BD2200GUL-E2

Datasheet Load Switch ICs 0.5A, 1.0A Load Switch ICs BD2200GUL BD2201GUL General Description Key Specifications BD2200GUL and BD2201GUL are load switch ICs (N-Channel MOSFET) for portable devices. These ICs have an ON-Resistance of 100mΩ (Typ). Furthermore, soft-start and output discharge circuits are integrated.  Input Voltage Range:  ON-Resistance:  Continuous Current: BD2200GUL BD2201GUL  Standby Current:  Operating Temperature Range: 2.7V to 5.5V 100mΩ(Typ) 0.5A(Max) 1.0A(Max) 0.01μA(Typ) -25°C to +85°C Features  Single Channel of Low ON-Resistance N-Channel MOSFET Built in  Soft-Start Circuit  Output Discharge Circuit W(Typ) Package D(Typ) H(Max) Applications Load Switches for Mobile Phone , Digital Still Cameras, PDA, MP3 Players, PCs, Portable Devices VCSP50L1 1.50mm x 1.00mm x 0.55mm VCSP50L1 1.50mm x 1.00mm x 0.55mm Typical Application Circuit V IN ON / OFF IN OUT IN OUT EN GND LOAD Lineup On-Resistance Output Current Output Turn On Time Control Logic 100mΩ 0.5A 1.0ms High VCSP50L1 Reel of 3000 BD2200GUL-E2 100mΩ 1.0A 1.0ms High VCSP50L1 Reel of 3000 BD2201GUL-E2 Package Orderable Part Number ○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays www.rohm.com TSZ02201-0E3E0H300170-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/18 TSZ22111･14･001 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Block Diagram IN OUT Charge Pump GND EN Pin Configuration (BOTTOM VIEW) B IN OUT OUT A IN EN GND 1 2 3 Pin Description Pin Number Pin Name A3 GND B2, B3 OUT A1, B1 IN A2 EN www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Pin Function Ground Switch output (Connect each pin externally) Switch input (Connect each pin externally) Enable input (Active-high switch on input) 2/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Absolute Maximum Ratings (Ta= 25°C) Parameter Symbol Rating Unit IN Supply Voltage V IN -0.3 to +6.0 V EN Input Voltage V EN -0.3 to V IN + 0.3 V OUT Voltage V OUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 °C Power Dissipation Pd 0.57 (Note 1) W (Note 1) Derate by 4.6mW /°C when operating above Ta=25°C (mounted on 50mm x 58mm x 1.75mm board). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Rating Min Typ Max Unit Switch Input Voltage V IN 2.7 3.3 5.5 V Operation Temperature Topr -25 +25 +85 °C Output Current (BD2200GUL) I LO 0 - 500 mA Output Current (BD2201GUL) I LO 0 - 1000 mA Electrical Characteristics BD2200GUL (Unless otherwise specified, V IN = 3.3V, Ta= 25°C) Parameter Symbol Limit Min Typ Max Unit Conditions [Current Consumption] Operating Current I DD - 20 30 µA V EN = 1.2V, V OUT = Open Standby Current I STB - 0.01 1 µA V EN = 0V, V OUT = Open V ENH 1.2 - - V High Level Input V ENL - - 0.4 V Low Level Input I EN -1 - +1 µA V EN = 0V or V EN = 1.2V ON-Resistance R ON - 100 200 mΩ I LO = 500mA Switch Leakage Current I LEAK - 0.01 1 µA V EN = 0V, V OUT = 0V Output Rise Time t ON1 - 1.0 2.0 ms R L = 10Ω, V OUT : 10% to 90% Output Turn-ON Time t ON2 - 1.2 2.4 ms R L = 10Ω, V EN : 50% to V OUT : 90% Output Fall Time t OFF1 - 2.5 5.0 µs R L = 10Ω, V OUT : 90% to 10% Output Turn-Off Time t OFF2 - 4.5 9.0 µs R L = 10Ω, V EN : 50% to V OUT : 10% Discharge ON-Resistance R DISC - 70 110 Ω I LO = -1mA, V EN = 0V Discharge Current I DISC - 15 20 mA V OUT = 3.3V, V EN = 0V [I/O] EN Input Voltage EN Input Current [Power Switch] [Discharge Circuit] www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Electrical Characteristics - continued BD2201GUL (Unless otherwise specified, V IN = 3.3V, Ta= 25°C) Parameter Symbol Limit Min Typ Max Unit Conditions [Current Consumption] Operating Current I DD - 20 30 µA V EN = 1.2V, V OUT = Open Standby Current I STB - 0.01 1 µA V EN = 0V, V OUT = Open V ENH 1.2 - - V High Level Input V ENL - - 0.4 V Low Level Input I EN -1 - +1 µA V EN = 0V or V EN = 1.2V ON-Resistance R ON - 100 180 mΩ I LO = 500mA Switch Leakage Current I LEAK - 0.01 1 µA V EN = 0V, V OUT = 0V Output Rise Time t ON1 - 1.0 2.0 ms R L = 10Ω, V OUT : 10% to 90% Output Turn-ON Time t ON2 - 1.2 2.4 ms R L = 10Ω, V EN : 50% to V OUT : 90% Output Fall Time t OFF1 - 2.5 5.0 µs R L = 10Ω, V OUT : 90% to 10% Output Turn-OFF Time t OFF2 - 4.5 9.0 µs R L = 10Ω, V EN : 50% to V OUT : 10% Discharge ON-Resistance R DISC - 70 110 Ω I LO = -1mA, V EN = 0V Discharge Current I DISC - 15 20 mA V OUT = 3.3V, V EN = 0V [I/O] EN Input Voltage EN Input Current [Power Switch] [Discharge Circuit] Test Circuit VIN VEN IN OUT IN OUT EN GND CL RL Switch Output Turn ON/OFF Timing VEN VENL VENH t ON2 t OFF2 90% VOUT 90% 10% 10% t ON1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 t OFF1 4/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Typical Performance Curves 40 Ta=25°C OperatingCURRENT Current : IDD: [μA] OPERATING IDD [µA] OperatingCURRENT Current : IDD: [μA] OPERATING IDD [µA] 40 30 20 10 0 2 3 4 5 Supply VOLTAGE Voltage : V:INV [V] SUPPLY IN [V] StandbyCURRENT Current : ISTB STB [µA] STANDBY : I [μA] Standby Current : ISTB[μA] STANDBY CURRENT : ISTB[µA] 0.8 0.6 0.4 0.2 0 50 AMBIENT TEMPERATURE : Ta [°C] Ambient Temperature : Ta[°C] 4 5 6 SUPPLY VIN [V] Supply VOLTAGE Voltage : VIN: [V] Figure 3. Standby Current vs Supply Voltage (EN Disable) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 100 VIN=3.3V 0.8 0.6 0.4 0.2 0.0 -50 0.0 3 10 1.0 Ta=25°C 2 20 Figure 2. Operating Current vs Ambient Temperature (EN Enable) Figure 1. Operating Current vs Supply Voltage (EN Enable) 1.0 30 0 -50 6 VIN=3.3V 0 50 100 Ambient Temperature : Ta[°C] AMBIENT TEMPERATURE : Ta [°C] Figure 4. Standby Current vs Ambient Temperature (EN Disable) 5/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Typical Performance Curves - continued 2.0 Ta=25°C Enable Input Voltage : VEN[V] ENABLE INPUT VOLTAGE : VEN [V] EnableINPUT Input Voltage : VEN EN [V] ENABLE VOLTAGE: V[V] 2.0 1.5 1.0 0.5 0.0 2 3 4 5 SupplyVOLTAGE Voltage : V:INV [V] SUPPLY IN [V] ON-Resistance : RON[mΩ] ON RESISTANCE : RON [mΩ] ON-Resistance : RON[mΩ] ON RESISTANCE : RON [mΩ] 100 50 0 0 50 100 AMBIENT TEMPERATURE : Ta [°C] Ambient Temperature : Ta[°C] VIN=3.3V ILO=100mA 150 100 50 0 -50 6 Figure 7. ON-Resistance vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.5 200 150 3 4 5 SUPPLY IN [V] SupplyVOLTAGE Voltage : V:INV[V] 1.0 Figure 6. EN Input Voltage vs Ambient Temperature Ta=25°C ILO=100mA 2 1.5 0.0 -50 6 Figure 5. EN Input Voltage vs Supply Voltage 200 VIN=3.3V 0 50 100 AMBIENT TEMPERATURE : Ta [°C] Ambient Temperature : Ta[°C] Figure 8. ON-Resistance vs Ambient Temperature 6/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Typical Performance Curves - continued 2.0 VIN=3.3V Ta=25°C Ta=25°C RL=10Ω 1.6 150 Rise Time : tON1[ms] RISE TIME : TON1[ms] ON-Resistance [mΩ] ON ON[ ON RESISTANCE: R :R mΩ] 200 100 50 1.2 0.8 0.4 0 0.0 0 100 200 300 400 500 OutputCURRENT Current : ILO OUTPUT : I[mA] LO [mA] 600 2 2.4 VIN=3.3V RL=10Ω Turn ON Time : tON2[ms] TURN ON TIME : TON2[ms] 1.6 Rise Time : tON1[ms] RISE TIME : TON1[ms] 6 Figure 10. Output Rise Time vs Supply Voltage Figure 9. ON-Resistance vs Output Current 2.0 3 4 5 SupplyVOLTAGE Voltage : VIN [V] SUPPLY :V IN [V] 1.2 0.8 0.4 0.0 Ta=25°C RL=10Ω 2.0 1.6 1.2 0.8 0.4 0.0 -50 0 50 100 2 AMBIENT TEMPERATURE : Ta [°C] Ambient Temperature : Ta[°C] Figure 11. Output Rise Time vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3 4 5 SupplyVOLTAGE Voltage : V: INV[V] SUPPLY IN [V] 6 Figure 12. Output Turn ON Time vs Supply Voltage 7/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Typical Performance Curves - continued 2.0 5.0 VIN=3.3V RL=10Ω Ta=25°C RL=10Ω 4.0 Fall TIME Time :: T tOFF1 OFF1[μs] FALL [µs] Turn ON Time : tON2 [ms] TURN ON TIME : TON2 [ms] 2.4 1.6 1.2 0.8 0.4 0.0 -50 3.0 2.0 1.0 0.0 0 50 100 Ambient Temperature : Ta[°C] AMBIENT TEMPERATURE : Ta [℃] 2 9 VIN=3.3V RL=10Ω Turn OFF Time : tOFF2[μs] TURN OFF TIME : TOFF2[µs] Fall Time [μs] FALL TIME: :tOFF1 TOFF1 [µs] 4.0 3.0 2.0 1.0 0.0 -50 Ta=25°C RL=10Ω 8 6 5 3 2 0 0 50 100 AMBIENT TEMPERATURE : Ta [℃] Ambient Temperature : Ta[°C] 2 Figure 15. Output Fall Time vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6 Figure 14. Output Fall Time vs Supply Voltage Figure 13. Output Turn ON Time vs Ambient Temperature 5.0 3 4 5 Supply VOLTAGE Voltage : V:INV[V] SUPPLY IN [V] 3 4 5 IN [V] SUPPLY VIN [V] SupplyVOLTAGE Voltage : V:INV [V] 6 Figure 16. Output Turn OFF Time vs Supply Voltage 8/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL 9 Turn OFF OFF TIME Time :: tTOFF2 [μs] OFF2 TURN [µs] 8 Discharge ON-Resistance : RDISC[Ω] DISCHARSE ON RESISTANCE : RDISC [Ω] Typical Performance Curves - continued VIN=3.3V RL=10Ω 6 5 3 2 0 -50 0 50 100 AMBIENT : Ta [℃] AmbientTEMPERATURE Temperature : Ta[°C] Discharge ON-Resistance : RDISC [Ω] [Ω] DISCHARSE ON RESISTANCE : RDISC Figure 17. Output Turn OFF Time vs Ambient Temperature 120 120 Ta=25°C 100 80 60 40 20 0 2 3 4 5 IN [V] SUPPLY :V Supply VOLTAGE Voltage : VIN [V] 6 Figure 18. Discharge ON-Resistance vs Supply Voltage VIN=3.3V 100 80 60 40 20 0 -50 0 50 100 Ambient Temperature : Ta[°C] AMBIENT TEMPERATURE : Ta [℃] Figure 19. Discharge ON-Resistance vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Typical Wave Forms (BD2200GUL) VEN (1.0/Div) VEN (1.0V/Div) VOUT (2.0V/Div) VOUT (2.0V/Div) VIN=3.3V RL=10kΩ CL=4.7µF IOUT (20mA/Div) VIN=3.3V RL=10kΩ CL=4.7µF IOUT (20mA/Div) TIME (0.5ms/Div) TIME (0.5ms/Div) Figure 20. Output Turn ON Response (VIN=3.3V RL=10kΩ CL=4.7µF) Figure 21. Output Turn OFF Response (VIN=3.3V RL=10kΩ CL=4.7µF) VOUT (2.0V/Div) VIN=3.3V RL=10kΩ CL=22µF CIN=10µF CL=4.7µF IOUT (20mA/Div) TIME (0.5ms/Div) Figure 22. Rush Current Response (VIN=3.3V RL=10kΩ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Application Circuit Example ON / OFF V IN IN OUT IN OUT EN GND LOAD This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. Functional Description 1. Switch Operation IN and OUT are connected to the MOSFET’s drain and source. By setting the EN input to high, the internal charge pump operates and turns on the MOSFET. When the MOSFET is turned on, the switch becomes bi-directional. Consequently, when V IN < V OUT , the current is flowing from OUT to IN. 2. Output Discharge Circuit The output discharge circuit operates when the switch is turned off. During its operation, a 70Ω (Typ) resistor is connected between OUT and GND. Unwanted electrical charge is discharged quickly into this resistor. IN EN OUT Discharge Circuit ON OFF ON OFF ON Figure 23. Timing Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Power Dissipation 700 POWER DISSIPATION : Pd [mW] Power Dissipation : Pd[mW] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT Temperature TEMPERATURE :: Ta[°C] Ta [℃] Ambient 50mm x 58mm x 1.75mm Glass Epoxy Board Figure 24. Power Dissipation Curve (Pd-Ta Curve) (VCSP50L1 Package) I/O Equivalence Circuit Pin Name Pin Number Equivalence Circuit IN EN A2 IN A1, B1 OUT B2, B3 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 EN IN OUT 12/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In rush Current 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND Figure 25. Example of monolithic IC structure N Region close-by GND 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Ordering Information B D 2 2 0 0 G Part Number B D U L - Package GUL: VCSP50L1 2 2 0 1 G Part Number U L - Package GUL: VCSP50L1 E2 Packaging and forming specification E2: Embossed tape and reel E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VCSP50L1 (TOP VIEW) 1PIN MARK Part Number Marking LOT Number Part Number Part Number Marking BD2200GUL ABA BD2201GUL ABU www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Physical Dimension Tape and Reel Information VCSP50L1 (BD2200GUL) 1.00±0.05 Package Name 1PIN MARK ABA 1.50±0.05 0.10±0.05 0.55MAX Lot. No. S 0.06 S 0.05 AB 0.25±0.05 (φ0.15) INDEX POST 6-φ0.25±0.05 A 0.5 B B A 1 0.25±0.05 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2 P=0.5×2 16/18 3 (Unit: mm) TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Physical Dimension Tape and Reel Information - continued Package Name VCSP50L1 (BD2201GUL) 1PIN MARK Lot No. 1.00±0.05 ABU 0.10±0.05 0.55MAX 1.50±0.05 S 0.06 S 0.05 AB 0.25±0.05 (φ0.15)INDEX POST 6-φ0.25±0.05 A 0.5 B B A 1 0.25 0.25±0.05 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2 3 (Unit: mm) P=0.5×2 17/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet BD2200GUL BD2201GUL Revision History Date Revision 11.Mar.2013 21.Aug.2014 001 002 Changes New Release Applied the ROHM Standard Style and improved understandability. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/18 TSZ02201-0E3E0H300170-1-2 21.Aug.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001