BD2066FJ

Power Management Switch ICs for PCs and Digital Consumer Products 2ch High Side Switch ICs for USB Devices and Memory Cards BD2062FJ,BD2066FJ No.11029EBT15 ●Description High side switch for USB is a high side switch having over-current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET. And, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft-start circuit are built in. ●Features 1) Dual N-MOS High Side Switch 2) Current Limit Threshold 2.4A 3) Control Input Logic Active-Low : BD2062FJ Active-High : BD2066FJ 4) Soft-Start Circuit 5) Over-Current Detection 6) Thermal Shutdown 7) Under-Voltage Lockout 8) Open-Drain Error Flag Output 9) Reverse Current Protection When Switch Off 10) Flag Output Delay Filter Built In 11) Power Supply Voltage Range 2.7V~5.5V 12) TTL Enable Input 13) 0.8ms Typical Rise Time 14) 1μA Max Standby Current ●Applications PC, PC peripheral USB hub in consumer appliances, Car accessory, and so forth ●Line Up Matrix Parameter Current limit threshold (A) Control input logic Number of channels Package BD2062FJ 2.4 Low 2ch SOP-J8 BD2066FJ 2.4 High 2ch SOP-J8 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Absolute Maximum Ratings (Ta=25℃) Parameter Supply voltage Enable input voltage /OC voltage /OC sink current OUT voltage Storage temperature Power dissipation *1 * Technical Note Symbol VIN VEN V/OC IS/OC VOUT TSTG Pd Ratings -0.3 ~ 6.0 -0.3 ~ 6.0 -0.3 ~ 6.0 ~5 -0.3 ~ 6.0 -55 ~ 150 675 *1 Unit V V V mA V ℃ mW Mounted on 70mm * 70mm * 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC This product is not designed for protection against radioactive rays. ●Operating Conditions Parameter Operating voltage Operating temperature Symbol VIN TOPR Ratings Min. 2.7 -40 Typ. Max. 5.5 85 Unit V ℃ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Electrical Characteristics ○BD2062FJ (Unless otherwise specified VIN = 5.0V, Ta = 25℃) Limits Parameter Symbol Min. Typ. Operating current Standby current /EN input voltage /EN input current /OC output low voltage /OC output leak current /OC delay time On-resistance Switch leak current Reverse leak current Current limit threshold Short circuit current Output rise time Output turn-on time Output fall time Output turn-off time UVLO threshold IDD ISTB V/EN V/EN I/EN V/OCL IL/OC T/OC RON ILSW ILREV ITH ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 2.0 -1.0 10 1.5 1.1 2.1 2.0 2.4 1.5 0.8 1.1 5 10 2.3 2.2 130 0.01 0.01 0.01 15 80 - Technical Note Max. 180 1 0.8 1.0 0.5 1 20 125 1.0 1.0 3.0 2.1 10 20 20 40 2.5 2.4 Unit μA μA V V μA V μA ms mΩ μA μA A A ms ms μs μs V V Conditions V/EN = 0V , OUT=OPEN V/EN = 5V , OUT=OPEN High input Low input V/EN = 0V or V/EN = 5V I/OC = 1mA V/OC = 5V IOUT = 500mA V/EN = 5V, VOUT = 0V VOUT = 5.5V, VIN = 0V VOUT = 0V CL = 47μF (RMS) RL = 10Ω RL = 10Ω RL = 10Ω RL = 10Ω Increasing VIN Decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ○BD2066FJ (Unless otherwise specified VIN = 5.0V, Ta = 25 ℃) Limits Parameter Symbol Min. Typ. Max. IDD ISTB VEN VEN IEN V/OCL IL/OC T/OC RON ILSW ILREV ITH ISC TON1 TON2 TOFF1 TOFF2 VTUVH VTUVL 2.0 -1.0 10 1.5 1.1 2.1 2.0 130 0.01 0.01 0.01 15 80 2.4 1.5 0.8 1.1 5 10 2.3 2.2 180 1 0.8 1.0 0.5 1 20 125 1.0 1.0 3.0 2.1 10 20 20 40 2.5 2.4 Technical Note Unit μA μA V V μA V μA ms mΩ μA μA A A ms ms μs μs V V Condition VEN = 5V , OUT=OPEN VEN = 0V , OUT=OPEN High input Low input VEN = 0V or VEN = 5V I/OC = 1mA V/OC = 5V Operating