Datasheet
Load Switch ICs
0.2A, 0.5A Current Load Switch ICs
for Portable Equipment
BD2202G
BD2206G
General Description
BD2202G and BD2206G are high-side switch ICs using a
single N-Channel MOSFET with low on resistance. These
ICs have over-current protection and this is triggered
when the over-current condition exceeds the
over-current shutdown time. After triggering the
over-current protection, the switch will be latched off
until enable is reset.
Moreover, soft start, under-voltage lockout, and thermal
shutdown are integrated. These ICs are used in power
supply lines of memory card slots.
Features
Key Specifications
Input Voltage Range:
2.7V to 3.6V
ON-Resistance:
150mΩ(Typ)
Operating Load Current:
BD2202G
0.2A
BD2206G
0.5A
Over-Current Threshold:
BD2202G
0.25A (Min), 1.0A (Max)
BD2206G
0.8A (Min), 1.6A (Max)
Standby Current:
0.01μA (Typ)
Operating Temperature Range:
-25°C to +85°C
W(Typ)
Package
Single Low ON-Resistance (Typ= 150mΩ)
N-Channel MOSFET
Control Input Logic:
Active-High
Soft Start Function
Over-Current Protection Circuit
Thermal Shutdown Circuit
Under-Voltage Lockout
D(Typ)
H(Max)
Applications
Memory Card Slots, Digital Still Cameras, Cell Phones,
Notebook PCs
SSOP5
2.90mm x 2.80mm x 1.25mm
Typical Application Circuit
OUT
IN
CIN
VIN
OFF
ON
COUT
ROUT
GND
EN
Lineup
Min
0.25A
0.8A
Over-Current Threshold
Typ
Max
1.0A
-
1.6A
Control Input
Logic
Package
Orderable Part Number
High
SSOP5
Reel of 3000
BD2202G-TR
High
SSOP5
Reel of 3000
BD2206G-TR
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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BD2202G
Datasheet
BD2206G
Block Diagram
IN
Current
Limit
Charge
Pump
OUT
GND
UVLO
Control Logic
Thermal
Shutdown
EN
Pin Configuration
TOP VIEW
1 IN
OUT 5
2 GND
3 EN
NC 4
Pin Description
Pin Number
Pin Name
I/O
1
IN
I
Power supply input terminal.
Input terminal to the power switch and supply of the internal circuit.
2
GND
I
Ground.
3
EN
I
Power switch enable input (active high).
4
N.C
-
No connection.
5
OUT
O
Power switch output.
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BD2202G
Datasheet
BD2206G
Absolute Maximum Ratings
Parameter
Supply Voltage
EN Voltage
OUT Voltage
Symbol
V IN
V EN
V OUT
Limit
-0.3 to +6.0
-0.3 to +6.0
-0.3 to V IN + 0.3
Unit
V
V
V
Tstg
-55 to +150
°C
Storage Temperature
Power Dissipation
(Note 1)
Pd
0.67
W
(Note 1) Derate by 5.4mW/°C when operating above Ta=25°C (mounted on 70mm x 70mm x 1.6mm board).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute
maximum ratings.
