BD19910MUV

1/4 Structure Product name Model name Function 特 長 Silicon monolithic IC System power LSI for Blu-ray/DVD BD19910MUV (1) Built-in 3.3V output synchronized rectifier type Step-down DC-to-DC converter (2) Built-in 1.0V/1.5V output selectable rectifier type Step-down DC-to-DC converter (3) Built-in synchronized rectifier type Step-up DC-to-DC converter 特 長 (4) Built-in Over-current and short-circuit protection function circuit 特 長 (5) Built-in Error-Amplifier phase compensation (Step-down only) 特 長 (6) Operational frequency Step-down : 2.0MHz(typ.), Step-up : 1.0MHz(typ.) 特 長 (7) Built-in Reset function circuit and Current Switch 特 長 (8) Built-in Shut down function circuit ○Absolute maximum ratings (Ta=25℃) Parameter Symbol Rating -0.3～6.5 -0.3～6.5 -0.3～6.5 -0.3～15.0 -0.3～15.0 -0.3～VCC+0.3 1.0 1.0 2.4 2.4 0.2 10 4.56 -30～+70 -55～+150 Unit V V V V V V A A A A A mA W ℃ ℃ PVCC1 terminal voltage PVCC1 PVCC2 terminal voltage PVCC2 AVCC terminal voltage AVCC DCSW3 terminal voltage VDCSW3 VDCO3 terminal voltage VVDCO3 Input terminal voltage (*1) VIN DCSW1 terminal output current (*2) IDCSW1 DCSW2 terminal output current (*2) IDCSW2 DCSW3 terminal output current (*2) IDCSW3 VDCO3 terminal output current (*2) IVDCO3 CSWO terminal output current ICSWO XRESET terminal input current IXRESET Power dissipation (*3) Pd Ambient temperature of operation Topr Ambient temperature of preservation Tstg (*1) SELDCO1, SELSQ, CSWON, ENUP, XENDWN, SELRST (*2) Absolute maximum ratings of this parameter include ripple current (*3) While mounted on FR4 Glass-epo. 4 layer Board (5505mm2) ○Operation condition(Ta=25℃) Parameter PVCC1 terminal voltage PVCC2 terminal voltage AVCC terminal voltage VDCO1 output current VDCO2 output current VDCO3 output current VDCO3 output voltage setting range CSWO output current This product is no antiradiation design Symbol PVCC1 PVCC2 AVCC IDCO1 IDCO2 IDCO3 VDCO3 ICSWO MIN. 4.5 4.5 4.5 6.0 - TYP. 5.0 5.0 5.0 - MAX. 5.5 5.5 5.5 0.8 0.8 0.6 11.0 0.1 Unit. V V V A A A V A REV. A 2/4 ○Electrical characteristics （PVCC1=PVCC2=AVCC=5.0V,Ta=25℃ unless otherwise specified） Parameter [TOTAL] Current consumption Shutdown current High level input voltage Low level input voltage input current H input current L [Step-down DC-to-DC Converter Block] VDCO1 voltage VDCO2 voltage Oscillation frequency High-side-switch resistance Low-side-switch resistance Soft start time [Step-up DC-to-DC Converter Block] FB（VREF） voltage Oscillation frequency High-side-switch resistance Low-side-switch resistance Soft-start beginning time AMPOUT3 maximum voltage AMPOUT3 minimum voltage Max Duty cycle [Reset Block] VRSTON1A VRSTON1B Reset ON voltage VRSTON2A VRSTON2B VRSTON3 VRSTHYS1A VRSTHYS1B Reset hysteresis voltage VRSTHYS2A VRSTHYS2B VRSTHYS3 XRESET output sink voltage XRESET leak current Reset delay time [Current Switch Block] Current SW ON resistance RCSWO 0.5 1.0 Ω CSWON=5V VRSINK IRLK tRST 3.600 4.087 1.140 0.665 2.565 70 70 70 70 70 -5.0 30 3.700 4.200 1.200 0.700 2.700 100 100 100 100 100 50 3.800 4.313 1.260 0.735 2.835 130 130 130 130 130 0.3 5.0 70 V V V V V mV mV mV mV mV V μA ms AVCC is observed, SELRST=0V AVCC is observed, SELRST=5V VDCO1 is observed, SELDCO1=0V VDCO1 is observed, SELDCO1=5V VDCO2 is observed AVCC is observed, SELRST=0V AVCC is observed, SELRST=5V VDCO1 is observed, SELDCO1=0V VDCO1 is observed, SELDCO1=5V VDCO2 is observed ISINK=5.0mA XRESET=5.0V VFB3 fOSCUP RONH3 RONL3 tSOFTUP VAMPOH VAMPOL DMAX 0.582 0.7 3.5 2.2 72 0.600 1.0 0.35 0.30 6.0 2.5 0.03 80 0.618 1.3 0.60 0.50 8.5 2.8 0.20 88 V MHz Ω Ω ms V V % VDCO3=10V VDCO3=10V FB3=0V FB3=0V FB3=2.5V FB3=0V VDCO1A VDCO1B VDCO2 fOSCDWN RONH1,2 RONL1,2 tSOFTDWN 1.455 0.970 3.201 1.4 0.6 1.500 1.000 3.300 2.0 0.40 0.30 1.0 1.545 1.030 3.399 2.6 0.60 0.50 1.8 V V V MHz Ω Ω ms No load SELDCO1=0V SELDCO1=5V ICC ISHUT VIOH VIOL IIO1 IIO2 2.0 -5.0 -5.0 3.6 1.2 7.2 3.0 0.8 5.0 5.0 mA mA V V μA μA Input=5V Input=0V VDCO1=VDCO2=5V, FB3=0V, CSWON=ENUP=5V, XENDWN=0V ENUP=0V, XENDWN=5V Symbol MIN. TYP. MAX. UNIT Condition [Input IO Block : ENUP, XENDWN, SELDCO1, SELSQ, SELRST, CSWON] REV. A 3/4 ○Dimension D19910 LOT No. Drawing No.：EX473-6001 VQFN028V5050 (unit：mm) ○Block diagram ○Terminal No.