Power Management Switch ICs for PCs and Digital Consumer products
Load Switch ICs for Portable Equipment
BD2200GUL, BD2201GUL
No.11029EAT22
●Description BD2200GUL ,BD2201GUL are Load switches for portable device. It is Load switch IC with build-in N channel MOSFET. This switch IC achieves On-resistance of 100mΩ (Typ.). It has the function of Soft-Start and build-in discharge circuit. ●Features 1) Single Channel Of Low On-resistance (Typ.=100mΩ) N-channel MOSFET Built in 2) 500mA Output Load Current (BD2200GUL) 1000mA Output Load Current (BD2201GUL) 3) Soft-Start Function 4) Output Discharge Circuit 5) VCSP50L1 package ●Application Mobile phone, Digital still camera, PDA, MP3 player, PC, etc. ●Line up matrix Part Number BD2200GUL BD2201GUL On-resistance 100mΩ 100mΩ Output current 500mA 1000mA Discharge circuit ○ ○ Logic control input High High Package VCSP50L1 1.5×1.0 mm VCSP50L1 1.5×1.0 mm
●Absolute Maximum Ratings (Ta=25℃) Parameter VIN Supply voltage EN input voltage VOUT voltage Storage temperature Power dissipation
*1 *
Symbol VIN VEN VOUT TSTG Pd
Ratings -0.3 ~ 6.0 -0.3 ~ VIN + 0.3 -0.3 ~ 6.0 -55 ~ 150 575 *1
Unit V V V ℃ mW
Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25℃ This product is not designed for protection against radioactive rays.
●Operation Conditions Parameter Switch input voltage Operation temperature Output current (BD2200GUL) Output current (BD2201GUL) Symbol VIN TOPR ILO ILO Ratings Min. 2.7 -25 0 0 Typ. 3.3 25 Max. 5.5 85 500 1000 Unit V ℃ mA mA
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Electrical Characteristics ○BD2200GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃) Parameter [Current consumption] Operating current Standby current [I/O] EN input voltage EN input current [Power switch] On-resistance Switch leakage current Output rise time Output turn-on time Output fall time Output turn-off time [Discharge circuit] Discharge on-resistance Discharge current RDISC IDISC 70 15 110 20 Ω mA RON ILEAK TON1 TON2 TOFF1 TOFF2 100 0.01 1.0 1.2 2.5 4.5 200 1 2.0 2.4 5.0 9.0 mΩ µA ms ms µs µs ILO = 500mA VENH VENL IEN 1.2 -1 0.4 1 V V µA High level input Low level input IDD ISTB 20 0.01 30 1 µA µA Symbol Limits Min. Typ. Max. Unit
Technical Note
Condition
VEN = 1.2V, VOUT = open VEN = 0V, VOUT = open
VEN = 0V or VEN = 1.2V
VEN = 0V, VOUT = 0V RL = 10Ω, VOUT :10% → 90% RL = 10Ω, VEN :50% →VOUT :90% RL = 10Ω, VOUT :90% → 10% RL = 10Ω, VEN :50% →VOUT :10%
ILO = -1mA, VEN = 0V VOUT = 3.3V, VEN = 0V
○BD2201GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃) Parameter [Current consumption] Operating current Standby current [I/O] EN input voltage EN input current [Power switch] On-resistance Switch leakage current Output rise time Output turn-on time Output fall time Output turn-off time [Discharge circuit] Discharge on-resistance Discharge current RDISC IDISC 70 15 110 20 Ω mA ILO = -1mA, VEN = 0V VOUT = 3.3V, VEN = 0V RON ILEAK TON1 TON2 TOFF1 TOFF2 100 0.01 1.0 1.2 2.5 4.5 180 1 2.0 2.4 5.0 9.0 mΩ µA ms ms µs µs ILO = 500mA VEN = 0V, VOUT = 0V RL = 10Ω, VOUT :10% → 90% RL = 10Ω, VEN :50% →VOUT :90% RL = 10Ω, VOUT :90% → 10% RL = 10Ω, VEN :50% →VOUT :10% VENH VENL IEN 1.2 -1 0.4 1 V V µA High level input Low level input VEN = 0V or VEN = 1.2V IDD ISTB 20 0.01 30 1 µA µA VEN = 1.2V, VOUT = open VEN = 0V, VOUT = open Symbol Limits Min. Typ. Max. Unit Condition
