BD34700FV-E2

Datasheet Sound Processors for Home Theater Systems 4ch Sound Processor with Built-in Micro-step Volume BD34700FV General Description Key Features      The BD34700FV is a 4ch independent volume system. Micro-step volume can reduce the switching pop noise when volume changes, so it can achieve a high-quality set. It is most suitable for subvolume of the multi channel volume such as AV receivers, but is most suitable for main volume of simple systems such as 2ch. Total harmonic distortion: Maximum output voltage: Output noise voltage: Residual output noise voltage: Cross-talk between channels: Package SSOP-B40 0.0004%(Typ.) 4.2Vrms(Typ.) 1.5uVrms(Typ.) 1.0uVrms(Typ.) -105dB(Typ.) W(Typ.) x D(Typ.) x H(Max.) 13.60mm x 7.80mm x 2.00mm Features  Micro-step volume can reduce the switching pop noise when volume changes.  Micro-step volume can reduce the capacitor for the DC offset cut  2-wire serial bus control, corresponding to 3.3/5V.  It is controllable to two chips on the same serial bus by using chip select terminal. Applications  Most suitable for the AV receivers, home theater and mini-component systems SSOP-B40 CL DA DGND CHIP Typical Application Circuit Figure 1. Application Circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/29 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Pin Configuration SSOP-B40 (TOP VIEW) 1 40 TEST TEST 2 39 TEST TEST 3 38 TEST GND 4 37 TEST GND 5 36 NC NC 6 35 NC VEES VINL1 7 34 GND VINR1 8 33 GND VINL2 9 32 GND VINR2 10 31 GND GND 11 30 GND GND 12 29 GND GND 13 28 GND CHIP 14 27 GND NC 15 26 VOUTL1 VCC 16 25 VOUTR1 DGND 17 24 TEST DA 18 23 TEST CL 19 22 VOUTL2 VEE 21 VOUTR2 20 Figure 2. Pin Configuration www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Description of terminal Terminal Number Symbol Terminal Number Symbol 1 VEES Negative power supply terminal 21 VOUTR2 Volume output terminal R2 2 TEST TEST terminal 22 VOUTL2 Volume output terminal L2 3 TEST TEST terminal 23 TEST TEST terminal 4 GND Analog ground terminal 24 TEST TEST terminal 5 GND Analog ground terminal 25 VOUTR1 Volume output terminal R1 6 NC Non connection 26 VOUTL1 Volume output terminal L1 7 VINL1 Volume input terminal L1 27 GND Analog ground terminal 8 VINR1 Volume input terminal R1 28 GND Analog ground terminal 9 VINL2 Volume input terminal L2 29 GND Analog ground terminal 10 VINR2 Volume input terminal R2 30 GND Analog ground terminal 11 GND Analog ground terminal 31 GND Analog ground terminal 12 GND Analog ground terminal 32 GND Analog ground terminal 13 GND Analog ground terminal 33 GND Analog ground terminal 14 CHIP Chip select 34 GND Analog ground terminal 15 NC Non connection 35 NC Non connection 16 VCC Positive power supply terminal 36 NC Non connection 17 DGND Digital ground terminal 37 TEST TEST terminal 18 DA Data and latch input terminal 38 TEST TEST terminal 19 CL Clock input terminal 39 TEST TEST terminal 20 VEE Negative power supply terminal 40 TEST TEST terminal Function www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/27 Function TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Block Diagram Figure 3. Block Diagram www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Absolute Maximum Ratings Item Symbol Rating Unit Positive power supply VCC +7.75 (Note1) V Negative power supply VEE -7.75 (Note1) V Power dissipation Pd 1.12 (Note2) W Input voltage Vin Operating temperature Topr Storage temperature Tstg Vee-0.2 to Vcc+0.2 -40 to +85 (Note3) -55 to +150 V °C °C (Note1) The maximum voltage that can be applied based on GND. (Note2) This value decreases 9.0mW/°C for Ta=25°C or more. A standard board, 70×70×1.6 mm, shall be mounted. (Note3) If it within operation voltage range, circuit functions operation is guaranteed within operation temp. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Operating Condition Item Symbol Rating Positive power supply VCC +6.5 to +7.5 Negative power supply VEE -6.5 to -7.5 (Note4) (Note5) Unit (Note4,5) (Note4,5) V V Applying a voltage based on GND. Within operation temp range, basic circuit function Operation is guaranteed within operation voltage range. But please confirm set up of constant and element, voltage set up and temp set up on use. Please watch out except condition stipulated by electrical characteristics within the range, It cannot guarantee standard value of electrical characteristics. But it retains original function . www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Electrical characteristic Unless specified particularly, Ta=25°C, Vcc=7V, Vee=-7V, f=1kHz, Vin=1Vrms, RL=10kΩ, Stereo input =VINL1,VINR1, Stereo output=VOUTL1,VOUTR1, Volume=0dB. Limit Item Symbol Unit Min. Typ. Max. TOTAL Positive circuit current Iqp - 22 44 mA No signal Negative circuit current Iqn -44 -22 - mA No signal Output voltage gain Gv -1.5 0 1.5 dB 21,22,25,26pin output Channel balance CB -0.5 0 0.5 dB L Channel reference, Total harmonic distortion THD - 0.0004 0.02 % Maximum output voltage Vom 3.8 4.2 - Vrms Output noise voltage Vno - 1.5 10 µVrms Vnor - 1 8 µVrms Cross-talk between channels ＊ CT - -105 -80 dB Input impedance Rin 32 47 62 kΩ 7 to 10pin ATTmax - -115 -100 dB Volume=Mute, BW=IHF-A ＊ Residual output noise voltage ＊ VOLUME Conditions Maximum attenuation ＊ BW=400 to 30kHz 21,22,25,26pin output THD=1%, VOLUME=+10dB 21,22,25,26pin output Rg=0Ω, BW=IHF-A 21,22,25,26pin output Volume=Mute, Rg=0Ω, BW=IHF-A 21,22,25,26pin output Rg=0Ω, BW=IHF-A 21,22,25,26pin output ※VP-9690A(Average value detection, effective value display) filter by Panasonic is used for ＊ measurement. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Typical Performance Curve(s) 30 25 20 15 Volume Gain[dB] Current[mA] 10 5 0 Operational range -5 -10 -15 -20 -25 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 -2 -30 0 1 2 3 4 5 6 7 10 8 100 VCC(+)/VEE(-)[V] Volume Gain[dB] Volume Gain[dB] 1000 10000 100000 Frequency[Hz] -30 -32 -34 -36 -38 -40 -42 -44 -46 -48 -50 -52 -54 -56 -58 -60 -62 -64 -66 10 100 1000 10000 100000 Frequency[Hz] Figure 6. Volume Gain vs. Input Frequency (0dB to -32 dB setting) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100000 Figure 5. Volume Gain vs. Input Frequency (32dB to 0 dB setting) 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 -30 -32 -34 100 10000 Frequenc y[Hz] Figure 4. Circuit Currents vs. Circuit Voltage 10 1000 Figure 7. Volume Gain vs. Input Frequency (-32dB to -64 dB setting) 7/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet 1.0000 -60 -62 -64 -66 -68 -70 -72 -74 -76 -78 -80 -82 -84 -86 -88 -90 -92 -94 -96 -98 0.1000 10kHz 100Hz THD+N[%] Volume Gain[dB] BD34700FV 1 kHz 0.0100 0.0010 0.0001 10 100 1000 10000 100000 0.001 Frequency[Hz] 0.100 1.000 10.000 Input Voltage [Vrms] Figure 8. Volume Gain vs. Input Frequency (-64dB to -95 dB setting) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.010 Figure 9. THD + N vs. Input Voltage 8/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Specifications for Control Signal (1) Timing of control signal Data is read at a rising edge of clock. Latch is read at a falling edge of clock. And Data on the latest 16bit are taken in the inside of this IC. Be sure to set DA and CL to LOW after latching. 1byte=16bit CL ( CLOCK) tsu 90％ 90％ twc 10％ thd DA DATA LATCH 90％ twd ts 90％ DATA th 90％ 10％ 10％ tsd thd tsl 90％ twh 10％ 90％ twc 90％ twl DATA 10％ thl 10％ 90％ LATCH Figure 10. The timing definition of the control signal. Item Symbol Clock width Data width Latch width Low hold width Data setup time (DATA→CLK) Data hold time (CLK→DATA) Latch setup time (CLK→LATCH) Latch hold time Latch Low setup time Latch Low hold time twc twd twl twh tsd thd tsl thl ts th Limit Typ. - Min. 