BD2041AFJ_09

Power Management Switch IC Series or PCs and Digital Consumer Product 1ch Large Current Output USB High Side Switch ICs BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ No.09029EAT03 Description Single channel high side switch IC for USB port is a high side switch having over current protection used in power supply line of universal serial bus (USB). N-channel power MOSFET of low on resistance and low supply current are realized in this IC. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. Features 1) Built-in low on resistance Nch MOS FET Switch. Typ = 80mΩ (BD2041AF/BD2051AFJ) Typ = 100mΩ (BD6518F/BD6519FJ) 2) Continuous current load 0.5A 3) Control input logic Active-Low : BD2041AFJ/ BD6519FJ Active-High : BD2051AFJ/ BD6518FJ 4) Soft start circuit 5) Over current detection 6) Thermal shutdown 7) Under voltage lockout 8) Open drain error flag output 9) Reverse-current protection when power switch off 10) Power supply voltage range 2.7V~5.5V (BD2041AF/BD2051AFJ) 3.0V~5.5V (BD6518F/BD6519FJ) 11) Operating temperature range -40°C~85°C Applications USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth Lineup Parameter Continuous current load (A) Output current at short (A) Control input logic Absolute Maximum Ratings Parameter Supply voltage Enable voltage /OC voltage /OC current OUT voltage Storage temperature Power dissipation BD2041AFJ 0.5 1.0 Low BD2051AFJ 0.5 1.0 High BD6518FJ 0.5 1.1 High BD6519FJ 0.5 1.1 Low Symbol VIN VEN, V/EN V/OC IS/OC VOUT TSTG PD Limits -0.3 to 6.0 -0.3 to 6.0 -0.3 to 6.0 10 -0.3 to 6.0 -55 to 150 560*1 Unit V V V mA V °C mW *1 In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C. * This chip is not designed to protect itself against radioactive rays. ※ IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Operating conditions ◎BD2041AF/BD2051AFJ Parameter Operating voltage Operating temperature Continuous output current ◎BD6518FJ/BD6519FJ Parameter Operating voltage Operating temperature Continuous output current Technical Note Symbol VIN TOPR ILO Limits 2.7 to 5.5 -40 to 85 0 to 500 Unit V °C mA Symbol VIN TOPR ILO Limits 3.0 to 5.5 -40 to 85 0 to 500 Unit V °C mA Electrical characteristics ◎BD2041AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Max. Operating Current IDD 90 120 Standby Current ISTB 0.01 1 V/EN 2.0 0.8 /EN input voltage V/EN 0.4 /EN input current I/EN -1.0 0.01 1.0 /OC output LOW voltage V/OC 0.5 /OC output leak current IL/OC 0.01 1 ON resistance RON 80 100 Output current at short Output rise time Output turn on time Output fall time Output turn off time UVLO threshold ◎BD6519FJ ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 0.7 2.1 2.0 1.0 1.2 1.5 1 3 2.3 2.2 1.3 10 20 20 40 2.5 2.4 Unit μA μA V V V μA V μA mΩ A ms ms μs μs V V Condition V/EN = 0V, OUT = OPEN V/EN = 5V, OUT = OPEN High input Low input Low input 2.7V≤ VIN ≤4.5V V/EN = 0V or V/EN = 5V I/OC = 5mA V/OC = 5V IOUT = 500mA VIN = 5V, VOUT = 0V, CL = 100μF (RMS) RL = 10Ω , CL = OPEN Increasing VIN Decreasing VIN (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Max. 90 140 Operating Current IDD Standby Current 0.01 2 2.5 CTRL input voltage VCTRL 0.7 CTRL input voltage ICTRL -1.0 0.01 1.0 FLAG output resistance RFLAG 180 450 FLAG output leak current ILFLAG 0.01 1 FLAG output delay TDFLAG 2.5 8 100 140 ON resistance RON 140 180 Short circuit output current ISC 0.6 1.6 Output leak current ILEAK 10 Output rise time TON1 1 4 Output turn on delay time TON2 1.3 6 Output fall time TOFF1 1 20 Output turn off delay time TOFF2 3 20 Thermal shutdown threshold TTS 135 VTUVH 2.3 2.5 2.7 UVLO threshold VTUVL 2.1 2.3 2.5 Unit μA μA V