Datasheet
1.2V to VCC-1V, 2.5A 1ch
Ultra Low Dropout Linear Regulator
BD3506F
General Description
Key Specifications
The BD3506F is an ultra-low dropout chipset linear
regulator that can achieve ultra-low voltage output
from an ultra-low voltage input. By using N-Channel
MOSFET for built-in power transistor, the regulator can
be used at ultra-low I/O voltage difference up to
voltage difference generated by ON resistor
(RON=120mΩ(Typ)). By reducing the I/O voltage
difference, large current (IOUTMAX=2.5A) output is
achieved and conversion loss can be reduced making
it comparable to switching power supply. BD3506F
does not need any choke coil, diode for rectification
and power transistors which are required for switching
power supply. Consequently, total cost of the set can
be reduced and compact size can be achieved for the
set. By using external resistors, output voltages from
0.65V to 2.5V can be set. In addition, since output
voltage start-up time can be adjusted by using the
NRCS terminal, it is possible to meet the power supply
sequence of the set.
IN Input Voltage Range:
VCC Input Voltage Range:
Output Voltage Range:
Output Current:
ON-Resistance:
Standby Current:
Operating Temperature Range:
Package
1.2V to VCC -1V
4.3V to 5.5V
0.65V to 2.5V
2.5A (Max)
120mΩ(Typ)
0µA (Typ)
-10°C to +100°C
W(Typ) x D(Typ) x H(Max)
Features
Built-in high-accuracy reference voltage circuit
(0.65V±1%)
Built-in VCC low input malfunction prevention
circuit (VCC = 4.15V)
Reduced rush current by NRCS
Built-in ultra-low on-resistor N-Channel Power
MOSFET
Built-in current limiting circuit (2.5A min)
Built-in thermal shutdown circuit
SOP8
5.00mm x 6.20mm x 1.71mm
Applications
Mobile PC, desktop PC, LCD-TV, DVD, digital home
appliances
Typical Application Circuit and Block Diagram
VCC
VCC
4
VCC
Enable
EN
1
UVLO
Current
CL
Reference
VIN
IN
IN
VIN
2
Limit
Block
OUT1
Vo1
7
CL
UVLO
TSD
Thermal
Vo
OUT
8
Vo2
OUT2
EN
VFB
FB
R2
R2
3
Shutdown
R1
R1
NRCS
TSD
6
5
NRCS
○Product structure：Silicon monolithic integrated circuit
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○This product has no designed protection against radioactive rays
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BD3506F
Pin Configuration
Pin Descriptions
TOP VIEW
EN 1
8 OUT2
VO2
IN 2
VIN
VO1
7 OUT1
FB 3
6 NRCS
VCC 4
5 GND
Pin No.
Pin Name
Pin Function
1
EN
Enable pin
2
IN
Input voltage pin
3
FB
Output voltage feedback
4
VCC
Power source
5
GND
Ground pin
6
NRCS
NRCS(Non rush current on start
up) time setup
7
OUT1
OUT1 Pin
8
OUT2
OUT2 Pin
Description of Blocks
1.
AMP
This is an error amplifier that compares the reference voltage (VREF) with FB voltage to drive the output N-Channel FET.
The frequency characteristics are optimized so that low ESR functional polymer capacitor can be used for the output
capacitor and high-speed transient response can be achieved. The output voltage range of the AMP section is
GND-VCC. When EN is OFF or at UVLO, the output goes LOW and the output N-Channel FET is turned OFF.
2.
EN
By the logic input pin, regulator ON/OFF is controlled. At the time of OFF, the circuit current is limited to 0 µA to reduce
the standby current consumption of the apparatus. In addition, EN turns ON FET that can discharge NRCS and OUT
and removes excess electric charge to prevent malfunction of IC on the load side. Since there is no electrical
connection with the VCC terminal (as in the case where there is and ESD diode) , operation is independent on the
input sequence.
3.
UVLO
To prevent malfunctions that can occur during sudden decrease in VCC, the UVLO circuit switches the output to OFF
state, and (like the EN block) discharges NRCS and OUT. When the voltage exceeds the threshold voltage (TYP
4.15V), the output is restored.
4.
Current Limit
When the output is ON and the output current exceeds the set current limit threshold (2.5A or more) , the output
voltage is attenuated to protect the IC on the load side. When current decreases, the output voltage is restored returns
to the allowable value.
5.
NRCS
By connecting an external capacitor to NRCS pin and GND, soft start function is enabled. The output voltage startup
time is determined by the time when the NRCS terminal reaches VFB (0.65V). During start-up, the NRCS terminal
serves as a constant current source of 20 µA (Typ), and charges the capacitor that is externally connected.
6.