current Standby current EN input voltage EN input current /OC output low voltage /OC output leak current /OC delay time On-resistance Switch leak current Reverse leak current Current limit threshold Short circuit current Output rise time Output turn-on time Output fall time Output turn-off time UVLO threshold IOUT = 500mA VEN = 0V, VOUT = 0V VOUT = 5.5V, VIN = 0V VOUT = 0V CL = 47μF (RMS) RL = 10Ω RL = 10Ω RL = 10Ω RL = 10Ω Increasing VIN Decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Measurement Circuit Technical Note VIN 1µF GND IN /OC1 OUT1 OUT2 /OC2 VIN 1µF GND IN /OC1 OUT1 RL CL OUT2 RL CL /OC2 A VEN VEN EN1 EN2 VEN VEN EN1 EN2 Operating current EN, /EN input voltage, Output rise, fall time Inrush current VDD VIN VIN 1µF GND IN IOUT /OC1 OUT1 OUT2 /OC2 IOUT 1µF GND IN 10k /OC1 OUT1 OUT2 /OC2 10k VEN VEN EN1 EN2 VEN VEN EN1 EN2 IOUT IOUT On-resistance, Over-current detection Fig.1 Measurement circuit ●Timing Diagram ○BD2062FJ TOFF1 TON1 VOUT 10% TON2 90% 90% VOUT 10% 10% /OC output low voltage ○BD2066FJ TOFF1 TON1 90% 90% 10% TON2 TOFF2 TOFF2 V/EN 50% 50% VEN 50% 50% Fig.2 Timing diagram Fig.3 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Electrical Characteristic Curves (Reference Data) 180 OPERATING CURRENT: IDD (uA) Technical Note 180 OPERATING CURRENT: IDD (uA) STANDBY CURRENT: IDD (uA) 1 160 140 120 100 80 60 40 20 0 TA=25℃ 160 140 120 100 80 60 40 20 0 VIN=5V TA=25℃ 0.8 0.6 0.4 0.2 0 2 3 4 5 6 -50 0 50 100 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) AMBIENT TEMPERATURE: TA (℃) SUPPLY VOLTAGE: VIN (V) Fig.4 Operating current EN, /EN enable 1 STANDBY CURRENT: IDD (uA) Fig.5 Operating current EN, /EN enable 2 EN INPUT VOLTAGE: VEN (V) Fig.6 Standby current EN, /EN disable 2 VIN=5V TA=25℃ Low to High High to Low EN INPUT VOLTAGE: V (V) EN VIN=5V Low to High 0.8 0.6 0.4 0.2 0 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) 1.5 1.5 High to Low 1 1 0.5 0.5 0 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) 0 -50 0 50 100 AMBIENT TEMPERATURE: TA ( ℃) Fig.7 Standby current EN, /EN disable /OC OUTPUT VOLTAGE: V/OC (mV) 100 80 60 40 20 0 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) /OC OUTPUT VOLTAGE: V/OC (mV) Fig.8 EN, /EN input voltage Fig.9 EN, /EN input voltage TA=25℃ 100 80 60 40 20 0 VIN=5V ON RESISTANCE: RON (mΩ) 120 100 80 60 40 20 0 TA=25℃ -50 0 50 100 2 3 4 5 6 AMBIENT TEMPERATURE: TA (℃) SUPPLY VOLTAGE: VIN (V) Fig.10 /OC output low voltage Fig.11 /OC output low voltage Fig.12 On-resistance VIN=5V CURRENT LIMIT THRESHOLD: ITH (A) CURRENT LIMT THRESHOLD: ITH (A) 120 ON RESISTANCE: RON (mΩ) 3 TA=25℃ 3 VIN=5V 100 80 60 40 20 0 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) 2.5 2.5 2 2 1.5 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) 1.5 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) Fig.13 On-resistance Fig.14 Current limit threshold Fig.15 Current limit threshold www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/16 2011.05 - Rev.B BD2062FJ,BD2066FJ Technical Note 1 OUTPUT RISE TIME: T (ms) ON1 0.8 0.6 0.4 0.2 0 2 SHORT CIRCUIT CURRENT:I (A) SC TA=25℃ 2 VIN=5V RISE TIME: TON1 (ms) 1 0.8 0.6 0.4 0.2 0 TA=25℃ 1.5 1 0.5 0 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) 3 4 5 6 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) SUPPLY VOLTAGE: VIN (V) Fig.16 Short circuit current Fig.17 Short circuit current Fig.18 Output rise time 1 0.8 0.6 0.4 0.2 0 VIN=5V TURN ON