Advanced 12 Channel
Constant Current LED Driver IC
BD18378EFV-M
General Description
The BD18378EFV-M is a serial input controlled constant
current LED driver with 8 V output rating. 6 bit current
calibration is available for each output while a selected
PWM input performs dimming on the corresponding
output. The BD18378EFV-M is able to perform diagnostic
(open / short / temperature) checks to detect LED failure
and over temperature on chip. Fault detection is
performed also during LED deactivated state. The
settings of all internal registers can be read out to verify
written information at any time.
Key Specifications
Input voltage range:
Output voltage range:
Output Current range:
Output Current accuracy
Maximum clock frequency:
Operating current:
Operating temperature range:
Package
HTSSOP-B28
Features
(Note1)
AEC-Q100 Qualified
Current capability: 50mA per output channel.
4-line SPI Control.
External resistor current setting.
Limp Home capability.
PWM dimming 0.2-99.2% at 200Hz
Diagnostic of all PWM inputs.
Programmable output mapping to each PWM input.
6 Bit LED brightness adjustment on each channel.
Diagnostic output on LED OPEN and SHORT for
each channel during PWM on & off time.
True LED voltage measurement.
Over Temperature Protection and Thermal
Feedback.
Open Drain Fault indicator.
Read-back of all register settings.
Outputs can be connected in parallel to achieve
more than 50mA into the load.
Slew Rate limited switching reduces
radiated Noise (EMI).
Daisy chain compatible.
3V to 5.5V
0.5V to 8V
10mA to 50mA
3.5%
1.25MHz
4mA (Typ.)
- 40°C to +105°C
L(Typ.) x W(Typ.) x H(Max.)
9.70mm x 6.40mm x 1.00mm
Applications
Automotive illumination & ambient light
Consumer electronics illumination
(Note1: Operating Temperature Grade 2)
Typical Application Circuit Diagram
8V max
RP
VCC
to Controller
LEDs
CLED
0
ERR
1
2
3
4
5
6
7
8
9
10
11
VLED
SENSE
CHANNEL
5.5V max
VCC
BD18378EFV-M
CIN
Heat Sink
Noisy
ground line
PGND
Quiet
ground line
PWM
IREF
AGND
0
1
2
3
4
5
SDI CLK SDO LATCH
REXT
to Controller
Figure 1. Typical application diagram
○Product structure：Silicon monolithic integrated circuit
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BD18378EFV-M
Pin Configuration
HTSSOP-B28
(TOP VIEW)
AGND
1
28
PGND
IREF
2
27
VCC
ERR
3
26
SDO
PWM0
4
25
PWM5
CH0
5
24
CH11
CH1
6
23
CH10
CH2
7
22
CH9
CH3
8
21
CH8
CH4
9
20
CH7
CH5
10
19
CH6
PWM1
11
18
SENSE
PWM2
12
17
PWM4
SDI
13
16
PWM3
CLK
14
15
LATCH
Heat Sink
Bottom
Side
Figure 2. Pin Configuration
Pin Description
Pin
No.
Symbol
Pin
No.
Symbol
1
AGND
Analog ground terminal
28
PGND
Power ground terminal
2
IREF
Current setting terminal
27
VCC
Power supply terminal
3
ERR
Open drain fault indicator
26
SDO
Serial data output terminal
4
PWM0
PWM 0 input terminal
25
PWM5
PWM 5 input terminal
5
CH0
Output channel 0
24
CH11
Output channel 11
6
CH1
Output channel 1
23
CH10
Output channel 10
7
CH2
Output channel 2
22
CH9
Output channel 9
8
CH3
Output channel 3
21
CH8
Output channel 8
9
CH4
Output channel 4
20
CH7
Output channel 7
10
CH5
Output channel 5
19
CH6
Output channel 6
11
PWM1
PWM 1 input terminal
18
SENSE
LED supply sensing terminal
12
PWM2
PWM 2 input terminal
17
PWM4
PWM 4 input terminal
13
SDI
Serial data input terminal
16
PWM3
PWM 3 input terminal
14
CLK
Serial communication clock
15
LATCH
Latch signal input terminal
Function
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Function
TSZ02201-0W1W0C500020-1-2
05. Apr. 2017 Rev.006
BD18378EFV-M
Absolute Maximum Ratings
Item
Symbol
Absolute Maximum value
Unit
VCC
7
V
VDmax
10
V
Input Voltage (Pin No: 4,11 to 17, 25)
VIN
-0.3 to VCC
V
Open Drain Fault Indicator(Pin No: 3)
VERR
7
V
Operating Temperature Range
TOPR
-40 to +105
°C
Storage Temperature Range
TSTG
-55 to +150
°C
Junction Temperature
TJmax
150
°C
VSENSE
10
V
ESD HBM
2000
V
ESD MM
200
V
PWM
100
%
Power Supply Voltage(Pin No: 27)
Output Voltage (Pin No: 5 to 9, 19 to 24)
LED Voltage(Pin No: 18)
Electrostatic-Discharge Capability Human
Body Model
Electrostatic-Discharge Capability
Machine Model
PWM duty cycle
Recommended Operating Ratings
Item
Power Supply Voltage
Drive Current at full brightness*1
Output Voltage*1
LED Voltage*1*3
Open Drain Fault Indicator
PWM duty cycle*2
Symbol
VCC
ID
VD
VSENSE
VERR
PWM
Min
3.0
10
VD
0.2
Standard Value
Typ
30
-
Max
5.5
50
8
8
5.5
99.2
Unit
V
mA
V
V
V
%
*1 Check Power de-rating curves of the package before applying maximum values.
