Datasheet
For Automotive, 40 V 150 mA 4ch
Constant Current LED Driver
BD18337EFV-M BD18347EFV-M
General Description
Key Specifications
BD18337EFV-M
/
BD18347EFV-M
are
40
V-withstanding constant current LED driver for
automotive applications. It is a 4 channel LED driver with
the built-in energy sharing control which can realize to
make the board size small. High reliability can be
realized with LED Open Detection, the OUTx (all later
x=1 to 4) pin Short Circuit Protection, Over Voltage Mute
and Thermal Shutdown Function. In case the output
OUTx pin has 3 LEDs in series, BD18337EFV-M has to
be used, in case of 2 LEDs in series, BD18347EFV-M
has to be used.
Input Voltage Range:
5.5 V to 20.0 V
Maximum Output Current:
150 mA/ch
Output Current Accuracy:
±5 %
Relative Channel Accuracy:
±5 %
Operating Temperature Range: -40 °C to +125 °C
Package
W (Typ) x D (Typ) x H (Max)
5.00 mm x 6.40 mm x 1.00 mm
HTSSOP-B16
Features
AEC-Q100 Qualified(Note 1)
Energy Sharing Control
PWM Dimming Function
License Lamp Mode
LED Open Detection
OUTx pin Short Circuit Protection (SCP)
Over Voltage Mute Function (OVM)
Disable LED Open Detection Function
at Reduced-Voltage
LED Failure Input / Output Functions (PBUS)
(Note 1) Grade1
Applications
Automotive LED Exterior Lamp
(Rear Lamp, License Lamp, DRL / Position Lamp,
Fog Lamp etc.)
Automotive LED Interior Lamp
(Air Conditioner Lamp, Interior Lamp, Cluster Light
etc.)
Typical Application Circuit
REXT
PWM_in
VINRES
D1
OUT1
ZD1
CVIN1
VIN
CVIN2
OUT2
D2
OUT3
CRT
DC_in
D3
CCRT
OUT4
RCRT
COUT4
DISC BD18337EFV-M
COUT3
COUT2
COUT1
BD18347EFV-M
+B
MSET1
MSET2
SET1
SET2
PBUS
RSET2
SET3
SET4
RSET3
RSET4
GND
〇Product structure : Silicon integrated circuit
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RSET1
〇This product has no designed protection against radioactive rays
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BD18337EFV-M BD18347EFV-M
Pin Configuration
VINRES
1
16
OUT1
VIN
2
15
OUT2
PBUS
3
14
OUT3
CRT
4
13
OUT4
12
GND
EXP- PAD
DISC
5
MSET1
6
11
MSET2
SET1
7
10
SET3
SET2
8
9
SET4
(TOP VIEW)
Pin Description
Pin No.
Pin Name
Function
1
VINRES
2
VIN
3
PBUS
4
CRT
CR TIMER setting1(Note 2)
5
DISC
CR TIMER setting2(Note 3)
6
MSET1
7
SET1
Output current setting pin 1
8
SET2
Output current setting pin 2
9
SET4
Output current setting pin 4
10
SET3
Output current setting pin 3
11
MSET2
12
GND
GND
13
OUT4
Current output pin 4
14
OUT3
Current output pin 3
15
OUT2
Current output pin 2
16
OUT1
Current output pin 1
-
EXP-PAD
Energy sharing external resistor connection(Note 1)
Supply voltage input
Output for fault flag / Input to disable output current
Mode setting pin 1
Mode setting pin 2
The EXP-PAD connect to GND.
(Note 1) Short the VINRES pin to the VIN pin when not in use.
(Note 2) Short the CRT pin to the VIN pin when not in use.
(Note 3) Open the DISC pin or connect it to GND when not in use.
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Block Diagram
V B G : Internal Reference Voltage
VINRES
Energy
Sharing
Control
V BG
VIN
Bandgap
VREG
VBG
VB G
OPM
OVM
Current
Driver
OUT1
to Current
Setting
Block
OPENLOAD
PBUS
0.05 V
MSET1
Control
Logic
MSET2
0.6 V⇔0.8 V
VB G
OUT3
SCP
VRE G
CRT
VINRE S
PBUS
VB G
OUT2
VB G
OUT4
VB G
CR
TIMER
DISC
VB G
SETx
Pin
Short
Detect
Current
Setting
V BG
GND
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SET1 SET2 SET3 SET4
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BD18337EFV-M BD18347EFV-M
Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +40.0
V
VINRES
-0.3 to +40.0 < VIN
V
VIN to VINRES Pin Voltage
VVIN_VINRES
-0.3 to +10.0
V
CRT, DISC Pin Voltage
VCRT, VDISC
-0.3 to +40.0
V
VMSET1, VMSET2
-0.3 to +20.0
V
VOUT1, VOUT2, VOUT3, VOUT4
-0.3 to VIN+0.3V
V
VPBUS
-0.3 to +20.0
V
Tstg
-55 to +150
°C
Tjmax
150
°C
Supply Voltage (VIN)
Supply Voltage (VINRES)
MSET1, MSET2 Pin Voltage
OUT1,OUT2,OUT3,OUT4 Pin Voltage
PBUS Pin Voltage
Storage Temperature Range
Maximum Junction Temperature
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance(Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
113
36
°C/W
ΨJT
13
9
°C/W
HTSSOP-B16
Junction to Ambient
Junction to Top Characterization
Parameter(Note 2)
(Note 1) Based on JESD51-2A(Still-Air), using a BD18347EFV-M Chip.
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Thermal Via(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VIN
5.5
13.0
20.0
V
Output Current (each channel)
IOUTx
-
-
150
mA
CR Timer Frequency
fPWM
-
-
750
Hz
PWM Minimum Pulse Width
tMIN
100
-
-
µs
Operating Temperature
Topr
-40
-
+125
°C
Supply Voltage (VIN)(Note 1)
(Note 1) ASO should not be exceeded.
Operating Conditions
Parameter
Capacitor
Connecting VIN Pin 1
Capacitor
Connecting VIN Pin 2
Capacitor
Connecting LED Anode
Capacitor
for Setting CR Timer
Resistor
for Setting CR Timer
Resistor
for Setting Output Current
Symbol
Min
Max
Unit
C VIN1 (Note 2)
1.0
-
μF
C VIN2 (Note 2)
0.047
-
μF
0.01
0.47
μF
C CRT (Note 2)
0.01
0.22
μF
R CRT
0.1
50
kΩ
R SET1, R SET2, R SET3, R SET4
12
36
kΩ
C OUT1, C OUT2,
C OUT3, C OUT4 (Note 2)
(Note 2) Recommended ceramic capacitor.
