Datasheet
Load Switch ICs
for Portable Equipment
BD2202G-LB BD2206G-LB
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market. The High-side switch, which has
over-current protection function, is used for the power
supply line of a memory card slot. In the switch part, an
N-channel MOSFET with low ON resistance has been 1
circuit integrated. The switch goes OFF when the
over-current condition lasts longer than the
over-current shutdown time. The OFF switch is set to
latch off mode. The operating voltage range is 2.7V to
3.6V and the current limit value is set on 400mA, 1A.
Moreover, functions of soft start, under voltage lockout,
and over temperature protection are integrated.
Input voltage range:
2.7V to 3.6V
ON resistance :
150mΩ(Typ.)
Over current threshold:
BD2202G
0.25A min., 1.0A max.
BD2206G
0.8A min., 1.6A max.
Standby current:
0.01μA (Typ.)
Operating temperature range:
-25℃ to +85℃
Package
W(Typ.) D(Typ.) H (Max.)
2.90mm x 2.80mm x 1.25mm
SSOP5
Features
Long time support a product for Industrial
applications.
Single low on-resistance (Typ. = 150mΩ) Nch
MOS FET
Continuous load current
¾ 0.2A:
(BD2202G)
¾ 0.5A:
(BD2206G)
Control input logic:
Active-High
Soft start function
Over current protection circuit
Over temperature protection circuit
Under voltage lockout
SSOP5
Applications
Industrial Equipment, Memory card slots of STB,
Digital still camera, Cell Phones, Notebook PC.
Typical Application Circuit
VIN
Cin
VIN
Current
limit
Charge
pump
VOUT
UVLO
Control logic
Cout
Thermal
shutdown
EN
OFF
Rout
ON
GND
Lineup
Min.
0.25A
0.8A
Over current threshold
Typ.
Max.
1.0A
-
1.6A
○Product structure：Silicon monolithic integrated circuit
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Control input logic
Package
Orderable Part Number
High
SSOP5
Reel of 3000
BD2202G-LBTR
High
SSOP5
Reel of 3000
BD2206G-LBTR
○This product has no designed protection against radioactive rays.
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Datasheet
BD2202G-LB BD2206G-LB
Block Diagram
VIN
Current
limit
Charge
pump
VOUT
GND
UVLO
Control logic
Thermal
shutdown
EN
Pin Configuration
TOP VIEW
1 VIN VOUT 5
2 GND
3 EN
NC 4
Pin Description
Pin Number
Pin Name
I/O
1
VIN
I
Power supply input terminal.
Input terminal to the power switch and supply of the internal circuit.
2
GND
I
Ground.
3
EN
I
Power Switch enable input.
Active-High Switch on input. Logic high turns the switch on.
4
N.C
-
No connection.
5
VOUT
O
Power switch output.
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Pin function
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Datasheet
BD2202G-LB BD2206G-LB
Absolute Maximum Ratings
Parameter
Supply voltage
EN voltage
OUT voltage
Storage temperature
Power dissipation
*1
Symbol
VIN
VEN
VOUT
TSTG
PD
Limits
-0.3 to 6.0
-0.3 to 6.0
-0.3 to VIN + 0.3
-55 to 150
675*1
Unit
V
V
V
°C
mW
Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating: 5.4mW/℃ for operating above Ta=25℃
Recommended Operating Range
◎BD2202G
Parameter
Symbol
Limits
Unit
VIN
2.7 to 3.6
V
TOPR
-25 to 85
°C
ILO
0 to 200
mA
Symbol
Limits
Unit
VIN
2.7 to 3.6
V
TOPR
-25 to 85
°C
ILO
0 to 500
mA
Operating voltage range
Operating temperature range
Operating load current
◎BD2206G
Parameter
Operating voltage range
Operating temperature range
Operating load current
Electrical Characteristics
◎BD2202G
(Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Operating current
IDD
-
70
90
μA
VEN = 3.3V, VOUT = OPEN
Standby current
ISTB
-
0.01
1
μA
VEN = 0V, VOUT = OPEN
EN input voltage
VEN
2.0
-
-
V
High level input
-
-
0.8
V
Low level input
EN input current
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 3.3V
ON resistance
RON
-
150
200
mΩ
IOUT = 50mA
Over-current Threshold
ITH
0.25
-
1.0
A
Short-circuit output current
ISC
200
-
600
mA
Output leak current
UVLO threshold
VOUT = 0V
ILEAK
-
0.01
10
μA
VEN = 0V, VOUT = 0V
VTUVH
2.1
2.3
2.5
V
VIN increasing
VTUVL
2.0
2.2
2.4
V
VIN decreasing
AC characteristics
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Condition
Output rise time
TON1
0.25
1.2
6
ms
ROUT=500Ω, COUT=0.1μF
Output turn on time
TON2
0.4
2
10
ms
ROUT=500Ω, COUT=0.1μF
Output fall time
TOFF1
50
100
200
μs
ROUT=500Ω, COUT=0.1μF
TOFF2
50
100
200
μs
ROUT=500Ω, COUT=0.1μF
Over current shutdown time 1
TBLANK1
5
10
15
ms
At continuous over current
Over current shutdown time 2
TBLANK2
3
-
15
ms
At discontinuous over current
Output turn off time
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Datasheet
BD2202G-LB BD2206G-LB
Electrical Characteristics - continued
◎BD2206G
(Unless otherwise specified, VIN = 3.3V, Ta = 25°C)
DC characteristics
Limits
Parameter
Symbol
Min.