V μA Ω μA ms mΩ mΩ A μA ms ms μs μs °C V V Condition VCTRL= 0V, OUT = OPEN VCTRL= 5V, OUT = OPEN High input Low input VCTRL = 0V or VCTRL = 5V IFLAG = 1mA VFLAG = 5V VDD = 5V, IOUT = 500mA VDD = 3.3V, IOUT = 500mA VDD = 5V , VOUT = 0V VCTRL = 5V RL = 10Ω , CL = OPEN Tj increase VDD increasing VDD decreasing www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ ◎BD2051AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Max. Operating Current IDD 90 120 Standby Current ISTB 0.01 1 VEN 2.0 EN input voltage 0.8 VEN 0.4 EN input current IEN -1.0 0.01 1.0 /OC output LOW voltage V/OC 0.5 /OC output leak current IL/OC 0.01 1 ON resistance RON 80 100 Output current at short Output rise time Output turn on time Output fall time Output turn off time UVLO threshold ◎BD6518FJ ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 0.7 2.1 2.0 1.0 1.2 1.5 1 3 2.3 2.2 1.3 10 20 20 40 2.5 2.4 Technical Note Unit μA μA V V V μA V μA mΩ A ms ms μs μs V V Condition VEN = 5V, OUT = OPEN VEN = 0V, OUT = OPEN High input Low input Low input 2.7V≤ VIN ≤4.5V VEN = 0V or VEN = 5V I/OC = 5mA V/OC = 5V IOUT = 500mA VIN = 5V, VOUT = 0V, CL = 100μF (RMS) RL = 10Ω , CL = OPEN Increasing VIN Decreasing VIN (Unless otherwise specified, VDD = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Operating Current 90 IDD Standby Current 0.01 2.5 CTRL input voltage VCTRL CTRL input voltage ICTRL -1.0 0.01 FLAG output resistance RFLAG 180 FLAG output leak current ILFLAG 0.01 FLAG output delay TDFLAG 2.5 100 ON resistance RON 140 Short circuit output current ISC 0.6 Output leak current ILEAK Output rise time TON1 1 Output turn on delay time TON2 1.3 Output fall time TOFF1 1 Output turn off delay time TOFF2 3 Thermal shutdown threshold TTS 135 VTUVH 2.3 2.5 UVLO threshold VTUVL 2.1 2.3 Max. 140 2 0.7 1.0 450 1 8 140 180 1.6 10 4 6 20 20 2.7 2.5 Unit μA μA V V μA Ω μA ms mΩ mΩ A μA ms ms μs μs °C V V Condition VCTRL= 5V, OUT = OPEN VCTRL= 0V, OUT = OPEN High input Low input VCTRL = 0V or VCTRL = 5V IFLAG = 1mA VFLAG = 5V VDD = 5V, IOUT = 500mA VDD = 3.3V, IOUT = 500mA VDD = 5V , VOUT = 0V VCTRL = 0V RL = 10Ω , CL = OPEN Tj increase VDD increasing VDD decreasing www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ  Measurement circuit VIN A 1uF GND IN IN EN(/EN) VEN (V/EN ) OUT OUT OUT /OC Technical Note VIN 1uF GND IN IN EN(/EN) VEN (V/EN ) OUT OUT OUT /OC RL CL Operating current EN, /EN input voltage, Output rise, fall time VIN VIN 10k GND IN IN EN(/EN) OUT OUT OUT /OC IOUT CL VIN VIN 1uF 1uF GND IN IN EN(/EN) VEN (V/EN ) OUT OUT OUT /OC I/OC VEN (V/EN ) ON resistance, Over current detection Fig.1 Measurement circuit /OC output LOW voltage Timing diagram ◎BD2041AFJ/BD6519FJ TOFF1 TON1 VOUT 10% 90% 90% 10% TOFF2 TON2 V/EN 50% Fig.2 Timing diagram 50% VEN 50% Fig.3 Timing diagram 50% TON2 VOUT 10% TON1 90% 90% 10% TOFF2 ◎BD2051AFJ/BD6518FJ TOFF1 ※IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Reference data (BD2041AFJ/BD2051AFJ) 120 Ta=25°C OPERATING CURRENT : IDD [μA] 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 100 OPERATING CURRENT : IDD [μA] 80 60 40 20 0 -50 120 Technical Note 1.0 VIN=5.0V Ta=25°C OPERATING CURRENT : ISTB [μA] 0.8 0.6 0.4 0.2 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.4 Operating current EN,/EN Enable Fig.5 Operating current EN,/EN Enable Fig.6 Operating current EN,/EN Disable 1.0 VIN=5.0V OPERATING CURRENT : ISTB [μA] 0.8 ENABLE INPUT VOLTAGE : VEN, V /EN[V] 0 2.0 2.0 ENABLE INPUT VOLTAGE : VEN, V/EN[V] Ta=25°C 1.5 VIN=5.0V 1.5 Low to High High to Low 0.6 0.4 Low to High 1.0 High to Low 1.0 0.2 0.5 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 Fig.7 