED open detection time setting Enable input The EXP-PAD connect to GND. (Note 1) Leave this pin unconnected www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Block Diagram VREG VIN FB EN VREG PBUS Over Voltage Mute BASE VREF PBUS OPENLOAD V RE G OP VI N V RE G OPEN MASK Control Logic 1.2 V V IN 1 mA OPM SCP SCP D 1.20 V ⇔1.25 V D COMP DELAY Rise 1 µs 0.9 V ⇔1.0 V V RE G CRT DCDIM THD Dimming THD CR TIMER DISC PWMOUT www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DC Dimming GND 3/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Absolute Maximum Ratings (Ta=25 °C) Parameter Symbol Rating Unit Power Supply Voltage(VIN) VIN -0.3 to +70.0 V EN, CRT, DISC Pin Voltage VEN, VCRT, VDISC -0.3 to +70.0 V VFB, VBASE, VOP,VSCP -0.3 to VIN+0.3 V VIN_FB, VIN_BASE -0.3 to +5.0 V VPBUS, VREG, VDCDIM, VTHD -0.3 to +7.0 V VPWMOUT, VOPM, VD -0.3 to VREG+0.3 V Tstg -55 to +150 °C Tjmax 150 °C FB, BASE, OP, SCP Pin Voltage VIN-FB, VIN-BASE Inter-Pin Voltage PBUS, VREG DCDIM, THD Pin Voltage PWMOUT, OPM, D Pin Voltage Storage Temperature Range Maximum Junction Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) θJA 143.0 26.8 °C/W ΨJT 8 4 °C/W HTSSOP-B20 Junction to Ambient Junction to Top Characterization Parameter (Note 2) (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Supply Voltage(Note 1) (Note 2) VIN 4.5 13.0 19.0 V CR TIMER Frequency fPWM 100 - 5000 Hz PWM Minimum Pulse Width(Note 3) tMIN 10 - - µs Operating Temperature Topr -40 - +125 °C (Note 1) ASO should not be exceeded (Note 2) At start-up time, apply a voltage 5 V or more once. The value is the voltage range after the temporary rise to 5 V or more. (Note 3) At connecting the external PNP Tr. (2SAR573DFHG (ROHM), 1 pcs). That is the same when the pulse input to the CRT pin. Operating Conditions Parameter Capacitor Connecting VIN Pin 1 Capacitor Connecting VIN Pin 2 Capacitor Connecting VREG Pin Capacitor Connecting LED Anode Capacitor for Setting CRT Timer Resistor for Setting CRT Timer Resistor for Setting LED Current Resistor for Disable LED Open Detection Voltage Setting at Reduced Voltage Resistor for DCIN Pull-down Resistor for Setting DC Dimming Resistor for Setting Thermal De-rating Capacitor for Setting Disable LED Open Detection Time Resistor for Limiting Base Current External PNP Transistor Symbol Min Max Unit CVIN1 1.0 - μF CVIN2(Note 4) 0.047 - μF CVREG(Note 5) 1.0 4.7 μF CLED 0.10 0.68 μF CCRT 0.01 0.22 μF RCRT 0.1 50.0 kΩ RFB1, RFB2(Note 6) 0.8 6.5 Ω ROPM 25 55 kΩ RDCIN - 10 kΩ R DCD IM1 4.7 50.0 kΩ R THD 4.7 50.0 kΩ CD(Note 5) 0.001 0.100 μF RLIM See Features Description 5 Ω Q1 (Note 7) - (Note 4) Recommended ceramic capacitor. ROHM Recommended Value (0.1 μF GCM155R71H104KE37 murata) (Note 5) Recommended ceramic capacitor. Setting the Disable LED Open Detection Time less than PWM minimum pulse width. (See Features Description, Section 5 –LED Open Detection Function). (Note 6) At connecting the external PNP Tr. 2SAR573DFHG (ROHM), 1 pcs. (Note 7) For external PNP transistor, Use the recommended device 2SAR573DFHG for this IC. While using non-recommended part device, check spec of part(hfe, parasitic capacitance) and validate the design on actual board. Check hfe of the part to design base current limit resistor. (See Features Description, section 5). As for parasitic capacitance, Evaluate over shoot of ILED on actual board. (See Features Description, Section 8 -Evaluation example, ILED pulse width at PWM Dimming operation). www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Electrical Characteristics (Unless otherwise specified Ta=-40 °C to +125 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) Limit Parameter Symbol Unit Conditions Min Typ Max [Circuit Current IVIN] Circuit Current at Stand-by Mode IVIN1 - 0 10 μA VEN=0 V VFB=VIN Circuit Current at Normal Mode IVIN2 - 2.0 5.0 mA VEN=VIN, VFB=VIN-1.0 V Base Current Subtracted Circuit Current at LED Open Detection IVIN3 - 2.0 5.0 mA VEN=VIN, VFB=VIN-1.0 V Circuit Current at PBUS=Low IVIN4 - 2.0 5.0 mA VEN=VIN, VFB=VIN-1.0 V VPBUS=0 V 4.85 5.00 5.15 V 4.75 5.00 5.25 V -1.0 - - mA 630 650 670 mV 617 650 683 mV IFB 7.5 15 30 μA VFB=VIN