*2 99.2% max and 0.2% min duty cycle at a 200Hz PWM frequency is recommended in order to have complete diagnostic capability;
please note that the PWM signal is active LOW.
*3 Please make sure the VSENSE voltage is always connected to the LEDs supply voltage - at a higher potential than VD. (see also the I/O
equivalent circuits)
Thermal Information
*4
Item
Symbol
Value
Unit
ƟJA
107
°C/W
ΨJT
6
°C/W
ƟJA
26
°C/W
ΨJT
3
°C/W
Junction to Case Thermal Resistance
ƟJC-TOP
13
°C/W
Junction to Case Thermal Resistance
ƟJC-BOT
4
°C/W
Junction to Ambient Thermal Resistance
(1 layer Board)
Junction to TOP Thermal characterization
Parameter (1 layer Board)
Junction to Ambient Thermal Resistance
(4 layer Board)
Junction to TOP Thermal characterization
Parameter (4 layer Board)
*4 Measured as per JEDEC Standard
Board as per JESD51-3/-5/-7
Environment as per JESD51-2A
The above mentioned data is measurement data to be used only as reference not guaranteed values.
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BD18378EFV-M
Block Diagram
Shift Register
SDI
SDO
CLK
Over
Temperature
16
LATCH
Weak LED
Supply
Control Logic
ERR
SENSE
48
PWM0-5
LED Open/
Short
Short to GND
Pull up
PWM Maping/
6
PWM Fault Detection
CH0-11
12
VCC
UVLO
PWM
72
CAL
BandGap
IREF Diag/
Current Mirror
Iref
12
Constant Current
Driver
x12
AGND
IREF
PGND
Figure 3. Block diagram
Description of Blocks Functionality
Constant current driver
The chip uses a constant current output driver with a provision for individual calibration per channel.
The constant current ID is derived from referring an internal reference voltage over the external resistor R EXT.
The resistor is chosen to set the reference current IREF.
The global reference current, IREF, is mirrored into the channel current to generate a local reference.
The output device is scaled to give 6 bit output range.
𝑰𝑫 = 𝟓𝟎𝟎 ∗
𝑽𝑹𝑬𝑭 (𝑪𝑨𝑳 + 𝟏)
∗
𝑹𝑬𝑿𝑻
𝟔𝟒
where VREF is the reference voltage measured at the IREF pin.
Output currents are timed by the assigned PWM input.
The drivers have a low leakage current to keep the LED in firm OFF condition when the channel is inactive.
Full Scale current setting example table:
REXT
IDmax
12kΩ
50mA
20kΩ
30mA
30kΩ
20mA
60kΩ
10mA
Active pull up circuit
A pull up current can be activated to avoid LED flicker during activated and deactivated state. This can be done by
changing the corresponding bit in the EN_PULL_UP@ON and EN_PULL_UP@OFF registers. Please see also the
description of the WRITE_EN_PULL_UP commands.
