Power Management Switch ICs for PCs and Digital Consumer Products
1ch High Side Switch ICs
for USB Devices and Memory Cards
No.11029ECT04
BD2045AFJ, BD2055AFJ
●Description
Single channel high side switch IC for USB port is a high side switch having over current protection used in power supply line
of universal serial bus (USB).
N-channel power MOSFET of low on resistance and low supply current are realized in this IC.
And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in.
●Features
1) Low on resistance 80mΩ Nch MOSFET Switch.
2) Continuous current load 0.25A
3) Control input logic
Active-Low : BD2045AFJ
Active-High : BD2055AFJ
4) Soft start circuit
5) Over current detection
6) Thermal shutdown
7) Under voltage lockout
8) Open drain error flag output
9) Reverse-current protection when power switch off
10) Power supply voltage range 2.7V to 5.5V
11) TTL Enable input
12) 1.2ms typical rise time
13) 10μA max standby current
14) Operating temperature range -40°C to 85°C
●Applications
USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth
●Lineup
Parameter
BD2045AFJ
BD2055AFJ
Continuous current load (A)
0.25
0.25
Output current at short (A)
0.5
0.5
Control input logic
Low
High
●Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Supply voltage
VIN
-0.3
to
6.0
V
Enable voltage
VEN, V/EN
-0.3
to
6.0
V
/OC voltage
V/OC
-0.3
to
6.0
V
/OC current
IS/OC
OUT voltage
VOUT
-0.3
6.0
V
Storage temperature
TSTG
-55 to 150
°C
PD
560*1
mW
Power dissipation
10
to
mA
*1 In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C.
* This chip is not designed to protect itself against radioactive rays.
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2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Operating conditions
Parameter
Operating voltage
Operating temperature
Continuous output current
Symbol
Ratings
Unit
VIN
2.7 to 5.5
V
TOPR
-40 to 85
°C
ILO
0 to 250
mA
●Electrical characteristics
◎BD2045AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating Current
IDD
-
90
120
μA
V/EN = 0V, OUT = OPEN
Standby Current
ISTB
-
0.01
1
μA
V/EN = 5V, OUT = OPEN
V/EN
2.0
-
-
V
High input
-
-
0.8
V
Low input
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
/EN input voltage
V/EN
/EN input current
I/EN
-1.0
0.01
1.0
μA
V/EN = 0V or V/EN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
ON resistance
RON
-
80
100
mΩ
IOUT = 250mA
Output current at short
ISC
0.3
0.5
0.7
A
Output rise time
TON1
-
1.2
10
ms
Output turn on time
TON2
-
1.5
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
UVLO threshold
(Unless otherwise specified, VIN = 5.0V, Ta = 25°C)
Limits
Parameter
Symbol
Min.
Typ.
Max.
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
RL = 20Ω , CL = OPEN
◎BD2055AFJ
Unit
Condition
Operating Current
IDD
-
90
120
μA
VEN = 5V, OUT = OPEN
Standby Current
ISTB
-
0.01
1
μA
VEN = 0V, OUT = OPEN
VEN
2.0
-
-
V
High input
-
-
0.8
V
Low input
-
-
0.4
V
Low input 2.7V≤ VIN ≤4.5V
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 5V
/OC output LOW voltage
V/OC
-
-
0.5
V
I/OC = 5mA
/OC output leak current
IL/OC
-
0.01
1
μA
V/OC = 5V
ON resistance
RON
-
80
100
mΩ
EN input voltage
EN input current
Output current at short
VEN
IOUT = 250mA
VIN = 5V, VOUT = 0V,
CL = 100μF (RMS)
ISC
0.3
0.5
0.7
A
TON1
-
1.2
10
ms
Output turn on time
TON2
-
1.5
20
ms
Output fall time
TOFF1
-
1
20
μs
Output turn off time
TOFF2
-
3
40
μs
VTUVH
2.1
2.3
2.5
V
Increasing VIN
VTUVL
2.0
2.2
2.4
V
Decreasing VIN
Output rise time
UVLO Threshold
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RL = 20Ω , CL = OPEN
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Measurement circuit
VIN
VIN
A
1uF
1uF
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
/OC
EN(/EN)
/OC
RL
CL
VEN (V/EN )
VEN (V/EN )
Operating current
VIN
EN, /EN input voltage, Output rise, fall time
VIN
VIN
10k
1uF
VIN
1uF
I/OC
GND
OUT
GND
OUT
IN
OUT
IN
OUT
IN
OUT
IN
OUT
EN(/EN)
/OC
EN(/EN)
/OC
IOUT
CL
VEN (V/EN )
VEN (V/EN )
ON resistance, Over current detection