BASE Pin Sink Current Capability IBASE 10 - - mA VFB=VIN, VBASE=VIN-1.5 V Ta=25 °C BASE Pin Pull-up Resistor RBASE 0.5 1.0 1.5 kΩ VCRT=0 V VFB=VIN, VBASE=VIN-1.0 V Enable at VDCDIM < VDDON [VREG Voltage] VREG Pin Voltage VREG VREG Pin Current Capability IVREG IVREG=-100 μA Ta=25 °C to 125 °C IVREG=-100μA Ta=-40 °C to +125 °C [DRV] FB Pin Voltage VFBREG FB Pin Input Current VFBREG=VIN-VFB RFB1=RFB2=1.8 Ω, Ta=25 °C to 125 °C VFBREG=VIN-VFB RFB1=RFB2=1.8 Ω, Ta=-40 °C to +125 °C [LED Current De-rating function (DC Dimming function)] VDDON VREG ×0.42 - VREG ×0.8 V DDG 710 730 750 mV/V ΔVFBREG / ΔVTHD VTHD:0.75 V → 0.35 V FB Pin Voltage VDCDIM=2.0 V(VREG×0.4) VFB_DC1 1.336 1.378 1.420 V VTHD > VDCDIM+0.25 V FB Pin Voltage VDCDIM=0.75 V(VREG×0.15) VFB_DC2 452 466 480 mV VTHD > VDCDIM+0.25 V FB Pin Voltage VDCDIM=0.50 V(VREG×0.1) VFB_DC3 272 284 296 mV VTHD > VDCDIM+0.25 V FB Pin Voltage VDCDIM=0.35 V(VREG×0.07) VFB_DC4 163 174 185 mV VTHD > VDCDIM+0.25 V DCDIM Pin Input Voltage range VDCDIM_R VREG ×0.07 - VREG ×0.4 V FB Pin Voltage VTHD=0.75 V VFB_THD1 438 466 494 mV VDCDIM > VTHD+0.25 V FB Pin Voltage VTHD=0.50 V VFB_ THD2 266 284 301 mV VDCDIM > VTHD+0.25 V FB Pin Voltage VTHD=0.35 V VFB_ THD3 160 174 188 mV VDCDIM > VTHD+0.25 V DC Dimming Enable Voltage DC Dimming Gain [DCDIM] [THD] www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Electrical Characteristics – continued (Unless otherwise specified Ta=-40 °C to +125 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) Limit Parameter Symbol Unit Conditions Min Typ Max [Over Voltage Mute Function (OVM)] ΔVFB=10.0 mV ΔVFB=VFB(@VIN=13 V)VFB(@VIN=VOVMS) Over Voltage Mute Start Voltage VOVMS 20.0 22.0 24.0 V Over Voltage Mute Gain VOVMG - -25 - mV/V CRT Pin Charge Current ICRT 36 40 44 μA CRT Pin Charge Voltage VCRT_CHA 0.72 0.80 0.88 V CRT Pin Discharge Voltage 1 VCRT_DIS1 1.80 2.00 2.20 V CRT Pin Discharge Voltage 2 VCRT_DIS2 2.10 2.40 3.00 V When VCRT > VCRT_DIS2, RD1 → RD2 CRT Pin Charge Resistor RCHA 28.5 30.0 31.5 kΩ RCHA= (VCRT_DIS1-VCRT_CHA)/ICRT CRT Discharge Constant VCRT_CHA/ VCRT_DIS1 0.38 0.40 0.42 V/V DISC Pin ON Resistor 1 RDISC1 20 50 100 Ω IDISC=10 mA DISC Pin ON Resistor 2 RDISC2 2.5 5.0 10 kΩ IDISC=100 μA PWMOUT Pin Output High Voltage VPWMOUTH 4.0 - 5.5 V IPWMOUT = -100μA PWMOUT Pin Output Low Voltage VPWMOUTL - - 0.5 V IPWMOUT = 100μA - - 0.5 mA -0.5 - - mA ΔVFB/ΔVIN [CR TIMER] PWMOUT Pin Sink Current Capability IPWMOUT PWMOUT Pin Source Current Capability IPWMOUT CRT Pin Leakage Current ICRT_LEAK - - 10 μA VOPD 1.1 1.2 1.3 V VOPD=VIN-VOP IOP 19 21 23 μA VOP=VIN-0.5 V _SINK _SOURCE VCRT=VIN [LED Open Detection] LED Open Detection Voltage OP Pin Input Current [Disable LED Open Detection Function at Reduced-Voltage] IOPM 38 40 42 μA VIN Pin Disable LED Open Detection Voltage at Reduced-Voltage VIN_OPM VOPM x 5.9 VOPM x 6.0 VOPM x 6.1 V OPM Pin Input Voltage Range VOPM_R 1.0 - 2.2 V OPM Pin Source Current [Disable LED Open Detection Time Setting D Function] Input Threshold Voltage D Pin Source Current D Pin ON Resistor www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VDH 0.9 1.0 1.1 V IDSOURCE 100 230 400 μA RD - - 950 Ω 7/37 ID_EXT=100 μA TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Electrical Characteristics – continued (Unless otherwise specified Ta=-40 °C to +125 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) Limit Parameter Symbol Unit Conditions Min Typ Max [Short Circuit Protection (SCP)] Short Circuit Protection Voltage VSCPD 1.10 1.20 1.30 V Short Circuit Protection Release Voltage VSCPR 1.15 1.25 1.35 V Short Circuit Protection Hysteresis Voltage VSCPHYS - 50 - mV SCP Pin Source Current ISCP 0.2 1.0 2.0 mA SCP Pin Source Current ON Voltage VSCP2 1.15 1.30 1.45 V tSCP 10 20 45 µs Input High Voltage VPBUSH 2.4 - - V Input Low Voltage VPBUSL - - 0.6 V Hysteresis Voltage VPBUSHYS - 200 - mV IPBUS 75 150 300 μA VEN=5 V PBUS Pin Output Low Voltage VPBUS_OL - - 0.6 V IPBUS_EXT=3 mA PBUS Pin Output High Voltage VPBUS_OH 3.5 4.5 5.5 V IPBUS_EXT=-10 μA PBUS Pin Leakage Current IPBUS_LEAK - - 10 μA VPBUS=7 V Input High Voltage VENH 2.4 - - V Input Low Voltage VENL - - 0.6 V Hysteresis