Datasheet
2ch High Side Switch ICs
2.4A Current Limit High Side Switch ICs
BD2062FJ
BD2066FJ
General Description
Key Specifications
BD2062FJ and BD2066FJ are dual channel high side
switch ICs with an over-current protection for of
Universal Serial Bus (USB) power supply line. Its
switch unit has two channels of N-Channel power
MOSFET. Over current detection circuit, thermal
shutdown circuit, under-voltage lockout, and soft-start
circuit are built in.
Features
Input Voltage Range:
2.7V to 5.5V
ON-Resistance:
80mΩ(Typ)
Continuous Current Load:
1.0A
Current Limit Threshold:
1.5A (Min), 3.0A (Max)
Standby Current:
0.01μA (Typ)
Output Rise Time:
0.8ms(Typ)
Operating Temperature Range:
-40°C to +85°C
W(Typ)
Package
Dual N-MOS High Side Switch
Control Input Logic
Active-Low :
BD2062FJ
Active-High:
BD2066FJ
Soft-Start Circuit
Over Current Detection
Thermal Shutdown
Under-Voltage Lockout
Open-Drain Error Flag Output
Reverse Current Protection
when Power Switch Off
Flag Output Delay
D(Typ)
H (Max)
SOP-J8
4.90mm x 6.00mm x 1.65mm
Applications
Note PC, PC Peripheral USB Hub in Consumer
Appliances, and so forth
Typical Application Circuit
5V(Typ)
GND
/OC1
CL
C IN
IN
OUT1
/EN1
OUT2
(EN1)
Data
/EN2
/OC2
(EN2)
CL
Data
Lineup
Min
1.5A
1.5A
Current Limit Threshold
Typ
Max
2.4A
3.0A
2.4A
3.0A
Control Input
Logic
Low
SOP-J8
Reel of 2500
BD2062FJ-E2
High
SOP-J8
Reel of 2500
BD2066FJ-E2
Package
Orderable Part Number
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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TSZ02201-0E3E0H300160-1-2
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21.Aug.2014 Rev.003
BD2062FJ
Datasheet
BD2066FJ
Block Diagram
TSD1
/EN1
EN1
/OC1
Gate
Logic1
OCD1
Delay
Charge
Pump1
OUT1
IN
UVLO
OUT2
/EN2
EN2
OCD2
Charge
Pump2
/OC2
Gate
Logic2
Delay
GND
TSD2
Pin Configurations
BD2062FJ
TOP VIEW
1 GND
BD2066FJ
TOP VIEW
/OC1 8
1 GND
/OC1 8
2 IN
OUT1 7
2 IN
OUT1 7
3 /EN1
OUT2 6
3 EN1
OUT2 6
4 /EN2
/OC2 5
4 EN2
/OC2 5
Pin Description
Pin No.
Symbol
I/O
1
GND
-
2
IN
-
3, 4
EN, /EN
I
5, 8
/OC
O
6, 7
OUT
O
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TSZ22111･15･001
Pin Function
Ground.
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
Enable input.
/EN: Switch on at low level. (BD2062FJ)
EN: Switch on at high level. (BD2066FJ)
High level input > 2.0V, low level input < 0.8V.
Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
Switch output.