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BD18378EFV-M
Protection circuitry and diagnostic
o
LED Short Detection
A short event is detected when the voltage across the LED falls below the short detection threshold
VSCth. The SHORT detection current which is flowing during LED active (PWM =”LOW”), will cause a typical
output current offset of 20µA. After a detected LED short event, the corresponding bit of the Gen_SHORT
detection register and the ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by
the controller. The SHORT detection is also performed, when the LED is not activated, using small sink
currents for small time intervals (20us) to avoid LED flicker. In order for the detection to be available at
non-activated LED state the PWM duty cycle must be H)
TDSOH
250
ns
SDO propagation delay time (H->L)
TDSOL
250
ns
The timings are valid for a 1.25MHz clock signal. The input High Going threshold voltage (VTH) is 0.4x VCC on the rising edge
and (VTH) 0.3x VCC on the falling edge for all digital pins. See electrical characteristics.
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BD18378EFV-M
SPI Communication
The serial port is used to write data, read diagnostic status and configure settings of the chip by transferring the input
data to the desired address. During normal operation an 8-bit serial address and 8-bit serial data is written into the 16-bit shift
register. The clock idle state is zero and the data on the SDI and SDO lines must be stable while the clock is high and
can be changed when the clock is low. The data is sampled by on the clock’s rising edge and propagated on the clock’s
falling edge, converting the 16 most recent inputs to parallel signals on the LATCH rising edge.
At the rising edge on the LATCH input addresses are interpreted by a decoder which controls data transfer between
shift and storage registers. Depending on the address, valid data is conveyed from or to the appropriate latch or a command is
interpreted. When a read address is latched data is read out from a storage register and shifted out of SDO to the microcontroller
or daisy chained chips.
Since for each address the chip shifts out a fixed amount of data at the end of a write/read cycle it is possible to send
different address codes to each IC in a daisy chain.
During the exchange of information the LED outputs do not flicker or dim.
Command Set
Address
IN
HEX
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
Data IN
d7
PWM_MAP01
PWM_MAP03
PWM_MAP05
PWM_MAP07
PWM_MAP09
PWM_MAP11
Not USED
Not USED
X
X
X
X
X
X
X
X
X
X
X
X
Not USED
Not USED
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
d6
PWM_MAP01
PWM_MAP03
PWM_MAP05
PWM_MAP07
PWM_MAP09
PWM_MAP11
Not USED
Not USED
X
X
X
X
X
X
X
X
X
X
X
X
Not USED
Not USED
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
s
X
X
X
X
X
0
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
d5
PWM_MAP01
PWM_MAP03
PWM_MAP05
PWM_MAP07
PWM_MAP09
PWM_MAP11
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
s
X
X
X
X
RST_ANY_SHRT_GND
1
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
d4
PWM_MAP01
PWM_MAP03
PWM_MAP05
PWM_MAP07
PWM_MAP09
PWM_MAP11
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
EN_OPEN@ON
Comments
d3
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
d2
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
d1
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
d0
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
EN_PULL_UP@ON
EN_PULL_UP@ON
EN_PULL_UP@OFF
EN_PULL_UP@OFF
s
u
X
EN_ERR_PIN_LOCK
EN_ERR_PIN_UNLOCK
RST_ANY_SHRT_OPEN
0
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
s
u
X
MAP_LOCK
MAP_UNLOCK
RST_WLS
0
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
s
u
X
CH_EN_LOCK
CH_EN_UNLOCK
RST_PWM_OK
0