Voltage VENHYS - 60 - mV IEN - 7 15 μA VEN=5 V UVLO Detection Voltage VUVLOD 3.88 4.10 4.32 V VIN: Sweep down UVLO Release Voltage VUVLOR 4.25 4.50 4.75 V VIN: Sweep up, VREG > 3.75 V VHYS - 0.4 - V SCP Delay Time [PBUS] PBUS Pin Source Current [EN] Pin Input Current [UVLO VIN] UVLO Hysteresis Voltage www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Typical Performance Curves (Reference Data) 5.0 6.0 4.5 5.5 4.0 5.0 VREG Pin Voltage : VREG[V] Circuit Current at Normal Mode : IVIN2[mA] (Unless otherwise specified Ta=25 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) Ta=+125 °C Ta=+25 °C Ta=-40 °C 3.5 3.0 2.5 2.0 1.5 1.0 4.5 4.0 3.5 Ta=+125 °C Ta=+25 °C Ta=-40 °C 3.0 2.5 2.0 1.5 1.0 0.5 0.5 0.0 0 2 4 6 8 0.0 10 12 14 16 18 20 0 2 4 Supply Voltage : VIN[V] 6 8 10 12 14 16 18 20 Supply Voltage : VIN[V] Figure 1. Circuit Current at Normal Mode vs Supply Voltage Figure 2. VREG Pin Voltage vs Supply Voltage 500 5.25 400 5.15 LED Current : ILED[mA] VREG Pin Voltage : VREG[V] 5.20 5.10 5.05 5.00 4.95 4.90 4.85 300 200 100 4.80 4.75 0 -50 -25 0 25 50 75 100 125 150 0 4 6 8 10 12 14 Resistor for Setting LED Current : RFB1+RFB2[Ω] Temperature[°C] Figure 3. VREG Pin Voltage vs Temperature www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2 Figure 4. LED Current vs Resistor for Setting LED Current 9/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Typical Performance Curves (Reference Data) – continued 5 690 4 680 FB Pin Voltage : VFBREG[mV] LED Current Accuracy : ΔILED[%] (Unless otherwise specified Ta=25 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) 3 2 1 0 -1 -2 ΔILED=(ILED/{0.65 V/(RFB1+RFB2)}-1) x100[%] -3 670 660 650 640 630 620 -4 -5 610 0 2 4 6 8 10 12 14 -50 -25 Resistor for Setting LED Current : RFB1+RFB2[Ω] 45 700 FB Pin Voltage : VFBREG[mV] BASE Pin Sink Current Capability : IBASE[mA] 800 40 35 30 Ta=+125 °C Ta=+25 °C Ta=-40 °C 400 300 200 10 0 8 10 12 14 16 18 Ta=+125 °C 6 20 11 16 21 26 31 36 41 46 51 56 Supply Voltage : VIN[V] Supply Voltage : VIN[V] Figure 7. BASE Pin Sink Current Capability vs Supply Voltage www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Ta=+25 °C Ta=-40 °C 500 100 6 75 100 125 150 600 15 4 50 Figure 6. FB Pin Voltage vs Temperature 50 20 25 Temperature[°C] Figure 5. LED Current Accuracy vs Resistor for Setting LED Current 25 0 Figure 8. FB Pin Voltage vs Supply Voltage 10/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Typical Performance Curves (Reference Data) – continued (Unless otherwise specified Ta=25 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) 42.0 OPM Pin Source Current : IOPM[μA] CRT Pin Charge Current : ICRT[μA] 42.0 41.5 41.0 40.5 40.0 39.5 39.0 38.5 38.0 41.5 41.0 40.5 40.0 39.5 39.0 38.5 38.0 -50 -25 0 25 50 75 100 125 150 -50 -25 Temp[℃] Temperature[°C] 25 50 75 100 125 150 Temp[℃] Temperature[°C] Figure 9. CRT Pin Charge Current vs Temperature www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 10. OPM Pin Source Current vs Temperature 11/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Typical Performance Curves (Reference Data) – continued (Unless otherwise specified Ta=25 °C, VIN=13 V, CVREG=1.0 µF, PNP Transistor=2SAR573DFHG) 760 2400 1800 750 Ta=+125 °C Ta=+25 °C Ta=-40 °C DC Dimming Gain : DDG[mV/V] FB Pin Voltage : VFBREG[mV] 2100 1500 1200 900 600 740 730 720 710 700 690 300 680 -50 -25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 DCDIM Pin Voltage : VDCDIM[mV] Figure 11. FB Pin Voltage vs DCDIM Pin Voltage 0 25 50 75 100 125 150 Temperature[°C] Figure 12. DC Dimming Gain vs Temperature 800 FB Pin Voltage : VFBREG[mV] 700 Ta=+125 °C Ta=+25 °C 600 500 Ta=-40 °C 400 300 200 100 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 THD Pin Voltage : VTHD[mV] Figure 13. FB Pin Voltage vs THD Pin Voltage www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function (Unless otherwise specified, Ta=25 °C, VIN=13 V, PNP Transistor=2SAR573DFHG, and numbers are “Typical” values.) 1. LED Current Setting LED current ILED can be defined by setting resistances RFB1 and RFB2. 