TSD (Thermal Shut down)
In order to prevent thermal breakdown and thermal runaway of the IC, the output is turned OFF when chip temperature
exceeds the threshold temperature. When the temperature decreases below the threshold temperature, the output is
restored. While the TSD circuit is designed to protect the IC in the occurrence of extreme heat, thermal design should
consider not to exceed Tj(max).
7.
IN
The IN line acts as the major current supply line, and is connected to the output N-Channel FET drain. Since there is
no electrical connection with the VCC terminal, as in the case when an ESD diode is connected, its operation does not
depend on the input sequence. However, because of the body diode of the output N-Channel FET, there is electrical
connection (diode connection) between IN and OUT. Consequently, when the output is turned ON and OFF by IN,
reverse current flows, in which case care must be taken.
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BD3506F
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Input Voltage1
VCC
7 (Note 1)
V
Input Voltage2
VIN
7 (Note 1)
V
Enable Input Voltage
VEN
7
V
Power Dissipation1
Pd1
0.56 (Note 2)
W
Power Dissipation2
Pd2
0.69 (Note 3)
W
Operating Temperature Range
Topr
-10 to+100
°C
Storage Temperature Range
Tstg
-55 to+125
°C
Tjmax
+150
°C
Maximum Junction Temperature
(Note 1) Provided Pd is not exceeded.
(Note 2) Derate by 4.48 mW/°C in the case of Ta ≥ 25°C (no heat radiation board),
(Note 3) Derate by 5.52 mW/°C in the case of Ta ≥ 25°C (when mounted on a 70mm x 70mm x 1.6mm glass epoxy substrate),
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)
Parameter
Rating
Symbol
Min
Max
Unit
Input Voltage1
VCC
4.3
5.5
V
Input Voltage2
VIN
1.2
VCC -1 (Note 4)
V
Output Voltage
VOUT
VFB
2.5
V
VEN
-0.3
+5.5
V
CNRCS
0.001
1
µF
Enable Input Voltage
Capacitor in NRCS pin
(Note 4) However, irrespective of charging order of VCC and IN.
Electrical Characteristics
(Unless otherwise noted, Ta=25°C VCC=5V VEN=3V VIN=1.8V R1=3.9kΩ R2=3.3kΩ)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Circuit Current
ICC
-
0.7
1.4
mA
Shut-Down Mode Current
IST
-
0
10
µA
VEN=0V
IOUT=50mA
Output Voltage
VOUT
-
1.200
-
V
Maximum Output Current
IOUT
2.5
-
-
A
Maximum Short Current
Temperature Coefficient of Output
Voltage
Feed Back Voltage 1
IOST
-
2.0
-
A
Tcvo
-
0.01
-
%/°C
VFB1
0.643
0.650
0.657
V
Feed Back Voltage 2
VFB2
0.630
0.650
0.670
V
Line Regulation 1
Reg.l1
-
0.1
0.5
%/V
IOUT=50mA
IOUT=0 to 2A,
Ta=-10°C to +100°C (Note 5)
VCC=4.3V to 5.5V
Line Regulation 2
Reg.l2
-
0.1
0.5
%/V
VIN=1.2V to 3.3V
Load Regulation
Reg.L
-
0.5
10
mV
Dropout Voltage
dVo
-
120
200
mV
Standby Discharge Current
IDEN
150
-
-
mA
IOUT=0A to 2A
IOUT=1A,VIN=1.2V,
Ta=-10°C to +100°C (Note 5)
VEN=0V, VOUT=1V
High Level Enable Input Voltage
VENHI
2
-
5.5
V
Low Level Enable Input Voltage
VENLOW
-0.3
-
+0.8
V
IEN
-
7
10
µA
IFB
-100
0
+100
nA
VOUT=0V
[Enable]
Enable Pin Input Current
VEN=3V
[Voltage Feed Back]
Feed Back Terminal Bias Current
(Note 5) Not 100% tested
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BD3506F
Electrical Characteristics – continued
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
[NRCS]
NRCS Charge Current
INRCS
14
20
26
µA
VNRCS=0.5V
NRCS Standby Voltage
VSTB
-
0
50
mV
VEN=0V
VCC UVLO
VCCUVLO
4.00
4.15
4.30
V
VCC UVLO Hysteresis
VCCHYS
100
160
220
mV
[UVLO]
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VCC: Sweep-down
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BD3506F
Typical Performance Curves
10
Feed Back Voltage : VFB (mV)
654
Input Current
: IIN (µA)
IIN(uA)
8
6
4
2
653
652
651
650
649
648
647
0
646
0
2
4
6
Input Voltage
: VIN (V)
VIN(V)
-10
8
30
50
70
90
Temperature : Ta (°C)
