BD1LBU50EFJ-CE2

Datasheet 1ch Low Side Switch IC In-Vehicle 1ch Low Side Switch BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Specifications Built-in overcurrent limiting circuit Built-in thermal shutdown circuit (TSD) Built-in open load detection circuit (at output OFF) Enables direct control from CMOS logic ICs, etc. Low standby current Built-in under voltage lock out circuit Built-in diagnostic output (ST) terminal Low ON resistance RDS(ON)=350mΩ(Typ) (VDD=IN=5V, Ta=25°C, IOUT=0.25A) Built-in overvoltage protection(active clamp) for output circuit Monolithic power IC in which the control unit (CMOS) and power MOS FET are incorporated into one chip 1ch low side switch for driving mechanical relay coil AEC-Q100 Qualified(1) Operating voltage range ON resistance (25°C, Typ.) Overcurrent limitation (Typ.) Active clamp energy (25°C) 3.5V to 5.5V 350mΩ 1.50A 25mJ Package HTSOP-J8 MSOP8 4.90mm x 6.00mm x 1.00mm 2.90mm x 4.00mm x 0.90mm (1) Grade1 Overview BD1LB500 Series is an in-vehicle 1ch low side switch. This switch builds in the overcurrent limiting circuit, thermal shutdown circuit, open load detection circuit and under voltage lock out circuit. It also provides the diagnostic output circuit when an abnormality is detected. Application MSOP8 HTSOP-J8 ■ In-vehicle application (Air conditioners, body devices, meters, etc.) Basic Application Circuit (Recommendation) VBAT RL VDD 8 7 6 N.C. VDD Under voltage lock out 5 DRAIN DRAIN Open load detection Overvoltage protection Logic Rext (2) 0.1µF Over current Limit IN 1 ST SOURCE (GND) SOURCE (GND) 2 3 4 10k (3) (2) (3) When the open detection function is required, an external resistance must be added between DRAIN terminal and SOURCE terminal. It is necessary to detect unusual state(ST terminal is low) when VDD terminal is opened. When ST pin is not used, it can be open. Product configuration: Silicon monolithic integrated circuit www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○The product is not designed for radiation resistance. 1/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Pin Descriptions Pin No. Symbol Function 1 IN Input terminal; a pull down resistor is connected internally. 2 ST Self-diagnostic output terminal; outputs “L” at detection of overcurrent, at open (IN=0V), and in the overheat state. See the truth table. It is structured as COMS inverter output circuit. 3,4 SOURCE (GND) 5,6 DRAIN 7 N.C. No Connect pin 8 VDD Power supply terminal Cooling Tab (1) TAB The heat radiation metal on the substrate is connected to the IC sub. Therefore, connect Cooling Tab to the external GND electrical potential (for HTSOP-J8 only). Ground terminal Output terminal; limits output current to protect IC when load is short-circuited and current exceeding the overcurrent detection value (0.8A Min) flows to the output terminal. (1)MSOP8 does not have Cooling Tab. Pin Configurations HTSOP-J8 (TOP VIEW) MSOP8 (TOP VIEW) 1.IN 8.VDD 2.ST 7.N.C 3.SOURCE (GND) 4.SOURCE (GND) Product Name 1.IN 8.VDD 2.ST 7.N.C. 3.SOURCE (GND) 4.SOURCE (GND) 6.DRAIN 5.DRAIN PKG Remarks BD1LB500EFJ-C HTSOP-J8 Production Line A (2) BD1LBU50EFJ-C HTSOP-J8 Production Line B (2) BD1LB500FVM-C MSOP8 - 6.DRAIN 5.DRAIN TSD function ON resistance (25°C,Typ) Self-restart 350mΩ (2) For the purpose of improving production efficiency, Production Line A and B have a multi-line configuration. Electrical characteristics noted in Datasheet does not differ between Production Line A and B. Production Line B is recommended for new product. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Absolute Maximum Ratings Item Symbol Limit values Unit DRAIN-SOURCE voltage V DS 42 (internally limited) V Power supply voltage V DD 7 V Diagnostic output voltage V ST -0.3 to +7 (1) Output current (DC) I OD Output current (Pulse) I OP Input voltage V IN 0.8 Internally V (2) A limited(3) A -0.3 to +7 (1) 2.1(HTSOP-J8) V (4) Power consumption Pd Operating temperature range T opr -40≤Topr＜+150 °C Storage temperature range T stg -55 to +150 °C Maximum junction temperature Active clamp energy (single pulse) W 0.587(MSOP8) (5) T jmax 150 °C E AS(25°C) 25 (6) mJ E AS(150°C) 25 (7)(8) mJ Code Limit values Unit V DD 3.5 to 5.5 V Operating Voltage Ratings Item Operating voltage range (1) The condition, V D D ＞VIN, V ST is required. (2) The value must not exceed Pd. (3) Internally limited by the overcurrent limiting circuit. (4) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate). When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C. (5) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area is Footprint only, glass epoxy single-layer substrate). When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C. (6) Active clamp energy at Tj(0) = 25°C, using single non-repetitive pulse of 0.4A (7) Active clamp energy at Tj(0) = 150°C, using single non-repetitive pulse of 0.4A (8) Not 100% tested. Heat Dissipation Characteristics 4.00 3.75 W 3.50 HTSOP-J8 (1) 3.00 Pd [W] 2.50 2.1 W HTSOP-J8 (2) 2.00 1.50 1.00 MSOP8 (3) 0.587 W 0.50 0.00 0 (HTSOP-J8) (MSOP8) 25 50 75 Ｔa [℃] 100 125 150 (1) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 4-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 30mW/°C. (2) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C. (3) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area is Footprint only, glass epoxy single-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Electrical Characteristics (VDD=3.5V to 5.5V, -40°C≤ Tj≤ +150°C unless otherwise is specified) Item Symbol Limit values Min Typ Max Unit Condition [Power Supply Block] Standby current IDDS － 0 10 μA VDD=5V,VIN=0V,VB=12V,RL=47Ω Operating current IDD － 0.5 1.0 mA VDD=5V,VIN=5V,VB=12V,RL=47Ω VUVLO － 2.5 3.0 V H level input voltage VTH1 － － VDD×0.8 V L level input voltage VTH2 VDD×0.2 － － V Input hysteresis VHYS － 0.40 － V High level input current IINH1 － 50 100 μA VIN=5V Low level input current IINL -1 0 1 μA VIN=0V RDS(ON) － 350 450 mΩ RDS(ON) － 570 750 mΩ IL(OFF) － － 10 μA VIN=0V,VDS=12V,Tj=25°C IL(OFF) － － 100 μA VIN=0V,VDS=12V,Tj=150°C tON － 20 40 μs VDD=5V,VIN=0V/5V, RL=47Ω tOFF － 20 40 μs VDD=5V,VIN=0V/5V, RL=47Ω Slew rate (at ON) dV/dtON 0.5 1 2 V/μs VDD=5V,VIN=0V/5V, RL=47Ω Slew rate (at OFF) -dV/dtOFF 0.5 1 2 V/μs VDD=5V,VIN=0V/5V, RL=47Ω VCL 42 47 52 V VIN=0V,IOUT=-1mA VSTL － － 0.4 V VDD=5V,VIN=5V,IST=0.1mA VSTH 4.88 － － V VDD=5V,VIN=0V,IST=-0.1mA ISTH － － 10 μA VIN=0V,VST=5.5V Under voltage threshold voltage lock out [Input Block] [Power MOS output] Output ON resistance VIN=5V, VDD=5V,ID=0.25A,Tj=25°C VIN=5V, VDD=5V,ID=0.25A,Tj=150°C Output leak current Switching time Output clamp voltage [Diagnostic output] Diagnostic output voltage “L level” Diagnostic output voltage “H level” Diagnostic output current “H level” www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Electrical Characteristics (VDD=3.5V to 5.5V, -40°C≤ Tj≤ +150°C unless otherwise is specified) Item Symbol Rated value Unit Condition Min Typ Max IOCP 0.8 1.5 2.5 A VIN=5V tDHL － 40 80 μs VDD=5V,RL=4Ω to ∞ tDLH － 320 640 μs VDD=5V,RL=∞ to 4Ω Open load detection threshold voltage (1) VOPEN 1 2 3 V IN=0V Open load detection time tOPEN 100 300 900 μs IN=0V [Protective circuit] Overcurrent detection current Diagnostic output delay time (1) To enable detection, an external resistance must be added between DRAIN terminal and SOURCE terminal. （Determine Rext depending on RL.） 10kΩ VDD ST VB RL IN SOURCE (GND) DRAIN Rext Definition IST IDD VDD ST IOUT IIN VDD IN VIN SOURCE (GND) VST DRAIN VOUT Figure 1. Definition www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Measuring Circuit Diagram 10kΩ 10kΩ VDD VDD ST ST 5V 5V 47Ω IN SOURCE (GND) IN DRAIN SOURCE (GND) DRAIN VIN=0V/5V VIN=5V VOUT IOUT=0.25A RDS(ON)=VOUT/IOUT Figure 3. Switching Time Measuring Circuit Diagram Figure 2. Output ON Resistance Measuring Circuit Diagram 10kΩ 10kΩ VDD VDD ST ST VB=12V 5V 5V RL=47Ω IN SOURCE (GND) IN DRAIN SOURCE (GND) DRAIN Rext VCL IOUT=1mA Figure 4. Output Clamp Voltage Measuring Circuit Diagram www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VOPEN Figure 5. Open Detection