BD3507HFV_10

High Performance Regulators for PCs Nch FET Ultra LDO for PC Chipsets BD3507HFV No.10030EAT31 ●Description The BD3507HFV is suited for power supply for chipset bus. Though small in size, BD3507HFV adopts power PKG with radiation fins, and it therefore can be used for a regulator up to 550mA. Because it adopts Nch MOSFET and can form a ultra LDO power supply of RON=300mΩ (TYP), BD3507HFV can compose a high-efficiency system, though it is of a linear type power supply. The output voltage can be set by VREF terminal and can be synchronized with other power supply. In addition, it can be used as a high side switch (RON = 300mΩ/lo = 550mA) of low-voltage power supply line. Because ceramic capacitors can be used for output capacitors, BD3507HFV contributes to downsizing and reduced thickness not only of IC but also of sets. ●Features 1) Built-in high-accuracy buffer circuit (can be set to 0.65-2.7V) 2) Adoption of ceramic capacitors 3) Built-in enable function (0μA at standby) 4) Built-in current limiting circuit (550mA Max) 5) Built-in under voltage lockout circuit (UVLO) 6) Built-in thermal shutdown circuit (TSD) 7) Adoption of ultra-small-size high-power HVSOF6 package (3.0 x 1.6 x 0.75 mm) ●Applications Notebook PC, desktop PC, digital camera, digital home appliances ●Absolute Maximum Ratings (Ta=25℃) Parameter Input Voltage1 Input Voltage2 Enable Input Voltage Power Dissipation1 Power Dissipation2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VIN VEN Pd1 Pd2 Topr Tstg Tjmax Ratings 6.0 6.0 *1 *2 Unit V V V mW mW ℃ ℃ ℃ 6.0 *1 *2 *1 *2 *3 512.5 850.0 *4 -10～+100 -55～+150 +150 *1 However, not exceeding Pd. *2 Maximum rating that can stand instantaneous voltage application such as surge, back EMF, or continuous pulse application whose duty ratio lowers 10%. *3 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 4.1 mW/°C. *4 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate (copper foil area: 100 mm2)), derated at 6.8 mW/°C. ●Operating Conditions (Ta=25℃) Parameter Input Voltage1 Input Voltage2 VREF Setup Voltage EN Input Voltage Output Current Symbol VCC VIN VREF VEN IO Ratings MIN 4.5 1.2 0.65 -0.3 0 MAX 5.5 Vcc-1 2.7 5.5 550 Unit V V V V mA ★ No radiation-resistant design is adopted for the present product. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/15 2010.05 - Rev.A BD3507HFV Technical Note ●Electrical Characteristics (unless otherwise noted, Ta=25℃, VCC=5V, VIN=1.8V, VREF=1.2V, VEN=3V) Standard Value Parameter Symbol Unit Condition MIN TYP MAX Bias Current Standby Current1 Standby Current2 Output Voltage1 Output Voltage2 Output Voltage3 Output Voltage4 Output Voltage5 Output Voltage6 Over Current Protect Output ON Resistance High Level Enable Input Voltage Low Level Enable Input Voltage Enable Pin Input Current UVLO OFF Voltage UVLO Hysteresis Voltage VREF Pin Bias Current VREF Discharge ON Resistance Output Discharge ON Resistance *5 Design Guarantee ICC ISTB IINSTB VO1 VO2 VO3 Vo4 Vo5 Vo6 ICL RON ENHigh ENLOW IEN VUVLO VHYS IVREF RONREF RONDIS 1.188 1.188 1.176 2.475 2.475 2.450 600 2.0 -0.2 3.5 100 -0.1 - 0.4 0 0 1.200 1.200 1.200 2.500 2.500 2.500 300 7 3.8 160 1.0 0.1 0.7 10 10 1.212 1.212 1.224 2.525 2.525 2.550 550 0.8 10 4.1 220 0.1 2.0 0.3 mA μA μA V V V V V V mA mΩ V V μA V mV μA kΩ kΩ EN:Sweep-up EN:Sweep-down VEN=3V Vcc:Sweep-up Vcc:Sweep-down VREF=0→2.7 V *5 VEN=0V VEN=0V Io=0mA Io=300mA Io=0mA to 550mA Vcc=4.5V to 5.5V Ta=-10℃ to 100℃ *5 VIN=3.3V,VREF=2.5V Io=0mA VIN=3.3V,VREF=2.5V Io=300mA VIN=3.3V,VREF=2.5V Io=0mA to 550mA Vcc=4.5V to 5.5V Ta=-10℃ to 100℃ *5 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/15 2010.05 - Rev.A BD3507HFV ●Reference Data 0.50 0.45 0.40 0.35 Icc(mA) 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -10 10 30 50 Ta( ℃) 70 90 Technical Note 1.75 280 240 200 160 120 80 40 0 -55 