/OC output LOW voltage
Fig.1 Measurement circuit
●Timing diagram
○BD2045AFJ
○BD2055AFJ
TOFF1
TOFF1
TON1
VOUT
TON1
90%
10%
VOUT
90%
10%
90%
90%
10%
10%
TOFF2
TOFF2
TON2
TON2
V/EN
VEN
50%
50%
50%
Fig.2 Timing diagram
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50%
Fig.3 Timing diagram
3/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Reference data
120
120
1.0
Ta=25°C
VIN=5.0V
60
40
3
4
5
SUPPLY VOLTAGE : VIN [V]
80
60
40
20
0
-50
0
2
OPERATING CURRENT :
ISTB [μA]
OPERATING CURRENT :
IDD [μA]
6
ENABLE INPUT VOLTAGE :
VEN, V /EN[V] 0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
0.4
0.2
VIN=5.0V
1.5
1.5
Low to High
High to Low
1.0
Low to High
High to Low
1.0
0.5
0.5
0.0
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
0.5
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
0.4
0.3
0.2
0.1
Ta=25°C
VIN=5.0V
0.4
0.3
0.2
0.1
0.0
0.0
Fig.10 /OC output LOW voltage
2
Fig.13 ON resistance
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6
1.00
SHORT CIRCUIT CURRENT :
ISC[A]
VIN=5.0V
0.75
0.50
0.25
0.00
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.12 ON resistance
Ta=25°C
SHORT CIRCUIT CURRENT :
ISC[A]
50
50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
1.00
VIN=5.0V
100
100
Fig.11 /OC output LOW voltage
200
150
150
0
-50
6
100
200
0.5
Ta=25°C
0
50
AMBIENT TEMPERATURE : Ta[℃]
Fig.9 EN,/EN input voltage
Fig.8 EN,/EN input voltage
Fig.7 Operating current
EN,/EN Disable
6
Fig.6 Operating current
EN,/EN Disable
ON RESISTANCE :
R ON[mΩ]
OPERATING CURRENT :
ISTB [μA]
0.6
0.0
/OC OUTPUT LOW VOLTAGE :
V/OC[V]
0.0
Ta=25°C
0.8
0
-50
0.2
2.0
VIN=5.0V
3
4
5
SUPPLY VOLTAGE : VIN [V]
0.4
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2.0
1.0
2
0.6
Fig.5 Operating current
EN,/EN Enable
Fig.4 Operating current
EN,/EN Enable
-50
0.8
ENABLE INPUT VOLTAGE :
VEN, V/EN[V]
OPERATING CURRENT :
IDD [μA]
80
20
ON RESISTANCE :
R ON [mΩ]
Ta=25°C
100
100
0.75
0.50
0.25
0.00
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.14 Output current at shortcircuit
4/12
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.15 Output current at shortcircuit
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
5.0
5.0
5.0
Ta=25°C
4.0
3.0
2.0
1.0
TURN ON TIME :
TON2 [ms]
4.0
RISE TIME :
TON1 [ms]
3.0
3.0
2.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
1.0
0.0
-50
6
Fig.16 Output rise time
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2
Fig.17 Output rise time
5.0
Ta=25°C
3.0
2.0
VIN=5.0V
4.0
4.0
3.0
3.0
FALL TIME :
T OFF1 [μs]
FALL TIME :
T OFF1 [μs]
TURN ON TIME :
TON2 [ms]
4.0
2.0
0.0
0.0
2
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
2.0
1.0
1.0
1.0
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
Fig.21 Output fall time
2.5
5.0
Ta=25°C
VIN=5.0V
4.0
TURN OFF TIME :
TOFF2 [μs]
4.0
3.0
2.0
1.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.22 Output turn off time
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.20 Output fall time
Fig.19 Output turn on time
5.0
6
5.0
5.0
VIN=5.0V
0.0
-50
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.18 Output turn on time
UVLO THRESHOLD VOLTAGE :
VUVLOH, VUVLOL[V]
RISE TIME :
TON1 [ms]
4.0
TURN OFF TIME :
TOFF2 [μs]
Ta=25°C
VIN=5.0V
2.4
VUVLOH
2.3
VUVLOL
2.2
2.1
2.0
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.23 Output turn off time
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.24 UVLO threshold voltage
UVLO HYSTERESIS VOLTAGE :
VHYS[V]
1.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.25 UVLO hysteresis voltage
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5/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Waveform data
V/EN
(5V/div.)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VEN
VOUT
(5V/div.)
VIN=5V
RL=20Ω
CL=100μF
(1V/div.)
VOUT
(5V/div.)
VIN=5V
RL=20Ω
CL=100μF
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
CL=100μF
IOUT
(0.1A/div.)
CL=47μF
CL=147μF
V/OC
(1V/div.)
VIN=5V
RL=20Ω
TIME(1ms/div.)
TIME(1ms/div.)
TIME (2ms/div.)