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BD2062FJ
Datasheet
BD2066FJ
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
V IN
-0.3 to +6.0
V
V EN , V /EN
-0.3 to +6.0
V
V /OC
-0.3 to +6.0
V
Supply Voltage
Enable Input Voltage
/OC Voltage
/OC Sink Current
I S/OC
5
mA
OUT Voltage
V OUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
(Note 1)
Pd
0.67
o
W
o
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ C above Ta=25 C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Rating
Symbol
Min
Typ
Max
Unit
Operating Voltage
V IN
2.7
-
5.5
V
Operating Temperature
Topr
-40
-
+85
°C
Electrical Characteristics
BD2062FJ
(Unless otherwise specified V IN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
I DD
-
130
180
μA
V /EN = 0V , OUT=OPEN
Standby Current
I STB
-
0.01
1
μA
V /EN = 5V , OUT=OPEN
V /ENH
2.0
-
-
V
High Input
V /ENL
-
-
0.8
V
Low Input
/EN Input Current
I /EN
-1.0
+0.01
+1.0
μA
V /EN = 0V
/OC Output Low Voltage
V /OC
-
-
0.5
V
I /OC = 1mA
/OC Output Leak Current
I L/OC
-
0.01
1
μA
V /OC = 5V
/OC Delay Time
t /OC
10
15
20
ms
ON-Resistance
R ON
-
80
125
mΩ
I OUT = 500mA
Switch Leak Current
I LSW
-
-
1.0
μA
V /EN = 5V, V OUT = 0V
Reverse Leak Current
I LREV
-
-
1.0
μA
V OUT = 5.5V, V IN = 0V
Current Limit Threshold
I TH
1.5
2.4
3.0
A
Short Circuit Current
I SC
1.1
1.5
2.1
A
Output Rise Time
t ON1
-
0.8
10
ms
R L = 10Ω
Output Turn-ON Time
t ON2
-
1.1
20
ms
R L = 10Ω
Output Fall Time
t OFF1
-
5
20
μs
R L = 10Ω
Output Turn-OFF Time
t OFF2
-
10
40
μs
R L = 10Ω
/EN Input Voltage
UVLO Threshold
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TSZ22111･15･001
or
V OUT = 0V
C L = 47μF (RMS)
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
3/22
V /EN = 5V
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21.Aug.2014 Rev.003
BD2062FJ
Datasheet
BD2066FJ
Electrical Characteristics - continued
BD2066FJ
(Unless otherwise specified V IN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
I DD
-
130
180
μA
V EN = 5V , OUT=OPEN
Standby Current
I STB
-
0.01
1
μA
V EN = 0V , OUT=OPEN
V ENH
2.0
-
-
V
High Input
V ENL
-
-
0.8
V
Low Input
I EN
-1.0
+0.01
+1.0
μA
V EN = 0V
/OC Output Low Voltage
V /OC
-
-
0.5
V
I /OC = 1mA
/OC Output Leak Current
I L/OC
-
0.01
1
μA
V /OC = 5V
/OC Delay Time
t /OC
10
15
20
ms
ON-Resistance
R ON
-
80
125
mΩ
I OUT = 500mA
Switch Leak Current
I LSW
-
-
1.0
μA
V EN = 0V, V OUT = 0V
Reverse Leak Current
I LREV
-
-
1.0
μA
V OUT = 5.5V, V IN = 0V
Current Limit Threshold
I TH
1.5
2.4
3.0
A
Short Circuit Current
I SC
1.1
1.5
2.1
A
Output Rise Time
t ON1
-
0.8
10
ms
R L = 10Ω
Output Turn-ON Time
t ON2
-
1.1
20
ms
R L = 10Ω
Output Fall Time
t OFF1
-
5
20
μs
R L = 10Ω
Output Turn-OFF Time
t OFF2
-
10
40
μs
R L = 10Ω
V TUVH
2.1
2.3
2.5
V
Increasing V IN
V TUVL
2.0
2.2
2.4
V
Decreasing V IN
EN Input Voltage
EN Input Current
UVLO Threshold
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TSZ22111･15･001
4/22
or
V EN = 5V
V OUT = 0V
C L = 47μF (RMS)
TSZ02201-0E3E0H300160-1-2
21.Aug.2014 Rev.003
BD2062FJ
Datasheet
BD2066FJ
Measurement Circuit
VIN
VIN
1µF
1µF
A
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
RL
RL
A.
VIN
Operating Current
B.
1µF
GND
VIN
IOUT
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
10k
1µF
/OC1
IN
CL
EN, /EN Input Voltage, Output Rise / Fall Time
Inrush Current
VDD
IOUT
CL
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
C. ON-Resistance, Over Current Detection
D.
