BD33FA1FP3-ZTL

Single-Output LDO Regulators 30V Voltage Resistance 0.1A LDO Regulators BDxxFA1FP3 series ●General Description BDxxFA1FP3 series are LDO regulators with output current capability of 0.1A. The output voltages are 3.3V, 5.0V, 5.4V, and 12.0V with ±1% accuracy. The SOT89-3K package is most suitable for heat dissipation. As protective function to prevent IC from destruction, this chip has built-in over current protection circuit to protect the device when output is shorted, and built-in thermal shutdown circuit to protect the IC during thermal over load conditions. This product can be used in wide variety of digital appliances. These regulators can use ceramic capacitor, which have smaller size and longer life than other capacitors. W(Typ) D(Typ) H(Max) 4.50mm x 4.095mm x 1.60mm ●Package SOT89-3K ●Features  High accuracy output voltage ±1.0%  Built-in Over current protection circuit (OCP)  Built-in Temperature protection circuit (TSD)  Soft start function ●Key Features  Input power supply voltage range: Vo+3.0V to 25.0V  Output voltage: 3.3V, 5.0V, 5.4V, 12.0V  Output current: 0.1A (Max)  Operating temperature range: Ta= -25°C to +85°C ●Typical Application Circuit VCC VO COUT CIN GND FIN CIN,COUT : Ceramic Capacitor ●Ordering Information B Part Number D x x F A Output voltage Input Output Voltage Current 33: 3.3V 50: 5.0V F:30V A1:0.1A 54: 5.4V J2: 12V ○ Product structure : Silicon monolithic integrated circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 1 F P Package 3 - Z T L Manufacturing Packaging and forming Code specification FP3:SOT89-3K TL : Emboss tape reel ○This product is not designed to have protection against radioactive rays. 1/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Block Diagram VCC OCP SOFT START VO TSD GND Figure. 1 Block Diagram ●Pin Configuration SOT89-3K (TOP VIEW) FIN reverse 1 2 3 VO GND VCC ●Pin Description Pin No. 1 2 3 reverse Pin name Vo GND Vcc FIN Pin Function Output pin GND pin Input pin GND (Connected to 2pin) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit VCC Vo -0.3 to +30.0 *1 -0.3 to +18 V V Pd*2 1.67 *2 W Ta Tstg Tjmax -25 to +85 -55 to +150 +150 °C °C °C Power supply voltage Output voltage Power dissipation SOT89-3K Operating temperature range Storage temperature range Maximum junction temperature *1 Not to exceed Pd. *2 In case Ta≧25°C (114.3mm×76.2mm×1.6mm when mounted on a 4-layer PCB based on JEDEC) is reduced by 13.4mW/°C ●Recommended Operating Conditions (Ta=25°C) Parameter Input power supply voltage Output current Symbol VCC IO Min. Vo+3.0 0.0 Max. 25.0 0.1 Unit V A ●Recommended Operating Condition Parameter Output Capacitor Symbol COUT Min 0.3 *3 Typ Max Unit 1.0 - μF Conditions Ceramic capacitor recommended *3 The minimum value of capacitor must met this specification over full operating conditions. (Ex: Temperature, DC bias) ●Electrical Characteristics (Unless otherwise specified, Vcc= Vo+5V, Ta=25°C) Parameter Bias current Line Regulation Load Regulation Minimum dropout voltage Output voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Symbol Limits Unit Conditions Min. - Typ. 300 Max. 450 μA IO=0A, Vo=3.3V Reg.I Reg IO VCO -1 -1.5 - 300 300 400 0.5 0.5 1.0 450 450 600 1 1.5 3.0 μA μA μA % % V IO=0A, Vo=5.0V IO=0A, Vo=5.4V IO=0A, Vo=12.0V VCC =( Vo+3V )→25.0V IO=0→0.1A IO=0.1A VO Vo×0.99 Vo Vo×1.01 V IO=0A ICC 3/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Performance Curve (Reference Data) ■ BD54FA1FP3 (Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, CIN=COUT=1μF) 8 6 Output Voltage: Vo [V] 7 5 Vcc 6 5V/div 5 0V 4 4 3 3 Vo 2 2 2V/div 1 0V 1 0 0 0 2 4 6 0 100 200 300 400 500 600 700 800100us/div 9001000 100μs/div 8 10 12 14 16 18 20 22 24 26 Supply Voltage: Vcc [V] Figure 3. Input sequence (COUT = 1μF) Figure 2. Vcc - Vo 10 10 Io  9 50mA/8 Io  9 50mA/ 8 div 7 div 