Fig.26 Output rise characteristic
(BD2045AFJ)
Fig.27 Output fall characteristic
(BD2045AFJ)
Fig.28. Inrush current response
(BD2045AFJ)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VIN=5V
IOUT
(0.5A/div.)
VIN=5V
TIME (20ms/div.)
TIME (2ms/div.)
Fig.29 Over current response
Ramped load
(BD2045AFJ)
Fig.30 Over current response
Ramped load
(BD2045AFJ)
V/EN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
Thermal Shutdown
IOUT
(0.5A/div.)
VIN=5V
CL=100μF
IOUT
(0.5A/div.)
VIN=5V
CL=100μF
VIN=5V
CL=100μF
IOUT
(1.0A/div.)
TIME (2ms/div.)
TIME (2ms/div.)
TIME (1s/div.)
Fig.31 Over current response
Enable to shortcircuit
(BD2045AFJ)
Fig.32 Over current response
Enable to shortcircuit
(BD2045AFJ)
Fig.33 Over current response
Enable to shortcircuit
(BD2045AFJ)
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
RL=20Ω
CI=100μF
RL=20Ω
CI=100μF
TIME (10ms/div.)
TIME (10ms/div.)
Fig.34 UVLO response Increasing VIN
(BD2045AFJ)
Fig.35 UVLO response Decreasing VIN
(BD2045AFJ)
Regarding the output rise/fall and over current detection characteristics of BD2055AFJ, refer to the characteristic of BD2045AFJ.
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2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
● Block diagram
GND
OUT
IN
Charge
pump
UVLO
IN
OUT
OCD
EN(/EN)
OUT
7
OUT
3
6
OUT
4
5
/OC
1
IN
2
IN
EN(/EN)
OUT
Gate logic
8
GND
/OC
TSD
Fig.36 Block diagram
●Pin description
◎BD2045AFJ
Pin No.
Symbol
Top View
Fig.37 Pin Configuration
I/O
Pin function
1
GND
I
Ground.
2, 3
IN
I
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
At use, connect each pin outside.
4
/EN
I
Enable input.
Power switch on at Low level.
High level input > 2.0V, Low level input < 0.8V.
5
/OC
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7, 8
OUT
O
Power switch output.
At use, connect each pin outside.
◎BD2055AFJ
Pin No.
Symbol
I/O
Pin function
1
GND
I
Ground.
2, 3
IN
I
Power supply input.
Input terminal to the power switch and power supply input terminal of the internal circuit.
At use, connect each pin outside.
4
EN
I
Enable input.
Power switch on at High level.
High level input > 2.0V, Low level input < 0.8V
5
/OC
O
Error flag output.
Low at over current, thermal shutdown.
Open drain output.
6, 7, 8
OUT
O
Power switch output.
At use, connect each pin outside.
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7/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●I/O circuit
Symbol
Pin No
EN(/EN)
4
/OC
5
OUT
6,7,8
Equivalent circuit
●Functional description
1. Switch operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 80mΩ switch. In
on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from OUT to IN.
2. Thermal shutdown circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 140°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs error flag (/OC). Then, when the junction temperature decreases lower than 120°C (typ.), power switch
is turned on and error flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output
of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over current detection (OCD)
The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over current. The over current detection
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon.
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the over
current detection value. When it exceeds the detection value, current limitation is carried out.
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2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
4. Under voltage lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Error flag (/OC) output
Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
V/EN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.38 Over current detection, thermal shutdown timing
(BD2045AFJ)
VEN
Output shortcircuit
VOUT
Thermal shut down
IOUT
V/OC
delay
Fig.39 Over current detection, thermal shutdown timing
(BD2055AFJ)
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9/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Typical application circuit
5V(typ.)
VBUS
IN
D+
Regulator
OUT
D-
Ferrite
Beads
GND
10k~
100kΩ
USB
Controller
CIN
GND
OUT
IN
OUT
IN
OUT
VBUS
D+
+
CL -
EN(/EN) /OC
DFerrite
Beads
GND
Fig.40 Typical application circuit
●Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND
terminal of IC. 1μF or higher is recommended.
Pull up /OC output by resistance 10kΩ to
100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
●Power dissipation character
(SOP-J8)
600
POWER DISSIPATION: Pd[mW]
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta [℃]
Fig.41 Power dissipation curve (Pd-Ta Curve)
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10/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break
down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal
and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals
a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from
the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring
pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay
attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in
the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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© 2011 ROHM Co., Ltd. All rights reserved.
11/12
2011.06 - Rev.C
Technical Note
BD2045AFJ, BD2055AFJ
●Ordering part number
B
D
2
Part No.
0
4
5
A
F
Part No.
2045A
2055A
J
Package
FJ: SOP-J8
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
(SOP-J8)
SOP-J8
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
0.1 S
1pin
Reel
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
12/12
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.06 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
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