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Test Circuit
VIN VIN VIN V EN EN VOUT VOUT GND CL RL
Technical Note
Fig.1 Measurement circuit ●Switch Output Turn ON/OFF Timing
VEN
50% TON2
50% TOFF2
90% VOUT 10% TON1
90%
10% TOFF1
Fig.2 Timing diagrams
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Reference Data
40 OPERATING CURRENT : IDD [µA] 40
1.0
Technical Note
Ta=25℃
OPERATING CURRENT : IDD [µA] 30 30
VIN=3.3V
STANDBY CURRENT : ISTB[µA] 0.8
Ta=25℃
0.6
20
20
0.4
10
10
0.2
0 2 3 4 5 6 SUPPLY VOLTAGE : VIN [V]
0 -50
0.0
0
50
100
2
AMBIENT TEMPERATURE : Ta [°C]
3 4 5 SUPPLY VOLTAGE : VIN [V]
6
Fig.3 Operating current EN enable
1.0
ENABLE INPUT VOLTAGE: VEN[V] 2.0
Fig.4 Operating current EN enable
2.0 ENABLE INPUT VOLTAGE : VEN [V]
Fig.5 Standby current EN disable
VIN=3.3V
STANDBY CURRENT : ISTB[µA] 0.8
Ta=25℃
1.5
VIN=3.3V
1.5
0.6
1.0
1.0
0.4
0.2
0.5
0.5
0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta [°C]
0.0 2 3 4 5 6 SUPPLY VOLTAGE : VIN [V]
0.0 -50
0 50 100 AMBIENT TEMPERATURE : Ta [°C]
Fig.6 Standby current EN disable
200 ON RESISTANCE : RON [mΩ]
200
Fig.7 EN input voltage
Fig.8 EN input voltage
200
ON RESISTANCE : R ON [mΩ]
150
150
ON RESISTANCE : R ON[mΩ]
Ta=25℃ ILO=100mA
VIN=3.3V ILO=100mA
VIN=3.3V Ta=25℃
150
100
100
100
50
50
50
0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6
0 -50
0
0 50 100 AMBIENT TEMPERATURE : Ta [°C]
0
100 200 300 400 500 OUTPUT CURRENT : ILO [mA]
600
Fig.9 On-resistance vs. VIN
Fig.10 On-resistance vs. temperature
Fig.11 On-resistance vs. ILO
2.0
2.0
Ta=25℃ RL=10Ω
1.6 RI SE TIME : TON1[ms ]
VIN=3.3V RL=10Ω TURN ON TIME : TON2[ms]
2.4 2.0 1.6 1.2 0.8 0.4 0.0
Ta=25℃ RL=10Ω
1.6 RISE TIME : TON1[ms]
1.2
1.2
0.8
0.8
0.4
0.4
0.0 2 3 4 5 6 SUPPLY VOLTAGE : VIN [V]
0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta [°C]
2
3 4 5 SUPPLY VOLTAGE : VIN [V]
6
Fig.12 Output rise time
Fig.13 Output rise time
Fig.14 Output turn-on time
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
Technical Note
2.4 2.0 1.6 1.2 0.8 0.4 0.0 -50
VIN=3.3V RL=10Ω
FALL TIME : TOFF1 [µs]
5.0
5.0
TURN ON TIME : TON2 [ms]
4.0
Ta=25℃ RL=10Ω
FALL TI ME : TOFF1[ µs]
4.0
VIN=3.3V RL=10Ω
3.0
3.0
2.0
2.0
1.0
1.0
0.0
0 50 100
0.0
2
AMBIENT TEMPERATURE : Ta [℃]
3 4 5 SUPPLY VOLTAGE : VIN [V]
6
-50
0 50 100 AMBIENT TEMPERATURE : Ta [℃]
Fig.15 Output turn-on time
Fig.16 Output fall time
Fig.17 Output fall time
TURN OFF TIME : TOFF2 [µs]
8 6 5 3 2 0 2
Ta=25℃ RL=10Ω
TURN OFF TIME : TOFF2 [µs]
8 6 5 3 2 0 -50
VIN=3.3V RL=10Ω
DISCHARSE ON RESISTANCE : RDISC [Ω]
9
9
120
Ta=25℃
100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6
3 4 5 SUPPLY VOLTAGE : VIN [V]
6
0 50 100 AMBIENT TEMPERATURE : Ta [℃]
Fig.18 Output turn-off time
Fig.19 Output turn-off time
Fig.20 Discharge on-resistance
DISCHARSE ON RESISTANCE : RDISC [Ω]
120
VIN=3.3V
100 80 60 40 20 0 -50
0
50
100
AMBIENT TEMPERATURE : Ta [℃]
Fig.21 Discharge on-resistance
●Waveform Data (BD2200GUL)
VEN (1.0V/div.) VOUT (2.0V/div.) CL=22µF VIN=3.3V RL=10kΩ
VEN (1.0V/div.)