Operating current EN,/EN Disable 0.5 /OC OUTPUT LOW VOLTAGE : V/OC[V] /OC OUTPUT LOW VOLTAGE : V/OC[V] 0.5 Fig.8 EN,/EN input voltage Fig.9 EN,/EN input voltage 200 VIN=5.0V Ta=25°C 0.4 Ta=25°C 150 0.4 0.3 0.3 0.2 ON RESISTANCE : R ON[mΩ] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 100 0.2 0.1 0.1 0.0 50 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.10 /OC output LOW voltage Fig.11 /OC output LOW voltage Fig.12 ON resistance 200 2.0 2.0 SHORT CIRCUIT CURRENT : ISC[A] VIN=5.0V SHORT CIRCUIT CURRENT : ISC[A] ON RESISTANCE : R ON [mΩ] 150 1.5 Ta=25°C VIN=5.0V 1.5 100 1.0 1.0 50 0.5 0.5 0 -50 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.13 ON resistance Fig.14 Output current at shortcircuit (BD2041AFJ/51AFJ) Fig.15 Output current at shortcircuit (BD2041AFJ/51AFJ) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note 5.0 5.0 Ta=25°C VIN=5.0V 4.0 RISE TIME : TON1 [ms] 5.0 Ta=25°C 4.0 4.0 3.0 2.0 3.0 2.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 TURN ON TIME : TON2 [ms] RISE TIME : TON1 [ms] 3.0 2.0 1.0 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.16 Output rise time Fig.17 Output rise time Fig.18 Output turn on time 5.0 VIN=5.0V 5.0 5.0 Ta=25°C 4.0 4.0 3.0 VIN=5.0V 4.0 TURN ON TIME : TON2 [ms] 3.0 FALL TIME : T OFF1 [μs] 3.0 2.0 2.0 1.0 0.0 -50 1.0 0.0 FALL TIME : TOFF1 [µs] 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.19 Output turn on time 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.20 Output fall time Fig.21 Output fall time 5.0 5.0 2.5 VIN=5.0V 4.0 TURN OFF TIME : TOFF2 [μs] 4.0 TURN OFF TIME : TOFF2[μs] UVLO THRESHOLD VOLTAGE : VUVLOH, V UVLOL[V] Ta=25°C 2.4 VUVLOH 3.0 3.0 2.0 2.3 2.0 2.2 2.1 VUVLOL 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.22 Output turn off time Fig.23 Output turn off time Fig.24 UVLO threshold voltage 1.0 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] UVLO HYSTERESIS VOLTAGE : VHYS[V] Fig.25 UVLO hysteresis voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Waveform data (BD2041AFJ/BD2051AFJ) V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V RL=10Ω CL=100μF V/EN (1V/div.) Technical Note IOUT (0.2A/div.) V/OC (1V/div.) 220μF 147μF 47μF 330μF IOUT (0.5A/div.) TIME(1ms/div.) VIN=5V RL=10Ω CL=100μF IOUT (0.5A/div.) TIME(1ms/div.) VIN=5V RL=10Ω TIME(0.5ms/div.) Fig.26 Output rise characteristic (BD2041AFJ) Fig.27 Output fall characteristic (BD2041AFJ) Fig.28 Inush current (BD2041AFJ) V/OC (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) TIME(20ms/div.) VIN=5V IOUT (0.5A/div.) TIME(2ms/div.) VIN=5V Fig.29 Over current response Ramped load (BD2041AFJ) V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) Fig.30 Over current response Ramped load (BD2041AFJ) V/OC (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) Thermal Shutdown VIN=5V CL=100μF IOUT (0.5A/div.) TIME (2ms/div.) VIN=5V CL=100μF IOUT (1A/div.) TIME (2ms/div.) VIN=5V CL=100μF IOUT (0.5A/div.) TIME (500ms/div.) Fig.31 Over current response Enable to shortcircuit (BD2041AFJ) VIN (5V/div.) Fig.32 Over current response Output shortcircuit at Enable (BD2041AFJ) Fig.33 Over current response Output shortcircuit at Enable (BD2041AFJ) VIN (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VOUT (5V/div.) IOUT (0.5A/div.) V/OC (5V/div.) TIME (10ms/div.) RL=10Ω CL=147μF V/OC (5V/div.) RL=10Ω CL=147μF TIME (10ms/div.) Fig.34 UVLO VDD increasing (BD2041AFJ) Fig.35 UVLO VDD decreasing (BD2041AFJ) Regarding the output rise/fall and over current detection characteristics of BD2051AFJ, refer to the characteristic of BD2041AFJ. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Reference data (BD6518F/BD6519FJ) 120 Ta=25°C Technical Note 120 VDD=5.0V 1.0 Ta=25°C OPERATING CURRENT : IDD [μA] 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 100 OPERATING CURRENT : IDD [μA] 80 60 40 20 0 -50 OPERATING CURRENT : ISTB[μA] 0.8 0.6 0.4 0.2 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.36 Operating current CTRL Enable 1.0 VDD=5.0V ENABLE INPUT VOLTAGE : VCTRL [V] 0 2.5 Fig.37 Operating current CTRL Enable 2.5 ENABLE INPUT VOLTAGE : VCTRL [V] Ta=25°C 2.0 Low to High 1.5 High to Low Fig.38 Operating current CTRL Disable VDD=5.0V OPERATING CURRENT : ISTB [μA] 0.8 2.0 Low to High 0.6 0.4 1.5 High to Low 1.0 1.0 0.5 0.2 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0.0 -50 0 50 100 AM BIENT TEM PERATURE : Ta[℃ ] Fig.39 Operating current CTRL Disable 250 FLAG OUTPUT RESISTANCE : R FLAG[Ω] Fig.40 CTRL input voltage Fig.41 CTRL input voltage 250 FLAG OUTPUT RESISTANCE : R FLAG[Ω] Ta=25°C VDD=5.0V 200 Ta=25°C 200 200 150 ON RESISTANCE : R ON[mΩ] 150 150 100 100 100 50 0 50 50 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0 -50 Fig.42 FLAG output resistance Fig.43 FLAG output resistance 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.44 ON resistance 200 VDD=5.0V 2.0 Ta=25°C 2.0 SHORT CIRCUIT CURRENT : ISC[A] VDD=5.0V SHORT CIRCUIT CURRENT : ISC[A] ON RESISTANCE : RON [mΩ] 150 1.5 1.5 100 1.0 1.0 50 0.5 0.5 0 -50 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0 50 100 AMBIENT TEMPERATURE : Ta[℃] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.45 ON resistance Fig.46 Output current at shortcircuit Fig.47 Output current at shortcircuit www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note 5.0 5.0 5.0 VDD=5.0V Ta=25°C FLAG OUTPUT DELAY : TDFLAG [ ms] 4.0 Ta=25°C FLAG OUTPUT DELAY : TDFLAG[ms] 4.0 4.0 3.0 2.0 2.0 1.0 1.0 0 .0 2 3 4 5 6 SUPPLY VOLTAGE : VDD[ V] 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] RISE TIME : T ON1 [ms] 3.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.48 FLAG output delay Fig.49 FLAG output delay Fig.50 Output rise time 5.0 VDD=5.0V 5.0 Ta=25°C 5.0 VDD=5.0V 4.0 TURN ON TIME : TON2 [ms] 4.0 4.0 TURN ON TIME : TON2 [ms] 3.0 RISE TIME : TON1 [ms] 3.0 2.0 3.0 2.0 2.0 1.0 0.0 -50 1.0 1.0 0.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.51 Output rise time Fig.52 Output turn on delay time Fig.53 Output turn on delay time 5.0 Ta=25°C 5.0 VDD=5.0V 5.0 Ta=25°C 4.0 FALL TIME : T OFF1 [μs] 4.0 3.0 4.0 TURN OFF TIME : TOFF2 [μs] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2.0 FALL TIME : T OFF1[μs] 3.0 3.0 2.0 2.0 1.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 0.0 Fig.54 Output fall time Fig.55 Output fall time Fig.56 Output turn off delay time 5.0 UVLO THRESHOLD VOLTAGE : VTUVH , VTUVL[V] VDD=5.0V 2.7 UVLO HYSTERESIS VOLTAGE : VHYS[V] 1.0 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 4.0 TURN OFF TIME : TOFF2 [μs] 2.6 2.5 VTUVH 3.0 2.0 2.4 2.3 2.2 2.1 VTUVL 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.57 Output turn off delay time Fig.58 UVLO threshold voltage Fig.59 UVLO hysteresis voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Waveform data (BD6518F/BD6519FJ) VCTRL (1V/div.) VDD=5V RL=10Ω CL=147μF VCTRL (1V/div.) VOUT (1V/div.) IOUT (0.2A/div.) VDD=5V RL=10Ω CL=147μF VCTRL (5V/div.) Technical Note VDD=5V RL=10Ω VOUT (1V/div.) IOUT (0.2A/div.) CL=330μF CL=220μF CL=147μF CL=47μF IOUT (0.2A/div.) VFLAG (1V/div.) TIME(1ms/div.) VFLAG (1V/div.) TIME(1ms/div.) VFLAG (5V/div.) TIME(0.5ms/div.) Fig.60 Output rise characteristic (BD6519FJ) Fig.61 Output fall characteristic (BD6519FJ) Fig.62 Inrush current characteristic (BD6519FJ) VOUT (1V/div.) VOUT (1V/div.) IOUT (0.2A/div.) IOUT (0.2A/div.) VFLAG (1V/div.) VDD=5V VFLAG (1V/div.) VDD=5V TIME(20ms/div.) TIME(2ms/div.) Fig.63 Over current response Ramped load (BD6519FJ) VCTRL (1V/div.) VOUT (1V/div.) VOUT (1V/div.) Fig.64 Over current response Ramped load (BD6519FJ) VDD=5V CL=100μF VOUT (1V/div.) Thermal Shutdown IOUT (0.5A/div.) IOUT (0.5A/div.) IOUT (0.2A/div.) VFLAG (1V/div.) TIME (1ms/div.) VDD=5V CL=100μF VFLAG (1V/div.) TIME (1ms/div.) VDD=5V CL=100μF VFLAG (1V/div.) TIME (200ms/div.) Fig.65 Over current response Enable to shortcircuit (BD6519FJ) Fig.66 Over current response Output shortcircuit at Enable (BD6519FJ) Fig.67 Over current response Output shortcircuit at Enable (BD6519FJ) VDD (1V/div.) VDD (1V/div.) VOUT (1V/div.) VOUT (1V/div.) IOUT (0.2A/div.) IOUT (0.2A/div.) VFLAG (1V/div.) TIME (10ms/div.) RL=10Ω CL=147μF VFLAG (1V/div.) TIME (10ms/div.) RL=10Ω CL=147μF Fig.68 UVLO VIN increasing (BD6519FJ) Fig.69 UVLO VIN decreasing (BD6519FJ) Regarding the output rise/fall and over current detection characteristics of BD6518FJ, refer to the characteristic of BD6519FJ. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ  Block diagram (BD2041AFJ/2051AFJ) GND OUT Technical Note IN UVLO Charge pump OCD OUT GND IN IN 1 2 3 4 8 7 6 5 OUT OUT OUT /OC IN Gate logic OUT Top View EN(/EN) TSD /OC EN(/EN) Fig.70 Block diagram Pin description (BD2041AFJ/2051AFJ) Pin No. Symbol I/O 1 GND I 2, 3 IN I Fig.71 Pin Configuration Pin function Ground. Power supply input. Input terminal to the power switch and power supply input terminal of the internal circuit. At use, connect each pin outside. Enable input. Power switch on at Low level. (BD2041AFJ) Power switch on at High level. (BD2051AFJ) High level input > 2.0V, Low level input < 0.8V. Error flag output. Low at over current, thermal shutdown. Open drain output. Power switch output. At use, connect each pin outside. 4 EN (/EN) I 5 6, 7, 8 I/O circuit /OC OUT O O (BD2041AFJ/2051AFJ) Symbol Pin No Equivalent circuit EN(/EN) 4 /OC 5 OUT 6,7,8 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Block diagram (BD6518FJ/BD6519FJ) GND OUT Technical Note VDD UVLO Charge pump OCD OUT GND VDD VDD 1 2 3 8 7 6 5 OUT OUT OUT FLAG VDD Gate logic OUT Top View CTRL TSD FLAG CTRL 4 Fig.73 Pin Configuration Fig.72 Block diagram Pin description (BD6518FJ/BD6519FJ) Pin No. Symbol I/O 1 2, 3 GND VDD I I Ground. Pin function Power supply input. Input terminal to the power switch and power supply input terminal of the internal circuit. At use, connect each pin outside. Enable input. Power switch on at High level. (BD6518FJ) Power switch on at Low level. (BD6519FJ) High level input > 2.5V, Low level input < 0.7V. Error flag output. Low at over current, thermal shutdown. Open drain output. Power switch output. At use, connect each pin outside. 4 CTRL I 5 6, 7, 8 FLAG OUT O O I/O circuit (BD6518FJ/BD6519FJ) Symbol Pin No Equivalent circuit CTRL 4 FLAG 5 OUT 6,7,8 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 12/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note Functional description (BD2041AFJ/2051AFJ) 1. Switch operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 80mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from OUT to IN. 2. Thermal shutdown circuit (TSD) If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 140°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 120°C (typ.), power switch is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active). 3. Over current detection (OCD) The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ). Under voltage lockout circuit works when the switch is on (EN,/EN signal is active). 