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 0.5 Max. - Unit µsec µsec µsec µsec µsec µsec µsec µsec µsec µsec (2) Voltage of control signal (CL, DA, CHIP) Limit Item High input voltage Low input voltage (3) Basic Structure of Control Data ←Input Direction D15 D14 D13 D12 D11 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Conditions Vcc=+6.5 to +7.5V Vee=-6.5 to -7.5V D10 D9 Data D8 9/27 D7 Min. Typ. Max. (B switching time] [B->A switching time] Prossing Time Figure 11. About [A→B switching-time] [B→A switching-time] Base clock is able to change Internal Oscillator Frequency. For example, when Base clock select ×1/2, A->B and B->A switching time is to be two times. (ex. 11msec->22msec) ○Caution on send data When send the same channel data among the switching process, internal operation is as below. Inv alid data ① ② ③ ④ CLK DATA Processing IC processing Output A->B switching time Initial time per 1 Processing B->A switching t ime Initial → ① → time A->B switching time ② per 1 B->A switching time ② → ④ Figure 12. The switching process with send data ②data is sent during A -> B switching time, it is valid. ③data and ④data are sent during B -> A switching time, it is valid at the next processing time. But ③data is replaced by ④data. ○About pop noise in gain changing The level of the pop noise sometimes varies in the difference in output DC offset of the inside condition A and B. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Application Circuit Diagram VOUTL1 10μ 10μ 34 33 32 31 30 29 28 27 VOUTL2 VOUTR1 26 VOUTR2 10μ 25 10μ 22 21 +32dB~95dB 0.5dB step LOGIC VINL1 8 VINR1 9 VINL2 10 11 12 13 14 VINR2 16 47μ 17 18 19 2200p VCC CL 7 DA 5 DGND 4 CHIP 1 20 47μ 2200p VEE Figure 13. Application Circuit Diagram Notes on wiring ① GND shall be wired from reference point and thicken. ② Wiring pattern of CL and DA shall be away from that of analog unit and cross-talk shall not be acceptable. ③ Lines of CL and DA of shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other. ④ Please pay attention the wiring pattern of the input terminal of the input selector to the cross talk. Recommend that wiring period is shielded. ⑤ Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to VCC and GND, VEE. ⑥ 1pin have to connect to 20-pin(VEE), if you don’t connect like as this note, IC may occurred “latch-up or ESD damaged”. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Power Dissipation About the thermal design by the IC Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two standpoints of immediate damage and long-term reliability of operation. Reference data SSOP-B40 Measurement condition: ROHM Standard board board Size：70×70×1.6(㎣) material：A FR4 grass epoxy board (3% or less of copper foil area) Power Dissipation Pd(W) 2.0 1.12W θja = 111.1°C/W 1.0 0.0 0 25 50 75 85 100 125 150 Ambient Temperature Ta(°C) Figure 14. Temperature Derating Curve Note) Value is actual measurements and is not guaranteed. Power dissipation values vary according to the board on which the IC is mounted. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV I/O equivalence circuit(s) Terminal Number Terminal Name Terminal Voltage (V) Equivalent Circuit Description of terminal Negative power supply terminal Vcc 1 VEES -7 Vee 4 5 11 12 13 27 28 29 30 31 32 33 34 Analog ground terminals. Vcc AGND 0 Vee Positive power supply terminal and Negative power supply terminal 16 20 VCC VEE +7 -7 Vcc Digital ground terminal. 17 DGND 0 Vee Vcc Input terminals for a clock and data. 18 DA 19 CL 14 CHIP - Vee Vcc Output terminals for analog sound signal. 21 22 25 26 VOUTR2 VOUTL2 VOUTR1 VOUTL1 0 Vee www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Terminal Number Terminal Name Terminal Voltage (V) Equivalent Circuit Input terminals for stereo sound signal. Input impedance is 47kΩ(Typ.). Vcc 7 8 9 10 VINL1 VINR1 VINL2 VINR2 Description of terminal 47k 0 Vee TEST terminals 2 3 23 24 37 38 39 40 TEST www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 23/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. VEE Voltage Ensure that no pins are at a voltage below that of the VEE pin at any time, even during transient condition. 