TIME: TON2 (ms) 1 0.8 0.6 0.4 0.2 0 TA=25℃ TURN ON TIME: TON2 (ms) 1 0.8 0.6 0.4 0.2 0 VIN=5V RISE TIME: TON1(ms) -50 0 50 100 2 3 4 5 6 -50 0 50 100 AMBIENT TEMPERATURE: TA(℃) SUPPLY VOLTAGE: VIN (V) AMBIENT TEMPERATURE: TA (℃) Fig.19 Output rise time Fig.20 Output turn-on time Fig.21 Output turn-on time 5 4 3 2 1 0 2 TA=25℃ FALL TIME: TOFF1 (us) 5 4 3 2 1 0 VIN=5V TURN OFF TIME: TOFF2 (us) 10 8 6 4 2 0 TA=25℃ FALL TIME: TOFF1 (us) 3 4 5 6 -50 0 50 100 2 3 4 5 6 SUPPLY VOLTAGE: VIN (V) AMBIENT TEMPERATURE: TA (℃) SUPPLY VOLTAGE: VIN (V) Fig.22 Output fall time Fig.23 Output fall time Fig.24 Output turn-off time 10 VIN=5V /OC DELAY TIME: T/OC (ms) 20 TA=25℃ /OC DELAY TIME: T/OC (ms) 20 VIN=5V TURN OFF TIME: TOFF2 (us) 8 6 4 2 0 -50 0 50 100 15 15 10 10 5 5 0 2 3 4 5 6 0 -50 0 50 100 AMBIENT TEMPERATURE: TA (℃) SUPPLY VOLTAGE: VIN ( V) AMBIENT TEMPERATURE: TA ( ℃) Fig.25 Output turn-off time Fig.26 /OC delay time Fig.27 /OC delay time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/16 2011.05 - Rev.B BD2062FJ,BD2066FJ Technical Note 2.5 UVLO THRESHOLD: VUVLO (V) 2.4 2.3 2.2 2.1 2 -50 0 50 100 AMBIENT TEMPERATURE: TA(℃) UVLO HYSTERESIS: V (V) HYS 0.2 0.15 VUVLOH 0.1 VUVLOL 0.05 0 -50 0 50 100 AMBIENT TEMPERATURE: TA( ℃) Fig.28 UVLO threshold voltage Fig.29 UVLO hysteresis voltage ●Waveform Data(BD2062FJ) /EN 1V/div VOUT 1V/div V/OC 1V/div IIN 0.5A/div /EN 1V/div VOUT 1V/div V/OC 1V/div IIN 0.5A/div /EN 1V/div VOUT 1V/div V/OC 1V/div CL=220uF IIN 0.5A/div CL=47uF TIME 200us/div CL=47uF CL=220uF VIN=5V RL=5Ω VIN=5V CL=100uF RL=5Ω VIN=5V CL=100uF RL=5Ω TIME 200us/div TIME 1ms/div Fig.30 Output rise characteristics Fig.31 Output fall characteristics Fig.32 Inrush current CL=47uF, 100uF, 147uF, 220uF VOUT1 1V/div V/OC1 1V/div VOUT2 1V/div IOUT1 1.0A/div VOUT1 1V/div V/OC1 1V/div VIN=5V CL=220uF C=10uF RL=5Ω TIME 200us/div VOUT2 1V/div IOUT1 0.5A/div TIME 5ms/div VIN=5V CL=47uF Fig.33 Inrush current Fig.34 Over-current response ramped load VOUT1 1V/div V/OC1 1V/div VOUT2 1V/div IOUT1 1.0A/div TIME 2ms/div /EN 1V/div VOUT 1V/div VOC 1V/div IOUT1 0.5A/div VIN=5V CL=47uF RL=1Ω V/OC2 1V/div VOUT1 1V/div V/OC1 1V/div IOUT1 0.5A/div VIN=5V CL=47uF VIN=5V CL=47uF TIME 2ms/div TIME 100ms/div Fig.35 Over-current response 1Ωload connected at enable Fig.36 Over-current response enable to short circuit Fig.37 Thermal shutdown response www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Block Diagram /EN1 EN1 Gate Logic1 OCD1 TSD1 /OC1 Delay Technical Note Charge Pump1 IN UVLO /EN2 EN2 OCD2 Gate Logic2 GND TSD2 Charge Pump2 OUT1 GND 1 IN 2 /EN1 3 (EN1) /EN2 4 (EN2) Top View 8 /OC1 7 OUT1 6 OUT2 5 /OC2 OUT2 /OC2 Delay Fig.38 Block diagram Fig.39 Pin configuration ●Pin Description ○BD2062FJ Pin No. 1 Symbol GND I/O Ground. Pin function 2 IN - Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. Enable input. Switch on at Low level. High level input > 2.0V, Low level input < 0.8V. Error flag output. Low at over-current, thermal shutdown. Open drain output. Switch output. 3, 4 /EN I 5, 8 /OC O 6, 7 OUT O ○BD2066FJ Pin No. 1 Symbol GND I/O Ground. Pin function 2 IN - Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. Enable input. Switch on at High level. High level input > 2.0V, Low level input < 0.8V Error flag output. Low at over-current, thermal shutdown. Open drain output. Switch output. 