Datasheet
2ch High Side Switch ICs
2.4A Current Limit High Side Switch ICs
BD2068FJ-M BD2069FJ-M
Key Specifications
General Description
BD2068FJ-M and BD2069FJ-M are dual channel high
side switch ICs with an over-current protection for of
Universal Serial Bus (USB) power supply line. Its
switch unit has two channels of N-Channel power
MOSFET. Over current detection circuit, thermal
shutdown circuit, under-voltage lockout, and soft-start
circuit are built in.
Features
Input Voltage Range:
2.7V to 5.5V
ON-Resistance:
80mΩ(Typ)
Continuous Current Load
1.0A
Current Limit Threshold:
1.5A (Min), 3.0A (Max)
Standby Current:
0.01μA (Typ)
Output Rise Time:
0.8ms(Typ)
Operating Temperature Range:
-40°C to +85°C
Package
(Note 1)
W(Typ)
AEC-Q100 Qualified
Built-in Dual Low ON-Resistance N-channel
MOSFET(Typ 80mΩ)
Control Input Logic
Active-High :
BD2068FJ-M
Active-Low:
BD2069FJ-M
Soft-Start Circuit
Over Current Detection
Thermal Shutdown
Under-Voltage Lockout
Open-Drain Error Flag Output
Reverse Current Protection
when Power Switch Off
Flag Output Delay Filter Built In
(Note 1: Grade3)
D(Typ)
H (Max)
SOP-J8
4.90mm x 6.00mm x 1.65mm
Applications
Car accessory
Typical Application Circuit
3.3V
5V(Typ)
3.3V
10kΩ to
100kΩ
GND
/OC1
CL
IN
10kΩ to
100kΩ
OUT1
C IN
/EN1
(EN1)
/EN2
(EN2)
OUT2
Data
/OC2
CL
BD2068FJ-M/69FJ-M
Data
Lineup
Min
1.5A
1.5A
Current Limit Threshold
Typ
Max
2.4A
3.0A
2.4A
3.0A
○Product structure：Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001
Control Input
Logic
High
SOP-J8
Reel of 2500
BD2068FJ-MGE2
Low
SOP-J8
Reel of 2500
BD2069FJ-MGE2
Package
Orderable Part Number
○This product has not designed protection against radioactive rays
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Datasheet
BD2068FJ-M BD2069FJ-M
Block Diagram
TSD1
/EN1
EN1
/OC1
Gate
Logic1
Delay
Charge
Pump1
OCD1
IN
OUT1
UVLO
OUT2
/EN2
EN2
Charge
Pump2
OCD2
/OC2
Gate
Logic2
Delay
GND
TSD2
Pin Configurations
BD2068FJ-M
TOP VIEW
1 GND
BD2069FJ-M
TOP VIEW
/OC1 8
1 GND
/OC1 8
2 IN
OUT1 7
2 IN
OUT1 7
3 EN1
OUT2 6
3 /EN1
OUT2 6
4 EN2
/OC2 5
4 /EN2
/OC2 5
Pin Description
Pin No.
Symbol
I/O
1
GND
-
2
IN
-
3, 4
EN1, /EN1
EN2, /EN2
I
5, 8
/OC1, /OC2
O
6, 7
OUT1, OUT2
O
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TSZ22111･15･001
Pin Function
Ground.
Power supply input.
Input terminal to the switch and power supply input terminal of the
internal circuit.
Enable input.
EN1, EN2: Switch on at high level. (BD2068FJ-M)
/EN1, /EN2: Switch on at low level. (BD2069FJ-M)
High level input > 2.0V, low level input < 0.8V.
Error flag output.
Low at over-current, thermal shutdown.
Open drain output.
Switch output.