Typ.
Max.
Operating current
IDD
Standby current
ISTB
Unit
Condition
-
70
90
μA
-
0.01
1
μA
VEN = 0V, VOUT = OPEN
2.0
-
-
V
High level input
VEN = 3.3V, VOUT = OPEN
EN input voltage
VEN
-
-
0.8
V
Low level input
EN input current
IEN
-1.0
0.01
1.0
μA
VEN = 0V or VEN = 3.3V
ON resistance
RON
-
150
200
mΩ
IOUT = 50mA
Over-current Threshold
ITH
0.8
-
1.6
A
Short-circuit output current
ISC
750
-
1350
mA
VOUT = 0V
ILEAK
-
0.01
10
μA
VEN = 0V, VOUT = 0V
VTUVH
2.1
2.3
2.5
V
VIN increasing
VTUVL
2.0
2.2
2.4
V
VIN decreasing
Output leak current
UVLO threshold
AC characteristics
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Condition
Output rise time
TON1
0.25
1.2
6
ms
ROUT=500Ω, COUT=0.1μF
Output turn on time
TON2
0.4
2
10
ms
ROUT=500Ω, COUT=0.1μF
Output fall time
TOFF1
50
100
200
μs
ROUT=500Ω, COUT=0.1μF
Output turn off time
TOFF2
50
100
200
μs
ROUT=500Ω, COUT=0.1μF
Over current shutdown time 1
TBLANK1
5
10
15
ms
At continuous over current
Over current shutdown time 2
TBLANK2
3
-
15
ms
At discontinuous over current
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Datasheet
BD2202G-LB BD2206G-LB
Measurement Circuits
VIN
GND
GND
EN
EN
NC
A. Operating current
VIN
NC
B. EN input voltage, Output rise / fall time
OUT
OUT
VIN
GND
EN
OUT
VIN
OUT
GND
NC
EN
C.ON resistance
NC
D. Over current protection characteristics
Figure 1. Measurement circuits
Timing Diagrams
VEN
50%
50%
TON2
Over current detection
TOFF2
90%
VOUT
90%
IOUT
VOUT
10%
TON1
10%
TOFF1
TBLANK
Figure 2. Switch Turn on / off time
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Figure 3. Over current limits characteristics
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BD2202G-LB BD2206G-LB
Typical Performance Curves
90
80
OPERATING CURRENT :
IDD [μA]
OPERATING CURRENT :
IDD [μA]
80
90
Ta=25°C
70
60
50
40
30
20
70
60
50
40
30
20
10
10
0
-50
0
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
50
100
Figure 5. Operating current
EN Enable
1.0
1.0
VIN=3.3V
Ta=25°C
0.6
0.4
0.2
0.0
0.8
ISTB[uA]
OPERATING CURRENT
0.8
ISTB[uA]
0
AMBIENT TEMPERATURE : Ta [°C]
Figure 4. Operating current
EN Enable
OPERATING CURRENT
VIN=3.3V
0.6
0.4
0.2
0.0
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
-50
0
50
100
AMBIENT TEMPERATURE : Ta [℃ ]
Figure 6. Operating current
EN Disable
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Figure 7. Operating current
EN Disable
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Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
2.0
2.0
VIN=3.3 V
ENABLE INPUT VOLTAGE
VEN, V/EN[V]
ENABLE INPUT VOLTAGE
VEN, V/EN[V] 0
Ta=25°C
Low to High
1.5
Low to High
1.5
High to Low
High to Low
1.0
1.0
0.5
0.5
0.0
0.0
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃ ]
4
Figure 8. EN input voltage
Figure 9. EN input voltage
250
250
VIN=3.3V
Ta=25°C
200
ON RESISTANCE :
R ON [mΩ]
ON RESISTANCE :
R ON [mΩ]
200
150
150
100
100
50
50
0
2
2.5
3
3.5
0
-50
4
SUPPLY VOLTAGE : VDD[V]
Figure 10. ON resistance
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0
50
100
AMBIENT TEMPERATURE : Ta [℃]
Figure 11. ON resistance
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BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
0.6
0.6
VIN=3.3V
SHORT CIRCUIT CURRENT :
ISC[A]
SHORT CIRCUIT CURRENT :
ISC[A]
Ta=25°C
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
-50
4
Figure 12. Short circuit output current
(BD2202G)
Figure 13. Short circuit output current
(BD2202G)
1.35
SHORT CIRCUIT CURRENT : ISC[A]
1.35
SHORT CIRCUIT CURRENT : ISC[A]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Ta=25°C
1.25
1.15
1.05
0.95
0.85
0.75
VIN=3.3V
1.25
1.15
1.05
0.95
0.85
0.75