Recommended Operating Conditions
BD2202G
Parameter
Rating
Symbol
Min
Typ
Max
Unit
Operating Voltage Range
V IN
2.7
-
3.6
V
Operating Temperature Range
Topr
-25
-
+85
°C
I LO
0
-
200
mA
Operating Load Current
BD2206G
Parameter
Rating
Symbol
Min
Typ
Max
Unit
Operating Voltage Range
V IN
2.7
-
3.6
Operating Temperature Range
Topr
-25
-
+85
°C
I LO
0
-
500
mA
Operating Load Current
V
Electrical Characteristics
BD2202G
(Unless otherwise specified, V IN = 3.3V, Ta= 25°C)
DC Characteristics
Limit
Parameter
Symbol
Min
Typ
Operating Current
I DD
Standby Current
I STB
Max
Unit
Conditions
-
70
90
μA
V EN = 3.3V, V OUT = OPEN
-
0.01
1
μA
V EN = 0V, V OUT = OPEN
2.0
-
-
V
High Level Input
EN Input Voltage
V EN
-
-
0.8
V
Low Level Input
EN Input Current
I EN
-1.0
+0.01
+1.0
μA
V EN = 0V or V EN = 3.3V
ON-Resistance
R ON
-
150
200
mΩ
I OUT = 50mA
Over-Current Threshold
I TH
0.25
-
1.0
A
I SC
200
-
600
mA
V OUT = 0V
I LEAK
-
0.01
10
μA
V EN = 0V, V OUT = 0V
Short-Circuit Output Current
Output Leak Current
UVLO Threshold
V TUVH
2.1
2.3
2.5
V
V IN Increasing
V TUVL
2.0
2.2
2.4
V
V IN Decreasing
AC Characteristics
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Output Rise Time
t ON1
0.25
1.2
6
ms
R OUT = 500Ω, C OUT = 0.1μF
Output Turn ON Time
t ON2
0.4
2
10
ms
R OUT = 500Ω, C OUT = 0.1μF
Output Fall Time
t OFF1
50
100
200
μs
R OUT = 500Ω, C OUT = 0.1μF
Output Turn OFF Time
t OFF2
50
100
200
μs
R OUT = 500Ω, C OUT = 0.1μF
Over-Current Shutdown Time 1
t BLANK1
5
10
15
ms
At Continuous Over-Current
Over-Current Shutdown Time 2
t BLANK2
3
-
15
ms
At Discontinuous Over-Current
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BD2202G
Datasheet
BD2206G
Electrical Characteristics - continued
BD2206G
(Unless otherwise specified, V IN = 3.3V, Ta= 25°C)
DC Characteristics
Limit
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Operating Current
I DD
-
70
90
μA
V EN = 3.3V, V OUT = OPEN
Standby Current
I STB
-
0.01
1
μA
V EN = 0V, V OUT = OPEN
EN Input Voltage
V EN
EN Input Current
2.0
-
-
V
High Level Input
-
-
0.8
V
Low Level Input
I EN
-1.0
+0.01
+1.0
μA
V EN = 0V or V EN = 3.3V
ON-Resistance
R ON
-
150
200
mΩ
I OUT = 50mA
Over-Current Threshold
I TH
0.8
-
1.6
A
Short-Circuit Output Current
I SC
750
-
1350
mA
Output Leak Current
UVLO Threshold
V OUT = 0V
I LEAK
-
0.01
10
μA
V EN = 0V, V OUT = 0V
V TUVH
2.1
2.3
2.5
V
V IN Increasing
V TUVL
2.0
2.2
2.4
V
V IN Decreasing
AC Characteristics
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
t ON1
0.25
1.2
6
ms
R OUT = 500Ω, C OUT = 0.1μF
Output Turn ON Time
t ON2
0.4
2
10
ms
R OUT = 500Ω, C OUT = 0.1μF
Output Fall Time
t OFF1
50
100
200
μs
R OUT = 500Ω, C OUT = 0.1μF
Output Rise Time
Output Turn OFF Time
t OFF2
50
100
200
μs
R OUT = 500Ω, C OUT = 0.1μF
Over-Current Shutdown Time 1
t BLANK1
5
10
15
ms
At Continuous Over-Current
Over-Current Shutdown Time 2
t BLANK2
3
-
15
ms
At Discontinuous Over-Current
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BD2202G
Datasheet
BD2206G
Measurement Circuit
A
GND
GND
EN
OUT
IN
OUT
IN
EN
NC
A. Operating Current
B.
NC
EN Input Voltage, Output Rise / Fall Time
V
OUT
IN
GND
C.
A
GND
NC
EN
OUT
IN
EN
ON-Resistance
D.