Figure 1. Input Current vs Input Voltage
(Ta=25°C)
Figure 2. Feed Back Voltage vs Temperature
14
700
12
Feed Back Voltage : VFB (mV)
Enable Pin Input Current : IEN (V)
10
10
8
6
4
2
0
0
1
2
3
4
500
400
300
200
100
0
5
0
0.2
0.4
0.6
0 .8
1
1.2
VNRCS (V)
Enable Input Voltage : VEN (V)
Figure 3. Enable Pin Input Current vs Enable Input
Voltage
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Figure 4. Feed Back Voltage vs VNRCS
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BD3506F
Typical Waveforms
VEN
VEN
VIN
VIN
VCC
VCC
VOUT
VOUT
Figure 5. Input Voltage SequenceFinal Input
Voltage EN
Figure 6. Input Voltage Sequence Final Input
Voltage IN
VEN
VOUT
20mV/DIV
VIN
VCC
IOUT
1A/DIV
VOUT
Figure 7. Input Voltage SequenceFinal Input
Voltage VCC
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Figure 8. Transient Response (Rise)
COUT=100µF
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BD3506F
Typical Waveforms – continued
VOUT
20mV/DIV
VOUT
20mV/DIV
IOUT
1A/DIV
IOUT
1A/DIV
Figure 9. Transient Response (Fall)
COUT=100µF
Figure 10. Transient Response (rise)
COUT=220µF
VOUT
20mV/DIV
VOUT
50mV/DIV
IOUT
1A/DIV
IOUT
1A/DIV
Figure 12. Transient Response (Rise)
47µ MLCC+30mΩ
Figure 11. Transient Response (Fall)
COUT=220µF
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BD3506F
Typical Waveforms – continued
VOUT
50mV/DIV
EN
2V/DIV
NRCS
0.5V/DIV
IOUT
1A/DIV
OUT
0.5V/DIV
Figure 13. Transient Response (Fall)
47µ MLCC+30mΩ
Figure 14. Start up Wave Form
EN
2V/DIV
NRCS
0.5V/DIV
OUT
0.5V/DIV
Figure 15. Shut down Wave Form
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BD3506F
Timing Chart
EN
ON/OFF
IN
VCC
V
O
2
EN
NRCS
Start up Time
OUT
t
VCC
ON/OFF
IN
UVLO
hysteresis
VCC
EN
NRCS
Start up Time
OUT
t
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BD3506F
Application Information
1. Evaluation Board
■BD3506F Evaluation Board Circuit
U1
EN
1
VIN
2
CIN1
3
BD3506F
EN
OUT2
IN
OUT1
FB
NRCS
Vo
8
7
R1
6
R2
GND
VCC
4
VCC
GND
COUT
CNRCS
5
CCC
■BD3506F Evaluation Board Application Components
Part No Value
Company
Parts Name
Part No
Value
Company
Parts Name
U1
-
ROHM
BD3506F
CCC
1µF
MURATA
GRM18 Series
R1
3.3k
ROHM
MCR03Series
CIN1
10µF
MURATA
GRM21 Series
R2
3.9k
ROHM
MCR03Series
COUT
220µF
SANYO,etc
2R5TPE220MF
C6
0.01µF
MURATA
GRM18 Series
■BD3506F Evaluation Board Layout
Silk Screen
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BD3506F
2.
Recommended Circuits
R2
VOUT (1.2V)/2.5A
1
8
2
7
3
6
4
5
C3
+
VEN
C2
VIN
R1
C4
C1
VCC
Part No
R1/R2
C3
C1
C2
C4
Value
Notes for use
The output voltage can be set by feedback voltage (VFB) and value of output voltage setting
resistors (R1, R2). Output voltage can be set by VFB x (R1+R2) / R1 but it is recommended to use at
6.5k/5.5k
the resistance value (total: about 10 kΩ) which is not susceptible to feedback terminal bias current
(±100 nA).
100µF
Connect the output capacitor between OUT1, OUT2 terminals and GND terminal without fail in
order to stabilize output voltage. The output capacitor has a role to compensate for the phase of
loop gain and to reduce output voltage fluctuation when load is rapidly changed. When there is an
insufficient capacitor value, there is a possibility to cause oscillation, and when the equivalent serial
resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is
rapidly changed. About 100-µF high-performance electrolytic capacitors are recommended but
output capacitor greatly depends on temperature and load conditions. In addition, when only
ceramic capacitors with low ESR are used, or various capacitors are connected in series, the total
phase allowance of loop gain is insufficient, and oscillation may result. Thorough confirmation at
application temperature and under load range conditions is requested.
