Datasheet
Single-Output LDO Regulators
High Voltage LDO Regulators
BD357xYFP-M
BD357xYHFP-M
Series
General Description
BD357xYFP-M BD357xYHFP-M Series regulators feature a high withstand voltage (50 V) and are suitable to use with
onboard vehicle microcontrollers. They offer an output current of 500 mA while limiting the quiescent current to 30 µA (Typ).
With these devices, a ceramic capacitor may be used at the output for stable operation. The output tolerance is within ±2 %
over their operating temperature range (-40 °C to +125 °C). The short circuit protection is folded-type to minimize generation
of heat during malfunction. These devices are developed to offer the most robust power supply design under harsh
automotive environments. The BD357xYFP-M BD357xYHFP-M Series provide an ideal solution to lower current
consumption as well as to simplify the use with battery direct-coupled systems.
Features
Packages
Low-Saturation Voltage Type P-Channel DMOS
Output Transistors
High Output Voltage Precision: ±2 %
(lo = 200 mA)
Low-ESR Ceramic Capacitors can be used as
Output Capacitors.
VCC Power Supply Voltage = 50 V
Built-in Overcurrent Protection Circuit and Thermal
Shutdown Circuit
W (Typ) x D (Typ) x H (Max)
TO252-3
TO252-5
6.50 mm x 9.50 mm x 2.50 mm 6.50 mm x 9.50 mm x 2.50 mm
Key Specifications
Recommended VCC Power Supply Voltage: 36 V (Max)
Output Voltage Type:
Fixed / Variable
Output Current:
500 mA (Max)
Low Quiescent Current:
30 µA (Typ)
Operating Temperature Range:
-40 °C to +125 °C
Applications
HRP5
9.395mm x 10.540mm x 2.005mm
Onboard Vehicle Devices (Body Control, Car Stereos,
Satellite Navigation Systems, etc.)
Ordering Information
B
D
3
5
7
x
Y
Part Number
x
F
P
-
M
x
x
Package
Packaging and forming specification
FP: TO252-3 / 5
E2: Embossed tape and reel (TO252-3 / 5)
HFP: HRP5
TR: Embossed tape and reel (HRP5)
Lineup
Output Voltage
Switch
Reel of 2000
HRP5
Not Included
TO252-3
Reel of 2000
HRP5
TO252-5
Variable
Reel of 2000
HRP5
TO252-5
3.3 V
5.0 V
Orderable Part Number
TO252-3
3.3 V
5.0 V
Package
Reel of 2000
HRP5
Included
Variable
〇Product structure : Silicon monolithic integrated circuit
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TO252-5
Reel of 2000
HRP5
TO252-5
Reel of 2000
HRP5
BD3570YFP-ME2
BD3570YHFP-MTR
BD3571YFP-ME2
BD3571YHFP-MTR
BD3572YFP-ME2
BD3572YHFP-MTR
BD3573YFP-ME2
BD3573YHFP-MTR
BD3574YFP-ME2
BD3574YHFP-MTR
BD3575YFP-ME2
BD3575YHFP-MTR
〇This product has no designed protection against radioactive rays
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Typical Application Circuits
VCC
VCC
1
1
Cin
Cin
Vref
Vref
SW
VO
VO
2
3
5
OCP
Co
OCP
Co
(Note1)
(Note2)
GND
GND
TSD
TSD
Fin
Fin
3
2
4
ADJ (N.C.
N.C.
N.C.
(Note 1)
)
Figure 2. TO252-5
Figure 1. TO252-3
VCC
1
Cin
(Note 1) For fixed voltage regulator only
(Note 2) For adjustable voltage regulator only
Vref
SW
VO
2
5
OCP
Co
(Note1）
(Note2)
GND
3
TSD
Fin
4
ADJ (N.C.
(Note 1)
)
Figure 3. HRP5
Block Diagrams / Pin Configurations / Pin Descriptions
[TO252-3]
VCC 1
Vref
3
VO
OCP
GND
TSD
2
N.C.
(TOP VIEW)
1
2
Pin No.
Pin Name
1
VCC
Power supply pin
2
N.C.
N.C. pin
3
VO
Fin
GND
Function
Voltage output pin
GND pin
3
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Block Diagrams / Pin Configurations / Pin Descriptions – continued
[TO252-5]
VCC 1
Vref
SW 2
5 VO
OCP
(Note 3)
(Note 4)
TSD
GND
3
N.C.
4
ADJ (N.C. (Note 3))
(Note 3) For fixed voltage regulator only
(Note 4) For adjustable voltage regulator only
(TOP VIEW)
Pin No.