IIN(mA) 1.70 1.65 1.60 1.55 1.50 1.45 -10 Icc(nA) -15 25 65 Ta( ℃) 105 145 10 30 50 Ta( ℃) 70 90 Fig.1 Ta-Icc (Vcc) Fig.2 Ta-ISTB (Vcc) Fig.3 Ta-IIN (VIN) 240 35 1.208 200 160 120 80 Vo=1.2V 32 1.203 Io(mA) IIN(nA) Vo(V) 29 26 23 20 -10 1.198 1.193 40 0 -55 -15 25 65 Ta( ℃) 105 145 1.188 -10 10 30 50 Ta( ℃) 70 90 10 30 50 Ta( ℃) 70 90 Fig.4 Ta-IINSTB (VIN) 2.180 8 Fig.5 Ta-Vo Fig.6 Ta-IODIS 500 450 VREF=1.2V 2.175 2.170 IREF(mA) IEN(uA) 7 6 RON[mΩ] 5 4 3 2 2.5V 400 350 300 250 200 4 4.5 5 VCC[V] 5.5 6 2.165 2.160 2.155 2.150 -10 10 30 50 70 90 1.8V 1 0 -60 1.2V -20 20 Ta( ℃) 60 Ta( ℃) 100 140 Fig.7 Ta-IrefDIS Fig.8 Ta-IEN Fig.9 Vcc-Ron 400 350 300 RON[mΩ］ 250 200 150 100 50 0 -10 10 30 50 70 90 EN EN VREF VREF VO VO Ta( ℃) Fig.10 Ta-Ron Fig.11 Startup Wave Form Fig.12 Shutdown Wave Form www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/15 2010.05 - Rev.A BD3507HFV Technical Note VCC VCC VCC EN EN EN VREF VREF VREF VO VO VO Fig.13 Input Sequence 1 Fig.14 Input Sequence 2 Fig.15 Input Sequence 3 VCC VCC VCC EN EN EN VREF VREF VREF VO VO VO Fig.16 Input Sequence 4 Fig.17 Input Sequence 5 Fig.18 Input Sequence 6 VO VO IO IO Fig.19 Transient Response (0→550mA/μs) Fig.20 Transient Response (550→0mA/μs) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/15 2010.05 - Rev.A BD3507HFV ●Block Diagram VCC Technical Note VCC VIN UVLO VIN UVLO Current Limit CL VREF VREF EN UVLO + EN TSD UVLO VO VO Ceramic Capacitor EN Enable EN EN EN EN TSD TSD UVLO GND ●Pin Function Pin No. 1 2 3 4 5 6 Pin Name VCC EN VIN Vo VREF GND VCC Pin Enable Input Pin Input Voltage Pin Output Pin Reference Voltage Input Pin Ground Pin PIN Function ●Pin Configration VCC 1 6 GND EN 2 5 VREF VIN 3 4 VO www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/15 2010.05 - Rev.A BD3507HFV ●Block Function Technical Note ・AMP An error amplifier that compares reference voltage (VREF) to Vo and drives Nch FET (Ron=300 mΩ) of output. The frequency characteristics are optimized so that ceramic capacitors can be used for output capacitors and high-speed transient response can be achieved. The input voltage range at the AMP section is GND-2.7V and the output voltage range of the AMP section is GND-VCC. At the time of EN OFF or UVLO, the output is brought to the LOW level and the output NchFET is turned OFF. ・EN By the logic input pin, regulator ON/OFF is controlled. At the time of OFF, the circuit current is controlled to be 0µA to reduce the standby current consumption of the apparatus. In addition, EN turns ON FET that can discharge VREF and Vo and removes excess electric charge to prevent maloperation of IC on the load side. Since there is no electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input sequence. ・UVLO UVLO turned OFF output to prevent output voltage from making maloperation at the time of Vcc reduced voltage. Same as EN, UVLO discharges VREF and Vo. When voltage exceeds the threshold voltage (TYP 3.8V), UVLO starts output. ・CURRENT LIMIT In the event the output current that exceeds the current (0.6A or more) set inside the IC flows when output is turned ON, output voltage is attenuated to protect the IC on the load side. When current reduces, output voltage returns to the set voltage. ・SOFT START Adding external resistor and capacitor to VREF pin can achieve soft-start. By the time constant that is determined by the time constant of CR, VREF pin becomes dull, and output rises in synchronism with VREF pin. Overshoot of output voltage or inrush current can be prevented. ・VREF VREF is a reference voltage input pin and sets output voltage. Since there is no electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input sequence. ・TSD(Thermal Shut down) In order to prevent thermal breakdown and thermal runaway of the IC, the output is turned OFF when chip temperature becomes high. In