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
s
u
MASK_WLS
CAL_LOCK
CAL_UNLOCK
RST_TSD
0
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
s
u
MASK_WLS
DIAG_LOCK
DIAG_UNLOCK
RST_POR
1
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
1
1
0
1
0
1
1
0
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
RESERVED
RESERVED
Not USED
Configures Output Ch1&Ch0 to PWMy
Configures Output Ch3&Ch2 to PWMy
Configures Output Ch5&Ch4 to PWMy
Configures Output Ch7&Ch6 to PWMy
Configures Output Ch9&Ch8 to PWMy
Configures Output Ch11&Ch10 to PWMy
Not USED
Not USED
Current configuration Ch0
Current configuration Ch1
Current configuration Ch2
Current configuration Ch3
Current configuration Ch4
Current configuration Ch5
Current configuration Ch6
Current configuration Ch7
Current configuration Ch8
Current configuration Ch9
Current configuration Ch10
Current configuration Ch11
Not USED
Not USED
Configure enable channel register for Ch 5 to Ch0
Configure enable channel register for Ch 11 to Ch6
Configure enable short for activated Ch5 to Ch0
Configure enable short for activated Ch11 to Ch6
Configure enable open for activated Ch5 to Ch0
Configure enable open for activated Ch11 to Ch6
Configure enable short for unactivated Ch5 to Ch0
Configure enable short for unactivated Ch11 to Ch6
Configure enable open for unactivated Ch5 to Ch0
Configure enable open for unactivated Ch11 to Ch6
Enable short to GND for Ch5 to Ch0
Enable short to GND for Ch11 to Ch6
Enable pull up @ ON for Ch5 to Ch0
Enable pull up @ ON for Ch11 to Ch6
Enable pull up @ OFF for Ch5 to Ch0
Enable pull up @ OFF for Ch11 to Ch6
Enable ERR PIN for STATUS bit6 to bit0
Enable ERR PIN for UNLOCK bit4 to bit0
Mask WLS detection
LOCK
UNLOCK
Clear STATUS register flags
Software reset (reset all and set POR flag)
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
RESERVED
RESERVED
RESERVED
Not USED
X= don’t care
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BD18378EFV-M
Adress
OUT
HEX
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
d7
PWM_MAP01
PWM_MAP03
PWM_MAP05
PWM_MAP07
PWM_MAP09
PWM_MAP11
Not USED
Not USED
U
U
U
U
U
U
U
U
U
U
U
U
Not USED
Not USED
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
U
Not USED
Not USED
Not USED
1
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
d6
d5
d4
PWM_MAP01
PWM_MAP01
PWM_MAP01
PWM_MAP03
PWM_MAP03
PWM_MAP03
PWM_MAP05
PWM_MAP05
PWM_MAP05
PWM_MAP07
PWM_MAP07
PWM_MAP07
PWM_MAP09
PWM_MAP09
PWM_MAP09
PWM_MAP11
PWM_MAP11
PWM_MAP11
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
U
CAL0
CAL0
U
CAL1
CAL1
U
CAL2
CAL2
U
CAL3
CAL3
U
CAL4
CAL4
U
CAL5
CAL5
U
CAL6
CAL6
U
CAL7
CAL7
U
CAL8
CAL8
U
CAL9
CAL9
U
CAL10
CAL10
U
CAL11
CAL11
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
U
EN_CHANNEL
EN_CHANNEL
U
EN_CHANNEL
EN_CHANNEL
U
EN_SHORT@ON
EN_SHORT@ON
U
EN_SHORT@ON
EN_SHORT@ON
U
EN_OPEN@ON
EN_OPEN@ON
U
EN_OPEN@ON
EN_OPEN@ON
U
EN_SHORT@OFF
EN_SHORT@OFF
U
EN_SHORT@OFF
EN_SHORT@OFF
U
EN_OPEN@OFF
EN_OPEN@OFF
U
EN_OPEN@OFF
EN_OPEN@OFF
U
EN_SHORT_TO_GND EN_SHORT_TO_GND
U
EN_SHORT_TO_GND EN_SHORT_TO_GND
U
EN_PULL_UP@ON
EN_PULL_UP@ON
U
EN_PULL_UP@ON EN_PULL_UP@ON
U
EN_PULL_UP@OFF EN_PULL_UP@OFF
U
EN_PULL_UP@OFF EN_PULL_UP@OFF
s
s
s
U
U
u
AnyShortGND
AnyShortOpen
REXT
U
U
EN_ERR_PIN_UNLOCK
U
PWM_OK
PWM_OK
U
U
U
U
Gen_SHORT
Gen_SHORT
U
Gen_SHORT
Gen_SHORT
U
Gen_OPEN
Gen_OPEN
U
Gen_OPEN
Gen_OPEN
U
SHORT_TO_GND
SHORT_TO_GND
U
SHORT_TO_GND
SHORT_TO_GND
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
Not USED
0
0
1
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
Not USED
Not USED
Data OUT
d3
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
Comments
d2
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
d1
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
d0
PWM_MAP00
PWM_MAP02
PWM_MAP04
PWM_MAP06