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Datasheet
BD2068FJ-M BD2069FJ-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 to +6.0
V
VEN , V/EN
-0.3 to +6.0
V
V/OC
-0.3 to +6.0
V
Supply Voltage
Enable Input Voltage
/OC Voltage
/OC Sink Current
I/OC
5
mA
OUT Voltage
VOUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
Pd
0.67
(Note 1)
W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Reduce 5.4mW/ oC above Ta=25 oC
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Rating
Symbol
Operating Voltage
Operating Temperature
Unit
Min
Typ
Max
VIN
2.7
-
5.5
V
Topr
-40
-
+85
°C
Electrical Characteristics
BD2068FJ-M (Unless otherwise specified VIN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
IDD
-
130
180
μA
VEN = 5V , OUT=OPEN
Standby Current
ISTB
-
0.01
1
μA
VEN = 0V , OUT=OPEN
VEN
2.0
-
-
V
High Input
VEN
-
-
0.8
V
Low Input
IEN
-1.0
+0.01
+1.0
μA
VEN = 0V or VEN = 5V
/OC Output Low Voltage
V/OCL
-
-
0.5
V
I/OC = 1mA
/OC Output Leak Current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC Delay Time
t/OC
10
15
20
ms
ON-Resistance
RON
-
80
125
mΩ
IOUT = 500mA
Switch Leak Current
ILSW
-
-
1.0
μA
VEN = 0V, VOUT = 0V
Reverse Leak Current
ILREV
-
-
1.0
μA
VOUT = 5.5V, VIN = 0V
Current Limit Threshold
ITH
1.5
2.4
3.0
A
Short Circuit Current
ISC
1.1
1.5
2.1
A
Output Rise Time
tON1
-
0.8
10
ms
RL = 10Ω
Output Turn-ON Time
tON2
-
1.1
20
ms
RL = 10Ω
Output Fall Time
tOFF1
-
5
20
μs
RL = 10Ω
Output Turn-OFF Time
tOFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
VIN Increasing
VTUVL
2.0
2.2
2.4
V
VIN Decreasing
EN Input Voltage
EN Input Current
UVLO Threshold
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TSZ22111･15･001
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VOUT = 0V
CL = 47μF (RMS)
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Datasheet
BD2068FJ-M BD2069FJ-M
Electrical Characteristics - continued
BD2069FJ-M (Unless otherwise specified VIN = 5.0V, Ta = 25°C)
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
IDD
-
130
180
μA
V/EN = 0V , OUT=OPEN
Standby Current
ISTB
-
0.01
1
μA
V/EN = 5V , OUT=OPEN
V/EN
2.0
-
-
V
High Input
V/EN
-
-
0.8
V
Low Input
I/EN
-1.0
+0.01
+1.0
μA
V/EN = 0V or V/EN = 5V
/OC Output Low Voltage
V/OCL
-
-
0.5
V
I/OC = 1mA
/OC Output Leak Current
IL/OC
-
0.01
1
μA
V/OC = 5V
/OC Delay Time
t/OC
10
15
20
ms
ON-Resistance
RON
-
80
125
mΩ
IOUT = 500mA
Switch Leak Current
ILSW
-
-
1.0
μA
V/EN = 5V, VOUT = 0V
Reverse Leak Current
ILREV
-
-
1.0
μA
VOUT = 5.5V, VIN = 0V
Current Limit Threshold
ITH
1.5
2.4
3.0
A
Short Circuit Current
ISC
1.1
1.5
2.1
A
Output Rise Time
tON1
-
0.8
10
ms
RL = 10Ω
Output Turn-ON Time
tON2
-
1.1
20
ms
RL = 10Ω
Output Fall Time
tOFF1
-
5
20
μs
RL = 10Ω
Output Turn-OFF Time
tOFF2
-
10
40
μs
RL = 10Ω
VTUVH
2.1
2.3
2.5
V
VIN Increasing
VTUVL
2.0
2.2
2.4
V
VIN Decreasing
/EN Input Voltage
/EN Input Current
UVLO Threshold
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TSZ22111･15･001
4/22
VOUT = 0V
CL = 47μF (RMS)
TSZ02201-0GGG0H300030-1-2
7.Apr.2015 Rev.001
Datasheet
BD2068FJ-M BD2069FJ-M
Measurement Circuit
VIN
VIN
1µF
1µF
A
GND
/OC1
GND
/OC1
IN
OUT1
IN
OUT1
VEN
EN1
OUT2
VEN
EN1
OUT2
VEN
EN2
/OC2
VEN
EN2
/OC2
RL
RL
A.