NC
Over-Current Protection Characteristics
Figure 1. Measurement Circuit
Timing Diagram
VEN
VENH
VENL
tON2
Over current Detection
detection
Over-Current
tOFF2
90%
VOUT
90%
IOUT
VOUT
10%
tON1
10%
tOFF1
TtBLANK
BLANK
Figure 2. Switch Turn ON / OFF Time
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Figure 3. Over-Current Limits Characteristics
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BD2202G
Datasheet
BD2206G
Typical Performance Curves
OPERATING
CURRENT
Operating Current
: IDD[μA] :
IDD [μA]
80
90
Ta=25°C
80
Operating Current
: IDD[μA]:
OPERATING
CURRENT
IDD [μA]
90
70
60
50
40
30
20
VIN=3.3V
70
60
50
40
30
20
10
10
0
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta [°C]
0
2
2.5
3
3.5
SUPPLY
VOLTAGE
:
V
[V]
Supply Voltage : VININ[V]
4
Figure 4. Operating Current vs Supply Voltage
(EN Enable)
Figure 5. Operating Current vs
Ambient Temperature
(EN Enable)
1.0
1.0
VIN=3.3V
Ta=25°C
0.8
OPERATING
CURRENT
Standby Current
: ISTB[μA]
ISTB[uA]
OPERATING
CURRENT
Standby Current
: ISTB[μA]
ISTB[uA]
0.8
0.6
0.6
0.4
0.4
0.2
0.2
0.0
0.0
2
2.5
3
3.5
SUPPLY
VOLTAGE
:
V
Supply Voltage : VIN[V]IN [V]
-50
0
50
100
AMBIENT
TEMPERATURE
: Ta [℃]
Ambient
Temperature : Ta[°C]
4
Figure 6. Standby Current vs Supply Voltage
(EN Disable)
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Figure 7. Standby Current vs
Ambient Temperature
(EN Disable)
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BD2202G
Datasheet
BD2206G
Typical Performance Curves - continued
2.0
2.0
VIN=3.3 V
Low to High
1.5
High to Low
1.0
0.5
Low to High
1.5
VEN , V/EN [V]
Enable
Input
Voltage
: VEN [V] :
ENABLE
INPUT
VOLTAGE
Enable Input Voltage : VEN [V]
Ta=25°C
High to Low
1.0
1.0
0.5
0.0
0.0
2
2.5
3
3.5
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta[℃]
4
Supply Voltage : VIN[V]
Figure 9. EN Input Voltage vs
Ambient Temperature
Figure 8. EN Input Voltage vs
Supply Voltage
250
250
VIN=3.3V
200
200
ON-Resistance
: RON[mΩ]
ON RESISTANCE
:
RON [mΩ]
ON-Resistance
: RON[mΩ]
ON RESISTANCE
:
RON [mΩ]
Ta=25°C
150
150
100
100
50
0
2
2.5
3
3.5
0
-50
4
SUPPLY
VOLTAGE
Supply
Voltage : :VVDD[V]
IN[V]
0
50
100
AMBIENT
: Ta [℃]
AmbientTEMPERATURE
Temperature : Ta[°C]
Figure 11. ON-Resistance vs
Ambient Temperature
Figure 10. ON-Resistance vs Supply Voltage
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BD2202G
Datasheet
BD2206G
Typical Performance Curves - continued
0.6
0.6
VIN=3.3V
SHORT
CIRCUIT
CURRENT
Short Circuit
Current
: ISC[A] :
ISC [A]
Short Circuit Current : ISC[A]
Ta=25°C
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
2
2.5
3
3.5
-50
4
Supply Voltage : VIN[V]
Figure 13. Short Circuit Current vs
Ambient Temperature
(BD2202G)
Figure 12. Short Circuit Current vs
Supply Voltage
(BD2202G)
1.35
1.35
Ta=25°C
SHORT CIRCUIT CURRENT : ISC [A]
1.25
Short Circuit Current : ISC[A]
Short Circuit Current : ISC[A]
SHORT CIRCUIT CURRENT : ISC [A]
0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
Ambient Temperature : Ta[°C] ℃
1.15
1.05
0.95
0.85
0.75
2
2.5
3
3.5
SupplyVOLTAGE
Voltage : VIN
SUPPLY
: [V]
VIN [V]
4
1.25
1.15
1.05
0.95