𝐼𝐿𝐸𝐷 = 𝑅 𝑉𝐹𝐵𝑅𝐸𝐺 𝐹𝐵1 +𝑅𝐹𝐵2 [A] where: 𝑉𝐹𝐵𝑅𝐸𝐺 is the FB pin voltage 650 mV (Typ). ●How to connect LED current setting resistors LED current setting resistors must always be connected at least two or more in series as below. If only one current setting resistor is used, then in case of a possible resistor short (pattern short on the board etc.), the external PNP Tr. and LED may be broken due to large current flow. PNP Tr. rating current, LED rating current, RFB1 and RFB2 must have the following relations: 𝑉 𝐼𝐿𝐸𝐷_𝑀𝐴𝑋 > 𝐼𝑃𝑁𝑃_𝑀𝐴𝑋 > 𝑀𝑖𝑛(𝑅𝐹𝐵𝑅𝐸𝐺 ,𝑅 𝐹𝐵1 𝐹𝐵2 ) [A] where: 𝐼𝐿𝐸𝐷_𝑀𝐴𝑋 𝐼𝑃𝑁𝑃_𝑀𝐴𝑋 𝑉𝐹𝐵𝑅𝐸𝐺 𝑀𝑖𝑛(𝑅𝐹𝐵1 , 𝑅𝐹𝐵2 ) is the LED rating current. is the PNP Tr. rating current. is the FB pin voltage 650 mV (Typ). is the lowest value of RFB1 and RFB2. RFB1 VIN RFB2 FB +B EN VREG VREG BASE VCE_PNP VREF GND CVREG ILED Figure 14. LED Current Setting ●Constant current control dynamic range Constant current control dynamic range of LED current I LED can be calculated as follows. 𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝐶𝐸_𝑃𝑁𝑃 + 𝑉𝐹𝐵𝑅𝐸𝐺 [V] where: 𝑉𝐼𝑁 𝑉𝑓_𝐿𝐸𝐷 𝑁 𝑉𝐶𝐸_𝑃𝑁𝑃 𝑉𝐹𝐵𝑅𝐸𝐺 2. is the VIN pin voltage. is the LED Vf. is the number of rows of LED. is the external PNP Tr. collector-emitter saturation voltage. is the FB pin voltage 650 mV (Typ). Reference Voltage (VREG) Reference voltage VREG 5.00 V (Typ) is generated from VIN input voltage. This voltage is used as power source for the internal circuit, and also used to fix the voltage of pins outside LSI to HIGH side. The VREG pin must be connected with CVREG=1.0 μF to 4.7 μF to ensure capacity for the phase compensation. If CVREG is not connected, the circuit behavior would become extraordinarily unstable, for example with the oscillation of the reference voltage. The VREG pin voltage must not be used as power source for other devices than this LSI. VREG circuit has a built-in UVLO function. The IC is activated when the VREG pin voltage rises to 4.00 V (Typ) or higher, and shut down when the VREG pin voltage drops to 3.75 V (Typ) or lower. www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 3. Table of Operations The PWM dimming mode switches to DC control depending on the CRT pin voltage. The switching conditions are as shown in the table below. When VIN > 22.0 V (Typ), LED current is limited to reduce the heat dissipation of external PNP transistor. Depending on the OP pin and the SCP pin voltage status, detect LED open or short circuit then LED current is turned OFF. LED current is also turned OFF when Low signal is input to the PBUS pin. In addition, UVLO and TSD further increases system reliability. For each functions, refer to Description of Function. Detecting Condition Operation Mode CRT Pin PBUS Pin [Release] LED Current (ILED) [Detect] Stand-by Mode(Note 1) - VEN ≤ 0.6 V VEN ≥ 2.4 V OFF(Note 3) Hi-Z DC VCRT ≥ 2.0 V (Typ) - - 50 mA to 400 mA High 4.5 V (Typ) PWM Dimming See Features Description 4 - - See Features Description 4 High 4.5 V (Typ) DC Dimming - VDCDIM ≤ VREG×0.42 VDCDIM > VREG×0.8 See Features Description 9 High 4.5 V(Typ) Thermal De-rating - VTHD ≤ 1.0 V(Typ) VTHD > 1.25 V See Features Description 10 High 4.5 V(Typ) Over Voltage Mute - VIN > 22.0 V (Typ) VIN ≤ 22.0 V (Typ) See Features Description 12 High 4.5 V (Typ) LED Open Detection(Note 2) - VOP ≥ VIN –1.2 V (Typ) VOP < VIN – 1.2 V (Typ) OFF(Note 3) Low Short Circuit Protection (SCP) - VSCP ≤ 1.20 V (Typ) VSCP ≥ 1.25 V (Typ) OFF(Note 3) Low PBUS Control OFF - VPBUS ≤ 0.6 V VPBUS ≥ 2.4 V OFF(Note 3) Input VPBUS ≤ 0.6 V UVLO - VIN ≤ 4.10 V (Typ) or VREG ≤ 3.75 V (Typ) VIN ≥ 4.50 V (Typ) or VREG ≥ 4.00 V (Typ) OFF(Note 3) High TSD - Tj ≥ 175 C (Typ) Tj ≤ 150 C(Typ) OFF(Note 3) Hi-Z (Note 1) Circuit current 0 μA (Typ) (Note 2) In regard to the sequence of LED current OFF, see Features Description 5. (Note 3) The BASE pin sink current: OFF, and LED current(ILED): OFF. www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 4. PWM Dimming Operation PWM Dimming is performed with the following circuit. The dimming cycle and ON Duty Width, can be set by values of the external components (CCRT , RCRT ). Connect the CRT pin to the VIN pin and the DISC pin to GND or open if it is not used. The CR timer function is activated if DC SW is OPEN. To perform PWM dimming