BD2224G

Power Management Switch ICs for PCs and Digital Consumer Products 1ch Small Package High Side Switch ICs for USB Devices and Memory Cards BD2224G,BD2225G No.11029EBT17 ●Description BD2224G and BD2225G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal Serial Bus (USB) applications. BD2224G and BD2225G are equipped with the function of over-current detection, thermal shutdown, under-voltage lockout and soft-start. ●Features 1) Low On-Resistance (Typ. 150mΩ) N-channel MOSFET Built-in 2) Over-Current Detection 3) Thermal Shutdown 4) Open-Drain Fault Flag Output 5) Under-Voltage Lockout 6) Soft-Start Circuit 7) Input Voltage Range: 2.7V ~ 5.5V 8) Control Input Logic Active-High (BD2224G), Active-Low (BD2225G) 9) SSOP5 Package ●Absolute Maximum Ratings (Ta=25℃) Parameter VIN Supply voltage EN(/EN) input voltage /OC Voltage /OC Sink current VOUT Voltage Storage temperature Power dissipation Symbol VIN VEN(/EN) V/OC I/OC VOUT TSTG Pd Ratings -0.3 ~ 6.0 -0.3 ~ 6.0 -0.3 ~ 6.0 5 -0.3 ~ VIN + 0.3 -55 ~ 150 675 *1 Unit V V V mA V ℃ mW *1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃. * This IC is not designed to be radiation-proof. ●Operating Conditions Parameter VIN operating voltage Operating temperature Symbol VIN TOPR Ratings Min. 2.7 -40 Typ. 5.0 Max. 5.5 85 Unit V ℃ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/12 2011.05 - Rev.B BD2224G,BD2225G ●Electrical Characteristics DC Characteristics Parameter (VIN= 5V, Ta= 25℃, unless otherwise specified.) Limits Min. Typ. 110 Max. 160 Technical Note Symbol Unit Conditions VEN= 5V (BD2224G) V/EN= 0V (BD2225G) VOUT= open VEN= 0V (BD2224G) V/EN= 5V (BD2225G) VOUT= open High input Low input VEN(/EN)= 0V or 5V Operating current IDD μA Standby current ISTB VEN(/EN) VEN(/EN) IEN(/EN) 2.0 -1 0.01 0.01 5 0.8 1 μA V V μA EN(/EN) input voltage EN(/EN) input leakage On-resistance RON - 150 200 mΩ IOUT= 50mA Over-current threshold ITH 550 780 1000 mA Short circuit output current ISC 350 - - mA VOUT= 0V, RMS /OC output low voltage V/OC 2.1 2.0 2.3 2.2 0.4 2.5 2.4 V V V I/OC= 0.5mA VIN increasing VIN decreasing UVLO threshold VTUV AC Characteristics Parameter Symbol Limits Min. Typ. 1 Max. 6 Unit Conditions Output rise time TON1 ms RL= 20Ω Output turn-on time TON2 - 1.5 10 ms RL= 20Ω Output fall time TOFF1 - 1 20 μs RL= 20Ω Output turn-off time TOFF2 - 3 40 μs RL= 20Ω /OC delay time T/OC 10 15 20 ms www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/12 2011.05 - Rev.B BD2224G,BD2225G ●Measurement Circuit VIN VIN Technical Note A VIN 1µF GND VEN(/EN) EN(/EN) /OC VEN(/EN) VOUT A VIN 1µF GND EN(/EN) /OC VOUT RL Operating current EN,/EN Input voltage, Output rise/fall time VIN VIN 10kΩ A VIN 1µF GND VEN(/EN) EN(/EN) /OC VOUT IOUT A IOC VIN 1µF GND VEN(/EN) EN(/EN) /OC VOUT On-resistance, Over-current detection Fig.1 Measurement circuit ●Timing Diagram /OC Output low voltage VEN 50% 50% V/EN 50% 50% TON2 90% TOFF2 90% 10% TON2 90% TOFF2 90% 10% VOUT 10% VOUT 10% TON1 TOFF1 TON1 TOFF1 Fig.2 Output rise/fall time (BD2224G) Fig.3 Output rise/fall time (BD2225G) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/12 2011.05 - Rev.B BD2224G,BD2225G ●Reference Data 140 140 Technical Note 1.0 Ta=25°C [μA] [μA] VIN=5.0V STB [μA] Ta=25°C 0.8 120 100 80 60 40 20 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 120 100 80 60 40 20 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] DD OPERATING CURRENT : I OPERATING CURRENT : I DD STANDBY CURRENT : I 0.6 0.4 0.2 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.4 Operating current EN,/EN enable 1.0 [V] 2.0 Fig.5 Operating current EN,/EN enable 2.0 EN [V] Fig.6 Standby current EN,/EN disable VIN=5.0V [μA] 0.8 DD Ta=25°C 1.5 VIN=5.0V 1.5 EN ENABLE INPUT CURRENT : V STANDBY CURRENT : I Low to High High to Low ENABLE INPUT