BD2801MUV-E2

Datasheet Built-in Charge Pump 3ch Linear LED Driver BD2801MUV Key Specifications General Description The BD2801MUV is a 3ch linear constant-current LED driver IC with a built-in charge pump power supply, allowing the output current of each channel to be adjusted by external resistors connected to the IREF pin. In addition, each ch can be controlled ON/OFF by inputting an external signal. It is suitable for R, G, and B LED driver IC for CIS type sensors. ◼ ◼ ◼ ◼ Input Voltage Range: Output Current Accuracy: Maximum Output Current: Operating Temperature: Package 3.135 V to 3.465 V ±9.1 % 100 mA (DC) 0 °C to 70 °C W (Typ) x D (Typ) x H (Max) 3.0 mm x 3.0 mm x 1.0 mm VQFN016V3030 Features ◼ ◼ ◼ ◼ Built-in Charge Pump Power Supply 3ch Independent ON/OFF 8-step Current Setting IREF Pin Ground Fault Protection (IREF SCP) Application ◼ LED Driver for CIS Type Sensor Typical Application Circuit CPOUT LED_R LED_G LED_B VDD CN CONT_R Current Driver CP Charge Pump CONT_G Current Driver CONT_B EN Current Driver PDN VSS 〇Product structure : Silicon integrated circuit www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 Current Setting IREF 〇This product has no designed protection against radioactive rays. 1/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Pin Configuration CN CP GND CPOUT 16 15 14 13 (TOP VIEW) VDD 1 12 LED_R IREF 2 11 GND PDN 3 10 LED_G EN 4 9 GND 5 6 7 8 CONT_B CONT_G CONT_R LED_B Exposed PAD Pin Descriptions Pin No. Pin Name Function 1 VDD Power supply 2 IREF Output current setting(Note 1) 3 PDN Power-down mode input 4 EN 5 CONT_B LED control signal input B 6 CONT_G LED control signal input G 7 CONT_R LED control signal input R 8 LED_B 9 GND 10 LED_G 11 GND 12 LED_R LED current output R 13 CPOUT Charge pump power output 14 GND 15 CP Charge pump positive side 16 CN Charge pump negative side - EXP-PAD Enable Input LED current output B GND LED current output G GND GND Exposed pad. Connect EXP-PAD to the GND (Note 1) Do not connect external capacitors. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Block Diagram CPOUT LED_R LED_G LED_B VDD CP CN CONT_R Current Driver Charge Pump CONT_G Current Driver CONT_B EN Current Driver PDN VSS www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Current Setting 3/15 IREF TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Description of Blocks 1 Charge Pump Block Generates the voltage required to light the LEDs from the voltage supplied to the VDD pin. 2 LED Driver Block This product is a 3-channel LED driver that drives anode common R, G, and B LEDs with constant current. The current applied to each channel can be adjusted with external resistors, and the current can be turned ON/OFF with the CONT_R, CONT_G and CONT_B pins. The current can be set in 8 steps by the CONT_R, CONT_G, CONT_B and EN pins. In case of 3-channel simultaneous lighting, the current setting shall be 50 % or less. (In case of 66 mA) 3 Power Down Function When the PDN pin is set to Low during VDD power-up, the device enters a power-down state. During power-down, the current supply inside the device stops, the LED_R, LED_G and LED_B pins are High-Z, and the CPOUT pin is Low. At startup, VDD should be started up with PDN = Low. 4 LED Current Setting Method On the rising edge of the EN pin, the pattern on the CONT_R, CONT_G and CONT_B pins is latched to determine the current value. Then, once the CONT_R, CONT_G and CONT_B pins are set to Low, the LED current is turned on and off according to the CONT_R, CONT_G and CONT_B. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Absolute Maximum Ratings (Ta = 25 °C) No. A-1 A-2 A-3 Parameter VDD Pin Voltage IREF, PDN, EN, CONT_B, CONT_G, CONT_R Pin Voltage LED_B, LED_G, LED_R, CPOUT Pin Voltage A-4 CP to CN Pin Voltage A-5 Storage Temperature Range A-6 Maximum Junction Temperature Symbol Rating Unit VDD -0.3 to +4.0 V -0.3 to VDD + 0.3 V -0.3 to +8.0 V VCP-CN -0.3 to +8.0 V Tstg -55 to +150 °C Tjmax 150 °C VIREF, VPDN, VEN, VCONT_B, VCONT_G, VCONT_R, VLED_B, VLED_G, VLED_R VCPOUT Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit VQFN016V3030 Junction to Ambient θJA 189.0 57.5 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 23 10 °C/W (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Recommended Operating Conditions Parameter No. Symbol Min Typ Max Unit O-1 VDD Power Supply Voltage(Note 1) VDD 3.135 3.300 3.465 V O-2 Operating Temperature Topr 0 - 70 °C Symbol Min Typ Max Unit CVDD 10 - - μF CCP-CN 1.0 - - μF CCPOUT 1.0 - - μF RIREF 3.4 4.7 14.1 kΩ Vf 1.1 - 4.8 V (Note 1) ASO should not be exceeded. Operating Conditions Parameter No. P-1 P-2 P-3 VDD Pin Connection Capacitor(Note 2) CP to CN Pins Connection Capacitor(Note 2) CPOUT Pin Connection Capacitor(Note 2) P-4 Output Current Setting Resistor P-5 LED Vf (Note 2) Connect the capacitor within 10 mm from the IC; if the capacitor is connected beyond 10 mm, the output current ILED_X (X = R,G,B) may oscillate or otherwise become unstable, so evaluate the capacitor thoroughly on the actual device for confirmation. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Electrical Characteristics (Unless otherwise specified Ta = 0 °C to 70 °C, VDD = 3.135 V to 3.465 V) Standard Value No. Parameter Symbol Min Typ Max Unit Condition Circuit Current E-1 VDD Pin Circuit Current IVDD - 5.0 - mA RIREF = 4.7 kΩ Digital Input DC Characteristic E-2 Input High Voltage VIH VDD x 0.7 - - V E-3 Input Low Voltage VIL - - VDD x 0.3 V E-4 Input Leakage Current ILEAK -2 0 +2 μA 6.27 6.60 6.93 V PDN, EN, CONT_R, CONT_G, CONT_B Charge Pump E-5 CPOUT Voltage VCPO E-6 CPOUT Rise Time tCPON 1 ms E-7 CPOUT Fall Time tCPOFF 20 ms VDD = 3.3 V At LED current disable LED Driver E-8 LED Current Setting Range E-9 IREF Pin Output Current at Ground Fault IRANGE 22 - 80 mA IREF 120 150 180 mA ILED 60 66 72 mA E-11 - 100 - % RIREF = 4.7 kΩ, LED pin voltage = (2 x VDD - 3.1) V LED Pin Voltage = (2 x VDD - 3.1) V CONT_X (X = R, G, B) 000 E-12 86.0 87.5 89.0 % 001 E-13 73.5 75.0 76.5 % 010 60.5 62.5 64.5 % 011 E-15 48.0 50.0 52.0 % 100 E-16 35.5 37.5 39.5 % 101 E-17 23.0 25.0 27.0 % 110 E-18 10.5 12.5 14.5 % 111 % When ILED_X (X = R, G, B) = 49.5 mA setting, LED pin voltage range = 1.1 V to 6.6 V, VLED_ X (X = R, G, B) = 2.0 V reference E-10 LED Current (R/G/B) E-14 LED Current Accuracy (R/G/B) E-19 Dependence of LED Current on LED Pin Voltage www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 ALED DLEDVF -2.5 7/15 - +2.5 VIREF = 0 V TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Electrical Characteristics - continued (Unless otherwise specified Ta = 0 °C to 70 °C, VDD = 3.135 V to 3.465 V) Standard Value No. Parameter Symbol Min Typ Max Unit Condition LED Driver E-20 LED Current Rise Time tON - 10 - μs E-21 LED Current Fall Time tOFF - 10 - μs E-22 Current Setting Setup Time tS 1 - - μs E-23 Current Setting Hold Time tH 1 - - μs E-24 Current Setting Mode Clear Time tCL 1 - - μs tPD 150 - - ns E-26 Startup Time tSTUP - - 1 ms E-27 Power Down Current IPDN - - 20 μA CONT_X (X = R, G, B) to EN(0.3VDD) EN(0.7VDD) to CONT_X (X = R, G, B) CONT_X (X = R, G, B): 0.7VDD PDN E-25 Power Down Period www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Timing Chart EN CONT_R CONT_G CONT_B LED_R LED_G LED_B CONT_R CONT_G CONT_B Current Setting (Typ) 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 100 % 87.5 % 75 % 62.5 % 50 % 37.5 % 25 % 12.5 % Figure 1. Output current setting www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Timing Chart - continued LED Driver Block Switching Characteristics 0.7 VDD EN 0.3 VDD CONT_R CONT_G CONT_B (Set：High) tS tH 0.7 VDD 0.7 VDD tCL CONT_R CONT_G CONT_B (Set：Low) tCL tH 0.3 VDD tON tOFF 90 % LED Current 10 % Figure 2. LED current switching PDN Switching Characteristics tPD 3.135 V VDD tSTUP PDN EN Figure 3. Startup input switching www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Operational Notes – continued 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 4. Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Ordering Information B D 2 8 0 1 M U V Package MUV: VQFN016V3030 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN016V3030 (TOP VIEW) Part Number Marking BD2 LOT Number 8 0 1 Pin 1 Mark www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Physical Dimension and Packing Information Package Name www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN016V3030 14/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 BD2801MUV Revision History Date Revision 24.Aug.2022 001 Changes New Release www.rohm.com © 2022 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/15 TSZ02201-0T1T0B600450-1-2 24.Aug.2022 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 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However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. 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Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001