0mA 6 5 5 4 4 Vo 50mV3/ div 7 6 0mA Vo 50mV3/ 5.4V div 2 1 0 5.4V 2 1 0 0 1us/div 10 20 30 40 50 60 70 801μs/div 90 100 1μs/div 0 Figure 4. Transient Response (Io = 0A→0.1A) (COUT = 1μF) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10 20 30 40 50 60 70 80100us/div 90 100 100μs/div Figure 5. Transient Response (Io = 0.1A→0A) (COUT = 1μF) 4/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Performance Curve (Reference Data) ■ BD54FA1FP3 (Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, CIN=COUT=1μF) 450 5.45 Bias Current: Icc [μA] Output Voltage: Vo [V] 400 5.43 5.41 5.39 5.37 350 300 250 200 150 100 50 5.35 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 0 -30 -20 -10 0 Figure 6. Ta - Vo (Io = 0mA) Figure 7. Ta - Icc 600 6 500 5 Output Voltage: Vo [V] Bias Current: Icc [μA] 10 20 30 40 50 60 70 80 90 Temperature: Ta [℃] Temperature: Ta [℃] 400 300 200 100 0 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 0 Output Current: Io [mA] 40 60 80 100 Output Current: Io [mA] Figure 8. Io - Icc www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20 Figure 9. Io - Vo 5/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Performance Curve (Reference Data) 1.2 6 1 5 Output Voltage: Vo [V] Dropout Voltage: Vco [V] ■ BD54FA1FP3 (Unless otherwise specified, Ta=25°C, Vcc=Vo+5V, CIN=COUT=1μF) 0.8 0.6 0.4 0.2 0 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 150 100 Output Current: Io [mA] 155 160 165 Figure 10. Minimum dropout Voltage Figure 11. TSD (Io = 0mA) Figure 12. OCP Figure 13. PSRR (Io = 50mA) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 170 175 180 Ambient Temperature: Ta [℃] 6/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Performance Curve (Reference Data) Equivalent Series Resistance: ESR [Ω] ■ BD54FA1FP3 (Unless otherwise specified, Ta=25°C, Vcc=10.4V, CIN=COUT=1μF) 10 1 Stable Area 0.1 0.01 0 20 40 60 80 100 Output Current: Io [mA] Figure 14. ESR Stable Region www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Power Dissipation ◎SOT89-3K Power Dissipation: Pd [W] 2 θj-a θj-a==74.8℃/W 74.8°C/W 1.5 1 0.5 0 0 25 50 75 100 125 150 Ambient Temparature: Ta [℃] Measurement condition: mounted on 4-layer JEDEC standard board Board size: 114.3mm × 76.2mm × 1.6mm When considering thermal design, operation should be maintained within the following conditions. (The temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.) 1. Ambient temperature Ta is 85°C and below. 2. Junction temperature Tj is 150°C and below. The junction temperature Tj can be determined as follows: Calculation based on ambient temperature Ta Tj=Ta+θj-a×W ・θj-a: SOT89-3K 74.8°C/W JEDEC standard 4 layers PCB Board size: 114.3mm × 76.2mm × 1.6mm Most of the heat loss that occurs in BDxxFA1FP3 is generated from the output Pch FET. Power loss is determined by the product of voltage drop across Vcc-Vo and the output current. Check the conditions of output voltage and output current to be used between Vcc-Vo and compare with the power dissipation characteristics. In addition, power dissipation may change significantly due to board conditions because BDxxFA1FP3 uses power package. It is important to consider the board size to be used before proceeding with the design. Power consumption [W] = { Input voltage (Vcc) – Output voltage (Vo) } × Output current (Io: Ave) Example) Vcc = 10.4V, Vo = 5.4V, Io(Average) = 0.1A Power consumption [W] = ( 10.4V – 5.4V ) × 0.1A = 0.5W www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Input/Output Capacitor It is recommended that a capacitor is placed close to pin between input pin and GND as well as output pin and GND. The input capacitor becomes more necessary when the power supply impedance is high or when the PCB trace has significant length. Moreover, the higher the capacitance of the output capacitor the more stable the