VOUT (2.0V/div.) IOUT (20mA/div.) VIN=3.3V RL=10kΩ CL=4.7µF
VOUT (2.0V/div.) IOUT (20mA/div.) VIN=3.3V RL=10kΩ CL=4.7µF IOUT (20mA/div.)
CIN=10µF CL=4.7µF
TIME (0.5ms/div.)
TIME (0.5ms/div.)
TIME (0.5ms/div.)
Fig.22 Output turn-on response
Fig.23 Output turn-off response
Fig.24 Rush current response
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Block Diagram B
VIN VOUT
Technical Note
VIN VIN 1
VOUT VOUT EN 2 GND 3
A
BD2200GUL,BD2201GUL (Bottom view)
charge pump
GND EN
Fig.26 Pin configuration
Fig.25 Bock diagram ●Pin Description Pin number A3 B2, B3 A1, B1 A2 Pin name GND VOUT VIN EN Ground Switch output (connect each pin externally) Switch input (connect each pin externally) Enable input (Active-High Switch on input) Pin function
●I/O Equivalent Circuit Pin name Pin number Equivalent circuit
VIN
EN
A2
EN
VIN VOUT
A1, B1 B2, B3
VIN
VOUT
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Operation Description
Technical Note
1. Switch operation Each VIN and VOUT pins are connected to MOSFET’s drain and source. By setting EN input to High level, the internal charge pump operates and turns on MOSFET. When MOSFET is turned on, the switch becomes bidirectional characteristics. Consequently, in case of VIN < VOUT, the current is flowing from VOUT to VIN. 2. Output discharge circuit Discharge circuit operates when switch is off. When discharge circuit operates, 70Ω (Typ.) resistor is connected between VOUT pin and GND pin. This discharges the electrical charge quickly.
VIN EN VOUT Discharge circuit ON OFF ON OFF ON
Fig.27 Operation timing
●Application Circuit Example
●Power Dissipation Characteristics
700
VIN VIN
VOUT VOUT GND
POWER DISSIPATION : Pd [mW]
600
500
VIN
ON/OFF
EN
LOAD
400
300
200
Fig.28 Application circuit example
**This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC.
100
0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta [ ℃]
Fig.29 Power dissipation curve (Pd-Ta Curve) (VCSP50L1 package)
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
Technical Note
●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the Occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (PD) in actual states of use.
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2011.02 - Rev.A
BD2200GUL, BD2201GUL
●Ordering part number
Technical Note
B
Part No.
D
2
Part No. 2200 2201
2
0
0
G
U
L
-
E
2
Package GUL: VCSP50L1
Packaging and forming specification E2: Embossed tape and reel
VCSP50L1(BD2200GUL)
1.00±0.05
Tape Quantity
0.10±0.05 0.55MAX
1PIN MARK
Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
1.50±0.05
Direction of feed
S
( reel on the left hand and you pull out the tape on the right hand
)
6-φ0.25±0.05 0.05 A B
BB
A 1 2
A
0.5
0.25±0.05
(φ0.15)INDEX POST
0.06 S
3
0.25±0.05
P=0.5×2
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
VCSP50L1(BD2201GUL)
1PIN MARK
Tape Quantity
1.00±0.05 0.10±0.05 0.55MAX
Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
1.50±0.05
Direction of feed
S
( reel on the left hand and you pull out the tape on the right hand
)
6-φ0.25±0.05 0.05 A B
B
B A
A
0.25 0.25±0.05
1
2
3
0.5
0.25±0.05
(φ0.15)INDEX POST
0.06 S
P=0.5×2
1pin
Direction of feed
(Unit : mm)
Reel
∗ Order quantity needs to be multiple of the minimum quantity.
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2011.02 - Rev.A
Notice
Notes
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R1120A