Measuring Circuit Diagram 6/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Diagnostic Output Truth Table VIN OUTPUT Tj Mode VST Output state IOUT < 1.5A(Typ) Normal H ON IOUT ≥ 1.5A(Typ) Overcurrent detection L OFF - - Thermal shut down L OFF H (3.0V or more) - Normal H OFF L (2.0V(Typ) or less) - Open load protection L OFF VOUT Tj ≤175°C(Typ) - H Tj >175°C(Typ) L - IOUT www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Characteristic Data (Reference Data) (VDD=5V, IN=5V, Tj=25°C unless otherwise is specified) 800 700 700 600 600 Output Resisntance [mΩ] Output Resistance [mΩ] 800 500 400 300 200 500 400 300 200 100 100 0 0 -50 -25 0 25 50 75 Ｔｊ [°C] 100 125 150 3.0 4.0 4.5 5.0 5.5 6.0 VDD [V] Figure 6. Output ON Resistance Characteristic [Temperature Characteristic] Figure 7. Output ON Resistance Characteristic [Source Voltage Characteristic] 200 10.0 8.0 150 6.0 IIN [μA] IDDS [μA] 3.5 4.0 Tj=150°C 100 Tj=25°C 50 2.0 Tj=-40°C 0 0.0 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 IN [V] VDD [V] Figure 9. Input Current Characteristic [Input Voltage Characteristic] Figure 8. Standby Current Characteristic [Source Voltage Characteristic] www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 8/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 45.0 45.0 40.0 40.0 35.0 35.0 30.0 30.0 VDD=3.5V 25.0 20.0 toff [μs] ton [μs] BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) VDD=5.0V VDD=5.5V 15.0 VDD=3.5V VDD=4V 25.0 VDD=5.0V 15.0 10.0 VDD=12V 20.0 VDD=18V VDD=5.5V 10.0 5.0 5.0 0.0 -50 -25 0 25 50 Tj [°C] 75 0.0 100 125 150 -50 Figure 10. Switching Time (ton) [Temperature Characteristic] -25 0 25 50 Tj [°C] 75 100 125 150 Figure 11. Switching Time (toff) [Temperature Characteristic] 2.0 2.0 1.5 1.5 VDD=5.5V toff [μs] ton [μs] VDD=5.5V 1.0 VDD=5.0V VDD=3.5V 1.0 VDD=5.0V VDD=3.5V 0.5 0.5 0.0 0.0 -50 -25 0 25 50 75 100 125 150 Tj [°C] Figure 12. Slew Rate (at ON) [Temperature Characteristic] www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 -50 -25 0 25 50 75 100 125 150 Tj [°C] Figure 13. Slew Rate (at OFF) [Temperature Characteristic] TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) 2.5 30 2.4 ON threshold 25 Output Leak Current [μA] 2.3 IN [V] 2.2 2.1 2.0 1.9 1.8 1.7 OFF threshold 20 15 10 5 1.6 1.5 0 -50 -25 0 25 50 75 -50 100 125 150 Figure 14. Input Voltage Threshold Characteristic [Temperature Characteristic] 25 50 75 100 125 150 Figure 15. Output Leak Current [Temperature Characteristic] (VIN=0V) Switching Time Measurement VIN(H) 0 Tj [°C] Tj [℃] 5Ｖ IN Wave form -25 Timing Chart with Inductive Load IN Input入力電圧 voltage VIN(L) t 0Ｖ TON Error flag エラーフラグ ST TOFF t VCL 12Ｖ OUT Wave form 0Ｖ 90 % 90% 10% Output voltage 出力電圧 VOUT t 10% dV/dtON -dV/dtOFF Output出力電流 current IO t Figure 17.Timing Chart with Inductive Load Figure 16. Switching Time www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Protective Function Timing Charts Input入力電圧 voltage IN t Chip temperature チップ温度 Tj t IL Output出力電流 current Io t Error flag エラーフラグ ST t Figure 18. Overheat Protection Timing Chart Input Voltage Input voltage IN VIN t Output Voltage VOUT Output voltage VOUT VOUT　≤　2.0V(Typ) (VOPEN) tOFF 1ms(typ) t Output current Io Error flag VST t Error flag 300μs(Typ) (TOPEN) ST 40µs(typ) 100µs(typ) Figure 19. Overcurrent Protection Timing Chart www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 20. Open Detection Protection Timing Chart 11/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) I/O Equivalent Circuits Pin Symbol I/O Equivalent Circuits VDD 1 IN IN SOURCE (GND) VDD ST 2 ST SOURCE (GND) 3.4 SOURCE （GND） DRAIN 5,6 DRAIN SOURCE (GND) 8 VDD Cooling Tab TAB www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Ordering Information B D 1 L B 5 0 0 E F J - PKG EFJ: HTSOP-J8 Production Line A B D 1 L B U 5 0 E F J C: High reliability Packaging and forming specification E2: Embossed tape and reel - PKG EFJ: HTSOP-J8 Production Line B B D 1 L B 5 0 0 F V M PKG FVM: MSOP8 CE2 CE2 C: High reliability Packaging and forming specification E2: Embossed tape and reel - CGTR C: High reliability G: Manufacturing code Packaging and forming specification TR: Embossed tape and reel Physical Dimension Tape and Reel Information www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Marking Diagram HTSOP-J8(TOP VIEW) Part Number Marking LOT Number 1PIN MARK Part Number Marking LB500E LBU50E Part Number BD1LB500EFJ-CE2 BD1LBU50EFJ-CE2 MSOP8(TOP VIEW) Part Number Marking L 0 B 5 0 LOT Number 1PIN MARK www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Operational Notes 1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the absolute maximum ratings. 