of LED current, a triangular waveform is generated at the CRT pin. The LED current (ILED) is turned OFF while CRT voltage is ramp up, and LED current(ILED) is turned ON while CRT voltage is ramp down. When VCRT ≥ VCRT_DIS1(2.0 V(Typ)), dimming mode turns to DC Control. When VCRT > VCRT_DIS2(2.4 V(Typ)), the DISC pin ON resister changes from RDISC1(50 Ω(Typ)) to RDISC2(5 kΩ(Typ)), and the power consumption of the IC is reduced by reducing the inflow current of the DISC pin. PWM SW ON VIN EN VREG DC SW OPEN FB Control Logic VREG BASE I CRT VREF CRT CCRT RCRT ILED VCRT_DIS1 GND VCRT_DIS2 DISC RDISC1 R DISC2 Figure 15. PWM Dimming Operation CRT Voltage Ramp up CRT Voltage Ramp down VCRT_DIS1 2.0 V(Typ) CRT Pin Waveform ΔVCRT VCRT_CHA 0.8 V(Typ) t OFF tOFF = LED Current ILED ΔVCRT×CCRT ICRT ILED OFF t ON =RCHA×CCRT ILED ON tON= - (R CRT + RDISC1)×CCRT×ln ILED OFF I LED ON VCRT_CHA VCRT_DIS1 I LED OFF I LED ON Figure 16. PWM Dimming Operation www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M 4. PWM Dimming Operation – continued (1) CRT ramp up Time tOFF and CRT ramp down Time tON CRT ramp up Time tOFF and CRT ramp down Time tON can be defined from the following equations. Make sure that tON is set PWM Minimum Pulse Width tMIN 10 μs or more. 𝑡𝑂𝐹𝐹 = ∆𝑉𝐶𝑅𝑇 ×𝐶𝐶𝑅𝑇 𝐼𝐶𝑅𝑇 = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 [s] 𝑉 𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (𝑉 𝐶𝑅𝑇_𝐶𝐻𝐴 ) [s] 𝐶𝑅𝑇_𝐷𝐼𝑆1 where: 𝐼𝐶𝑅𝑇 𝑅𝐶𝐻𝐴 𝑅𝐷𝐼𝑆𝐶1 𝑉𝐶𝑅𝑇_𝐶𝐻𝐴 𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1 is the CRT pin charge current, 40 μA (Typ). is the CRT pin charge resistor, 30 kΩ (Typ). is the DISC pin ON resistor1, 50 Ω (Typ). is the CRT pin charge voltage, 0.8 V (Typ). is the CRT pin discharge voltage1, 2.0 V (Typ). (2) PWM Dimming Frequency fPWM PWM Dimming Frequency is defined by tON and tOFF. 𝑓𝑃𝑊𝑀 = 𝑡 1 𝑂𝑁 +𝑡𝑂𝐹𝐹 [Hz] (3) ON Duty(DON) PWM ON duty is defined by tON and tOFF. 𝐷𝑂𝑁 = 𝑡 𝑡𝑂𝑁 𝑂𝑁 +𝑡𝑂𝐹𝐹 [%] (Example) In case of RCRT=3.6 kΩ, CCRT=0.1 μF (Typ) 𝑡𝑂𝐹𝐹 = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 = 30 × 0.1 = 3.0 [ms] 𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛(𝑉𝐶𝑅𝑇_𝐶𝐻𝐴 /𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1 ) = −(3.6 + 50) × 0.1 × 𝐼𝑛(0.8/2.0) = 0.334 [ms] 𝑓𝑃𝑊𝑀 = 1/(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 1/(3.0 + 0.334) = 300 [Hz] 𝐷𝑂𝑁 = 𝑡𝑂𝑁 /(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 0.334/(3.0 + 0.334) = 10.0 [%] [PWM Dimming Operation Using External Signal] In case external PWM input to the CRT pin, make sure that input pulse high voltage ≥ 2.2 V and pulse low voltage ≤ 0.6 V. Also open the DISC pin or connect to GND. VIN EN VREG FB Control Logic V REG BASE I CRT VREF μ-Con or CRTIMER CRT ILED GND DISC Figure 17. PWM Dimming Operation Using External Signal www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M 4. PWM Dimming Operation – continued ●About deviation of CRT ramp up/down time with a reverse connection protection diode If this LSI is used to drive LED like below schematic, there is a possibility of occur CRT ramp up/down time deviation due to characteristics of reverse current Ir diode (D2, D3) . Consider to choose a diode (D2, D3) which is recommended by Rohm or Ir value 1 μA (Max) or less. Since reverse current flows even with the recommended diodes, connect a resistor of RDCIN of 10 kΩ or less between Point A and GND so that the voltage at point A does not rise. Mechanism of deviation of CRT ramp up/down time from set values. ① During the PWM dimming operation mode, Point A on Figure 18 is Hi-Z. ↓ ② Reverse current Ir of D2 and D3 goes to Point A. (Power supply voltage is being input into the cathode of D2, so mainly reverse current of D2 goes into C1.) →Reverse current Ir of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down time deviates from the settings. ↓ ③ C1 gets charged, voltage at Point A rises. ↓ ④ Point A voltage ≥ the CRT pin voltage of each IC. ↓ ⑤ Vf occurs in the diodes D3. ↓ ⑥ D3 circulate forward current If →Forward current If of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down time deviates from the settings. ↓ ⑦ Repetition of ➁ to ➅. D1 VIN EN D2 Point A