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Electrical Characteristics (Unless otherwise specified, Ta=-40 °C to +125 °C, VIN=13 V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[Circuit Current IVIN]
Circuit Current
in Normal Mode
IVIN1
-
3.0
7.0
mA
Circuit Current
when LED Open is Detected
IVIN2
-
3.0
7.0
mA
at LED Open Detection
Circuit Current
when PBUS is Low
IVIN3
-
3.0
7.0
mA
VPBUS=0 V
IOUTx_OFF
-
-
1
μA
VOUTx=2 V, VCRT=0 V,
Ta=25 °C
VDR
-
-
1.0
V
IOUTx=100 mA
IOUTx_OPEN
-
-
10
mA
VES
1.3
2.0
3.0
V
VINRES-VOUTx_MAX,
VIN=13 V, VOUTx=9 V
-
0.5
1.0
Ω
IVIN=100 mA
20
50
100
mV
VINRES-VOUTx
[Output Current IOUTx]
OUTx OFF Current
VINRES-OUTx Pin Drop Voltage
LED Open Detection Output
Current
V OUTx =V INRES -100 mV
[Energy Sharing Control]
Energy Sharing Control Voltage
ON Resistance Between the VIN
Pin and the VINRES Pin
RVIN
_VINRES
[LED Open Detection]
OUTx Pin
LED Open Detection Voltage
VOPD
[Disable LED Open Detection Function at Reduced-Voltage]
VIN Pin Voltage
VIN_OPM
10.5
11.0
11.5
V
BD18337EFV-M
VIN Pin Voltage
VIN_OPM
7.30
7.65
8.00
V
BD18347EFV-M
IOUTx_SCP
0.1
0.3
1.0
mA
OUTx Pin Short Circuit
Protection Voltage
VSCP
0.5
0.6
0.7
V
OUTx Pin Short Circuit
Protection Release Voltage
VSCPR
0.7
0.8
0.9
V
SCP Detect Delay Time 1
tSCPD1
10
60
150
µs
Refer to Figure 17
SCP Detect Delay Time 2
tSCPD2
-
20
-
µs
Refer to Figure 17
SCP Release Delay Time
tSCPR
-
40
-
µs
Refer to Figure 17
tSCPPON
-
140
-
µs
Refer to Figure 17
1710
1800
1890
-
RSETx=12 kΩ to 18 kΩ,
IOUTx=KSET / RSETx [A]
1620
1800
1980
-
RSETx=18 kΩ to 36 kΩ,
IOUTx=KSET / RSETx [A]
1.08
1.20
1.32
V
1.0
2.4
5.0
kΩ
[OUTx pin Short Circuit Protection (SCP)]
OUTx Pin Short Circuit Current
SCP Protection Disable Time at
Power On
VOUTx=0.9 V
[Output Current Setting]
Output Current Setting
Coefficient
KSET
SETx Pin Voltage
VSETx
SETx Pin Short Detection
Resistance
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RSETx
_SHORT
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Electrical Characteristics – continued (Unless otherwise specified, Ta=-40 °C to +125 °C, VIN=13 V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[CR TIMER]
CRT Pin Charge Current
ICRT
36
40
44
μA
CRT Pin Charge Voltage
VCRT_CHA
0.72
0.80
0.88
V
CRT Pin
Discharge Voltage 1
VCRT_DIS1
1.80
2.00
2.20
V
CRT Pin
Discharge Voltage 2
VCRT_DIS2
2.10
2.40
3.00
V
CRT Pin
Charge Resistance
RCHA
28.5
30.0
31.5
kΩ
VCRT_CHA /
VCRT_DIS1
0.38
0.4
0.42
V/V
DISC Pin ON Resistance 1
RDISC1
20
50
100
Ω
IDISC=10 mA
DISC Pin ON Resistance 2
RDISC2
2.5
5
10
kΩ
IDISC=100 μA
CRT Pin Leakage Current
ICRT_LEAK
-
-
10
μA
VCRT=VIN
ΔIOUTx=-3 %
ΔIOUTx=
IOUTx (@VIN=VOVM) /
IOUTx (@VIN=13 V) -1
CRT Discharge Constant
VCRT > VCRT_DIS2
RDISC1 → RDISC2
[Over Voltage Mute Function (OVM)]
Over Voltage Mute Start Voltage
VOVMS
20.0
22.0
24.0
V
Over Voltage Mute Gain
IOVMG
-
-20
-
%/V
Input High Voltage
VPBUSH
2.4
-
-
V
Input Low Voltage
VPBUSL
-
-
0.6
V
IPBUS
75
150
300
μA
PBUS Pin Output Low Voltage
VPBUS_OL
-
-
0.6
V
Source 3 mA
to the PBUS pin
PBUS Pin Output High Voltage
VPBUS_OH
3.5
4.5
5.5
V
Sink 10 μA
from the PBUS pin
PBUS Pin Leakage Current
IPBUS_LEAK
-
-
10
μA
VPBUS=7 V
VUVLO_VIND
4.50
4.75
5.00
V
VIN: Sweep down
VUVLO_VINR
5.00
5.25
5.50
V
VIN: Sweep up
4.25
4.50
4.75
V
VINRES: Sweep down
4.75
5.00
5.25
V
VINRES: Sweep up
ΔIOUTx / ΔVIN
[PBUS]
PBUS Pin Source Current
[UVLO VIN]
UVLO VIN
Detection Voltage
UVLO VIN
Release Voltage
[UVLO VINRES]
UVLO VINRES
Detection Voltage
VUVLO
_VINRESD
UVLO VINRES
Release Voltage
[MSET1, MSET2]
_VINRESR
MSET1, MSET2 Input H Voltage
VMSETH
2.4
-
-
V
MSET1, MSET2 Input L Voltage
VMSETL
-
-
0.6
V
IMSET
25
50
100
μA
MSET1, MSET2 Pin
Outflow Current
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Typical Performance Curves (Reference Data)
(Unless otherwise specified, Ta=25 °C, VIN=13 V)
160
6.0
Ta=-40 °C
140
Ta=+25 °C
5.0
Output Current: IOUTx[mA]
Circuit Current in Normal Mode: IVIN1 [mA]
7.0
Ta=+125 °C
4.0
3.0
2.0
120
100
80
60
1.0
40
0.0
0
2
4
10
6 8 10 12 14 16 18 20
Supply Votage: VIN [V]
18
22
26
30
34
38
Resistor for Setting Output Current: RSETx[kΩ]
Figure 1. Circuit Current in Normal Mode
vs Supply Voltage
Figure 2. Output Current
vs Resistor for Setting Output Current
180
120
RSETx=12 kΩ
115
120
Output Current: IOUTx[mA]
150
Output Current: IOUTx[mA]
14
RSETx=18 kΩ
90
RSETx=36 kΩ
60
30
110
105
100
95
90
85
80
0
-50
0
5
10
15
20
25
30
Supply Voltage: VIN[V]
35
40
Figure 3. Output Current vs Supply Voltage
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-25
0
25
50
75 100
Temperature[°C]
125
150
Figure 4. Output Current vs Temperature
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Typical Performance Curves (Reference Data) – continued
(Unless otherwise specified, Ta=25 °C, VIN=13 V)
31.5
Output Current: IOUTx[mA]
100
CRT Pin Charge Resistance: RCHA[kΩ]
120
Ta=+125 °C
80
Ta=+25 °C
60
Ta=-40 °C
40
20
31.0
30.5
30.0
29.5
29.0
28.5
0
6
11
16
21
26
31
Supply Voltage: VIN[V]
-50
36
Figure 5. Output Current vs Supply Voltage
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-25
0
25
50
75 100 125 150
Temperature[°C]
Figure 6. CRT Pin Charge Resistance vs Temperature
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Description of Function
(Unless otherwise specified, Ta=25 °C, VIN=13 V)
1.