PWM_MAP08
PWM_MAP10
Not USED
Not USED
CAL0
CAL1
CAL2
CAL3
CAL4
CAL5
CAL6
CAL7
CAL8
CAL9
CAL10
CAL11
Not USED
Not USED
EN_CHANNEL
EN_CHANNEL
EN_SHORT@ON
EN_SHORT@ON
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_OPEN@ON
EN_OPEN@ON
EN_SHORT@OFF
EN_SHORT@OFF
EN_OPEN@OFF
EN_OPEN@OFF
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_SHORT_TO_GND
EN_PULL_UP@ON EN_PULL_UP@ON EN_PULL_UP@ON EN_PULL_UP@ON
EN_PULL_UP@ON EN_PULL_UP@ON EN_PULL_UP@ON EN_PULL_UP@ON
EN_PULL_UP@OFF EN_PULL_UP@OFF EN_PULL_UP@OFF EN_PULL_UP@OFF
EN_PULL_UP@OFF EN_PULL_UP@OFF EN_PULL_UP@OFF EN_PULL_UP@OFF
s
u
WLS
MAP_UNLOCK
PWM_OK
U
Gen_SHORT
Gen_SHORT
Gen_OPEN
Gen_OPEN
SHORT_TO_GND
SHORT_TO_GND
Not USED
Not USED
Not USED
1
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
s
u
TSD180
CH_EN_UNLOCK
PWM_OK
U
Gen_SHORT
Gen_SHORT
Gen_OPEN
Gen_OPEN
SHORT_TO_GND
SHORT_TO_GND
Not USED
Not USED
Not USED
1
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
s
u
TSD130
CAL_UNLOCK
PWM_OK
U
Gen_SHORT
Gen_SHORT
Gen_OPEN
Gen_OPEN
SHORT_TO_GND
SHORT_TO_GND
Not USED
Not USED
Not USED
1
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
s
u
POR
DIAG_UNLOCK
PWM_OK
MASK_WLS
Gen_SHORT
Gen_SHORT
Gen_OPEN
Gen_OPEN
SHORT_TO_GND
SHORT_TO_GND
Not USED
Not USED
Not USED
0
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
Read output Ch1&Ch0 to PWMy configuration
Read output Ch3&Ch2 to PWMy configuration
Read output Ch5&Ch4 to PWMy configuration
Read output Ch7&Ch6 to PWMy configuration
Read output Ch9&Ch8 to PWMy configuration
Read output Ch11&Ch10 to PWMy configuration
Not USED
Not USED
Read output configuration Ch0
Read output configuration Ch1
Read output configuration Ch2
Read output configuration Ch3
Read output configuration Ch4
Read output configuration Ch5
Read output configuration Ch6
Read output configuration Ch7
Read output configuration Ch8
Read output configuration Ch9
Read output configuration Ch10
Read output configuration Ch11
Not USED
Not USED
Read enable channel register for Ch 5 to Ch0
Read enable channel register for Ch 11 to Ch6
Read enable short for activated Ch5 to Ch0
Read enable short for activated Ch11 to Ch6
Read enable open for activated Ch5 to Ch0
Read enable open for activated Ch11 to Ch6
Read enable short for unactivated Ch5 to Ch0
Read enable short for unactivated Ch11 to Ch6
Read enable open for unactivated Ch5 to Ch0
Read enable open for unactivated Ch11 to Ch6
Read enable short to GND for Ch5 to Ch0
Read enable short to GND for Ch11 to Ch6
Read enable pull up @ ON for Ch5 to Ch0
read enable pull up @ ON for Ch11 to Ch6
read enable pull up @ OFF for Ch5 to Ch0
read enable pull up @ OFF for Ch11 to Ch6
read ERR PIN for STATUS bit6 to bit0
read ERR PIN for UNLOCK bit4 to bit0
Read STATUS register bits 6to 0
Read UNLOCKED
Read PWM OK register for PWM5 to PWM0
Read Mask WLS Detection
Read short register for Ch5 to Ch0
Read short register for Ch11 to Ch6
Read open register for Ch5 to Ch0
Read open register for Ch11 to Ch6
Read Short to GND register for Ch5 to Ch0
Read Short to GND register for Ch11 to Ch6
Not USED
Not USED
Not USED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Not USED
U=unchanged
Note: The IC has also reserved addresses for internal test modes. All test modes are digital and are protected by security codes.
Starting the system, the initialization sequence described in the startup flow chart must be followed in order to correctly set the
default state for all the registers. These commands make sure all internal test mode registers are set to a default state after start
up. Every test register written must be preceded by the respective enable command (security codes) as given in the startup flow
chart. A Software POR command must be sent after the initialization of the internal test mode registers.