Operating Current
B.
CL
CL
EN, /EN Input Voltage, Output Rise / Fall Time
Inrush Current
VDD
VIN
1µF
GND
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
10k
1µF
/OC1
IN
C.
VIN
IOUT
IOUT
GND
/OC1
IN
OUT1
VEN
EN1
OUT2
VEN
EN2
/OC2
ON-Resistance, Over Current Detection
D.
10k
IOUT
IOUT
/OC Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
tOFF1
tOFF1
tON1
tON1
90%
VOUT
90%
10%
10%
tON2
VEN
VENH
90%
10%
10%
tON2
tOFF2
tOFF2
VENL
V/EN
Figure 2. Timing Diagram(BD2068FJ-M)
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TSZ22111･15･001
90%
VOUT
V/ENL
V/ENH
Figure 3. Timing Diagram(BD2069FJ-M)
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Performance Curves
(Reference Data)
180
I (uA)
OPERATING CURRENT:DD
Ta=25°C
160
Operating Current: IDD (µA)
IDD (µA)
Operating Current:
I (uA)
CURRENT:
OPERATING
DD
180
140
120
100
80
60
40
20
3
4
5
Supply
Voltage:
V
(V)
SUPPLY VOLTAGE: IN
VIN (V)
6
120
100
80
60
40
20
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 4. Operating Current vs Supply Voltage
(EN, /EN Enable)
Figure 5. Operating Current vs Ambient Temperature
(EN, /EN Enable)
1
1
Ta=25°C
Standby Current: ISTB (µA)
CURRENT: IDD (uA)
STANDBY
Standby CURRENT:
Current: ISTBI (µA)
STANDBY
DD (uA)
140
0
-50
0
2
VIN=5V
160
0.8
0.6
0.4
0.2
3
4
5
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
6
0.6
0.4
0.2
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
T (℃)
A
Figure 6. Standby Current vs Supply Voltage
(EN, /EN Disable)
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TSZ22111･15･001
0.8
0
-50
0
2
VIN=5V
Figure 7. Standby Current vs Ambient Temperature
(EN, /EN Disable)
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Performance Curves - continued
2
Enable Input Voltage: VEN, V/EN (V)
Ta=25°C
EN INPUT VOLTAGE: EVN (V)
Enable
Input Voltage:
VEN, V
(V)
VN/EN(V)
VOLTAGE:
EN INPUT
E
2
Low to High
1.5
High to Low
1
0.5
VIN=5V
Low to High
1.5
High to Low
1
0.5
0
-50
0
2
3
4
5
6
0
Figure 9. EN, /EN Input Voltage vs
Ambient Temperature
(EN1, EN2, /EN1, /EN2)
100
/OC
LowVOLTAGE:
Voltage: V/OCL
(mV)
OUTPUT
/OCOutput
OC (mV)
/V
/OC OUTPUT VOLTAGE: /VOC (mV)
/OC Output Low Voltage: V/OCL (mV)
Figure 8. EN, /EN Input Voltage vs
Supply Voltage
(EN1, EN2, /EN1, /EN2)
Ta=25°C
80
60
40
20
0
3
4
5
6
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
100
VIN=5V
80
60
40
20
0
-50
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 10. /OC Output Low Voltage vs
Supply Voltage
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TSZ22111･15･001
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Supply Voltage: V (V)
SUPPLY VOLTAGE:INVIN (V)
2
50
Figure 11. /OC Output Low Voltage vs
Ambient Temperature
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Performance Curves - continued
120
120
ON-Resistance:
RONRON
(mΩ)
RESISTANCE:
(mΩ)
