BD35632EFJ

1/4 STRUCTURE TYPE PRODUCT SERIES FEATURES Silicon Monolithic Integrated Circuit 1ch Regulator IC BD35632EFJ ・Ceramic capacitor 1uF ・Built-in Soft Start function ○Absolute Maximum Ratings (Ta=25℃) PARAMETER Power Supply Voltage Enable Input Voltage Output Voltage Output Reference Voltage Power Dissipation Operating Temperature Range Storage Temperature Range Maximum Junction Temperature SYMBOL VCC VEN VO VFB Pd Topr Tstg Tjmax RATING 15.0 *1 15.0 15.0 15.0 2110*2 -40～+100 -55～+150 +150 UNIT V V V V mW ℃ ℃ ℃ *1 Should not exceed Pd. *2 Reduced by 16.9mW/℃ for each increase in Ta≧25℃ (when mounted on a 70mm×70mm×1.6mm glass-epoxy board, two layer) ○Operating Conditions (Ta=25℃) PARAMETER Input Power Supply Voltage Enable Input Voltage Output Voltage Setting Range Output Current SYMBOL VCC VEN VO Io MIN. 6.0 0.0 1.5 0.0 MAX. 14.0 14.0 13.0 1.0 UNIT V V V A ★This product is not designed for use in radioactive environments. REV. A 2/4 ○ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Ta=25℃, VEN=3V, Vcc=12V, R1=91kΩ, R7=3.3kΩ,R2=8.2kΩ* ) PARAMETER SYMBOL LIMIT TYP 0 700 25 25 0.60 0.800 3 UNIT μA μA mV mV V V V V μA CONDITIONS VEN=0V, OFF mode VCC=(VO+0.92V)→14.0V Io=0→1.0A VCC=12V, Io=1.0A Io=0mA 1 Circuit Current at Shutdown Isd Bias Current Icc Line Regulation Reg.Ii Load Regulation Reg.Io I/O voltage difference Vco Output Reference Voltage VFB EN Low Voltage VEN(Low) EN High Voltage VEN(High) EN Bias Current IEN *1 VO=VFB×(R1+R2) ÷ R2 [V] MIN 0.792 0 2.4 1 MAX 5 900 50 75 0.92 0.808 0.8 14.0 9 REV. A 3/4 ○PHYSICAL DIMENSIONS 4.9±0.1 (MAX 5.25 include BURR) (3.2) 4° 8765 6.0±0.2 3.9±0.1 D35632 1 2 3 4 Lot No 1PIN MARK 0.545 +0.05 0.17 -0.03 S 1.27 1.0MAX 0.85±0.05 0.08±0.08 +0.05 0.42 -0.04 0.08 S (2.4) 0.08 M 0.65±0.15 HTSOP-J8 (Unit : mm) ○BLOCK DIAGRAM GND 5 6 OCP 1.05±0.2 +6° −4° Vcc 1 (Vo+0.92)～14V Ceramic Capacitor ≧ 1uF SOFT Vo 3 R1 R7 EN 7 TSD 1.5～13V Ceramic Capacitor ≧ 1uF 4 FB R2 ○Pin number・Pin name Pin No. 1 2 3 4 5 6 7 8 reverse Pin name VCC N.C VO FB GND GND EN N.C FIN Pin Function Input Voltage Pin OPEN Output Voltage Pin Output Reference Voltage Pin(Feed back Pin) GND Pin GND Pin Enable Pin OPEN Substrate * Please short N.C, FIN to the GND. REV. A 4/4 ○ NOTE FOR USE 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Please add a protection diode when a large inductance component is connected to the output terminal, and reverse-polarity power is possible at startup or in output OFF condition. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [°C] (typ.) 175 Hysteresis temperature [°C] (typ.) 15 BD35632EFJ 10. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 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