0.85
0.75
-50
0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
Ambient Temperature : Ta[°C] ℃
Figure 14. Short Circuit Current vs
Supply Voltage
(BD2206G)
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VIN=3.3V
Figure 15. Short Circuit Current vs
Ambient Temperature
(BD2206G)
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BD2202G
Datasheet
BD2206G
15
15
Ta=25°C
14
Over-Current Shutdown Time : tBLANK[ms]
Over-Current Shutdown Time : tBLANK[ms]
Typical Performance Curves - continued
13
12
11
10
9
8
7
6
5
2
2.5
3
3.5
VIN=3.3V
14
13
12
11
10
9
8
7
6
5
-50
4
50
100
Supply Voltage : Ta[°C]
Figure 16. Over-Current Shutdown Time vs
Supply Voltage
Figure 17. Over-Current Shutdown Time vs
Supply Voltage
2500
2500
Ta=25°C
VIN=3.3V
2000
RISE
:
Rise
TimeTIME
: tON1[μs]
TON1[us]
2000
1500
1500
TON1[us]
RISE
TIME
: [μs]
Rise
Time
: tON1
0
Supply Voltage : VIN[V]
1000
1000
500
500
0
0
2
2.5
3
3.5
SUPPLY
VIN [V]
Supply VOLTAGE
Voltage : VIN: [V]
4
-50
0
50
100
AMBIENT
TEMPERATURE
: Ta[℃]
Ambient
Temperature : Ta[°C]
Figure 19. Output Rise Time vs
Ambient Temperature
Figure 18. Output Rise Time vs Supply Voltage
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BD2202G
Datasheet
BD2206G
Typical Performance Curves - continued
2500
2500
Ta=25°C
VIN=3.3V
2000
TURN
ON TIME
:
Turn
ON Time
: tON2[μs]
TON2[us]
Turn ON Time : tON2[ms]
2000
1500
1500
1000
1000
500
500
0
0
2
2.5
3
3.5
-50
0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
℃
Ambient Temperature : Ta[°C]
4
Supply Voltage : VIN[V]
Figure 20. Output Turn ON Time vs Supply Voltage
Figure 21. Output Turn ON Time vs
Ambient Temperature
200
200
VIN=3.3V
150
150
FALL TIME :
TOFF1[us]
Fall Time : tOFF1[μs]
Fall Time : tOFF1[μs]
Ta=25°C
100
100
50
50
2
2.5
3
3.5
-50
4
Supply Voltage : VIN[V]
Figure 22. Output Fall Time vs Supply Voltage
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0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
Ambient Temperature : Ta[°C] ℃
Figure 23. Output Fall Time vs
Ambient Temperature
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BD2202G
Datasheet
BD2206G
Typical Performance Curves - continued
200
200
Ta=25°C
TURN
OFF :TIME
:
Turn
OFF Time
tOFF2[μs]
TOFF2[us]
TURN
OFF TIME
:
Turn
OFF Time
: tOFF2[μs]
TOFF2[us]
VIN=3.3V
150
150
100
100
50
2
2.5
3
3.5
SUPPLY
VOLTAGE
: [V]
VIN [V]
Supply Voltage
: VIN
50
4
-50
Figure 24. Output Turn OFF Time vs
Supply Voltage
Figure 25. Output Turn OFF Time vs
Ambient Temperature
0.20
TURN OFF TIME :
TOFF2[us]
UVLOUVLO
HYSTERESIS
VOLTAGE
Hysteresis
Voltage ::VVHYS[V
HYS[V]
2.5
UVLO Threshold : VTUVH, VTUVL [V]
0
50
100
AMBIENT
TEMPERATURE
:
Ta[
]
℃
Ambient Temperature : Ta[°C]
2.4
VTUVH
2.3
2.2
VTUVL
2.1
2
-50
0
50
100
Ambient
Temperature : Ta[°C]
AMBIENT
TEMPERATURE
: Ta[℃]
0.12
0.08
0.04
0.00
-50
0
50
100
AMBIENT
: Ta[℃]
AmbientTEMPERATURE
Temperature : Ta[°C]
Figure 27. UVLO Hysteresis Voltage vs
Ambient Temperature
Figure 26. UVLO Threshold Voltage vs
Ambient Temperature
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BD2202G
Datasheet
BD2206G
Typical Wave Forms
VOUT
(1V/div.)