RDCIN FB Ir D3 C1 BD18345EFV-M BASE CRT If Vf GND DISC Figure 18. How Reverse Protection Diode Affects the CRT Pin Ramp Up/Down Time www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 5. LED Open Detection Function In case any one of the LEDs is in the open state, the IC can detect LED open condition when the OP pin voltage (VOP) meets the following condition: VOP ≥ VIN-1.2 V (Typ). As soon as VOP ≥ VIN-1.2 V (Typ) condition is achieved, the D pin source current (230 μA (Typ)) turns on and starts charging the disable LED open detection time setting capacitor (CD). Once the D pin voltage (VDH) becomes 1.0 V (Typ) or more and 1 μs (Typ) elapses, the BASE pin sink current (IBASE) is latched OFF and the PBUS pin voltage (VPBUS) is switched to Low. [Base Current Limit Resistance (RLIM)] The OP pin voltage VOP at LED open is defined by the following formula: (Note that the external PNP Tr. goes into the saturation mode when the collector is open, it becomes the following formula.) 𝑉𝑂𝑃 = 𝑉𝐼𝑁 − {(𝑅𝐹𝐵1 + 𝑅𝐹𝐵2 ) × 𝐼𝐵𝐴𝑆𝐸_𝑀𝐴𝑋 + 𝑉𝐶𝐸_𝑃𝑁𝑃 } 𝐼𝐵𝐴𝑆𝐸_𝑀𝐴𝑋 = 6.0𝑉/𝑅𝐿𝐼𝑀 [V] [A] (𝐼𝐵𝐴𝑆𝐸_𝑀𝐴𝑋 < 80 𝑚𝐴) where: 𝑅𝐹𝐵1 , 𝑅𝐹𝐵2 𝐼𝐵𝐴𝑆𝐸_𝑀𝐴𝑋 𝑅𝐿𝐼𝑀 𝑉𝐶𝐸_𝑃𝑁𝑃 is the LED current setting resistance. is a maximum sink current of the BASE pin. is the resistor for limiting a sink current of the BASE pin. is the external PNP Tr. Collector-emitter voltage (Note: ICE=IOP (23 μA (Max))). Determine the BASE current limit resistance RLIM to ensure that the OP pin voltage when the LED is open should meet the following condition: VOP > VIN-1.2 V (Typ). Also note that the BASE current limit resistance must meet the following condition in order to obtain the BASE current to be needed during normal LED operation. 4.0/𝑅𝐿𝐼𝑀 > 𝐼𝐿𝐸𝐷 /ℎ𝑓𝑒_𝑀𝐼𝑁 [A] where: ℎ𝑓𝑒_𝑀𝐼𝑁 is the minimum external PNP Tr. hfe. For the D pin, it is possible to set the disable time tD from when the OP pin voltage meets the condition “VOP > VIN-1.2 V (Typ)” until the BASE pin sink current (IBASE) is latched off, according to the following formula. Note that the disable time must be shorter than or equal to the ON pulse width of the PWM dimming tON. 𝐶𝐷 ×𝑉𝐷𝐻 𝑡𝑂𝑁 > 𝑡𝐷 = 𝐼 [s] 𝐷𝑆𝑂𝑈𝑅𝐶𝐸 where: 𝑡𝑂𝑁 𝐶𝐷 𝑉𝐷𝐻 𝐼𝐷𝑆𝑂𝑈𝑅𝐶𝐸 is the ON pulse width of the PWM dimming(CRT ramp down time). is the disable LED open detection time setting capacitor. is the D pin input threshold voltage, 1.0 V (Typ). is the D pin source current, 230 μA (Typ). To reset the latched off LED current, EN must be turned-on again (The time when the EN Pin is “L” since the power is turned on again: 50 μs or more) or the condition “UVLO (VIN ≤ 4.10 V or VREG ≤ 3.75 V)” must be fulfilled. VIN LED OPEN R FB1 FB PBUS DRV R FB2 IBASE R LIM VCE_PNP OPEN LED OPEN OP 1.2 V VOP 21 μA VIN Control Logic D D COMP 1 μs Filter CD VF_LED LED Open Detection Comparator Output D Pin Voltage VD C LED VD Discharge Co by the OP pin input current(21μA) VIN VIN - 1.2 V(Typ) BASE PBUS 230 μA OP Pin Voltage VOP ILED 1.0 V (Typ) 1 μs (Typ) C D x 1.0 V 230 μA PBUS Pin Voltage VPBUS 1.0 V GND I B A S E: ON (DRV: ON) I B A S E: OFF(DRV: OFF) Latch Release Condtion : EN: H -> L or UVLO: detect Figure 19. LED Open Detection Timing Chart www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 6. Disable LED Open Detection Function at Reduced-Voltage The disable LED open detection function serves to prevent false detection of LED open at the reduced-voltage during the ramp-up/ramp-down of the VIN pin voltage. Even though LED is in the open state, LED open will not be detected until the VIN pin voltage becomes more than Disable Open Detection Voltage at Reduced-Voltage (VIN_OPM). Once VIN_OPM is surpassed, the LED current will be latched OFF (The BASE pin sink current (IBASE) is latched OFF) and the PBUS voltage will be switched to Low following the sequence explained in Description of Function 5. VIN_OPM must be defined by the following formula. (The OPM pin voltage must be set between 1.0 V and 2.2 V.) 