Output Current Setting and Power Control
Output current IOUTx can be set by the value of the output current setting resistor R SETx.
𝐾
𝐼𝑂𝑈𝑇𝑥 = 𝑅 𝑆𝐸𝑇
𝑆𝐸𝑇𝑥
[A]
where:
𝐾𝑆𝐸𝑇 is the output current setting coefficient 1800 (Typ).
𝑅𝑆𝐸𝑇𝑥 is the output current setting resistor.
When not to use the OUTx pin, open the SETx pin.
●Required VIN for set current to flow
Output Current IOUTx and minimum VIN should be set to satisfy the following relationship.
𝑉𝐼𝑁 ≥ 𝑉𝑓_𝐿𝐸𝐷 × 𝑁 + 𝑉𝐷𝑅 + 𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 × 𝐼𝑂𝑈𝑇𝑥_𝑇𝑂𝑇𝐴𝐿
where:
𝑉𝐼𝑁
𝑉𝑓_𝐿𝐸𝐷
𝑁
𝑉𝐷𝑅
𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆
𝐼𝑂𝑈𝑇𝑥_𝑇𝑂𝑇𝐴𝐿
[V]
is the VIN pin voltage.
is the LED forward voltage.
is the number of LED.
is the VINRES - OUTx drop voltage.
is the ON resistance between the VIN pin and the VINRES pin.
is the total output current.
VINRES
REXT
Energy
Sharing
Control
VB G
VIN
Current
Driver
+B
Bandgap
VREG
OUT1
OVM
OUT2
VB G
Current
Setting
SETx
IOUT1
I OUT2
OUT3
I OUT3
OUT4
I OUT4
GND
IOUTx_TOTAL=IOUT1+IOUT2+IOUT3+IOUT4
RSETx
Figure 7. Output Current Setting
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Description of Function – continued
2.
Energy Sharing Control
Energy sharing is performed by connecting external resistor REXT between the VIN and VINRES pins. It makes possible
to distribute the heat generated by the IC to REXT. (When not in use, short the VINRES pin with the VIN pin.)
The IC controls the difference voltage to VES (2.0 V(Typ)) which is between the VINRES pin and the pin that has
maximum voltage among OUT1 to OUT4 pins.
Insert resistor in the anode of the LED, when the following expression is not satisfied.
𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅 ≤ 𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋 + 𝑉𝐸𝑆
𝑉𝑂𝑈𝑇𝑥 = 𝐼𝑂𝑈𝑇𝑥 × 𝑅𝑂𝑈𝑇𝑥 + 𝑉𝑓_𝐿𝐸𝐷 × 𝑁
where:
𝑉𝑈𝑉𝐿𝑂_𝑉𝐼𝑁𝑅𝐸𝑆𝑅
𝑉𝑂𝑈𝑇𝑥_𝑀𝐴𝑋
𝑉𝐸𝑆
𝑉𝑂𝑈𝑇𝑥
𝐼𝑂𝑈𝑇𝑥
𝑅𝑂𝑈𝑇𝑥
𝑉𝑓_𝐿𝐸𝐷
𝑁
is the VINRES pin UVLO release voltage, 5.00 V (Typ).
is the maximum voltage among the OUT1 to OUT4 pins
is the Energy Sharing control voltage, 2.0 V (Typ).
is the OUTx pin voltage.
is the OUTx pin current.
is the resistor inserted in the anode of LED.
is the LED forward voltage.
is the number of LED.
VINRES
REXT
V BG
VIN
Energy
Sharing
Control
Current
Driver
+B
Bandgap
OUT1
VREG
OUT2
IOUT1
IOUT2
OUT3
IOUT3
OUT4
IOUT4
ROUTx
GND
Figure 8. Energy Sharing Control
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2. Energy Sharing Control – continued
The power consumption(Pc) across the IC and REXT when IOUT_TOTAL=200 mA, VOUTx=6 V (x=1 to 4),
REXT=30 Ω, 40 Ω or 50 Ω are shown below. (Reference data)
Pc(IC, REXT) vs VIN Voltage
4.0
Pc_IC(REXT=30
(REXT=30 Ω)
Pc_IC
Ω)
3.5
Pc_REXT (R
Pc_REXT
(REXT=30
EXT=30 Ω)Ω)
Pc_IC(REXT=40
(REXT=40 Ω)
Pc_IC
Ω)
3.0
Pc_REXT (R
Pc_REXT
(REXT=40
EXT=40 Ω)Ω)
Pc_IC(REXT=50
(REXT=50 Ω)
Pc_IC
Ω)
Pc[W]
2.5
Pc_REXT (R
Pc_REXT
(REXT=50
EXT=50 Ω)Ω)
2.0
1.5
1.0
0.5
0.0
5
6
7
8
9
10
11
12
13
14
VIN Voltage[V]
15
16
17
18
19
20
Figure 9. Energy Sharing Control Operation Example 1
The power consumption(Pc) across the IC and REXT when IOUT_TOTAL=300 mA, VOUTx=6 V (x=1 to 4),
REXT=20 Ω, 30 Ω or 40 Ω are shown below. (Reference data)
Pc(IC, REXT) vs VIN Voltage
4.0
Pc_IC (REXT=20 Ω)
Pc_IC(REXT=20Ω)
3.5
Pc_REXT (REXT=20 Ω)
Pc_REXT(REXT=20Ω)
Pc_IC (REXT=30 Ω)
Pc_IC(REXT=30Ω)
3.0
Pc_REXT (REXT=30 Ω)
Pc_REXT(REXT=30Ω)
Pc_IC (REXT=40 Ω)
Pc_IC(REXT=40Ω)
Pc[W]
2.5
Pc_REXT(REXT=40Ω)
Pc_REXT (REXT=40 Ω)
2.0
1.5
1.0
0.5
0.0
5
6
7
8
9
10
11
12
13
14
VIN Voltage[V]
15
16
17
18
19
20
Figure 10. Energy Sharing Control Operation Example 2
The power consumption(Pc) across the IC and REXT when IOUT_TOTAL=400 mA, VOUTx=6 V (x=1 to 4),
REXT=15 Ω, 20 Ω or 25 Ω are shown below. (Reference data)
Pc(IC, REXT) vs VIN Voltage
4.0
Pc_IC (REXT=15 Ω)
Pc_IC(REXT=15Ω)
3.5
Pc_REXT (REXT=15 Ω)
Pc_REXT(REXT=15Ω)
Pc_IC (REXT=20 Ω)
Pc_IC(REXT=20Ω)
3.0
Pc_REXT (REXT=20 Ω)
Pc_REXT(REXT=20Ω)
Pc_IC (REXT=25 Ω)
Pc_IC(REXT=25Ω)
Pc_REXT (REXT=25 Ω)
Pc_REXT(REXT=25Ω)
Pc[W]
2.5
2.0
1.5
1.0
0.5
0.0
5
6
7
8
9
10
11
12
13
14
VIN Voltage[V]
15
16
17
18
19
20
Figure 11. Energy Sharing Control Operation Example 3
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Description of Function – continued
3.