CURRENT : V Low to High High to Low 0.6 1.0 1.0 0.4 0.2 0.5 0.5 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.7 Standby current EN,/EN disable 200 200 Fig.8 EN,/EN input voltage Fig.9 EN,/EN input voltage TH [A] Ta=25°C ON RESISTANCE : R ON [mΩ] ON RESISTANCE : R ON [mΩ] 150 150 1.0 VIN=5.0V Ta=25°C 0.9 OVERCURRENT THRESHOLD : I -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.8 100 100 0.7 50 50 0.6 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0 0.5 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.10 On-resistance Fig.11 On-resistance Fig.12 Over-current threshold 1.0 TH [A] 100 100 VIN=5.0V 0.9 /OC OUTPUT LOW VOLTAGE : V /OC[mV] 80 Ta=25°C /OC OUTPUT LOW VOLTAGE : V /OC[mV] 80 VIN=5.0V OVERCURRENT THRESHOLD : I 0.8 60 60 0.7 40 40 0.6 20 20 0.5 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.13 Over-current threshold Fig.14 /OC output low voltage Fig.15 /OC output low voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/12 2011.05 - Rev.B BD2224G,BD2225G Technical Note 2.5 UVLO HYSTERESIS VOLTAGE:V HSY[V] VTUVL [V] 1.0 5.0 VIN=5.0V 2.4 VIN=5.0V 0.8 RISE TIME : T ON1 [ms] 4.0 Ta=25°C TUVH , UVLO THRESHOLD : V 2.3 VTUVH 0.6 3.0 2.2 0.4 2.0 2.1 VTUVL 0.2 1.0 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 -50 0 50 AMBIENT TEMPERATURE : Ta[℃] 100 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.16 UVLO threshold Fig.17 UVLO hysteresis voltage Fig.18 Output rise time 5.0 5.0 5.0 VIN=5.0V [ms] 4.0 RISE TIME : T ON1 [ms] 4.0 Ta=25°C [ms] 4.0 VIN=5.0V ON2 TURN ON TIME : T TURN ON TIME : T 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 3.0 3.0 ON2 3.0 2.0 2.0 2.0 1.0 1.0 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.19 Output rise time Fig.20 Output turn-on time Fig.21 Output turn-on time 5.0 5.0 6.0 Ta=25°C 4.0 FALL TIME : T OFF1 [μs] FALL TIME : T OFF1 [μs] 4.0 VIN=5.0V OFF2 [μs] Ta=25°C 5.0 4.0 3.0 2.0 1.0 0.0 2.0 2.0 1.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN OFF TIME : T 3.0 3.0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.22 Output fall time Fig.23 Output fall time Fig.24 Output turn-off time 6.0 20 20 VIN=5.0V TURN OFF TIME : TOFF2[μs] /OC DDLAY TIME : T/OC[ms] 5.0 4.0 3.0 2.0 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 18 Ta=25°C /OC DDLAY TIME : T/OC[ms] 18 VIN=5.0V 16 16 14 14 12 12 10 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 10 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] Fig.25 Output turn-off time Fig.26 /OC delay time Fig.27 /OC delay time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/12 2011.05 - Rev.B BD2224G,BD2225G ●Waveform Data (BD2224G) VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) VEN (5V/div.) Technical Note V/OC (5V/div.) V/OC (5V/div.) CL=147uF VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) RL=20Ω VOUT (5V/div.) VIN=5V RL=20Ω IOUT (0.2A/div.) CL=47uF TIME(1ms/div.) CL=100uF IOUT (0.5A/div.) VIN=5V RL=20Ω Fig.28 Output rise characteristic TIME(1us/div.) TIME (2ms/div.) Fig.29 Output fall characteristic Fig.30 Inrush current response V/OC (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VIN=5V TIME (5ms/div.) IOUT (0.5A/div.) VIN=5V IOUT (0.2A/div.) VIN=5V TIME (200ms/div.) TIME (5ms/div.) Fig.31 Over-current response ramped load Fig.32 Over-current response enable to shortcircuit Fig.33 Over-current response enable to shortcircuit V/OC (5V/div.) VIN (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V IOUT (0.5A/div.) IOUT (0.2A/div.) RL=20Ω IOUT (0.2A/div.) RL=20Ω TIME (5ms/div.) TIME (10ms/div.) Fig.34 Over-current response enable to shortcircuit Fig.35 UVLO response increasing VIN TIME (10ms/div.) Fig.36 UVLO response decreasing VIN www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/12 2011.05 - Rev.B BD2224G,BD2225G ●Block Diagram Technical Note