𝑉𝐼𝑁_𝑂𝑃𝑀 ≥ 𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 [V] VIN where: 𝑉𝐼𝑁_𝑂𝑃𝑀 is the VIN pin disable open detection voltage at reduced-voltage. 𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 is the VIN pin open erroneous detection voltage at reduced-voltage. V RE G OPM ROPM 𝑉𝐼𝑁_𝑂𝑃𝐸𝑅𝑅 = 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝑂𝑃𝐷 VCE_PNP OPEN MASK LED OPEN OP Vf_LED ×N VI N [V] BASE VREF I OP M 𝑉𝐼𝑁_𝑂𝑃𝑀 = 𝑉𝑂𝑃𝑀 × 6.0 (𝑇𝑦𝑝) [V] 𝑉𝑂𝑃𝑀 = 𝐼𝑂𝑃𝑀 × 𝑅𝑂𝑃𝑀 FB Control Logic VOP D =1.2 V [V] GND Figure 20. Disable LED Open Detection Function at Reduced-Voltage where: 𝑉𝑂𝑃𝑀 is the OPM pin voltage. 𝐼𝑂𝑃𝑀 is the OPM pin source current, 40 μA (Typ) 𝑅𝑂𝑃𝑀 is the OPM pin connection resistance. 𝑉𝑓_𝐿𝐸𝐷 is the LED Vf. 𝑁 is the number of rows of LED. 𝑉𝑂𝑃𝐷 is the LED open-circuit detection voltage, 1.2 V (Typ) ●When connecting resistor for heat dispersion, or connecting resistor or diodes between the OP pin and LED anode The formula to calculate VIN_OPERR will be different from the one above when the current flowing the LED is large and it is necessary to connect a resistor for heat dispersion in series with the LED to reduce the heat generation from the external PNP Tr., when multiple rows of the LEDs are driven, or when connecting a resistor to adjust the threshold voltage for detecting the LED open-circuit. Read the Application Note of BD1834xFV-M series for details. VIN_OPERR VIN_OPM VIN_OPM VIN_OPERR VIN > Vf_LED × N + VCE_PNP + VFBREG VIN Controllable Range of constant current Disable LED Open Detection Area VIN Disable LED Open Detection Area VOPD =VIN -1.2 V LED Open Detection Area LED Open Detection Area VOP VOP = Vf_LED × N ILED ILED 4.5 V VPBUS Figure 21. VIN Pin Disable LED Open Detection Voltage at Reduced-Voltage and LED Open Erroneous Detection Voltage at Reduced-Voltage www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 7. Short Circuit Protection (SCP) Short Circuit Protection function will be activated by decreasing the SCP pin voltage when the collector of the external PNP Tr. is short to GND. After a lapse of the short circuit protection delay time(tSCP)(20 μs(Typ)) following the drop of the SCP pin voltage(VSCP) is 1.2 V(Typ) or less, the external PNP Tr. is turned OFF to prevent its thermal destruction, and it can be notify the abnormally to the outside by changing the PBUS pin output to low. In order to avoid malfunction since the power is turned on, the Short Circuit Protection function will not be activated until VCRT > 2.0 V(Typ) after UVLO is reset. If it is in the short circuit state (VSCP < 1.2 V(Typ)) since the power is turned on, the Short Circuit Protection function will be activated when VCRT > 2.0 V(Typ) condition is reached and 60 µs(Typ) passes, after UVLO is reset. VIN FB EN VREG BASE VREF PBUS VIN PBUS SCP GND ILED 1 mA Control Logic SCP 20 µs Filter SHORT 1.20 V ⇔1.25 V Short Circuit Short Circuit 4.5 V VIN 2.0 V VCRT 1.25 V 1.25 V 1.20 V VSCP ON 60 μs OFF ILED ON ON 20 μs OFF OFF High High High Low VPBUS Low Figure 22. Short Circuit Protection (SCP) ●SCP Pin Source Current The SCP pin sources the current (1 mA(Typ)) once its voltage (VSCP) drops under 1.3 V in order to prevent the malfunction of the short circuit protection. VIN FB EN 1.3 V (Typ) VREG BASE VSCP VREF 0V PBUS PBUS SCP 1 mA Control Logic VIN 1.3 V 1.0 mA (Typ) GND SCP 20 µs Filter 1.2 V⇔1.25 V ISCP ISCP 0 mA Figure 23. SCP Pin Source Current www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 8. About the Capacitor of Connecting LED Anode There is a zone which the output (LED anode) will become high impedance (Hi-Z) at PWM dimming Mode. During this time noise(Note 1) can decrease LED anode voltage and cause false detection of SHORT condition. To prevent this, it is necessary to connect a Capacitor CLED between LED anode and the GND pin nearby pin. Make sure that the capacitor of connecting LED anode is the following equation: 0.1 ≤ 𝐶𝐿𝐸𝐷 ≤ 0.68 [µF] In case CLED is set the range from 0.1 μF to 0.68 μF, the ILED current becomes dull, so evaluate ILED waveform in PWM mode operation. About the example of evaluation, See evaluation example on page 22. In case a capacitor exceeding the recommended range is connected to LED anode, there is a possibility that delay time of start-up will reach about several ten ms, so special attention is needed. (Note 1) Conducted noise, Radiated noise, Crosstalk of connecter