4. Ground Wiring Pattern GND pins which are digital ground(17pin) and analog ground(4,5,11,12,13,27,28,29,30,31,32,33,34pin) are not connected inside LSI. These ground pins traces should be routed separately but connected to a single ground at the reference point of the application board. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to IC pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Because the input impedance of the terminal becomes 47kΩ when the signal input terminal makes a terminal open, the plunge noise from outside sometimes becomes a problem. Please connect the no using input pin to GND. And please open the no using output pin. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Operational Notes – continued 1 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When Vee > Pin A and Vee > Pin B, the P-N junction operates as a parasitic diode. When Vee > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the Vee voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin B Pin A C E Pin A P + N P + N N P + N Pin B B Parasitic Elements N P N P B + N P N C E Parasitic Elements P Substrate P Substrate Vee Vee Vee Vee Parasitic Elements Parasitic Elements N Region close-by Figure 15. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. About power ON/OFF 1. At power ON/OFF, a pop sound will be generated and, therefore, use MUTE on the set. 2. When turning on power supplies, Vee and Vcc should be powered on simultaneously or Vee first; then followed by Vcc. If the Vcc side is started up first, an excessive current may pass Vcc through Vee. 15. About function switching When switching Input Selector, Mode selector or Input Gain, use MUTE on Volume. 16. Volume gain switching In case of the boost of the volume when changing to the high gain which exceeds +20dB especially, the switching pop noise sometimes becomes big. In this case, we recommend changing every 1 dB step without changing a gain at once. Also, the pop noise sometimes can reduce by making micro-step volume switching time long, too. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Operational Notes – continued 2 17. Output load characteristic The usages of load for output are below (reference). Please use the load more than 10 kΩ(TYP). Output terminal Terminal Terminal No. Name 21 VOUTR2 22 VOUTL2 Terminal No. 25 26 Terminal Name VOUTR1 VOUTL1 5 4.5 4 V O,max Vrms 3.5 3 2.5 2 Vcc=+7V Vee=-7V THD+n=1% BW=400～30kHz 1.5 1 0.5 0 100 1000 10000 100000 Load Resistance Ω Figure 16. Output load characteristic at Vcc=+7V, Vee=-7V(Reference) 18. About TEST and N.C pins treatment About the next pin of the TEST and NC designator, please handle it as follows Pin number How to countermeasure 2,3,37,38,39,40 Short to GND 6,15,23,24,35,36 OPEN (None connection) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Ordering Name Selection B D 3 4 7 0 0 F V E2 Package FV: SSOP-B40 Part Number Tape and Reel Information E2: Reel type embossed taping (SSOP-B40) Physical Dimension Tape and Reel Information SSOP-B40 13.6 ± 0.2 (MAX 13.95 include BURR) 0.5 ± 0.2 1 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 20 0.15 ± 0.1 0.1 1.8 ± 0.1 Embossed carrier tape Quantity 21 5.4 ± 0.2 7.8 ± 0.3 40 Tape 0.1 S 0.65 0.22 ± 0.1 0.08 M 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. Marking Diagram SSOP-B40(TOP VIEW) Part Number Marking BD34700FV LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet BD34700FV Revision History Date 6.Aug.2014 Revision 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/27 TSZ02201-0C2C0E100060-1-2 06.Aug.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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