BD2046AFJ

Power Management Switch ICs for PCs and Digital Consumer Products 2ch High Side Switch ICs for USB Devices and Memory Cards BD2046AFJ, BD2056AFJ No.11029EBT05 ●Description High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. ●Features 1) Dual N-MOS high side switch 2) Continuous current load 0.25A 3) Control input logic Active-Low : BD2046AFJ Active-High : BD2056AFJ 4) Soft start circuit 5) Over current detection 6) Thermal shutdown 7) Under voltage lockout 8) Open drain error flag output 9) Reverse-current protection when switch off 10) Flag output delay filter built in ●Applications USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth ●Lineup Parameter Continuous current load (A) Over current detection (A) Control input logic ●Absolute Maximum Ratings Parameter Supply voltage Enable voltage /OC voltage /OC current OUT voltage Storage temperature Power dissipation *1 * BD2046AFJ 0.25 0.5 Low BD2056AFJ 0.25 0.5 High Symbol VIN VEN, V/EN V/OC IS/OC VOUT TSTG Pd Ratings -0.3 -0.3 -0.3 -0.3 to to to 10 to 560 *1 Unit V V V mA V °C mW 6.0 6.0 6.0 6.0 -55 to 150 In the case of exceeding Ta = 25°C, 4.48mW should be reduced per 1°C. This chip is not designed to protect itself against radioactive rays. ●Operating conditions Parameter Operating voltage Operating temperature Continuous output current Symbol VIN TOPR ILO Ratings 2.7 to 5.5 -40 to 85 0 to 250 Unit V °C mA www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Electrical characteristics ○BD2046AFJ (Unless otherwise specified, VIN = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Max. Operating Current Standby Current /EN input voltage /EN input current /OC output LOW voltage /OC output leak current ON resistance Output current at short Output rise time Output turn on time Output fall time Output turn off time UVLO threshold ○BD2056AFJ IDD ISTB V/EN I/EN V/OC IL/OC RON ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 2.0 -1.0 0.3 2.1 2.0 110 0.01 0.01 0.01 100 0.5 1.8 2.1 1 3 2.3 2.2 140 1 0.8 0.4 1.0 0.5 1 130 0.7 10 20 20 40 2.5 2.4 Technical Note Unit μA μA V V V μA V μA mΩ A ms ms Condition V/EN = 0V, OUT = OPEN V/EN = 5V, OUT = OPEN High input Low input Low input 2.7V≤ VIN ≤4.5V V/EN = 0V or V/EN = 5V I/OC = 5mA V/OC = 5V IOUT = 250mA VIN = 5V, VOUT = 0V, CL = 100μF (RMS) RL = 20Ω , CL = OPEN μs μs V V Increasing VIN Decreasing VIN (Unless otherwise specified, VIN = 5.0V, Ta = 25°C) Limits Parameter Symbol Min. Typ. Max. IDD ISTB VEN IEN V/OC IL/OC RON ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 2.0 -1.0 0.3 2.1 2.0 110 0.01 0.01 0.01 100 0.5 1.8 2.1 1 3 2.3 2.2 140 1 0.8 0.4 1.0 0.5 1 130 0.7 10 20 20 40 2.5 2.4 Unit μA μA V V V μA V μA mΩ A ms ms Condition VEN = 5V , OUT = OPEN VEN = 0V , OUT = OPEN High input Low input Low input 2.7V≤ VIN ≤4.5V VEN = 0V or VEN = 5V I/OC = 5mA V/OC = 5V IOUT = 250mA VIN = 5V , VOUT = 0V, CL = 100μF (RMS) Operating Current Standby Current /EN input voltage /EN input current /OC output LOW voltage /OC output leak current ON resistance Output current at short Output rise time Output turn on time Output fall time Output turn off time UVLO threshold RL = 20Ω , CL = OPEN μs μs V V Increasing VIN Decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Measurement circuit VDD 1µF GND IN V EN V EN EN1 EN2 /OC1 OUT1 OUT2 /OC2 Technical Note VDD 1µF GND IN /OC1 OUT1 RL CL OUT2 RL CL /OC2 A VEN VEN EN1 EN2 Operating current VDD 10k /OC1 OUT1 OUT2 /OC2 IOUT IOUT 10k EN, /EN input voltage, Output rise, fall time VDD VDD 1µF GND IN VEN VEN EN1 EN2 IOUT /OC1 OUT1 OUT2 /OC2 IOUT 1µF GND IN VEN VEN EN1 EN2 ON resistance, Over current detection Fig.1 Measurement circuit OC output LOW voltage ●Timing diagram ○BD2046AFJ TOFF1 TON1 VOUT 10% TON2 90% 90% VOUT 10% 10% TON2 TON1 90% 90% ○BD2056AFJ TOFF1 10% TOFF2 TOFF2 VEN 50% 50% VCTRL 50% 50% Fig.2 Timing diagram Fig.3 