and PCB pattern etc… VIN EN VREG FB Control Logic VREG BASE ICRT VREF CRT CLED GND DISC ILED Figure 24. About the Capacitor of Connecting LED Anode www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued Evaluation example (ILED pulse width at PWM Dimming operation) Condition: +B=13 V Ta=25 °C LED=1 Strings CCRT=0.01 μF RDISC=1.0 kΩ PWM Dimming Mode ILED=50 mA ILED=500 mA ILED=50 mA ILED=200 mA CLED=0.1 μF CLED=0.47 μF CLED=0.1 μF CLED=0.47 μF www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 22/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 9. DC Dimming Function (DCDIM) The IC provides DC dimming function to input DC voltage to the DCDIM pin like below schematic. The DCDIM pin is connecting the internal comparator which select the reference voltage of the DRVAMP reference voltage (VFBREG).The VFBREG is set by the DCDIM pin voltage when VDCDIM < VREG × 0.42 and set by internal reference voltage when VDCDIM ≥ VREG × 0.8. VFBREG can be set to 0.174 V to 1.378 V (Typ) by applying voltage at the VDCDIM. An output current can be set by a resistor connected to a LED board for Luminous Flux group as below. In case of not using DC dimming function, the DCDIM pin needs to be connected to the VREG pin. Also if needed be measure for EMC, connect capacitor to the DCDIM pin. The DC dimming function setting can be defined by the following formula: 𝑉𝐹𝐵𝑅𝐸𝐺 (𝑉𝐷𝐶𝐷𝐼𝑀 < 𝑉𝑅𝐸𝐺 × 0.5) = 𝑉𝐷𝐶𝐷𝐼𝑀 × 𝐷𝐷𝐺 − 0.08 [𝑉 ] DDG :DC Dimming Gain 730 mV/V(Typ) VIN VFBREG FB :The DCDIM pin voltage dependence DRVAMP BASE VREF VREG LED Board ILED DCDIM internal reference voltage Input the voltage which divided resistor (VREG) VFBREG (VIN-VFB) 1.378 V Internal Reference voltage DC dimming Range Set VFBREG by external voltage 0.650 V 0.174 V 0 VREG×0.6 VREG×0.5 VREG×0.07 VDCDIM [V] VREG×0.4 Figure 25. DC Dimming Function www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 23/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Description of Function – continued 10. Thermal De-rating Function (THD) The IC provides Thermal De-rating function to connect NTC Thermistor to the THD pin like below schematic. VFBREG can be set to 0.174 V to 0.466 V (Typ) by applying voltage at the THD pin voltage. To set NTC Thermistor value detect LED Board heat up and decrease the THD pin voltage. Output current is limited and prevent heat up. In case of not using THD function, the THD pin voltage needs to be connected to the VREG pin. Also if needed be measure for EMC, connect capacitor to the THD pin. Steep changes in the THD pin voltage also might affect the ability of the output amplifier to keep up with the changes. So evaluate ILED waveform on actual board. The Thermal De-rating function can be defined by the following formula: In case of not using DC Dimming 𝑉𝐹𝐵𝑅𝐸𝐺 (𝑉𝑇𝐻𝐷 < 1.0𝑉 ) = 𝑉𝐹𝐵𝑅𝐸𝐺 − (1.0𝑉 − 𝑉𝑇𝐻𝐷 ) × 𝐷𝐷𝐺 [𝑉 ] In case of using DC Dimming 𝑉𝐹𝐵𝑅𝐸𝐺 (𝑉𝑇𝐻𝐷 < 𝑉𝐷𝐶𝐷𝐼𝑀 ) = 𝑉𝐹𝐵𝑅𝐸𝐺 − (𝑉𝐷𝐶𝐷𝐼𝑀 − 𝑉𝑇𝐻𝐷 ) × 𝐷𝐷𝐺 [𝑉 ] DDG :DC Dimming Gain 730 mV/V(Typ) VIN VFBREG FB BASE VREF VREG LED Board ILED THD NTC Thermistor Input the voltage which divided resistor (VREG) In case of not using DC Dimming In case of using DC Dimming VFBREG(VIN-VFB) VFBREG(VIN-VFB) Thermal De-rating starts at VTHD Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 34. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 34/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Ordering Information B D 1 8 3 4 5 Product Name E F V - Package EFV: HTSSOP-B20 ME2 Product Rank M: for Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram HTSSOP-B20 (TOP VIEW) Part Number Marking D 1 8 3 4 5 LOT Number Pin 1 Mark www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 35/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Physical Dimension and Packing Information Package Name www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 HTSSOP-B20 36/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 BD18345EFV-M Revision History Date Revision 21.Sep.2018 001 Changes New Release www.rohm.com ©2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 37/37 TSZ02201-0T3T0B300040-1-2 21.Sep.2018 Rev.001 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001