ON
ON-Resistance:
RON
RON(mΩ)
RESISTANCE:
(mΩ)
ON
Ta=25°C
100
80
60
40
20
4
5
6
60
40
20
0
50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 12. ON-Resistance vs
Supply Voltage
Figure 13. ON-Resistance vs
Ambient Temperature
3
Current Limit Threshold: I
2.5
2
1.5
3
4
5
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
6
VIN=5V
2.5
2
1.5
-50
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 15. Current Limit Threshold vs
Ambient Temperature
Figure 14. Current Limit Threshold vs
Supply Voltage
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TSZ22111･15･001
100
3
(A)
Ta=25°C
2
80
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
TH
CURRENT LIMIT THRESHOLD:
THI (A)
Current Limit
ITH (A)
THRESHOLD:
LIMTThreshold:
CURRENT
THI (A)
3
100
0
-50
0
2
VIN=5V
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Datasheet
BD2068FJ-M BD2069FJ-M
2
Circuit Current:
ShortCIRCUIT
ISC (A) (A)
CURRENT:I
SHORT
SC
Circuit Current:
Short CIRCUIT
ISC (A)I (A)
CURRNT:
SHORT
SC
Typical Performance Curves - continued
Ta=25°C
1.5
1
0.5
0
2
3
4
5
6
2
VIN=5V
1.5
1
0.5
0
-50
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
100
Figure 17. Short Circuit Current vs
Ambient Temperature
1
1
Ta=25°C
VIN=5V
Time:
Output
Rise
(ms)
T tON1
TIME:
RISE
(ms)
0.8
ON1
ON1
50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 16. Short Circuit Current vs
Supply Voltage
Time:
Output
Rise
(ms)
T tON1
TIME:
(ms)
RISE
0
0.6
0.4
0.2
3
4
5
6
0.4
0.2
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA(℃)
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 18. Output Rise Time vs
Supply Voltage
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TSZ22111･15･001
0.6
0
-50
0
2
0.8
Figure 19. Output Rise Time vs
Ambient Temperature
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Performance Curves - continued
1
Output
Turn
ON
Time:TtON2(ms)
(ms)
TIME:
ON
TURN
Ta=25°C
VIN=5V
0.8
ON2
0.8
ON2
Output
Turn
Time:T tON2
(ms)
TIME:
ONON
(ms)
TURN
1
0.6
0.4
0.2
0.6
0.4
0.2
0
-50
0
2
3
4
5
6
SupplyVOLTAGE:
Voltage: VIN
SUPPLY
V(V)
IN (V)
Figure 20. Output Turn ON Time vs
Supply Voltage
5
100
VIN=5V
Output Fall Time: tOFF1 (µs)
4
FALL TIME: TOFF1 (us)
FALL TIME: TOFF1 (us)
50
5
Ta=25°C
Output Fall Time: tOFF1 (µs)
0
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 21. Output Turn ON Time vs
Ambient Temperature
3
2
1
3
4
5
Supply
Voltage:
V
(V)
IN
SUPPLY VOLTAGE: VIN (V)
6
2
1
0
50
100
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 23. Output Fall Time vs
Ambient Temperature
Figure 22. Output Fall Time vs
Supply Voltage
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TSZ22111･15･001
3
0
-50
0
2
4
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Performance Curves - continued
10
Ta=25°C
Output
Turn
OFF
Time:
T tOFF2
TIME:
OFF
(us)(µs)
TURN
8
VIN=5V
8
OFF2
OFF