3, 4 EN I 5, 8 /OC O 6, 7 OUT O www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●I/O Circuit Symbol Technical Note Pin No Equivalent circuit /EN1(EN1) /EN2(EN2) EN1(/EN1) EN2(/EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 5, 8 OUT1 OUT2 6, 7 OUT1 OUT2 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Functional Description 1. Switch operation Technical Note IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. And the IN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN/EN control input, IN terminal and OUT terminal are connected by a 100mΩ switch. In on status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to prevent current from flowing reversely from OUT to IN. 2. Thermal shutdown circuit (TSD) Thermal shut down circuit have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an over-current occurs, only the switch of an over-current state become off and error flag is output. Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. The thermal shut down circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). 3. Over-current detection (OCD) The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in short-circuit status When the switch is turned on while the output is in short-circuit status or so, the switch gets in current limit status soon. 3-2. When the output short-circuits while the switch is on When the output short-circuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-voltage lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). Under-voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active). www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/16 2011.05 - Rev.B BD2062FJ,BD2066FJ 5. Error flag (/OC) output Technical Note Error flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. V/EN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.40 Over-current detection, thermal shutdown timing (BD2062FJ) VEN VOUT Output shortcircuit Thermal shut down IOUT V/OC delay Fig.41 Over-current detection, thermal shutdown timing (BD2066FJ) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Typical Application Circuit 5V(Typ.) 10k~100k 10k~100k VBUS D+ OC DGND Regulator OC ON/OFF Data USB Controller CIN IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 Technical Note IN OUT ON/OFF GND /OC1 CL Ferrite Beads Data /OC2 CL BD2062FJ/66FJ Data Fig.42 Typical application circuit ●Application Information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND terminal of IC. 1uF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Power Dissipation Character (SOP-J8) 600 Technical Note 500 POWER DISSIPATION: Pd[mW] 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.43 Power dissipation curve (Pd-Ta Curve) ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/16 2011.05 - Rev.B BD2062FJ,BD2066FJ (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. Technical Note (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/16 2011.05 - Rev.B BD2062FJ,BD2066FJ ●Ordering part number Technical Note B D 2 Part No. 2062 2066 0 6 2 F J - E 2 Part No. Package FJ: SOP-J8 Packaging and forming specification E2: Embossed tape and reel SOP-J8 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 8 7 6 5 Tape Quantity 0.45MIN Embossed carrier tape 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold 6.0±0.3 3.9±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 0.545 S 0.2±0.1 1.375±0.1 0.175 1.27 0.42±0.1 0.1 S 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/16 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A