Pin Name
1
VCC
Power supply pin
2
SW
N.C.
VO ON / OFF function pin
N.C. pin (BD3572Y only)
3
N.C.
N.C. pin
4
N.C.
ADJ
N.C. pin
Output voltage setting pin (BD3572Y, 3575Y only)
5
VO
Voltage output pin
Fin
GND
1 2 3 4 5
Function
GND pin
[HRP5]
VCC 1
Vref
SW 2
5 VO
OCP
(Note 5)
(Note 6)
TSD
GND 3
4
ADJ (N.C. (Note 5))
(Note 5) For fixed voltage regulator only
(Note 6) For adjustable voltage regulator only
Pin No.
Pin Name
1
VCC
Power supply pin
2
SW
N.C.
VO ON / OFF function pin
N.C. pin (BD3570Y, 3571Y, 3572Y only)
3
GND
GND pin
4
N.C.
ADJ
N.C. pin
Output voltage setting pin (BD3572Y, 3575Y only)
(TOP VIEW)
1 2 3 4 5
5
VO
Fin
GND
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Function
Voltage output pin
GND pin
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Supply Voltage
Limit
VCC
Switch Supply Voltage
VSW
Output Current
50
V
50
(Note 8)
V
IO
500
1.20 (TO252-3)
Power Dissipation
Unit
(Note 7)
mA
(Note 9)
1.30 (TO252-5) (Note 10)
Pd
1.60 (HRP5)
W
(Note 11)
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
Maximum Junction Temperature
(Note 7)
(Note 8)
(Note 9)
(Note 10)
(Note 11)
Caution:
Not to exceed Pd and ASO.
For ON / OFF SW Regulator only
TO252-3: Reduced by 9.6 mW / °C at 25 °C, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
TO252-5: Reduced by 10.4 mW / °C at 25 °C, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
HRP5: Reduced by 12.8 mW / °C at 25 °C, when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm).
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Recommended Operating Conditions
Symbol
Parameter
Input Voltage
VCC
BD3570Y, 3572Y, 3573Y, 3575Y
VCC
BD3571Y, 3574Y
Min
Max
Unit
4.5
(Note 12)
36.0
V
5.5
(Note 12)
36.0
V
Output Current
IO
-
500
mA
Variable Output Voltage Range
VO
2.8
12
V
(Note 12) Please consider that the output voltage would decrease (dropout voltage) according to the output current.
Electrical Characteristics
（Unless otherwise specified, Ta = -40 °C to +125 °C, VCC = 13.2 V, SW = 3 V (Note 13), VO settings is 5 V (Note 14)）
Symbol
Parameter
Limit
Unit
Conditions
Min
Typ
Max
lshut
-
-
10
µA
SW = GND
Bias Current
lb
-
30
50
µA
IO = 0 mA
Output Voltage
VO
VO x
0.98
VO
VO x
1.02
V
IO = 200 mA,
VO: Please refer to product line.
VADJ
1.235
1.260
1.285
V
IO = 200 mA
Output Current
IO
0.5
-
-
A
Dropout Voltage
ΔVd
-
0.25
0.48
V
Ripple Rejection
R.R.
45
55
-
dB
Line Regulation
Reg.I
-
10
30
mV
Shut Down Current
ADJ Terminal Voltage
(Note 13)
(Note 14)
VCC = 4.75 V, lO = 200 mA(Note 15)
f = 120 Hz, ein = 1 Vrms,
IO = 100 mA
VCCD(Note 16) ≤ VCC ≤ 25 V
IO = 0 mA
0 mA ≤ IO ≤ 200 mA
Reg.L
-
20
40
mV
Switch Threshold Voltage H
(Note 13)
SWH
2.0
-
-
V
IO = 0 mA
Switch Threshold Voltage L
(Note 13)
SWL
-
-
0.5
V
IO = 0 mA
Switch Bias Current
(Note 13)
SWI
-
22
60
µA
SW = 5 V, lO = 0 mA
Load Regulation
(Note 13) BD3573Y, 3574Y, 3575Y only
(Note 14) BD3572Y, 3575Y only
(Note 15) BD3571Y, 3572Y, 3574Y, 3575Y only
(Note 16) BD3570Y, 3573Y: VCCD = 5.5 V
(Note 16) BD3571Y, 3572Y, 3574Y, 3575Y: VCCD = 6.5 V
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Typical Performance Curves
BD3574YHFP-M（Unless otherwise specified, Ta = 25 °C, VCC = 13.2 V, SW = 3 V)
50
6
5
Ta = 125 °C
Output Voltage: VO [V]
Circuit Current: ICC [μA]
40
30
Ta = 25 °C
20
4
Ta = 125 °C
3
Ta = 25 °C
2
Ta = -40 °C
Ta = -40 °C
10
1