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃ ]
Figure 14. Short circuit output current
(BD2206G)
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Figure 15. Short circuit output current
(BD2206G)
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BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
OVER CURRENT SHUTDOWN TIME :
TBLANK1[ms]
OVER CURRENT SHUTDOWN TIME :
TBLANK1[ms]
15
Ta=25°C
14
13
12
11
10
9
8
7
6
5
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
15
VIN=3.3V
14
13
12
11
10
9
8
7
6
5
-50
Figure 16. Over current shutdown time
100
Figure 17. Over current shutdown time
2500
2500
Ta=25°C
VIN=3.3V
2000
RISE TIME :
TON1 [us]
2000
RISE TIME :
TON1 [us]
0
50
SUPPLY VOLTAGE : Ta[℃]
1500
1000
500
1500
1000
500
0
0
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 18. Output rise time
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Figure 19. Output rise time
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Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
2500
2500
Ta=25°C
VIN=3.3V
2000
TURN ON TIME :
TON2 [us]
TURN ON TIME :
TON2 [ms]
2000
1500
1000
1500
1000
500
500
0
0
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
4
Figure 20. Output turn on time
Figure 21. Output turn on time
200
200
VIN=3.3V
Ta=25°C
150
FALL TIME :
TOFF1[us]
FALL TIME :
TOFF1[us]
150
100
100
50
50
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
-50
4
Figure 22. Output fall time
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0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 23. Output fall time
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Datasheet
BD2202G-LB BD2206G-LB
Typical Performance Curves - continued
200
200
VIN=3.3V
TURN OFF TIME :
TOFF2[us]
TURN OFF TIME :
TOFF2[us]
Ta=25°C
150
150
100
100
50
50
2
2.5
3
3.5
SUPPLY VOLTAGE : VIN [V]
4
-50
Figure 24. Output turn off time
Figure 25. Output turn off time
0.20
UVLO HYSTERESIS VOLTAGE : VHYS[V]
2.5
2.4
TURN OFF TIME :
TOFF2[us]
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
VUVLOH
2.3
2.2
VUVLOL
2.1
2
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃ ]
Figure 26. UVLO threshold voltage
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0.16
0.12
0.08
0.04
0.00
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Figure 27. UVLO hysteresis voltage
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Datasheet
BD2202G-LB BD2206G-LB
Typical Wave Forms
VOUT
(1/div.)
VOUT
(1/div.)
VIN=3.3V
RL=500Ω
CL=0.1uF
V/EN
(1/div.)
VIN=3.3V
RL=500Ω
CL=0.1uF
V/EN
(1/div.)
TIME (0.5div.)
TIME (0.5div.)
Figure 28. Output turn on response
Figure 29. Output turn off response
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VEN
(1V/div.)
VEN
(1V/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 30. Current limit response
Enable into short circuit
(BD2202G)
Figure 31. Current limit response
Enable into short circuit
(BD2206G)
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BD2202G-LB BD2206G-LB
Typical Wave Forms - continued
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VOUT
(1V/div.)
TIME (2ms/div.)
TIME (2ms/div.)
Figure 32. Current limit response
Output shorted to GND
(BD2202G)
Figure 33. Current limit response
Output shorted to GND
(BD2206G)
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10uF
CL=0.1uF
VIN=3.3V
CIN=10uF
CL=0.1uF
VOUT
(1V/div.)
VOUT
(1V/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Figure 34. Current limit response
Ramped load (1A/10ms)
(BD2202G)
Figure 35. Current limit response
Ramped load (1A/10ms)
(BD2206G)
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Typical Wave Forms - continued
VIN
(1V/div.)