addition, when temperature returns to the specified temperature, the output is recovered. However, since the temperature protection circuit is originally built in to protect the IC itself, thermal design within Tj(max) is requested. ・VIN This is a large-current supply line. The VIN terminal is connected to the rain of output NchFET. Since there is no electrical connection with the Vcc terminal as is the case of Di for electrostatic measures, it does not depend on the input sequence. However, because there is body Di of output Nch FET between VIN and Vo, there is electrical connection (Di-connection) between VIN and Vo. Consequently, when the output is turned ON/OFF by VIN, reverse current flows from Vo to VIN, to which care must be taken. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/15 2010.05 - Rev.A BD3507HFV ●Timing Chart EN ON/OFF VIN Technical Note VCC EN Vref Vo t VCC ON/OFF VIN hysteresis VCC EN Vref Vo t Vref Synchronous Action VIN VCC EN Vref Vo t www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/15 2010.05 - Rev.A BD3507HFV ●Application setting method Vcc Vcc C1 ON/OFF VIN C2 EN VREF R2 VO C3 Vo Ceramic Capacitor GND R1 Technical Note VR VREF C4 VIN Part No Value Notes for Use R1/R2 22k/11k The present IC can set output voltage by external reference voltage (VR) and value of output voltage setting resistors (R1, R2). Output voltage can be set by VRxR2/(R1+R2) but it is recommended to use at the resistance value (total: about 10 kΩ) which is not susceptible to VREF bias current (±100nA). Connect the output capacitor between Vo terminal and GND terminal without fail in order to stabilize output voltage. The output capacitor has a role to compensate for the phase of loop gain and to reduce output voltage fluctuation when load is rapidly changed. When there is an insufficient capacity value, there is a possibility to cause oscillation, and when the equivalent serial resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is rapidly changed. About 22µF ceramic capacitors are recommended but output capacitor greatly depends on temperature and load conditions. In addition, when various capacitors are connected in series, the total phase allowance of loop gain becomes not sufficient, and oscillation may result. Thoroughgoing confirmation at application temperature and under load range conditions is requested. The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (Vcc). When output impedance of this power supply increases, the input voltages (Vcc, VIN) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. The use of capacitors of about 10μF with low ESR, which provide less capacity value changes caused by temperature changes, is recommended, but since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thoroughgoing confirmation under the application temperature and load range, is requested. The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (VIN). When output impedance of this power supply increases, the input voltages (Vcc, VIN) become unstable and there is a possibility of giving rise to oscillation and degraded ripple rejection characteristics. The use of capacitors of about 10μF with low ESR, which provide less capacity value changes caused by temperature changes, is recommended, but since input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, thoroughgoing confirmation under the application temperature and load range, is requested. C3 22μF C1 0.1μF C2 10μF C4 1μF The present IC can set the output voltage buildup time by VREF terminal capacitor (C4) and R1 and R2 values. When EN terminal is “High” or UVLO is reset, output voltage is built up by the time constant determined by C4, R1, and R2. It is recommended to use capacitors (B special) with little capacity value change caused by temperature change for C4. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/15 2010.05 - Rev.A BD3507HFV ●Directions for pattern layout of PCB ■ BD3507HFV Evaluation Board Circuit U1 VCC C1 VCC SW EN VREF R5_1 VR Technical Note 1 BD3507HFV VCC GND GND 6 2 5 EN VREF C5 R5_2 Vo VIN 3 C3 VIN Vo 4 C4_1 C4_2 ■ BD3507HFV Evaluation Board Application Components Part No Value Company Parts Name U1 R5_1 R5_2 22k 11k ROHM ROHM ROHM BD3507HFV MCR03 Series MCR03 Series Part No C1 C3 C4_1 C4_2 C5 Value 1μF 10μF 22μF 1μF Company MURATA MURATA MURATA MURATA Parts Name GRM18 Series GRM21 Series GRM31 Series GRM18 Series ■ BD3507HFV Evaluation Board Layout Silk Screen TOP Layer Mid Layer 1 Mid Layer 2 Bottom Layer www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/15 2010.05 - Rev.A BD3507HFV Technical Note ●About heat loss In designing heat, operate the apparatus within the following conditions. (Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.) 1. Ambient temperature Ta shall be not more than 100°C. 2. Chip junction temperature Tj shall be not more than 150°C. Chip junction temperature Tj can be considered under the following two cases. ①Chip junction temperature Tj is found from IC surface temperature TC under actual application conditions: Tj=TC+θj-c×W ＜Reference value＞ θj-c:HVSOF6 30℃/W ②Chip junction temperature Tj is found from ambient temperature Ta: Tj=Ta+θj-a×W ＜Reference value＞ θj-a:HVSOF6 243.9℃/W Single-layer substrate (substrate surface copper foil area: less 3%) 147.1℃/W Single-layer substrate 2 (substrate surface copper foil area:100mm ) 89.3℃/W Single-layer substrate 2 (substrate surface copper foil area:900mm ) 73.5℃/W Single-layer substrate 2 (substrate surface copper foil area:2500mm ) 3 Substrate size 70×70×1.6mm When multilayer substrates are used, if any GND pattern is present in the inner layer, arrange heat radiation vias on the package rear side. Because the present package size is as small as 1.0 x 1.6 mm and vias are unable to be arranged in a large quantity at the lower part of IC, the pattern is expanded as illustrated below and the number of vias is increased to obtain superb heat radiation characteristics (the figure below is an image figure only, and the size and the quantity of vias that match the condition must be designed into patterns). Most of heat loss in BD3507HFV occurs at the output N-channel FET. The power lost is determined by multiplying the voltage between VIN and Vo by the output current. Confirm the VIN and Vo voltages used and output current conditions, and check with the thermal derating characteristics. As this IC employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used. Power dissipation (W) = {Input voltage (VIN) – Output voltage (V0≒VREF)}×Io (averaged) Ex.) If VIN = 1.8 volts, V0=1.2 volts, and Io (averaged)=0.5 A, the power dissipation is given by the following: Power dissipation (W) =(1.8 volts – 1.2 volts) × 0.5 (A) = 0.3 W www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/15 2010.05 - Rev.A BD3507HFV ●Example of applied circuit Technical Note Specifications: High side switch of low-voltage power supply line (1.2-2.5V) Characteristics: RON = 300 mΩ, lo max) = 550 mA, with soft start function and overheat protection circuit equipped. Example Circuit VCC VCC C1 ON/OFF VIN C2 EN VREF GND VCC R1 VREF C4 VIN VO C3 Vo Ceramic Capacitor ●Equivalent Circuit 1pin (VCC) 2pin (EN) Vcc 3pin (VIN) VIN 4pin (Vo) 5pin (VREF) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/15 2010.05 - Rev.A BD3507HFV Technical Note ●Notes for use 1. Absolute maximum ratings For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 2. GND potential Bring the GND terminal potential to the minimum potential in any operating condition. 3. Thermal design Consider permissible dissipation (Pd) under actual working condition and carry out thermal design with sufficient margin provided. 4. Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. 5. Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. 6. Built-in thermal shutdown protection circuit The present IC incorporates a thermal shutdown protection circuit (TSD circuit). The working temperature is 175°C (standard value) and has a -15°C (standard value) hysteresis width. When the IC chip temperature rises and the TSD circuit operates, the output terminal is brought to the OFF state. The built-in thermal shutdown protection circuit (TSD circuit) is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. 7. Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1000μF between output and GND. 8. Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. 9. IC terminal input + The present IC is a monolithic IC and has a P substrate and P isolation between elements. With this P layer and N layer of each element, PN junction is formed, and when the potential relation is GND>terminal A>terminal B, PN junction works as a diode, and Terminal B>GND terminal A, PN junction operates as a parasitic transistor. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal. Resistor Pin A Pin A N N P + Transistor (NPN) Pin B C B E B P P + Pin B N P+ N P P+ N C E P substrate Parasitic element GND Parasitic element Parasitic element N P substrate GND GND GND Parasitic element Other adjacent elements www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/15 2010.05 - Rev.A BD3507HFV Technical Note 10. GND wiring pattern If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of component externally connected, pay special attention not to cause undesirable change to it. 11 Input terminals (VCC,VIN,EN,VREF) In the present IC, EN terminal, VIN terminal, VCC terminal, and VREF terminal have an independent construction. In addition, in order to prevent malfunction at the time of low input, the UVLO function is equipped with the VCC terminal. They begin to start output voltage when all the terminals reach threshold voltage without depending on the input order of input terminals. 12. Heat sink Heatsink is connected to SUB, which should be short-circuited to GND. Solder the heatsink to a pc board properly, which offers lower thermal resistance. 13. Operating range Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change may not occur to such characteristics within the operating range. 14. For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 15. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. (Example) OUTPUT PIN HVSOF6 land pattern MIE E3 e D3 L2 Unit:mm Land Pitch e 0.50 Pad Length D3 1.60 Land Space MIE 2.20 Pad Width E3 1.60 Land Length l2 0.55 Land Width b2 0.25 In actually designing, optimize in accordance with the condition. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. b2 13/15 2010.05 - Rev.A BD3507HFV ●Power Dissipation HVSOF 6 2.5 Technical Note 2.0 Power Dissipation ：Pd （W) ③1.70W 1.5 ②1.40W 1.0 ①0.85W 0.5 0.0 0 25 50 75 100 125 150 Ambient Temperature：Ta(℃) ①:PCB 1st layer (Cu-area : 100mm2) θja = 147.1℃/W ②:PCB 1st layer (Cu-area : 900mm2) θja = 89.3℃/W ③:PCB 1st layer (Cu-area : 2500mm2) θja = 73.5℃/W PCB size : 70mm×70mm×1.6mm www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/15 2010.05 - Rev.A BD3507HFV ●Ordering part number Technical Note B D 3 Part No. 5 0 7 H F V - T R Part No. Package HFV : HVSOF6 Packaging and forming specification TR: Embossed tape and reel HVSOF6 1.6±0.1 (MAX 1.8 include BURR) 2.6±0.1 (MAX 2.8 include BURR) (1.5) Tape Quantity (0.45) Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold 654 3.0±0.1 Direction of feed (1.2) (1.4) 123 ( reel on the left hand and you pull out the tape on the right hand 1pin ) (0.15) 0.145±0.05 S 0.1 S 0.22±0.05 0.5 0.75Max. Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/15 2010.05 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A