1µF
The input capacitor plays a part to lower the output impedance of a power supply connected to
input terminals (VCC). When output impedance of this power supply increases, the input voltage
(VCC,) become unstable and there is a possibility of giving rise to oscillation and degraded ripple
rejection characteristics. The use of capacitors of about 1µF with low ESR, and which provide less
capacitance value changes caused by temperature changes, is recommended. But since the input
capacitor greatly depends on characteristics of the power supply used for input, substrate wiring
pattern and thorough confirmation under the application temperature and load range, is requested.
10µF
The input capacitor plays a part to lower output impedance of a power supply connected to input
terminals (IN). When output impedance of this power supply increases, the input voltages (VIN)
become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection
characteristics. The use of capacitors of about 10µF with low ESR, and which provide less
capacitance value changes caused by temperature changes, is recommended. But since input
capacitor greatly depends on characteristics of the power supply used for input, substrate wiring
pattern and thorough confirmation under the application temperature and load range, is requested.
0.1µF
In this IC, NRCS (Non Rush Current on Start-up) function prevents rush current from IN to load and
output capacitor via OUT at the output voltage start-up. When the EN terminal is reset from High or
UVLO, constant current is allowed to flow from the NRCS terminal. By this current, voltage
generated at the NRCS terminal becomes the reference voltage and output voltage is started. In
order to stabilize the NRCS set time, it is recommended to use a capacitor (B special) with less
capacity value change caused by temperature change.
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BD3506F
3.
About Heat Loss
In thermal design, consider the temperature range wherein the IC is guaranteed to operate and apply appropriate
margins. The temperature conditions that need to be considered are listed below:
(1) Ambient temperature Ta shall be not more than 100°C.
(2) Chip junction temperature Tj shall be not more than 150°C.
Chip junction temperature Tj can be considered under the following two cases.
①Chip junction temperature Tj is found from
IC surface temperature TC under actual
application conditions:
②Chip junction temperature Tj is found from ambient temperature Ta:
Tj Ta j a W
Tj Tc j c W
θj-a: SOP8 222.0°C/W (IC only)
181.0°C/W Single-layer substrate
(substrate surface copper foil area: less 3%)
Single-layer substrate
θj-c: SOP8 41.0°C/W
Substrate size:70 x 70 x 1.6mm
(Substrate surface capper
foil area:less3%)
Substrate size 70 x 70 x 1.6mm3 (thermal vias in the board.)
Most of heat loss in BD3506F occurs at the output N-Channel FET. The power loss is determined by multiplying the
voltage between VIN and VOUT by the output current. Confirm voltage and output current conditions of IN and OUT used,
and collate them with the thermal derating characteristics.
Power dissipation (W) = {Input voltage (VIN) – Output voltage (VOUT)} x IOUT (averaged)
Ex.)
If VIN = 1.8V, VOUT=1.2V, and IOUT (averaged)= 1.5 A, the power dissipation is given by the following:
Power dissipation 1.8V 1.2V 1.5 A
0.9W
Power Dissipation
SOP8
0.8
Power Dissipation ：Pd （W)
② 0.69W
0.7
0.6
① 0.56W
0.5
0.4
100°C
0.3
0.2
0.1
0
25
50
75
100
125
150
Ambient Temperature : Ta (°C)
①
②
IC only
θj-a=222°C/W
Mounted on board
70mm x 70mm x 1.6mm Glass-epoxy PCB
θj-a=181°C/W
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BD3506F
I/O Equivalent Circuits
VCC
VCC
1kΩ
NRCS
1kΩ
10kΩ
1kΩ
1kΩ
IN
1kΩ
10kΩ
1kΩ
VCC
VCC
1kΩ
FB
1kΩ
OUT1
EN
350kΩ
OUT2
50kΩ
1kΩ
100kΩ
20pF
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BD3506F
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD3506F
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 16. Example of monolithic IC structure
13. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
14. Input Terminals (VCC,IN,EN)
In the present IC, EN terminal, IN terminal, and VCC terminal have an independent construction. In addition, in order
to prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to
start output voltage when all the terminals reach threshold voltage without depending on the input order of input
terminals.
15. In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
(Example)
OUTPUT PIN
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/18
TSZ02201-0J2J0A601080-1-2
02.Nov.2015 Rev.001
BD3506F
Ordering Information
B
D
3
5
0
6
Part Number
F
E2
Package
F : SOP8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP8 (TOP VIEW)
Part Number Marking
D 3 5 0 6
LOT Number
1PIN MARK
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/18
TSZ02201-0J2J0A601080-1-2
02.Nov.2015 Rev.001
BD3506F
Physical Dimension, Tape and Reel Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/18
TSZ02201-0J2J0A601080-1-2
02.Nov.2015 Rev.001
BD3506F
Revision History
Date
Revision
02.Nov.2015
001
Changes
New Release
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/18
TSZ02201-0J2J0A601080-1-2
02.Nov.2015 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