10k
IOUT
IOUT
/OC Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
tOFF1
tOFF1
tON1
tON1
90%
VOUT
90%
10%
10%
tON2
V/EN
V/ENL
90%
10%
10%
tON2
tOFF2
V/ENH
VEN
Figure 2. Timing Diagram(BD2062FJ)
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TSZ22111･15･001
90%
VOUT
VENH
tOFF2
VENL
Figure 3. Timing Diagram(BD2066FJ)
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BD2062FJ
Datasheet
BD2066FJ
Typical Performance Curves
(Reference Data)
180
Ta=25°C
160
Operating Current: IDD (µA)
OPERATING CURRENT: I DD (uA)
Operating CURRENT:
Current: IDD I(µA)
OPERATING
DD (uA)
180
140
120
100
80
60
40
20
4
5
120
100
80
60
40
20
6
0
50
100
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 4. Operating Current vs Supply Voltage
(EN, /EN Enable)
Figure 5. Operating Current vs Ambient Temperature
(EN, /EN Enable)
1
1
Ta=25°C
Standby Current: ISTB (µA)
STANDBY CURRENT:
IDD (uA)
Standby Current: ISTB (µA)
STANDBY CURRENT:
IDD (uA)
3
140
0
-50
0
2
VIN=5V
160
0.8
0.6
0.4
0.2
3
4
5
6
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 6. Standby Current vs Supply Voltage
(EN, /EN Disable)
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TSZ22111･15･001
0.8
0.6
0.4
0.2
0
-50
0
2
VIN=5V
0
50
100
Ambient
Temperature:
T
(°C)
AMBIENT TEMPERATURE:a TA (℃)
Figure 7. Standby Current vs Ambient Temperature
(EN, /EN Disable)
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BD2062FJ
Datasheet
BD2066FJ
Typical Performance Curves - continued
Ta=25°C
Enable Input Voltage: VEN, V/EN (V)
EN INPUT VOLTAGE: V EN (V)
Enable
Input Voltage:
VENV
,V
/EN (V)
EN INPUT
VOLTAGE:
EN (V)
2
Low to High
1.5
High to Low
1
0.5
0
2
3
4
5
Supply Voltage: VIN(V)
SUPPLY VOLTAGE: VIN (V)
6
2
VIN=5V
1.5
High to Low
1
0.5
0
-50
0
/OC
Low
Voltage: V
V/OC
(mV)
/OC (mV)
/OC Output
OUTPUT
VOLTAGE:
/OC Output Low Voltage: V/OC (mV)
/OC OUTPUT VOLTAGE: V /OC (mV)
80
60
40
20
0
3
4
5
6
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
100
VIN=5V
80
60
40
20
0
-50
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 10. /OC Output Low Voltage vs
Supply Voltage
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TSZ22111･15･001
100
Figure 9. EN, /EN Input Voltage vs
Ambient Temperature
(EN1, EN2, /EN1, /EN2)
Ta=25°C
2
50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 8. EN, /EN Input Voltage vs
Supply Voltage
(EN1, EN2, /EN1, /EN2)
100
Low to High
Figure 11. /OC Output Low Voltage vs
Ambient Temperature
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BD2062FJ
Datasheet
BD2066FJ
Typical Performance Curves - continued
120
Ta=25°C
ON-Resistance:
RON
(mΩ)
ON
RESISTANCE:
R ON
(mΩ)
ON-Resistance:
ON
RESISTANCE:RRONON(mΩ)
(mΩ)
120
100
80
60
40
20
4
5
6
60
40
20
0
50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 12. ON-Resistance vs
Supply Voltage
Figure 13. ON-Resistance vs
Ambient Temperature
Ta=25°C
2.5
2
1.5
2
80
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
Current Limit Threshold: ITH (A)
CURRENT LIMIT THRESHOLD:
I TH (A)
Current LIMT
Limit THRESHOLD:
Threshold: ITH I(A)(A)
CURRENT
TH
3
3
100
0
-50
0
2
VIN=5V
3
4
5
6
3
100
VIN=5V
2.5
2
1.5
-50
0
50
100
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 14. Current Limit Threshold vs
Supply Voltage
Figure 15. Current Limit Threshold vs
Ambient Temperature
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TSZ22111･15･001
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BD2062FJ
Datasheet
BD2066FJ
2
ShortCIRCUIT
Circuit Current:
ISC (A) (A)
SHORT
CURRENT:I
SC
ShortCIRCUIT
Circuit Current:
ISC (A)
SHORT
CURRNT:
ISC (A)
Typical Performance Curves - continued
Ta=25°C
1.5
1
0.5
0
2
3
4
5
6
2
VIN=5V
1.5
1
0.5
0
-50
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Output
Rise
Time:
tON1
(ms)
RISE
TIME:
TON1
(ms)
Output Rise Time: tON1 (ms)
RISE TIME: TON1 (ms)
1
0.8
0.6
0.4
0.2
4
5
6
0.8
0.6
0.4
0.2
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA(℃)
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 18. Output Rise Time vs
Supply Voltage
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TSZ22111･15･001
VIN=5V
0
-50
0
3
100
Figure 17. Short Circuit Current vs
Ambient Temperature
Ta=25°C
2