・Terminal name Terminal No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Terminal name PGND1 SELDCO1 PVCC1 AVCC PVCC2 SELSQ PGND2 DCSW2 RESERVE VDCO2 XENDWN SELRST RESERVE DCSW3 PGND3 RESERVE VDCO3 RESERVE FB3 AMPOUT3 Terminal No. 21 22 23 24 25 26 27 28 Exposed PAD 28 27 26 25 24 23 22 PGND1 1 CURRENT SW 21 AGND RESET SELDCO1 2 CONTROL DRIVER 20 AMPOUT3 Terminal name AGND CSWO CSWI CSWON XRESET VDCO1 ENUP DCSW1 GND XRESET CSWON VDCO1 DCSW1 CURRENT LIMIT PVCC1 3 19 FB3 BIAS AVCC 4 18 RESERVE SAW PVCC2 5 CURRENT LIMIT 17 VDCO3 SELSQ 6 CONTROL DRIVER CONTROL DRIVER CSWO ENUP CSWI 16 RESERVE PGND2 7 CURRENT LIMIT 15 PGND3 8 DCSW2 9 RESERVE 10 VDCO2 11 XENDWN 12 SELRST 13 RESERVE 14 DCSW3 REV. A 4/4 ○Notes on use 1. Notes for printed pattern board ・PVCC1, PVCC2, AVCC and CSWI must be connected to power supply on the board. ・PGND1, PGND2, PGND3 and AGND must be connected to GND on the board. ・Please wire with wide, short and keep low impedance for the PVCC1, PVCC2 and AVCC connection. ・Please wire with wide, short and keep low impedance for the PGND1, PGND2, PGND3 and AGND connection. ・Please extract the output of DC-to-DC converter from both ends of capacitor connected to VDCO1, VDCO2 and VDCO3. ・The characteristics of DC-to-DC converter is influenced by surrounding, components and board pattern design. Consider the effects from surroundings while designing. Notes for external parts ・Use low ESR ceramic capacitor between PVCC1(PVCC2) and PGND1(PGND2). Place the capacitor right next to the IC pins. ・Please wire AGND independently from the GND side of bi-pass capacitor. ・Please use parts recommended by this specification and place external parts such as inductors and capacitors right next to the IC pins. Especially, please use wide and short wire in the part where a large current flows. 2. 3. Notes for SELDCO1 terminal, SELSQ terminal and SELRST terminal ・Please connect these terminal to the power supply or GND, and prohibit switching it after turning on the power supply (IC in operation). 4. Notes for Thermal shutdown function ・Thermal shutdown function is activated by the chip temperature achieving 175℃ (typ.). And DC-to-DC converter output will be turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC). ・Main purpose of TSD is to shutting IC down from runaway effect. It is not to compensate or to protect set device. Therefore, please do not continuously operate the IC after TSD circuit is activated and/or premise operations such that TSD circuit function being used. 5. Notes for Over-voltage mute function ・Over-voltage mute function is built in this IC. DC-to-DC converter output is turned off (DCSW1=DCSW2=0.0V, DCSW3=VCC) when the VCC becomes 6.5V (typ.) or higher. 6. Notes for Over current protection function ・Over-current protection circuit is built in to Each outputs terminal except VDCO3 and XRESET. Which protects IC from destruction by abrupt VCC and GND short. 7. Notes for load current while start-up ・Keep light Load at each output while start-up. 8. Notes for Absolute maximum ratings ・Even quality control of the product have fun well taken care, however operating above the absolute maximum ratings of supply voltage and/or operational temperature range may cause decay and destroy the IC. Please make it sure to use the IC within the operating rage at anytime while designing. ・Operating over the maximum ratings of supply voltage and/or operational temperature may destroy the product. Once destroyed, open/short mode to specify the defection is impossible. Please have physical countermeasure such as adding fuse etc. If specific mode such that exceeding the Absolute Maximum ratings is expected. 9. Notes for Terminal to Terminal short / miss-alignment ・While mounting IC on the board, check direction and shift of the IC. If inadequately mounted, IC might destroy. ・Avoid short-circuit of I/O terminals (VDCO1, VDCO2, VDCO3, DCSW1, DCSW2, DCSW3) and VCC / GND. If short-circuit of terminals and VCC /GND is executed, the IC will break down and the smoke may occur. 10. Notes for test of mounted print board ・While connecting capacitor to Low impedance pins, please discharge capacitor by one process by another to prevent stressing the IC. While mounting and removing the IC to/from the Board in the inspection process, be sure to turn off the power supply at each actions. Moreover equip ground earth in assembling process for ESD protection and handle with care during the test and/or transportation. 11. Notes for input terminal ・This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be careful so as not to operate the parasitic elements by applying lower voltage than GND (P substrate) to input terminals. Moreover, please apply each input terminal with lower than the power-supply voltage or equal to the specified range in the guaranteed voltage when the power-supply voltage being applied. 12. Notes for ASO ・Set up the current so as the output transistor not to exceed absolute maximum ratings and ASO while operating the IC. 13. Notes for Thermal design ・In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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