Table of Operations
Depending on the CRT pin voltage, the IC switches between DC mode and PWM mode. Switching conditions are shown
in the table below. When VIN > 22.0 V, output current is limited to reduce power dissipation across the IC. Detect LED
open and the OUTx pin short circuit then output current is turned OFF. When the PBUS pin is pulled low, all drivers are
turned OFF. This IC also has inbuilt Under Voltage Lockout (UVLO) and Thermal Shutdown function (TSD). The
correspondence table is given below. For details, refer to functional description of each block.
Operation
Mode
CRT Pin
DC
Detecting Condition
[Detect]
[Release]
Output Current
(IOUTx)
VCRT ≥
2.0 V (Typ)
-
-
50 mA to 150 mA
-
PWM Dimming
See
Description of
Function 4
-
-
See Description of
Function 4
-
Over Voltage
Mute (OVM)
-
VIN >
22.0 V (Typ)
VIN ≤
22.0 V (Typ)
See Description of
Function 13
-
LED
Open Detection
-
VOUTx ≥
VINRES - 0.05 V
(Typ) and
VIN ≥ VIN_OPM (Typ)
VOUTx <
VINRES - 0.05 V
(Typ) or
VIN < VIN_OPM (Typ)
See Description of
Function 11
Low
OUTx Pin
Short Circuit
Protection (SCP)
-
VOUTx ≤
0.6 V (Typ)
VOUTx ≥
0.8 V (Typ)
See Description of
Function 11
Low
RSET ≤ 2.4 kΩ (Typ)
RSET > 2.4 kΩ (Typ)
OFF
Low
-
VPBUS ≤ 0.6 V
VPBUS ≥ 2.4 V
OFF
VPBUS ≤
0.6 V input
-
VIN ≤ 4.75 V (Typ)
VIN ≥ 5.25 V (Typ)
OFF
High
-
VINRES ≤
4.50 V (Typ)
VINRES ≥
5.00 V (Typ)
Power Control
OFF
High
-
Tj ≥
175 C (Typ)
Tj ≤
150 C (Typ)
OFF
High
SETx Pin Short
Detection
PBUS Control
OFF
Under Voltage
Lockout
(VIN UVLO)
Under Voltage
Lockout
(VINRES UVLO)
TSD
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Description of Function – continued
4.
PWM Dimming Operation
PWM Dimming is performed with the following circuit.
The dimming cycle and ON Duty Width can be set by values of the external components (CCRT, RCRT).
Connect the CRT pin to the VIN pin when not in use. Connect the DISC pin to GND or open when not in use.
The CR timer function is activated if DC SW is OPEN. To perform PWM dimming of output current, a triangular
waveform is generated at the CRT pin. The output current (IOUTx) is turned OFF while CRT voltage is ramp up, and
output current (IOUTx) is turned ON while CRT voltage is ramp down.
When VCRT ≥ VCRT_DIS1 (2.0 V (Typ)), dimming mode turns to DC Control. When VCRT > VCRT_DIS2 (2.4 V (Typ)), the DISC
pin ON resister changes from RDISC1 (50 Ω (Typ)) to RDISC2 (5 kΩ (Typ)), and the power consumption of the IC is reduced
by reducing the inflow current of the DISC pin.
VINRES
PWM_in
V BG
VIN
Bandgap
Energy
Sharing
Control
VREG
Current
Driver
OUT1
DC_in
Control
Logic
VRE G
IOUT1
OUT2
+B
CRT
CCRT
RCRT
OUT3
CR
TIMER
VB G
OUT4
DISC
GND
CRT Voltage
Ramp up
CRT Voltage
Ramp down
VCRT_DIS1
2.0 V(Typ)
CRT Pin
Waveform
ΔVCRT
VCRT_CHA
0.8 V(Typ)
t OFF
tOFF =
Output Current
IOUTx
ΔVCRT×CCRT
ICRT
ILED
OFF
t ON
=RCHA×CCRT
ILED
ON
tON= - (R CRT + RDISC1)×CCRT×ln
ILED
OFF
I LED
ON
VCRT_CHA
VCRT_DIS1
I LED
OFF
I LED
ON
Figure 12. PWM Dimming Operation
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4.
PWM Dimming Operation – continued
(1)
CRT ramp up time tOFF and CRT ramp down time tON
CRT ramp up time tOFF and CRT ramp down time tON can be defined from the following equations.
Make sure that tON is set PWM Minimum Pulse Width tMIN 100 μs or more.
𝑡𝑂𝐹𝐹 =
∆𝑉𝐶𝑅𝑇 ×𝐶𝐶𝑅𝑇
𝐼𝐶𝑅𝑇
= 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇
[s]
𝑉
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛 (𝑉 𝐶𝑅𝑇_𝐶𝐻𝐴 )
[s]
𝐶𝑅𝑇_𝐷𝐼𝑆1
where:
𝐼𝐶𝑅𝑇
𝑅𝐶𝐻𝐴
𝑅𝐷𝐼𝑆𝐶1
𝑉𝐶𝑅𝑇_𝐶𝐻𝐴
𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1
(2)
is the CRT pin charge current, 40 μA (Typ).
is the CRT pin charge resistor, 30 kΩ (Typ).
is the DISC pin ON resistor1, 50 Ω (Typ).
is the CRT pin charge voltage, 0.8 V (Typ).
is the CRT pin discharge voltage1, 2.0 V (Typ).