VOUT
(1V/div.)
VIN=3.3V
RL=500Ω
CL=0.1µF
VEN
(1v/div.)
VIN=3.3V
RL=500Ω
CL=0.1µF
VEN
(1V/div.)
TIME (0.5Div.)
TIME (0.5Div.)
Figure 28. Output Turn ON Response
(VIN=3.3V RL=500Ω CL=0.1µF)
Figure 29. Output Turn OFF Response
(VIN=3.3V RL=500Ω CL=0.1µF)
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10µF
CL=0.1µF
VOUT
(1V/div.)
VIN=3.3V
CIN=10µF
CL=0.1µF
VOUT
(1V/div.)
VEN
(1V/div.)
VEN
(1V/div.)
TIME (2ms/Div.)
TIME (2ms/Div.)
Figure 30. Current Limit Response
Enable Into Short Circuit
(VIN=3.3V CIN=10µF CL=0.1µF BD2202G)
Figure 31. Current Limit Response
Enable Into Short Circuit
(VIN=3.3V CIN=10µF CL=0.1µF BD2206G)
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BD2202G
Datasheet
BD2206G
Typical Wave Forms - continued
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10µF
CL=0.1µF
VIN=3.3V
CIN=10µF
CL=0.1µF
VOUT
(1V/div.)
VOUT
(1V/div.)
TIME (2ms/Div.)
TIME (2ms/Div.)
Figure 32. Current Limit Response
Output Shorted to GND
(VIN=3.3V CIN=10µF CL=0.1µF BD2202G)
Figure 33. Current Limit Response
Output Shorted to GND
(VIN=3.3V CIN=10µF CL=0.1µF BD2206G)
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=3.3V
CIN=10µF
CL=0.1µF
VOUT
(1V/div.)
VIN=3.3V
CIN=10µF
CL=0.1µF
VOUT
(1V/div.)
TIME (5ms/Div.)
TIME (5ms/Div.)
Figure 34. Current Limit Response
Ramped Load (1A/10ms)
(VIN=3.3V CIN=10µF CL=0.1µF BD2202G)
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Figure 35. Current Limit Response
Ramped Load (1A/10ms)
(VIN=3.3V CIN=10µF CL=0.1µF BD2206G)
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BD2202G
Datasheet
BD2206G
Typical Wave Forms - continued
VIN
(1V/div.)
VIN
(1V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
RL=500Ω
CL=0.1µF
IOUT
(10mA/div.)
RL=500Ω
CL=0.1µF
IOUT
(10mA/div.)
TIME (5ms/Div.)
TIME (500ms/Div.)
Figure 36. UVLO VIN Rising
(RL=500Ω CL=0.1µF)
Figure 37. UVLO VIN Falling
(RL=500Ω CL=0.1µF)
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BD2202G
Datasheet
BD2206G
Typical Application Circuit
VIN
Cin
C
IN
VIN
Current
limit
Charge
pump
VOUT
OUT
UVLO
Control logic
Cout
EN
OFF
ON
Rout
Thermal
shutdown
GND
Application Information
Power supply noise may affect IC operation. To avoid this, connect a 1μF bypass capacitor or higher across IN and
GND.
Due to the internal body diode in the switch a C IN greater than C OUT is highly recommended.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for
external components including AC/DC characteristics as well as dispersion of the IC.
Operation Description
BD2202G and BD2206G are high side switch ICs with over-current protection. The over-current protection is triggered
when the over-current condition exceeds the allowable period of time. Then the switch will be latched off until EN is
reset (toggled from high to low to high).
1.
Switch ON/OFF Control
IN and OUT are connected to the drain and the source of the MOSFET switch respectively. IN is also used as a
power source input to the internal control circuit.