0xB5 1001 1110
0xB6 0000 0000
0xB5 1001 1110
0xB7 0000 0000
0xB5 1001 1110
0xB8 0000 0000
0xB5 1001 1110
0xB9 0000 0000
0x79 1101 0110
0x7A 0000 0000
0x79 1101 0110
0x7B 0000 0000
0x6C 1010 0001
// Enabler 1 command to access the reserved address
// Initialization of internal test mode 1
// Enabler 1 command to access the reserved address
// Initialization of internal test mode 2
// Enabler 1 command to access the reserved address
// Initialization of internal test mode 3
// Enabler 1 command to access the reserved address
// Initialization of internal test mode 4
// Enabler 2 command to access the reserved address
// Initialization of internal test mode 5
// Enabler 2 command to access the reserved address
// Initialization of internal test mode 6
// Software POR command
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Power Dissipation
The maximum current specification per output ID max = 50mA. However when all channels are sinking this maximum the
total power dissipation exceeds the value set by the package limit. The power dissipation can be estimated using Equation 1.
Maximum power dissipation. In case of high current and high voltage it is possible to exceed the maximum power dissipation
even at a single channel. Because these situations do not occur often the current limit per channel is set higher such that the
flexibility of the system is improved.
It is recommended to connect the LEDs to a 5V supply voltage (V LED) for an optimal thermal performance. If the LEDs
are connected to a higher voltage care should be taken because power dissipation will increase. LED series resistors ( RD )
may be added to reduce the voltage drop over the IC output. These resistors are an optional safeguard against exceeding the
dissipation limit of BD18378EFV-M. The maximum power rating of the BD18378EFV-M can be read from the figure below.
11
Pdiss,max (VLED V f ,i I D ,i RD ,i ) I D ,i
i 0
11
(VD ,i I D ,i )
i 0
TON
TPWM
TON
TPWM
Equation 1. Maximum power dissipation
Pdiss,max: Maximum power dissipation of the package
VLED: Supply voltage of LEDs.
Vf: LED forward voltage
RD: Optional series resistance.
TPWM: Period of PWM
TON: ON time (duty) of PWM
Figure 12. Maximum power dissipation of HTSSOPB28
Note 1: Power dissipation calculated when mounted on 70mm X 70mm X 1.6mm glass epoxy substrate (1-layer
platform/copper thickness 18μm)
Note 2: Power dissipation changes with the copper foil density of the board. This value represents only observed values, not
guaranteed values.
HTSSOP-B28
Pd=1.85W (0.97W)： Board copper foil area 225m ㎡
Pd=3.30W (1.72W)： Board copper foil area 4900m ㎡
Pd=4.70W (2.44W)： Board copper foil area 4900m ㎡
(Value within parentheses represents power dissipation when Ta=85°C)
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I/O equivalence circuit(s)
Input
Pin: 4,11,12, 16, 17, 25
VCC
Output
Pin: 26
VCC
Pin: 13,14,15
Pin: 3
VCC
Pin: 5 to 10, 19 to 24, Pin : 18
Pin 18
Figure 13. Input/output equivalent circuits
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD18378EFV-M
Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
N
Parasitic
Elements
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 14. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD18378EFV-M
Ordering Information
B
D
1
8
3
7
8
E
F
V
-
Package
EFV: HTSSOP-B28
ME2
Packaging
M: High Reliability
E2: Embossed carrier tape
(HTSSOP-B28)
Figure 15. Ordering Information
Marking Diagram
HTSSOP-B28 (TOP VIEW)
Part Number Marking
BD18378EFV
LOT Number
1PIN MARK
Figure 16. Marking Diagram
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Physical Dimensions, Tape And Reel Information for HTSSOP-B28
Figure 17. Physical dimensions for HTSSOP-B28
Figure 18. Tape and reel information
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Revision History
Date
Revision
01.Dec.2014
04.Dec.2015
003
004
Adrian Joita – Datasheet Release after AEC-Q100 Qualification
Adrian Joita
-added note for AEC-Q100-Operating Temperature Grade
-added note for VSENSE
-added Thermal Information
-added description of WRITE_CALx & READ_CALx commands
-added ISENSE parameter
-added note on input circuitry
-corrected typo for propagation delay
-added Pin 18 to I/O equivalent circuits
Author / Comments
24.Feb.2017
005
05.Apr.2017
006
Adrian Joita
-updated Recommended Operating Ratings
-added StartUP Flow Chart
-updated SPI Timing Diagram
-updated Register Map description
Adrian Joita
-corrected typo in the SPI Timing
Status of this document
The English version of this document is formal specification. A customer may use the translation version only for a reference to
help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Mouser Electronics
Authorized Distributor
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ROHM Semiconductor:
BD18378EFV-ME2