PWM Dimming Frequency (fPWM)
PWM Dimming Frequency is defined by tON and tOFF.
𝑓𝑃𝑊𝑀 = 𝑡
1
𝑂𝑁 +𝑡𝑂𝐹𝐹
(3)
[Hz]
ON Duty (DON)
PWM ON duty is defined by tON and tOFF.
𝐷𝑂𝑁 = 𝑡
𝑡𝑂𝑁
𝑂𝑁 +𝑡𝑂𝐹𝐹
[%]
(Example) In case of RCRT=3.6 kΩ, CCRT=0.1 μF
𝑡𝑂𝐹𝐹 = 𝑅𝐶𝐻𝐴 × 𝐶𝐶𝑅𝑇 = 30 𝑘𝛺 × 0.1 µ𝐹 = 3.0
[ms]
𝑡𝑂𝑁 = −(𝑅𝐶𝑅𝑇 + 𝑅𝐷𝐼𝑆𝐶1 ) × 𝐶𝐶𝑅𝑇 × 𝐼𝑛(𝑉𝐶𝑅𝑇_𝐶𝐻𝐴 /𝑉𝐶𝑅𝑇_𝐷𝐼𝑆1 )
= −(3.6 𝑘𝛺 + 50 𝛺) × 0.1 µ𝐹 × 𝐼𝑛(0.8 𝑉/2.0 𝑉) = 0.334
[ms]
𝑓𝑃𝑊𝑀 = 1/(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 1/(3.0 𝑚𝑠 + 0.334 𝑚𝑠) = 300
[Hz]
𝐷𝑂𝑁 = 𝑡𝑂𝑁 /(𝑡𝑂𝑁 + 𝑡𝑂𝐹𝐹 ) = 0.334 𝑚𝑠/(3.0 𝑚𝑠 + 0.334 𝑚𝑠) = 10.0 [%]
●PWM Dimming Operation Using External Signal
In case external PWM input to the CRT pin, make sure that input pulse high voltage ≥ 2.2 V and pulse low voltage ≤ 0.6
V. Also open the DISC pin or connect to GND.
VIN
+B
Bandgap
VREG
VRE G
μ-Con
CRT
VB G
CR
TIMER
Control
Logic
DISC
GND
Figure 13. PWM Dimming Operation Using External Signal
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4.
PWM Dimming Operation – continued
●About deviation of CRT ramp up/down time with a reverse connection protection diode
If this LSI is used to drive LED like below schematic, it is possible to occur CRT ramp up/down time deviation due to
characteristics of reverse current Ir diode (D2, D3).
Consider to choose a diode (D2, D3) which is recommended by Rohm or Ir value 1 μA (Max) or less.
Since reverse current flows even with the recommended diodes, connect a resistor RDCIN of 10 kΩ or less between
point A and GND so that the voltage at point A does not rise.
Mechanism of deviation of CRT ramp up/down time from set values.
(1) During the PWM dimming operation mode, Point A on Figure 14 is Hi-Z.
↓
(2) Reverse current Ir of D2 and D3 goes to Point A.
(Power supply voltage is being input into the cathode of D2, so mainly reverse current of D2 goes into C1.)
→Reverse current Ir of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down
time deviates from the settings.
↓
(3) C1 gets charged, voltage at Point A rises.
↓
(4) Point A voltage ≥ the CRT pin voltage of each IC.
↓
(5) Vf occurs in the diodes D3.
↓
(6) D3 circulate forward current IF
→Forward current IF of D3 is added to the CRT pin charge current and discharge current, so CRT ramp up/down
time deviates from the settings.
↓
(7) Repetition of (2) to (6).
PWM_in
D1
VIN
OUTx
D2
point A
Ir
D3
DC_in
RDCIN
C1
CRT
IF
Vf
I OUTx
BD18337EFV-M
BD18347EFV-M
GND
DISC
Figure 14. How Reverse Protection Diode Affects the CRT pin Ramp Up / Down Time
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Description of Function – continued
5.
The SETx pin Short Detection Function
When the SETx pin is shorted to GND, the IC detects that the SETx pin current has increased and turns off the output
current. The maximum resistance on the SETx pin short detection is RSETx ≤ 5.0 kΩ (Max). Fault is indicated by pulling
the PBUS pin low.
Note that the SETx pin short detection resistance value RSETx is 5 kΩ or less when the over voltage mute function is
active.
VINRES
Energy
Sharing
Control
V BG
VIN
+B
Bandgap
VREG
VBG
VB G
PBUS
VB G
Current
Driver
OUTx
to Current
Setting
Block
OPM
PBUS
OVM
Control
Logic
SETx
Pin
Short
Detect
Current
Setting
from OVM
Block
V BG
GND
SETx
RSETx
Figure 15. SETx pin Short Detection
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Description of Function – continued
6.
LED Open Detection Function
When one of the LEDs is in the open state, the OUTx pin voltage rises. At VOUTx ≥ VINRES - 0.05 V (Typ), LED Open
Detection operation is performed. In case of LED Open Detection, fault is indicated by pulling the PBUS pin low.
7.
Disable LED Open Detection Function at Reduced-Voltage
Built-in disable LED Open Detection function prevents erroneous detection of LED Open during voltage ramp up or
ramp down at the VIN pin. Open Detection is not performed until the VIN pin voltage is internal OPM threshold voltage
(VIN_OPM) or more. LED Open Detection remains disabled during power supply ramp up and ramp down, when VIN <
VIN_OPM.
For disable LED Open Detection function to work properly, LEDs must be selected according to the following formula:
𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷 × 𝑁 + 100 𝑚𝑉 + 𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆 × 40 𝑚𝐴 < 𝑉𝐼𝑁_𝑂𝑃𝑀
where:
𝑉𝑓_𝐿𝐸𝐷_𝑂𝑃𝐷
𝑅𝑉𝐼𝑁_𝑉𝐼𝑁𝑅𝐸𝑆
𝑁
[V]
is the LED Vf when IF=IOUT_OPEN (IOUT_OPEN=10 mA (Max))
is the ON resistance between the VIN pin and the VINRES pin.
is the number of LED.
VINRES
Energy
Sharing
Control
V BG
VIN
+B
Bandgap
VREG
OVM
VBG
V BG
Current
Driver
OUTx
OPM
LED OPEN
PBUS
0.05V
VIN_OPM
VOPD
VI NRE S
PBUS
Control
Logic
GND
VIN_OPM
VOPD
VIN
VOUTx
Disable
LED Open
Detection
Area
LED Open
Detection
Area
VINRES
Disable
LED Open
Detection
Area
VOPD =VINRES -0.05V
VOUTx = V f_LED × N
IOUTx
LED Open
Detection
Area
IOUTx
4.5V
VPBUS
Figure 16. Disable LED Open Detection Voltage at Reduced-Voltage
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Description of Function – continued
8.