VIN
(1V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
RL=500Ω
CL=0.1uF
IOUT
(10mA/div.)
RL=500Ω
CL=0.1uF
IOUT
(10mA/div.)
TIME (5ms/div.)
TIME (500ms/div.)
Figure 36. UVLO VIN rising
Figure 37. UVLO VIN falling
Typical application circuit
VIN
Cin
VIN
Current
limit
Charge
pump
VOUT
UVLO
Control logic
Cout
EN
OFF
ON
Rout
Thermal
shutdown
GND
Application Information
When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power
source line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass
capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for
external components including AC/DC characteristics as well as dispersion of the IC.
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BD2202G-LB BD2206G-LB
Operation Description
BD2202G and BD2206G are high side switch ICs with over-current protection function. The operating voltage range is
from 2.7V to 3.6V and the current limit value is set to 400mA and 1A respectively.
When an over-current condition lasts longer than its over-current shutdown time, the switch turns OFF. The OFF switch
is set to latch mode. The switch set to latch mode returns to normal by toggling EN pin from High to Low to High.
1.Switch On/Off control
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the
VIN terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN control input, VIN and VOUT are connected by a 150mΩ switch. In normal
condition, the switch is bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from
VOUT to VIN.
In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is
off, when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN.
2. Over current detection (OCD)
The over current detection circuit limits current flowing in switch MOSFET when it exceeds its limit threshold. There
are three types of responses against over current. The over current detection circuit is in operation when the power
switch is ON (when EN signal is active).
2-1 When the switch is turned on while the output is in short-circuit status
When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
2-2 When the output short-circuits while the switch is on
When the output short-circuits or high-current load is connected while the switch is on, very large current flows
until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is
carried out.
2-3 When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
3.Over current shutdown
When the over current detection circuit detects an over current, TBLANK timer starts working. When the over current
condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over current condition progresses to
more than TBLANK1, the switch is shut off. The OFF switch is set to latch off mode. The latch is reset when EN
terminal is toggled or when UVLO is detected.
4.Under voltage lockout (UVLO)
UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation,
if VIN voltage drops to 2.2V (Typ.), the power switch is set to OFF. UVLO has a 100mV hysteresis. The under voltage
lock out circuit is in operation when power switch is ON (when EN signal is active).
5.Thermal shutdown
When the chip temperature increases to 160°C (Typ.), the thermal shut down circuit works and the power switch is
turned OFF. When the chip temperature falls to 140°C (Typ.), the power switch output returns to normal. This
operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch output is
turned off.
The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active).
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BD2202G-LB BD2206G-LB
TBLANK2
TBLANK1
Output current
ON
OFF
ON
Switch sta tus
EN voltage
Figure 38. Over-current detection, shutdown operation (return with EN input)
TBLANK2
TBLANK1
Output current
ON
OFF
ON
Switch sta tus
VTUVL
VIN voltage
VTUVH
Figure 39. Over-current detection, shutdown operation (return with UVLO operation)
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Power Dissipation
(SSOP5)
700
POWER DISSIPATION : Pd [mW
600
500
400
300
200
100
0
0
25
50
75
100
AMBIENT TEMPERATURE : Ta [℃ ]
125
150
Figure 40. Power dissipation curve (Pd-Ta Curve)
I/O Equivalence Circuit
Pin Name
Pin Number
EN
3
VOUT
5
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Operational Notes
(1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
(4) Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
(5) Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that
no pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between Pins and Mounting Errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the
pins.
(7) Operation under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
(9) Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin B
B
Pin A
N
P+
N
P+
P
E
N
N
P+
B
N
P+
P
C
N
E
P substrate
Parasitic element
P substrate
GND
GND
Parasitic element
Figure 41.
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Other adjacent elements
Example of monolithic IC structure
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(10)GND Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line
impedance.
(11)External capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12)Thermal Shutdown Circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do
not use the IC in conditions where this function will always be activated.
(13) Thermal Consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)
in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation
: Pd (W)=(Tjmax－Ta)/θja
Power dissipation
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
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Ordering Information
B
D
2
2
0
x
Part Number
G
-
LBTR
Package
G : SSOP5
Product class
LB for Industrial applications
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5 (TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD2202G
AN
BD2206G
AR
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Physical Dimension Tape and Reel Information
Package Name
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Revision History
Date
Revision
13.Mar.2012
001
21.Feb.2014
002
Changes
New Release
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1).
Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel
Information”).
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
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