Output
Turn
Time:T
tOFF2 (µs)
TIME:
OFF
TURN
OFF2 (us)
10
6
4
2
3
4
5
4
2
0
-50
0
2
6
6
SupplyVOLTAGE:
Voltage: VINV(V)
SUPPLY
IN (V)
Figure 24. Output Turn OFF Time vs
Supply Voltage
20
50
100
20
Ta=25°C
VIN=5V
/OC Delay
t/OCT(ms)
TIME:
DELAYTime:
/OC
/ OC (ms)
Delay Time:
/OC DELAY
t/OCT (ms)
TIME:
/OC
/ OC (ms)
0
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA (℃)
Figure 25. Output Turn OFF Time vs
Ambient Temperature
15
10
5
3
4
5
Supply
Voltage:
V
(V)
IN
SUPPLY VOLTAGE: VIN (V)
6
Figure 26. /OC Delay Time vs
Supply Voltage
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TSZ22111･15･001
10
5
0
-50
0
2
15
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0
50
100
Ambient Temperature: Ta(°C)
AMBIENT TEMPERATURE: TA (℃)
Figure 27. /OC Delay Time vs
Ambient Temperature
TSZ02201-0GGG0H300030-1-2
7.Apr.2015 Rev.001
Datasheet
BD2068FJ-M BD2069FJ-M
0.2
2.5
UVLO HYSTERESIS: VHYS (V)
UVLO Hysteresis Voltage: VHYS (V)
UVLO THRESHOLD: V
UVLO (V)
UVLO Threshold: VUVLOH, VUVLOL (V)
Typical Performance Curves - continued
2.4
VUVLOH
2.3
2.2
2.1
VUVLOL
2
-50
0
50
100
0.1
0.05
0
-50
AmbientTEMPERATURE:
Temperature: Ta(°C)
AMBIENT
TA(℃)
Figure 28. UVLO Threshold Voltage vs
Ambient Temperature
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TSZ22111･15･001
0.15
0
50
Ambient TEMPERATURE:
Temperature: TTa(°C)
AMBIENT
(℃)
100
A
Figure 29. UVLO Hysteresis Voltage vs
Ambient Temperature
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Datasheet
BD2068FJ-M BD2069FJ-M
Typical Wave Forms
BD2069FJ-M
V/EN
V/EN
1V/div
1V/div
VOUT
VOUT
1V/div
1V/div
V/OC
V/OC
1V/div
1V/div
VIN=5V
CL=100µF
RL=5Ω
IIN
IIN
0.5A/div
0.5A/div
TIME 1ms/div
TIME 200µs/div
Figure 31. Output Fall Characteristics
Figure 30. Output Rise Characteristics
V/EN
VIN=5V
RL=5Ω
1V/div
VOUT
1V/div
VIN=5V
CL=100µF
RL=5Ω
VOUT1
1V/div
V/OC1
CL=47µF
1V/div
CL=220µF
V/OC
VOUT2
1V/div
1V/div
IIN
VIN=5V
CL=220µF
RL=5Ω
IOUT1
CL=220µF
1.0A/div
0.5A/div
CL=47µF
TIME 200µs/div
TIME 200µs/div
Figure 32. Inrush Current
CL=47µF, 100µF, 147µF, 220µF
Figure 33. Inrush Current
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Typical Wave Forms - continued
VOUT1
VOUT1
1V/div
1V/div
V/OC1
V/OC1
1V/div
1V/div
VOUT2
VOUT2
1V/div
1V/div
VIN=5V
CL=47µF
VIN=5V
CL=47µF
IOUT1
IOUT1
0.5A/div
1.0A/div
TIME 5ms/div
TIME 2ms/div
Figure 34. Over-Current Response
Ramped Load
Figure 35. Over-Current Response
1Ω Load Connected at Enable
VIN=5V
CL=47µF
RL=1Ω
V/EN
1V/div
V/OC2
1V/div
VOUT
VOUT1
1V/div
1V/div
VOC
V/OC1
1V/div
1V/div
IOUT1
IOUT1
0.5A/div
0.5A/div
TIME 2ms/div
TIME 100ms/div
Figure 36. Over-Current Response
Enable to Short Circuit
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Figure 37. Thermal Shutdown
Response
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Typical Application Circuit
5V(Typ.)