OUTx pin Short Circuit Protection (SCP)
If the OUTx pin is shorted to GND, the OUTx voltage goes low. When the OUTx pin voltage VOUTx ≤ 0.6 V (Typ), then
SCP mechanism is enabled after a delay of tSCPD2 (20 μs (Typ)). In case of SCP, output current IOUT is turned off to
prevent thermal damage of the IC. Fault is indicated by pulling the PBUS pin low after a delay open tSCPD1 (60 μs (Typ)).
To prevent false SCP at power supply startup, the output SCP is disabled until VCRT > 2.0 V (Typ) once UVLO is
released. In case of power supply ramping up with the OUTx pin short circuit condition (VOUTx 2.0 V (Typ).
VINRES
Energy
Sharing
Control
V BG
VIN
+B
Bandgap
VREG
OVM
Current
Driver
VB G
OUTx
OPM
VB G
PBUS
Control
Logic
PBUS
VB G
SHORT
VIN
SCP
GND
0.6 V ⇔0.8 V
Short Circuit
Short Circuit
4.5 V
VIN
2.0 V
VCRT
0.8 V
0.8 V
0.6 V
VOUTx
ON
OFF
IOUTx
t SCPD2
ON
OFF
High
High
High
tSCPR
tSCPPON
VPBUS
ON
20 μs
OFF
140 μs
Lo w
40 μs
tSCPR
t SCPD1
Lo w
40 μs
60 μs
Figure 17. OUTx pin Short Circuit Protection (SCP)
●OUTx pin short circuit current
When VOUTx < 1.3 V, the OUTx pin short circuit current IOUTx_SCP flows to prevent malfunction of the OUTx pin short
circuit protection mechanism.
1.3 V
VOUTx
IOUTx_SCP
0.9 V
0.3 mA
0 mA
Figure 18. OUTx pin Short Circuit Current
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Description of Function – continued
9.
Connection Method of LEDs to Output pins – Effect on Protection Functions
OUTx
OUTx
OUTx
・・・
1 string in
series
2 or more strings
in parallel
・・・
2 or more strings in
parallel
(Matrix connection)
Figure 19. About the Capacitor of Connecting LED Anode
Connection method
Output SCP
LED Open Detection
1 string in Series
Detectable
Detectable
2 or more strings in parallel
Detectable
Not detectable(Note 1)
2 or more strings in parallel
(Matrix connection)
Detectable
Not detectable(Note 2)
(Note 1) Detectable only when one or more LEDs are open in all columns.
(Note 2) Detectable only when all LEDs from any row are open.
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Description of Function – continued
10. LED Open Detection, SCP and OUTx pin Hi-Z in DC/PWM Dimming Modes
Operation of LED Open Detection and SCP sections differ in DC mode and PWM dimming mode.
In DC mode, LED Open Detection and SCP are enabled at all times.
In PWM dimming mode, the LED Open Detection function is valid only during the falling edge of CRT signal, whereas
SCP is valid at all times. There is a possibility of the OUTx pin becoming Hi-Z. False SCP may occur if the OUTx pin
voltage drops due to external noise(Note 1). Connect a capacitor (0.1 μF or more(Note 2)) to GND, close to the OUTx pin to
avoid erroneous output.
(Note 1) Propagation noise, radiation noise, interference between wires, interference between connectors, etc.
(Note 2) When connecting 0.1 μF or more, evaluate the delay time from the start of VIN until the IOUTx current flows. Also, evaluate the IOUTx pulse width in
the PWM dimming mode.
In DC mode
VIN
VCRT
VOUTx
IOUTx
In PWM dimming mode
VIN
0V
0V
VCRT
0V
VOUTx
0V
0V
IOUTx
0 mA
OUTx pin
Hi-Z state
0 mA
OUTx pin
Hi-Z state
None
LED Op en
Detection
Vali d
LED Op en
Detection
SCP
Vali d
SCP
Hi-Z
Hi-Z
Valid
Hi-Z
Valid
Valid
Vali d
Figure 20. LED Open Detection, SCP and the OUTx pin Hi-Z
VINRES
OUT1
VIN
OUT2
OUT3
CRT
OUT4
COUT4
DISC BD18337EFV-M
COUT3
COUT2
COUT1
BD18347EFV-M
MSET1
MSET2
SET1
SET2
PBUS
SET3
SET4
GND
Figure 21. Capacitor Connected to the OUTx pin
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10. LED Open Detection, SCP and OUTx pin Hi-Z in DC/PWM Dimming Modes – continued
Evaluation example (ILED pulse width at PWM Dimming operation)
Condition: +B=13 V
Ta=25 °C
LED=1 Strings
CCRT=0.01 μF
RCRT=1.0 kΩ
PWM Dimming Mode
50 mA / ch
150 mA / ch
Rise Time
VCRT
1 V / Div
COUTx=0.01 μF
VCRT
3.5 μs
1 V / Div
Fall Time
2 V / Div
VOUT1
2 V / Div
50 mA / Div
0.8 μs
0.8 μs
Rise Time
Rise Time
VCRT
VCRT
7.7 μs
VOUT1
2 V/Div
1 V / Div
4.9 μs
VOUT1
Fall Time
IOUT1
2 V / Div
Fall Time
IOUT1
20 mA / Div
50 mA / Div
12 μs
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IOUT1
20 mA / Div
COUTx=0.22 μF
2.5 μs
VOUT1
IOUT1
1 V / Div
Rise Time
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Description of Function – continued
11. Lamp Control Modes (MSET1, MSET2)
By connecting the MSET1 pin to ground or open, it is possible to change output channel operation mode on detecting an
LED error. The MSET2 pin can also be used to control CH4 operation.
MSET1=L (GND short) : If SCP or LED Open is detected in any one of 4 channels, all the channels are OFF.
MSET1=H (Pin open) : Remaining channels continue to operate even if one channel detects SCP or LED Open.
MSET2=L (GND short) : CH4 operates in the same way as CH1 to CH3
MSET2=H (Pin open) : CH4 ignores the PWM signal generated by CRTIMER and are always in DC mode. When CH4
detects SCP or LED Open, PBUS : H is maintained and CH1 to CH3 continue to operate (License
Lamp Mode).