50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 16. Short Circuit Current vs
Supply Voltage
1
0
Figure 19. Output Rise Time vs
Ambient Temperature
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BD2062FJ
Datasheet
BD2066FJ
Typical Performance Curves - continued
1
Ta=25°C
Output Turn ON Time: tON2 (ms)
TURN ON TIME: T ON2 (ms)
Output
Turn
Time:
tON2
(ms)
TURN
ONON
TIME:
T ON2
(ms)
1
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
0
-50
0
2
3
4
5
VIN=5V
6
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 20. Output Turn ON Time vs
Supply Voltage
5
Ta=25°C
Output Fall Time: tOFF1 (µs)
FALL TIME: T OFF1 (us)
Output Fall Time: tOFF1 (µs)
FALL TIME: T OFF1 (us)
5
4
3
2
1
3
4
5
6
100
4
3
2
1
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 23. Output Fall Time vs
Ambient Temperature
Supply VOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
Figure 22. Output Fall Time vs
Supply Voltage
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TSZ22111･15･001
50
VIN=5V
0
-50
0
2
0
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 21. Output Turn ON Time vs
Ambient Temperature
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BD2062FJ
Datasheet
BD2066FJ
Typical Performance Curves - continued
10
Ta=25°C
Output
Turn
OFF
Time:
tOFF2
TURN
OFF
TIME:
T OFF2
(us)(µs)
Output
Turn
OFF
Time:
tOFF2
(µs)
TURN
OFF
TIME:
T OFF2
(us)
10
8
6
4
2
3
4
5
8
6
4
2
0
-50
0
2
VIN=5V
6
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
Figure 24. Output Turn OFF Time vs
Supply Voltage
20
Ta=25°C
/OC Delay Time: t (ms)
/OC DELAY TIME: /OC
T /OC (ms)
/OCDELAY
Delay Time:
(ms)
/OC
TIME: tT/OC
/OC (ms)
20
15
10
5
3
4
5
6
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 26. /OC Delay Time vs
Supply Voltage
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TSZ22111･15･001
50
100
VIN=5V
15
10
5
0
-50
0
2
0
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
T A (℃)
Figure 25. Output Turn OFF Time vs
Ambient Temperature
11/22
0
50
100
Ambient Temperature: Ta(°C)
AMBIENT TEMPERATURE: TA (℃)
Figure 27. /OC Delay Time vs
Ambient Temperature
TSZ02201-0E3E0H300160-1-2
21.Aug.2014 Rev.003
BD2062FJ
Datasheet
BD2066FJ
0.2
2.5
UVLO HYSTERESIS: VHYS (V)
UVLO Hysteresis Voltage: VHYS (V)
UVLO Threshold: VUVLOH, VUVLOL (V)
UVLO THRESHOLD: V UVLO (V)
Typical Performance Curves - continued
2.4
VUVLOH
2.3
2.2
2.1
VUVLOL
2
-50
0
50
100
0.1
0.05
0
-50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA(℃)
Figure 28. UVLO Threshold Voltage vs
Ambient Temperature
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TSZ22111･15･001
0.15
0
50
Ambient TEMPERATURE:
Temperature: TTa(°C)
AMBIENT
(℃)
100
A
Figure 29. UVLO Hysteresis Voltage vs
Ambient Temperature
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BD2062FJ
Datasheet
BD2066FJ
Typical Wave Forms
V/EN
V/EN
VOUT
VOUT
V/OC
V/OC
1V/div
1V/div
1V/div
1V/div
1V/div
1V/div
VIN=5V
CL=100µF
RL=5Ω
IIN
IIN
0.5A/div
0.5A/div
TIME 1ms/div
TIME 200µs/div
Figure 31. Output Fall Characteristics
(BD2062FJ)
Figure 30. Output Rise Characteristics
(BD2062FJ)
V/EN
VIN=5V
RL=5Ω
1V/div
VOUT
1V/div
CL=220µF
1V/div
1V/div
VOUT2
1V/div
1V/div
0.5A/div
VOUT1
V/OC1
CL=47µF
V/OC
IIN
VIN=5V
CL=100µF
RL=5Ω
VIN=5V
CL=220µF
C=10µF
RL=5Ω
IOUT1
CL=220µF
1.0A/div
CL=47µF
TIME 200µs/div
TIME 200µs/div
Figure 32. Inrush Current
CL=47µF, 100µF, 147µF, 220µF
(BD2062FJ)
Figure 33. Inrush Current
(BD2062FJ)
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Typical Wave Forms - continued
VOUT1
VOUT1
1V/div
1V/div
V/OC1
V/OC1
1V/div
1V/div
VOUT2
VOUT2
1V/div
1V/div
VIN=5V
CL=47µF
VIN=5V
CL=47µF
IOUT1
IOUT1
0.5A/div
1.0A/div
TIME 5ms/div
TIME 2ms/div
Figure 34. Over-Current Response
Ramped Load
(BD2062FJ)
Figure 35. Over-Current Response
1Ω Load Connected at Enable
(BD2062FJ)
VIN=5V
CL=47µF
RL=1Ω
V/EN
1V/div
V/OC2
1V/div
VOUT
VOUT1
VOC
V/OC1
IOUT1
IOUT1
1V/div
VIN=5V
CL=47µF
1V/div
1V/div
1V/div
0.5A/div
0.5A/div
TIME 2ms/div
TIME 100ms/div
Figure 36. Over-Current Response
Enable to 1Ω short
(BD2062FJ)
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Figure 37. Thermal Shutdown
Response
(BD2062FJ)
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Typical Application Circuit
5V(Typ.)