(Typ)
10kΩ to 100kΩ
10k~100k
10k~100k
10kΩ to 100kΩ
VBUS
IN
OUT
ON/OFF
GND
/OC1
D+
CL
OC
IN
OUT1
CIN
DRegulator
GND
/EN1
(EN1)
/EN2
(EN2)
OC
ON/OFF
Data
OUT2
Data
/OC2
CL
BD2068FJ-M/69FJ-M
USB Controller
Data
Application Information
When excessive current flows due to output short circuit or so, ringing occurs by inductance between power source line and
IC. This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor (CIN) should be connected
across IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.
Set up values of CL which satisfies the application.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN(/EN) control input, IN and OUT terminals are connected by a 80mΩ switch. In on
status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current
flows from OUT to IN terminal. On the other hand, when the switch is turned off, it is possible to prevent current from
flowing reversely from OUT to IN terminal since a parasitic diode between the drain and the source of switch MOSFET is
not present.
2. Thermal Shutdown Circuit (TSD)
Thermal shut down circuit have a dual thermal shutdown threshold. Since thermal shutdown works at a lower junction
temperature when an over-current occurs, the switch turns off and outputs an error flag (/OC).
Thermal shut down action has hysteresis. When the junction temperature goes down the switch automatically turns on
and resets the error flag. Unless the cause of increase of the chip’s temperature is removed or the output of power switch
is turned off, this operation repeats. The thermal shut down circuit works when the switch of either OUT1 or OUT2 is on
(EN, /EN signal is active).
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3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. The over-current detection circuit works when the switch is on (EN, (/EN) signal is
active). There are three types of response against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short-circuits or a high capacity load is connected while the switch is on, very large current flows
until the over-current limit circuit reacts. When the current detection and limit circuit operates, current limitation is
carried out.
(3) When the output current increases gradually, current limitation would not operate unless the output current exceeds
the over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still ON, then UVLO shuts off the power switch. UVLO has a hysteresis of 100mV(Typ).
Note: Under-voltage lockout circuit operates when the switch of either OUT1 or OUT2 is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output level
will turn low.
Over current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug. If fault flag output is unused, /OC pin should
be connected to ground line or open.
VEN
VOUT
Output Short Circuit
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 38. Over Current Detection, Thermal Shutdown Timing
(BD2068FJ-M)
V/EN
VOUT
Output Short Circuit
Thermal Shutdown
IOUT
V/OC
/OC Delay Time
Figure 39. Over Current Detection, Thermal Shutdown Timing
(BD2069FJ-M)
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Power Dissipation
(SOP-J8)
600
Power
: PdPd[mW]
[mW]
DISSIPATION:
POWERDissipation
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT
Ta [℃]
Ambient TEMPERATURE:
Temperature : Ta[°C]
Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB.
Figure 40. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No
Equivalence Circuit
/EN1(EN1)
/EN2(EN2)
EN1(/EN1)
EN2(/EN2)
3, 4
/OC1
/OC2
/OC1
/OC2
OUT1
OUT2
5, 8
6, 7
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OUT1
OUT2
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BD2068FJ-M BD2069FJ-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 41. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD2068FJ-M BD2069FJ-M
Ordering Information
B
D
2
0
6
8
Part Number
B
D
F
J
-
Package
FJ: SOP-J8
2
0
6
9
Part Number
F
J
MGE2
Product Rank
M: for Automotive
Packaging and forming specification
G: Halogen free
E2: Embossed tape and reel
-
Package
FJ: SOP-J8
MGE2
Product Rank
M: for Automotive
Packaging and forming specification
G: Halogen free
E2: Embossed tape and reel
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Part Number Marking
BD2068FJ-M
D2068
BD2069FJ-M
D2069
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BD2068FJ-M BD2069FJ-M
Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
7.Apr.2015
Revision
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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