Normal Mode (MSET2=L)
MSET1
L
All
CH OFF
H
IndividualCH
OFF
MSET2
OUT1 to OUT3 OUT1 to OUT3
OUT4
OPEN Detect
SCP
OPEN Detect
Detect
Detect
-
L
Normal
Mode
Detect
Detect
-
Detect
Detect
-
OUT4
SCP
LED Error
CH Output
Detect
Detect
ON
OFF
ON
OFF
ON
OFF
ON
OFF
OUT4
SCP
LED Error
CH Output
Detect
Detect
ON
OFF
ON
OFF
ON
OFF
ON
OFF
Remaining
CH1 to CH3
Output
OFF
OFF
OFF
OFF
ON
ON
ON
ON
CH4
Output
OFF
OFF
ON
OFF
ON
ON
ON
OFF
PBUS
L
L
License Mode (MSET2=H)
MSET1
L
All
CH OFF
H
IndividualCH
OFF
MSET2
H
License
Mode
OUT1 to OUT3 OUT1 to OUT3
OUT4
OPEN Detect
SCP
OPEN Detect
Detect
Detect
-
Detect
Detect
-
Detect
Detect
-
Remaining
CH1 to CH3
Output
OFF
OFF
ON
ON
ON
ON
ON
ON
CH4
Output
OFF
OFF
ON
OFF
ON
ON
ON
OFF
PBUS
L
H
L
H
Figure 22. Lamp Control Modes (MSET1, MSET2)
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Description of Function – continued
12. PBUS Function
The PBUS pin is the pin to input and output an error signal.
When abnormality such as LED Open or the OUTx pin short circuit occurs, it can notify the abnormality to the outside by
changing the PBUS pin output from high to low. In addition, by externally controlling the PBUS pin from high to low, the
output current is turned off. When using multiple LSIs to drive multiple LEDs, it is possible to turn off all LED lines at
once by connecting the PBUS pins of each CH as shown in the figure below, even if LED Open or the OUTx pin short
circuit occurs.
Caution of using the PBUS Pin
Do not connect to the PBUS pins other than below list items due to the difference of ratings, internal threshold voltages,
and so on. (BD18340FV-M, BD18341FV-M, BD18342FV-M, BD18343FV-M, BD18345EFV-M, BD18337EFV-M,
BD18347EFV-M)
PWM_in
DC_in
+B
VIN
CRT
OUTx
VIN
CRT
IC1
LED
OPEN
DISC
OUTx
CRT
IC2
LED
OFF
DISC
PBUS
VIN
IC3
LED
OFF
DISC
PBUS
GND
OUTx
PBUS
GND
GND
communication each other by PBUS
Figure 23. PBUS Function
▼Example of Protective Operation due to LED Open Circuit
①CH1 LED
Open
IC1 VOUTx
ON
IC1 IOUTx
OFF
②V PBUS: High→Low
VPBUS
PBUS: When low, the OUTX pin of IC2, IC3 is
clamped to 1.4 V.
IC2, IC3
VOUTX
ON
IC2, IC3
IOUTX
ON
1.4 V
OFF
Figure 24. Example of Protective Operation
In case of LED Open, VPBUS of IC1 goes from High to Low. As VPBUS goes low, IC2 and IC3 LED drivers turn off their
LEDs. When VPBUS goes low, the OUTx pins are clamped to 1.4 V (Typ), in order to prevent output ground protection
operation.
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Description of Function – continued
13. Over Voltage Mute Function (OVM)
When the VIN pin voltage exceeds 22.0 V (Typ), Over Voltage Mute function is activated to prevent thermal deterioration
to the IC. This is done by attenuating the output current (IOUTx). The output current (IOUTx) is attenuated at -20 %/V (Typ).
If the output current is attenuated less than 10 mA (Typ), output current is turned OFF.
VINRES
VIN
+B
Energy
Sharing
Control
I OUTx
100 %
OVM
-20 %/V (Typ)
Current
Setting
Current
Driver
Output current is
muted during power
supply overvoltage
OUTx
GND
SETx
IOUTx
RSETx
0
VOVMS
VIN
Figure 25. Over Voltage Mute Function (OVM)
14. Under Voltage Lockout (UVLO)
UVLO circuit prevents the IC malfunction during times of power supply ramp up, ramp down or instantaneous power
interruptions. When the VIN pin voltage is 4.75 V (Typ) or less, VIN UVLO is activated and output current (IOUTx) is
turned OFF, and when the VIN pin voltage increases to 5.25 V (Typ) or more, VIN UVLO is deactivated and normal
operation resumes. The VINRES pin voltage is 4.50 V (Typ) or less, VINRES UVLO is activated and power control
function is turned OFF, and when The VINRES pin voltage increases to 5.00V (Typ) or more, VINRES UVLO is
deactivated and power control function is turned ON.
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Application Examples
1. IOUTx=75 mA/ch License MODE,
PWM ON Duty:10 %, Pulse Width=0.334 ms, PWM Frequency=300 Hz
PWM_in
REXT 4
REXT 3
REXT 2
REXT 1
D1
ZD1
CVIN1
VINRES
OUT1
VIN
CVIN2
OUT2
D2
OUT3
CRT
DC_in
D3
CCRT
RCRT
DISC
VBAT
OUT4
BD18337EFV-M
BD18347EFV-M
U1
COUT4
COUT3
COUT2
COUT1
MSET1
MSET2
SET1
SET2
PBUS
RSET1
RSET2
SET3
RSET3
SET4
GND
RSET4
Figure 26. Application Example 1
Recommended Parts List 1
Parts
No.
IC
U1
D1, D2
Diode
Resistor
Capacitor
Parts Name
BD18337EFV-M
BD18347EFV-M
RFN2LAM6STF
Value
Unit
Product Maker
-
-
ROHM
-
-
ROHM
ROHM
NIPPON
CHEMICON
D3
RFN1LAM6STF
-
-
ZD1
TND12H-220KB00AAA0
-
-
MCR03EZPFX2402
24
kΩ
ROHM
LTR100JZPJ101
100
Ω
ROHM
MCR03EZPFX3601
3.6
kΩ
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CCRT
COUT1, COUT2,
COUT3, COUT4
GCM155R71H104KE37
0.1
μF
murata
GCM155R71H104KE37
0.1
μF
murata
RSET1, RSET2,
RSET3, RSET4
REXT1, REXT2,
REXT3, REXT4
RCRT
About ZD1, place according to test standard of battery line.
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Application Examples – continued
2.
IOUTx=100 mA/ch, Tail / Stop application with MSET1=L
PWM ON Duty=10 %, Pulse Width=0.334 ms, PWM Frequency=300 Hz
PWM_in
REXT 4
REXT 3
REXT 2
REXT 1
D1
ZD1
CVIN1
VINRES
OUT1
VIN
CVIN2
OUT2
D2
OUT3
CRT
DC_in
D3
CCRT
OUT4
RCRT
BD18337EFV-M
BD18347EFV-M
U1
DISC
VBAT
COUT4
COUT3
COUT2
COUT1
MSET1
MSET2
SET1
SET2
PBUS
RSET1
RSET2
SET3
RSET3
SET4
GND
RSET4
Figure 27. Application Example 2
Recommended Parts List 2
Parts
No.