2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 3) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) Source (GND) Voltage The voltage of the Source (GND) pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches 175°C (25°C hysteresis). It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 8) Over voltage protection (active clamp) There is a built-in over voltage protection circuit (active clamp) to absorb the induced current when inductive load is off (Power MOS = off). During active clamp and when IN=0V, TSD will not function so keep IC temperature below 150°C. 9) Over current protection circuit (OCP) The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current (without latching) in the event of more than 1.5A (typ) flow, such as from a large capacitor or other component connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and unexpected current surges. The IC should not be used in applications where the over current protection circuit will be activated continuously. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 11) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin B B Pin A N P+ N P P+ N P substrate Parasitic element GND E Parasitic N P+ B N P P+ N C E element P substrate GND Parasitic element GND Parasitic GND element Other adjacent elements Example of monolithic IC structure 12) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 13) Back electromotive force (BEMF) There is a possibility that the BEMF is changed by using the operating condition, environment and the individual characteristics of motor. Please make sure there is no problem when operating the IC even though the BEMF is changed. 14) Rush Current When power is supplied to the IC, inrush current may flow instantaneously. It is possible that the charge current from the parasitic capacitance of the internal logic may be unstable. Therefore, give a special consideration with the power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 15) TAB IC’ sub is already connected to TAB, please short TAB to External GND. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 BD1LB500 Series (BD1LB500EFJ-C BD1LBU50EFJ-C BD1LB500FVM-C) Revision History Date Revision Changes 01.Aug.2013 003 New release 06.Aug.2013 004 ・P.11 Figure20 VOUT timing chart is modified. 10.Jan.2014 005 1.Apr.2015 006 10.Nov.2015 007 26.May.2017 008 10.May.2022 009 Condition of Diagnostic output voltage “L level” is added. Item of Diagnostic output voltage “H level” is added. “AEC-Q100 qualified” is added in Features Note (1),(2) and (3) are added Pin No 7 N.C. is added in Pin Description “Cooling Tab”(Symbol; TAB) is added in Pin Description Note (6) is added Min of “ Diagnostic output voltage “H level” “ is changed to 4.88V ”ton” is changed to “toff” in Figure 11. 13. Figure 17 is changed FIN is changed to TAB in 15) “Absolute Maximum Ratings” Note (5) is changed “Heat Dissipation Characteristics” Note(3) is changed “Basic Application Circuit(Recommendation)” Comment of note (3) is added Active clamp energy (single pulse) limit value of Tj(0)=150°C is added in “Absolute Maximum Ratings”. ・P13. Revised expression on the information of Ordering Information. ・P4. ・P4. ・P1. ・P1. ・P2. ・P2. ・P3. ・P4. ・P9. ・P10. ・P15. ・P3. ・P3. ・P1. ・P3. ・P1.2.13.14 www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Added BD1LBU50EFJ-C 17/17 TSZ02201-0G3G0BD00040-1-2 10.May.2022 Rev.009 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001