(Typ)
10k to 100k
10k~100k
10k~100k
10k to 100k
VBUS
IN
OUT
ON/OFF
GND
/OC1
D+
CL
OC
CIN
DOC
Regulator
GND
ON/OFF
Data
IN
/EN1
(EN1)
/EN2
(EN2)
OUT1
OUT2
Data
/OC2
CL
BD2062FJ/66FJ
USB Controller
Data
Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source
lines and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.
Set up values of C L which satisfies the application.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 80mΩ switch.
In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is not present in the off status, it is possible
to prevent current from flowing reversely from OUT to IN.
2. Thermal Shutdown Circuit (TSD)
Thermal shut down circuit have a dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an over-current occurs, the switch turns off and outputs an error flag (/OC).
Thermal shut down action has hysteresis. When the junction temperature goes down the switch automatically turns on
and resets the error flag. Unless the cause of increase of the chip’s temperature is removed or the output of power switch
is turned off, this operation repeats. The thermal shut down circuit works when the switch of either OUT1 or OUT2 is on
(EN, /EN signal is active).
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3. Over Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN, /EN signal is active).
(1) When the switch is turned on while the output is in short-circuit state, the switch goes into current limit status
immediately.
(2) When the output short-circuits or a high-current load is connected while theswitch is on, very large current flows until
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V(Typ). If V IN drops below 2.2V(Typ) while the
switch is still ON, then UVLO shuts off the switch. UVLO has ahysteresis of 100mV(Typ).
Note: Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
5. Error Flag (/OC) Output
Error flag output is N-MOS open drain output. At detection of over current or thermal shutdown, the output level is low.
Over current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as surge current at switch on or hot plug. . If fault flag output is unused, /OC pin should be
connected to open or ground line.
V/EN
VOUT
Output Short Circuit
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 38. Over Current Detection, Thermal Shutdown Timing
(BD2062FJ)
VEN
VOUT
Output Short Circuit
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 39. Over Current Detection, Thermal Shutdown Timing
(BD2066FJ)
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BD2066FJ
Power Dissipation
(SOP-J8)
700
Power Dissipation: Pd[mW]
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75
100
AMBIENT
[℃]
AmbientTEMPERATURE
Temperature:: TaTa[°C]
125
150
Figure 40. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
EN1(/EN1)
EN2(/EN2)
Pin No
Equivalence Circuit
/EN1(EN1)
/EN2(EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
5, 8
6, 7
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OUT1
OUT2
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 41. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
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Datasheet
BD2066FJ
Ordering Information
B
D
2
0
6
2
Part Number
B
D
F
J
-
Package
FJ: SOP-J8
2
0
6
6
Part Number
F
J
E2
Packaging and forming specification
E2: Embossed tape and reel
-
Package
FJ: SOP-J8
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Part Number Marking
BD2062FJ
D2062
BD2066FJ
D2066
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Datasheet
BD2066FJ
Physical Dimension, Tape and Reel Information
Package Name
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BD2066FJ
Revision History
Date
11.Mar.2013
25.Jun.2013
21.Aug.2014
Revision
001
002
003
Changes
New Release
Modified Block Diagram.
Applied the ROHM Standard Style and improved understandability.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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