IC
Diode
Resistor
Capacitor
Parts Name
Value
Unit
Product Maker
-
-
ROHM
D1, D2
BD18337EFV-M
BD18347EFV-M
RFN2LAM6STF
-
-
ROHM
D3
RFN1LAM6STF
-
-
ZD1
TND12H-220KB00AAA0
-
-
ROHM
NIPPON
CHEMICON
MCR03EZPFX2402
18
kΩ
ROHM
LTR100JZPJ101
100
Ω
ROHM
U1
RSET1, RSET2,
RSET3, RSET4
REXT1, REXT2,
REXT3, REXT4
RCRT
MCR03EZPFX3601
3.6
kΩ
ROHM
CVIN1
GCM32ER71H475KA40
4.7
μF
murata
CVIN2
GCM155R71H104KE37
0.1
μF
murata
CCRT
COUT1, COUT2,
COUT3, COUT4
GCM155R71H104KE37
0.1
μF
murata
GCM155R71H104KE37
0.1
μF
murata
About ZD1, place according to test standard of battery line.
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Application Examples – continued
3. IOUTx=100 mA/ch, PWM Control Each Channel from External Signal
DC_in
REXT 4
REXT 3
REXT 2
REXT 1
D1
ZD1
CVIN1
CVIN2
VINRES
OUT1
VIN
OUT2
OUT3
CRT
DISC
VBAT
OUT4
BD18337EFV-M
BD18347EFV-M
U1
COUT4
COUT3
COUT2
COUT1
MSET1
MSET2
SET1
SET2
PBUS
RSET1
RSET2
SET3
RSET3
SET4
GND
RSET4
Q1
Q2
µ-Con
Q3
Q4
Figure 28. Application Example 3
Recommended Parts List 3
Parts
No.
IC
U1
MOSFET
Q1 to Q4
Diode
Resistor
Capacitor
Parts Name
BD18337EFV-M
BD18347EFV-M
RJU003N03FRAT106
Value
Unit
Product Maker
-
-
ROHM
-
-
ROHM
ROHM
NIPPON
CHEMICON
D1
RFN2LAM6STF
-
-
ZD1
TND12H-220KB00AAA0
-
-
MCR03EZPFX2402
18
kΩ
ROHM
LTR100JZPJ101
100
Ω
ROHM
GCM32ER71H475KA40
4.7
μF
murata
GCM155R71H104KE37
0.1
μF
murata
GCM155R71H104KE37
0.1
μF
murata
RSET1, RSET2,
RSET3, RSET4
REXT1, REXT2,
REXT3, REXT4
CVIN1
CVIN2
COUT1, COUT2,
COUT3, COUT4
About ZD1, place according to test standard of battery line.
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Power Dissipation
Thermal design should meet the following equation.
𝑃𝑑 > 𝑃𝐶
𝑃𝑑 = (1/𝜃𝐽𝐴 ) × (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑎 )𝑜𝑟(1/𝛹𝐽𝑇 ) × (𝑇𝑗𝑚𝑎𝑥 − 𝑇𝑇 )
When don’t use Energy Sharing Control, refer to below equation.
𝑃𝐶 = (𝑉𝐼𝑁 × (𝐼𝑉𝐼𝑁1 + 𝐼𝐷𝐼𝑆𝐶 ) + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇1 ) × 𝐼𝑂𝑈𝑇1 + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇2 ) × 𝐼𝑂𝑈𝑇2
+ (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇3 ) × 𝐼𝑂𝑈𝑇3 + (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇4 ) × 𝐼𝑂𝑈𝑇4
When use Energy Sharing Control, refer to page 11 and 12.
where:
𝑃𝑑
𝑃𝐶
𝑉𝐼𝑁
𝐼𝑉𝐼𝑁1
𝐼𝐷𝐼𝑆𝐶
𝐼𝑂𝑈𝑇1 to 𝐼𝑂𝑈𝑇4
𝑉𝑂𝑈𝑇1 to 𝑉𝑂𝑈𝑇4
𝜃𝐽𝐴
𝛹𝐽𝑇
𝑇𝑗𝑚𝑎𝑥
𝑇𝑎
𝑇𝑇
is the power dissipation.
is the power consumption.
is the VIN pin voltage.
is the circuit current at normal mode.
is the DISC pin input current.
is the output current through each channel.
is the OUTx pin voltage each channel.
is the thermal resistance of junction to ambient.
is the thermal characterization parameter of junction to center case surface.
is the maximum junction temperature (150 °C).
is the ambient temperature.
is the case surface temperature.
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I/O Equivalence Circuits
No.
Pin
Name
I/O Equivalence Circuit
No.
Pin
Name
6,11
MSET1
MSET2
I/O Equivalence Circuit
VIN
1
VINRES
VINRES
GND
3
PBUS
MSETx
GND
PBUS
100 kΩ(Typ)
7 to
10
SET1
SET2
SET3
SET4
SETx
GND
GND
VINRES
4
CRT
13 to
16
CRT
OUT1
OUT2
OUT3
OUT4
OUTx
GND
GND
DISC
5
DISC
5.2 V
(Typ)
5 kΩ
(Typ)
GND
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 29. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Ordering Information
B
D
1
8
3
3
7
E
F
V
Product Rank
M: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Package
EFV:
HTSSOP-B16
B
D
1
8
3
4
7
E
F
ME2
-
V
Package
EFV:
HTSSOP-B16
ME2
-
Product Rank
M: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
HTSSOP-B16 (TOP VIEW)
Part Number Marking
1 8 3 3 7
LOT Number
Pin 1 Mark
HTSSOP-B16 (TOP VIEW)
Part Number Marking
1 8 3 4 7
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
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Revision History
Date
Revision
21.Jan.2019
001
Changes
New Release
Page.6
Electrical Characteristics
Circuit current IVIN1, IVIN2, IVIN3
Page.10
Page.11
25.Jul.2019
002
L-9 Sentence
L-1 Sentence
Typ 4 mA → Typ 3 mA
Revise
L2-3 Sentence
Revise
Page.15
PWN dimming function
Revise
Make sure that tON is set PWM Minimum Pulse Width tMIN 10 μs or more.
↓
Make sure that tON is set PWM Minimum Pulse Width tMIN 100 μs or more.
Page.15
(Example) In case of RCRT=3.6 kΩ, CCRT=0.1 μF
Insert unit each formula.
Page.19
OUTx pin Short Circuit Protection(SCP)
Revise
the PBUS pin low after a delay open tSCPR (40 μs (Typ))
↓
the PBUS pin low after a delay open tSCPD1 (60 μs (Typ))
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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