BD2812GU

1/4 Structure Silicon Monolithic Integrated Circuit Product Name RGB Illumination LED Driver for mobile phone Type BD2812GU RGB LED driver A slope control function is incorporated Slope control can be implemented using the DC current. Two modes “continuous illumination mode” and “illumination single cycle mode” are supported. Independent external ON/OFF synchronizing terminals (of dual drivers) are provided. Low consumption operation is possible by the sleep operation mode function. Charge pump system DC/DC built-in. Features ●Absolute Maximum Ratings (Ta=25 ℃) Parameter Maximum Applied voltage Power Dissipation Operating Temperature Range Storage Temperature Range Symbol VMAX Pd Topr Tstg 1460 Limits 7 Note1） Unit V mW ℃ ℃ -40 ~ +85 -55 ~ +150 note1）Power dissipation deleting is-11.68mW/ ℃, when it’s used in over 25 ℃. (It’s deleting is on the board that is ROHM’s standard) Dissipation by LSI should not exceed tolerance level of Pd. ●Operating conditions（VBAT≥VIO, Ta=-40~85 ℃） Parameter VBAT input voltage VIO pin voltage Symbol VBAT VIO Limits 2.7 ~ 5.5 1.65 ~ 3.3 Unit V V * Radiation-proof is not designed. REV. A 2/4 ●Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V) Parameter 【Circuit Current】 VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 VBAT Circuit current 4 VBAT Circuit current 5 VBAT Circuit current 6 VBAT Circuit current 7 【LED Driver】 LED current Step LED Maximum setup current LED current accurate ILEDSTP Symbol Min. Typ. Max. Unit μA μA mA mA mA mA μA Condition IBAT1 IBAT2 IBAT3 IBAT4 IBAT5 IBAT6 IBAT7 - 0.1 0.5 0.8 61 92 123 5 3.0 3.0 1.2 65 102 140 7.5 RESETB=0V, VIO =0V RESETB=0V, VIO=1.8V LED 6Ch ON, ILED=10mA setting Exclusive of LED current, RGBISET =120kΩ DC/DC x1mode, Io=60mA, VBAT=4.0V DC/DC x1.5mode, Io=60mA, VBAT=3.6V DC/DC x2mode, Io=60mA, VBAT=2.7V External clock Sleep operation mode External clock = 31.25kHz, ILED=0mA RGB1 group, RGB2 group RGB1 group, RGB2 group RGBISET=100kΩ RGB1 group, RGB2 group, Terminal voltage =1V ILED=20mA setting, RGBISET =120kΩ RGB1 group, between RGB2 group, Terminal voltage =1V ILED=20mA setting 128 18 20 30.48 22 step mA mA IMAX ILED LED current Matching LED OFF Leak current 【DC/DC (Charge Pump)】 Output voltage 1 ILEDMT ILKL - 5 - 10 1.0 % μA VoCP1 - Vf+0.2 3.9 4.2 4.5 4.8 1.0 6.0 250 Vf+0.25 4.095 4.41 4.725 5.04 255 1.2 6.5 375 V V V V V mA MHz V mA At output voltage auto mode, Vf is forward direction voltage of LED 3.705 Output voltage 2 VoCP2 3.99 4.275 4.56 Load stability Oscillator frequency Over voltage protection detect voltage Over current protection detect current 【SDA, SCL】 (I C interface ) VILI VIHI VhysI VOLI linI -0.3 0.75 × VIO 0.05 × VIO 0 -10 2 At fixed voltage output mode, Io=60mA VBAT≥3.2V Iout fosc OVP OCP 0.8 - VBAT≥3.2V, VOUT=4V VOUT=0V L level input voltage H level input voltage Hysteresis of Schmitt trigger input L level output voltage Input current - 0.25 ×VIO VBAT+0.3 0.3 10 V V V V μA SDA pin, IOL=3 mA Input voltage = 0.1×VIO~ 0.9×VIO REV. A 3/4 ● Electrical Characteristics（(Unless otherwise specified, Ta=25℃, VBAT=3.6V, VIO=1.8V） Parameter 【RESETB】 Symbol Min. Typ. Max. Unit Condition (CMOS input pin) VILR VIHR IinR VILCNT VIHCNT IinCNT (CMOS output pin) VOLCLK VOHCLK fclk1 fclk2 VIO -0.2 200 25 250 31.25 0.2 300 37.5 V V kHz kHz IOL=1mA IOH=1mA FSEL=0 setting FSEL=1 setting -0.3 0.75 × VIO -10 -0.3 0.75 × VIO 3.6 0.25 ×VIO VBAT+0.3 10 0.25 ×VIO VBAT+0.3 10 V V μA V V μA Input voltage = 1.8V Input voltage = 0.1×VIO~ 0.9×VIO L level input voltage H level input voltage Input current 【RGB1CNT, RGB2CNT】 L level input voltage H level input voltage Input current 【CLKIO（Output） 】 L level output voltage H level output voltage Output frequency1 Output frequency2 【CLKIO (Input)】 L level input voltage H level input voltage Input current (CMOS input pin with Pull-down resistance) (CMOS input pin with Pull-down resistance) VILCLK VIHCLK IinCLK -0.3 0.75 × VIO 3.6 0.25 ×VIO VIO+0.3 10 V V μA Input voltage = 1.8V ● Package 1PIN MARK Lot No. BD2812 3.1±0.05 0.25±0.1 1.0MAX S 0.06 S 32-φ0.30±0.05 0.05 AB F E D C B A 1 0.3±0.05 2345 P=0.5×5 6 A (φ0.15) INDEX POST B P=0.5×5 0.3±0.05 3.1±0.05 VCSP85H3 （unit:mm） REV. A 4/4 ● Block Diagram CPGND C1N C2N C1P C2P ●Pin Functions PIN VOUT PIN NAME VBATCP VBAT1 VBAT2 T1 T2 T3 T4 VIO RESETB SDA SCL CPGND GND1 GND2 RGBGND C1N PIN C5 A5 C6 D6 D5 E2 E6 E5 F5 E4 E3 F3 D2 D1 B4 C2 PIN NAME C1P C2N C2P VOUT VOUTM RGBISET R1LED G1LED B1LED R2LED G2LED B2LED RGB1CNT RGB2CNT ADDSEL CLKIO VBATCP VBAT2 VBAT1 Charge Pump Charge Pump Mode Control B6 F2 C1 x1 / x1.5 / x2 OVP VOUTM R1LED VIO LED port voltage Feedback A1 A6 F6 F1 A2 A3 B3 B2 Slope Control (RGB1) G1LED RESETB B1LED SCL R2LED Level SDA I2C interface Digital Control I/O Shift Slope Control (RGB2) G2LED B2LED RGB1CNT RGBGND RGB2CNT CLKIO ADDSEL CLKIO A4 E1 RGBISET IREF VREF TSD B1 GND1 GND2 T1 T3 T2 T4 F4 B5 ● Cautions on use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and ground line Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) Ground voltage Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) Short circuit between pins and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input pins In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that an operation becomes unstable. (11) About the pin for the test, the un-use pin Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge. (12) About the rush current For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of wiring. (13) About the function description or application note or more. The function description and the application notebook are the design materials to design a set. So, the contents of the materials aren't always guaranteed. Please design application by having fully examination and evaluation include the external elements. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. 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