When the switch is turned on from the EN control input, a 150mΩ switch connects IN and OUT. During normal
condition, the switch is bidirectional. Therefore, when the voltage of OUT is higher than IN, current flows from OUT
to IN.
There is a parasitic diode (body diode) between drain and source of the MOSFET switch. So, even when the switch
is off, when the voltage of OUT is higher than IN, the current flows through the body diode from OUT to IN.
2.
Over-Current Detection (OCD)
The over-current detection circuit limits current flowing in the MOSFET switch when it exceeds its limit threshold.
There are three types of responses against over-current. The over-current detection circuit is in operation when the
power switch is ON (when EN signal is active).
(1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit
status immediately.
(2) When the output short-circuits or high-current load is connected while the switch is on, very large current
flows until the over-current limit circuit reacts. When the current detection and limit circuit works, current
limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current
exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried
out.
3.
Over-Current Shutdown
When the over-current detection circuit detects an over-current, t BLANK timer starts working. When the over-current
condition disappears before t BLANK2 stage, t BLANK timer is reset. When the over-current condition progresses to more
than t BLANK1 , the switch is shutdown. The OFF switch is set to latch off mode. The latch is reset when EN terminal is
toggled or when UVLO is detected.
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4.
Under-Voltage Lockout (UVLO)
UVLO keeps the power switch off until V IN voltage exceeds 2.3V (Typ). On the other hand, from a power switch ON
situation, if V IN voltage drops to 2.2V (Typ), the power switch turns OFF. UVLO has a 100mV hysteresis. The
under-voltage lockout circuit is in operation when power switch is ON (when EN signal is active).
5.
Thermal Shutdown
When the chip temperature increases to 160°C (Typ), the thermal shutdown circuit is triggered and the power
switch is turned OFF. When the chip temperature falls to 140°C (Typ), the power switch output returns to normal.
This operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch
output is turned off. The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is
active).
tBLANK2
tBLANK1
Output Current
ON
OFF
ON
Switch Status
EN Voltage
Figure 38. Over-Current Detection, Shutdown Operation (Return with EN Input)
tBLANK2
tBLANK1
Output Current
ON
OFF
ON
Switch Status
VTUVL
IN Voltage
VTUVH
Figure 39. Over-Current Detection, Shutdown Operation (Return with UVLO Operation)
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Datasheet
BD2206G
Power Dissipation
(SSOP5)
700
Power Dissipation : Pd[mW]
POWER DISSIPATION : Pd [mW
600
500
400
300
200
100
0
0
85
50
75
100
AMBIENT TEMPERATURE : Ta [℃]
25
125
150
Ambient Temperature : Ta[°C]
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 40. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Pin Name
Pin Number
EN
3
OUT
5
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity
when connecting the power supply, such as mounting an external diode between the power supply and the IC’s
power supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of
the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is
when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute
maximum rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
In rush Current
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions during transport and storage.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the
IC has more than one power supply. Therefore, give special consideration to power coupling
capacitance, power wiring, width of ground wiring, and routing of connections.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may
result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and
output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid
environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD2206G
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The
small charge acquired in this way is enough to produce a significant effect on the conduction through the
transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be
connected to the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating
a parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes
to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate)
should be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
Figure 41. Example of monolithic IC structure
GND
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should
always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC
from heat damage.
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BD2202G
Datasheet
BD2206G
Ordering Information
B
D
2
2
0
2
Part Number
B
D
G
-
Package
G: SSOP5
2
2
0
Part Number
6
G
-
Package
G: SSOP5
TR
Packaging and forming specification
TR: Embossed tape and reel
TR
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
LOT Number
Part Number
Part Number Marking
BD2202G
AN
BD2206G
AR
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BD2206G
Physical Dimension Tape and Reel Information
Package Name
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BD2206G
Revision History
Date
Revision
11.Mar.2013
25.Jun.2013
21.Aug.2014
001
002
003
Changes
New Release
Changed character color from RED to BLOCK on page 5.
Applied the ROHM Standard Style and improved understandability.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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