output will be, even with load and line voltage variations. However, please check the actual functionality by mounting on a board for the actual application. Also, ceramic capacitors usually have different thermal and equivalent series resistance characteristics and may degrade gradually over continued use. For additional details, please check with the manufacturer and select the best ceramic capacitor for your application. Rated Voltage: 10V 10 B1 characteristics GRM188B11A105KA61D 0 Rated Voltage: 10V -10 B characteristics Capacitance Change [%] Rated Voltage: 6.3V -20 B characteristics -30 -40 Rated Voltage: 10V -50 F characteristics -60 Rated Voltage: 4V X6S characteristics -70 -80 -90 -100 0 1 2 DC Bias Voltage [V] 3 4 Ceramic Capacitor Capacitance Value - DC Bias Characteristics (Characteristics Example) To prevent oscillation, please attach a capacitor between VO and GND. Generally, capacitor has ESR (Equivalent Series Resistance). Operation will be stable in ESR-Io range*1 shown in the right. The 1.0µF ceramic capacitor and resistor at output in this characteristic data are connected in series and measured. Generally, ESR of ceramic capacitor, tantalum capacitor and electrolytic capacitor is different. Check the ESR of capacitor to be used and use it within the range of stable region. However, please take note that for the same value of capacitance of different electrolytic capacitor, ESR are not always the same. In addition, ESR characteristics may also change due to wiring impedance of board, input power impedance and load impedance; therefore check the behavior in actual application. Equivalent  Series Resistance: ESR  [Ω] ●Output Capacitor Equivalent Series Resistance 10 1 Stable Area 安定領域 0.1 0.01 0 20 40 60 80 100 Output Current: Io [mA] *1 Ta=25°C, Vcc=6.3V to 25V, Io=0A to 0.1A www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Input/Output Equivalent Circuit 3pin (VCC) / 1pin (VO) 3pin (VCC) 1pin (VO) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Operational Notes (1) Absolute Maximum Value Rate Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. (2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. (3) Power supply line Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (4) Ground voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. (6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused be conductive particles caught between the pins. (7) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (8) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. BDxxFA1FP3 TSD ON Temperature [°C] (Typ) 173 Hysteresis Temperature [°C] (Typ) 8 (9) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 (10) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. (11) Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●External Measurement Drawing and Packing Forming Specification Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOT89-3K 13/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Datasheet BDxxFA1FP3 ●Marking Diagram Output Voltage [V] Part Number Marking(xx) 3.3 33 Part Number Marking 5.0 50 5.4 54 LOT Number 12.0 J2 SOT89-3K (TOP VIEW) xxF1 1PIN ●Revision History Date Revision 2014.02.04 001 New release 2014.10.31 002 Added 5.0V and 12V to output voltage line-up. 2015.06.08 003 The document control number: TSZ02201-0R6R0A600600-1-2 →TSZ02201-0GAG0A600600-1-2. Modified the package name to SOT89-3K. Modified external measurement drawing. 004 P.1 Ordering Information changed P.3 Electrical characteristics added P.6 Figure 13. PSRR modified from (Io=0mA) to (Io=50mA) The document control number: TSZ02201-0R6R0A600600-1-2 →TSZ02201-0G2G0A600060-1-2 2016.04.11 Revision contents www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/14 TSZ02201-0G2G0A600060-1-2 11.Apr.2016 Rev.004 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001