5. Error flag (/OC) output Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output. Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 13/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note Functional description (BD6518FJ/BD6519FJ) 1. Switch operation VDD terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VDD terminal is used also as power source input to internal control circuit. When the switch is turned on from CTRL control input, VDD terminal and OUT terminal are connected by a 100mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of VDD terminal, current flows from OUT terminal to VDD terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from OUT to VDD. 2. Thermal shutdown circuit (TSD) If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 135°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch turn off and outputs error flag (FALG). Then, when the junction temperature decreases lower than 125°C (typ.), power switch is turned on and error flag (FLAG) is cancelled. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (CTRL signal is active). 3. Over current detection (OCD) The over current detection circuit limits current (ISC) and outputs error flag (FLAG) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection circuit works when the switch is on (CTRL signal is active). 3-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 200mV(Typ). Under voltage lockout circuit works when the switch is on (CTRL signal is active). 5. Error flag (FLAG) output Error flag output (FLAG) is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output. Over current detection has delay filter on 2.5ms(Typ.). This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 14/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note V/EN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.74 Over current detection, thermal shutdown timing (BD2041AFJ/BD6519FJ) VEN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.75 Over current detection, thermal shutdown timing (BD2051AFJ/BD6518FJ) ※ IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively. Typical application circuit 5V(typ.) VBUS D+ DGND 10k~ 100kΩ CIN GND IN IN OUT OUT OUT + CL Ferrite Beads IN Regulator OUT Ferrite Beads VBUS D+ DGND USB Controller EN(/EN) /OC Fig.76 Typical application circuit (BD2041AFJ/51AFJ) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 15/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1μF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. ※ IN, EN (/EN), and /OC terminal of BD2041AFJ/BD2051AFJ correspond to VDD, CTRL, and FLAG terminal of BD6518FJ/BD6519FJ, respectively. Power dissipation character (SOP-J8) 600 500 POWER DISSIPATION: Pd[mW] 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.77 Power dissipation curve (Pd-Ta Curve) Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 16/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ Technical Note (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 17/18 2009.05 - Rev.A BD2041AFJ,BD2051AFJ,BD6518FJ,BD6519FJ  Ordering part number Technical Note B D 6 Part No. 2041A 2051A 6518 6519 5 1 8 F J - E 2 Part No. Package FJ: SOP-J8 Packaging and forming specification E2: Embossed tape and reel (SOP-J8) SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 8 7 6 5 Tape Quantity 0.45MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.0±0.3 3.9±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 0.545 S 0.2±0.1 1.375±0.1 0.175 1.27 0.42±0.1 0.1 S 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 18/18 2009.05 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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