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Reference data 140 OPERATING CURRENT : IDD [uA] 120 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Ta=25°C 140 120 OPERATING CURRENT : IDD [uA] 100 80 60 40 20 0 -50 1.0 Technical Note VIN=5.0V OPERATING CURRENT : ISTB [uA] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.8 Ta=25°C 0.6 0.4 0.2 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.4 Operating current EN,/EN Enable Fig.5 Operating current EN,/EN Enable Fig.6 Operating current EN,/EN Disable 1.0 VIN=5.0V OPERATING CURRENT : ISTB [uA] 0.8 ENABLE INPUT VOLTAGE : VEN, V /EN[V] 0 2.0 2.0 ENABLE INPUT VOLTAGE : VEN, V/EN[V] Ta=25°C 1.5 VIN=5.0V Low to High High to Low 1.5 0.6 0.4 Low to High 1.0 High to Low 1.0 0.2 0.5 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.7 Operating current EN,/EN Disable 0.5 /OC OUTPUT LOW VOLTAGE : V/OC[V] /OC OUTPUT LOW VOLTAGE : V/OC[V] 0.5 Fig.8 EN,/EN input voltage Fig.9 EN,/EN input voltage 200 Ta=25°C 0.4 0.3 VIN=5.0V 0.4 ON RESISTANCE : R ON[mΩ] 150 Ta=25°C 0.3 0.2 100 0.2 0.1 0.1 0.0 50 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.10 /OC output LOW voltage Fig.11 /OC output LOW voltage Fig. ON resistance 200 2.0 2.0 SHORT CIRCUIT CURRENT : ISC[A] VIN=5.0V SHORT CIRCUIT CURRENT : ISC[A] ON RESISTANCE : R ON [mΩ] 150 1.5 Ta=25°C VIN=5.0V 1.5 100 1.0 1.0 50 0.5 0.5 0 -50 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.13 ON resistance Fig.14 Output current at shortcircuit Fig.15 Output current at short circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ Technical Note 5.0 5.0 Ta=25°C VIN=5.0V 4.0 TURN ON TIME : TON2 [ms] 5.0 Ta=25°C 4.0 4.0 RISE TIME : T ON1 [ms] RISE TIME : T ON1 [ms] 3.0 2.0 3.0 2.0 3.0 2.0 1.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0.0 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.16 Output rise time Fig.17 Output rise time Fig.18 Output turn on time 5.0 VIN=5.0V 5.0 5.0 Ta=25°C 4.0 FALL TIME : T OFF1[us] FALL TIME : T OFF1[us] 4.0 3.0 VIN=5.0V 4.0 TURN ON TIME : TON2 [ms] 3.0 3.0 2.0 2.0 1.0 0.0 -50 2.0 1.0 1.0 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.19 Output turn on time Fig.20 Output fall time Fig.21 Output fall time 6.0 5.0 TURN OFF TIME : TOFF2 [us] 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Ta=25°C 5.0 UVLO THRESHOLD VOLTAGE : VUVLOH , VUVLOL [V] 2.5 VIN=5.0V 4.0 TURN OFF TIME : TOFF2 [us] 2.4 VUVLOH 2.3 3.0 2.0 2.2 2.1 VUVLOL 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.22 Output turn off time Fig.23 Output turn off time Fig.24 UVLO threshold voltage 1.0 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] UVLO HYSTERESIS VOLTAGE : VHYS[V] Fig.25 UVLO hysteresis voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Waveform data V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V RL=10Ω CL=100uF V/EN (1V/div.) Technical Note V/OC (1V/div.) VIN=5V RL=20Ω CL=200µF VIN=5V RL=10Ω CL=100uF IOUT (0.5A/div.) IOUT (0.1A/div.) TIME(1ms/div.) CL=100µ CL=47µF CL=147µF IOUT (0.5A/div.) TIME(1ms/div.) TIME(500us/div.) Fig.26 Output rise characteristic (BD2056AFJ) Fig.27 Output fall characteristic (BD2056AFJ) Fig.28 Inrush current response (BD2056AFJ) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V VIN=5V IOUT (0.5A/div.) TIME(20ms/div.) TIME(2ms/div.) IOUT (0.5A/div.) Fig.29 Over current response Ramped load (BD2056AFJ) V/EN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) V/OC (1V/div.) Fig.30 Over current response Ramped load (BD2056AFJ) VIN=2.5V CL=100uF V/OC (5V/div.) VOUT (5V/div.) VOUT (1V/div.) VIN=5V CL=100uF VIN=5V CL=100uF Thermal Shutdown IOUT (0.5A/div.) TIME (2ms/div.) IOUT (0.5A/div.) TIME (1ms/div.) IOUT (0.5A/div.) TIME (500ms/div.) Fig.31 Over current response Enable to short circuit (BD2056AFJ) V/OC (5V/div.) Fig.32 Over current response Enable to short circuit (BD2056AFJ) V/OC (5V/div.) Fig.33 Over current response Enable to short circuit (BD2056AFJ) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) V/OC (5V/div.) IOUT (0.5A/div.) RL=20Ω CL=100uF TIME (1s/div.) V/OC (5V/div.) RL=20Ω CL=100uF TIME (1s/div.) Fig.34 UVLO response Increasing VIN (BD2056AFJ) Fig.35 UVLO response Decreasing VIN (BD2056AFJ) Regarding the output rise/fall and over current detection characteristics of BD2046AFJ, refer to the characteristic of BD2056AFJ. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Block diagram /EN1 EN1 Gate Logic1 OCD1 TSD1 /OC1 Delay Technical Note Charge Pump1 IN UVLO /EN2 EN2 OCD2 Gate Logic2 GND TSD2 Charge Pump2 OUT1 GND 1 IN 2 /EN1 3 (EN1) /EN2 4 (EN2) Top View 8 /OC1 7 OUT1 6 OUT2 5 /OC2 OUT2 /OC2 Delay Fig.36 Block diagram Fig.37 Pin Configuration ●Pin description ○BD2046AFJ Pin No. 1 2 3, 4 5, 8 6, 7 ○BD2056AFJ Pin No. 1 2 3, 4 5, 8 6, 7 Symbol GND IN /EN /OC OUT I/O I I I O O Ground. Pin function Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. Enable input. Switch on at Low level. High level input > 2.0V, Low level input < 0.8V. Error flag output. Low at over current, thermal shutdown. Open drain output. Switch output. Symbol GND IN EN /OC OUT I/O I I I O O Ground. Pin function Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. Enable input. Switch on at High level. High level input > 2.0V, Low level input < 0.8V Error flag output. Low at over current, thermal shutdown. Open drain output. Switch output. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●I/O circuit Symbol Pin No Equivalent circuit Technical Note EN1(/EN1) EN2(/EN2) /EN1(EN1) /EN2(EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 5, 8 OUT1 OUT2 6, 7 OUT1 OUT2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ Technical Note ●Functional description 1. Switch operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from OUT to IN. 2. Thermal shutdown circuit (TSD) Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output. Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). 3. Over current detection (OCD) The over current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). Under voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). 5. Error flag (/OC) output Error flag output is N-MOS open drain output. At detection of over current, thermal shutdown, low level is output. Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ Technical Note V/EN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.38 Over current detection, thermal shutdown timing (BD2046AFJ) VEN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.39 Over current detection, thermal shutdown timing (BD2056AFJ) ●Typical application circuit 5V(Typ) 10k~100k 10k~100k VBUS D+ OC DGND Regulator OC ON/OFF Data USB Controller Data CIN IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 Data /OC2 CL Ferrite Beads CL IN OUT ON/OFF GND /OC1 BD2046AFJ/56AFJ Fig.40 Typical application circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ Technical Note ●Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1uF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. ●Power dissipation character (SOP-J8) 600 500 POWER DISSIPATION: Pd[mW] 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.41 Power dissipation curve (Pd-Ta Curve) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/13 2011.05 - Rev.B BD2046AFJ, BD2056AFJ ●Ordering part number Technical Note B D 2 Part No. 2046A 2056A 0 4 6 A F J - E 2 Part No. Package FJ: SOP-J8 Packaging and forming specification E2: Embossed tape and reel (SOP-J8) SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 8 7 6 5 Tape Quantity 0.45MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.0±0.3 3.9±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 0.545 S 0.2±0.1 1.375±0.1 0.175 1.27 0.42±0.1 0.1 S 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/13 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A