Over-Current Detection Under-Voltage Lockout Delay Counter Charge Pump Thermal Shutdown /OC VIN 1 GND 5 VOUT Top View 4 /OC GND 2 EN(/EN) VIN VOUT EN(/EN) 3 Fig.37 Block diagram ●Pin Description Pin No. 1 Fig.38 Pin configuration Symbol VIN I/O - Function Switch input and the supply voltage for the IC. 2 GND - Ground. Enable input. EN: High level input turns on the switch. (BD2224G) /EN: Low level input turns on the switch. (BD2225G) Over-current notification terminal. Low level output during over-current or over-temperature condition. Open-drain fault flag output. Switch output. 3 EN, /EN I 4 /OC O 5 VOUT O ●I/O Circuit Symbol Pin No. Equivalent Circuit EN (/EN) 3 EN (/EN) VOUT 5 VOUT /OC /OC 4 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/12 2011.05 - Rev.B BD2224G,BD2225G ●Functional Description 1. Switch Operation Technical Note VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN,/EN control input, VIN terminal and VOUT terminal are connected by a 150mΩ(Typ.) switch. In on status, the switch is bidirectional. Therefore, when the potential of VOUT terminal is higher than that of VIN terminal, current flows from VOUT terminal to VIN terminal. 2. Thermal Shutdown Circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 135°C(Typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 115°C(Typ.), power switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active). 3. Over-Current Detection (OCD) The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection circuit works when the switch is on (EN,/EN signal is active). 3-1. When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out. 3-3. When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ). Under-voltage lockout circuit works when the switch is on (EN,/EN signal is active). 5. Fault Flag (/OC) Output Fault flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/12 2011.05 - Rev.B BD2224G,BD2225G Technical Note Over Current Detection VOUT Over Current Load Removed ITH IOUT T/OC V/OC ISC Fig.39 Over-current detection VEN VOUT Output Shortcircuit Thermal Shutdown IOUT V/OC Delay Fig.40 Over-current detection, Thermal shutdown timing (BD2224G) V/EN VOUT Output Shortcircuit Thermal Shutdown IOUT V/OC Delay Fig.41 Over-current detection, Thermal shutdown timing (BD2225G) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/12 2011.05 - Rev.B BD2224G,BD2225G ●Typical Application Circuit Technical Note 5V (Typ.) 10kΩ~ 100kΩ CIN Controller VIN GND EN(/EN) /OC VOUT CL + Ferrite Beads Fig.42 Typical application circuit ●Application Information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor CIN by VIN terminal and GND terminal of IC. 1μF or higher is recommended. Pull up /OC output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. ●Power Dissipation Characteristic (SSOP5 package) 700 600 POWER DISSIPATION : Pd [mW] 500 400 300 200 100 0 0 25 50 75 85 100 AMBIENT TEMPERATURE : Ta [℃] 125 150 * 70mm x 70mm x 1.6mm Glass Epoxy Board Fig.43 Power Dissipation Curve (Pd-Ta Curve) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/12 2011.05 - Rev.B BD2224G,BD2225G ●Notes for Use Technical Note (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/12 2011.05 - Rev.B BD2224G,BD2225G ●Ordering part number Technical Note B D 2 Part No. 2224 2225 2 2 4 G - T R Part No. Package G: SSOP5 Packaging and forming specification TR: Embossed tape and reel SSOP5 2.9±0.2 5 4 +6° 4° −4° Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +0.2 1.6 −0.1 2.8±0.2 1 2 3 0.2Min. ( reel on the left hand and you pull out the tape on the right hand 1pin ) +0.05 0.13 −0.03 1.25Max. S +0.05 0.42 −0.04 0.95 0.1 S 1.1±0.05 0.05±0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/12 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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