0
0
0
5
10
15
20
Supply Voltage: VCC [V]
25
0
Figure 4. Circuit Current vs Supply Voltage
(“Total Supply Current”)
5
10
15
20
Supply Voltage: VCC [V]
25
Figure 5. Output Voltage vs Supply Voltage
6
3
Dropout Voltage: ΔVd [V]
Output Voltage: VO [V]
5
4
Ta = 125 °C
3
Ta = 25 °C
2
Ta = -40 °C
Ta = 125 °C
2
Ta = 25 °C
1
Ta = -40 °C
1
0
0
0
500
1000
1500
Output Current: IO [mA]
2000
Figure 6. Output Voltage vs Output Current
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0
100
200
300
400
Output Current: IO [mA]
500
Figure 7. Dropout Voltage vs Output Current
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BD357xYHFP-M
Datasheet
Series
Typical Performance Curves – continued
BD3574YHFP-M（Unless otherwise specified, Ta = 25 °C, VCC = 13.2 V, SW = 3 V)
6
70
5
Ta = 25 °C
50
Output Voltage: VO [V]
Ripple Rejection: R.R. [dB]
60
40
Ta = 125 °C
30
20
4
Ta = -40 °C
3
Ta = 25 °C
2
Ta = 125 °C
Ta = -40 °C
1
10
0
0
10
100
0
1000
10000 100000 1000000
Frequency: f [Hz]
2
Figure 9. Output Voltage vs SW Supply Voltage
Figure 8. Ripple Rejection vs Frequency
6
100
5
Output Voltage: VO [V]
80
Circuit Current: ICC [μA]
0.5
1
1.5
SW Supply Voltage: VSW [V]
60
40
20
4
3
2
1
0
0
0
100
200
300
400
Output Current: IO [mA]
100
500
140
160
180
200
Ambient Temperature: Ta [℃]
Figure 10. Circuit Current vs Output Current
(“Total Supply Current Classified by Load”)
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Figure 11. Output Voltage vs Ambient Temperature
(“Thermal Shutdown Circuit “)
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Datasheet
Series
Typical Performance Curves – continued
BD3574YHFP-M（Unless otherwise specified, Ta = 25 °C, VCC = 13.2 V, SW = 3 V)
5.5
120
5.25
SW Bias Current: ISW [μA]
Output Voltage: VO [V]
Ta = 125 °C
5
4.75
4.5
90
Ta = 25 °C
Ta = -40 °C
60
30
0
-40
0
40
80
120
0
Ambient Temperature: Ta [℃]
Figure 12. Output Voltage vs Ambient Temperature
5
10
15
20
SW Supply Voltage: VSW [V]
25
Figure 13. SW Bias Current vs Supply Voltage
50
2
Circuit Current: ICC [μA]
Dropout Voltage: ΔVd [V]
40
1.5
1
30
20
0.5
10
0
0
-40
0
40
80
-40
120
Figure 14. Dropout Voltage vs Ambient Temperature
(IO = 500 mA)
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0
40
80
120
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
Figure 15. Circuit Current vs Ambient Temperature
(“Total Supply Current Temperature”)
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BD357xYHFP-M
Datasheet
Series
I/O Equivalence Circuit (All resistance values are typical.)
Figure 17. 5PIN [VO]
(BD3570Y, 3571Y, 3573Y, 3574Y)
Figure 16. 2PIN [SW]
VCC
VO
ADJ
Figure 18. 4, 5PIN [ADJ, VO]
(BD3572Y, BD3575Y)
Output Voltage Adjustment
To set the output voltage, insert a pull-down resistor R1 between the ADJ and GND pins,
and the pull-up resistor R2 between the VO and ADJ pins.
VO
ADJ
1
2 / 1
}
1.26
R2
Where:
VADJ is the ADJ terminal voltage.
R1
The recommended resistor value for the ADJ - GND connection is 30 kΩ to 150 kΩ.
Figure 19
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Power Dissipation
TO252-3
TO252-5
2.0
2.0
IC mounted on a ROHM standard board
Substrate size: 70 mm x 70 mm x 1.6 mm
θja = 104.2 (°C / W)
IC mounted on a ROHM standard board
Substrate size: 70 mm x 70 mm x 1.6 mm
θja = 96.2 (°C / W)
1.6
Power Dissipation: Pd [W]
Power Dissipation: Pd [W]
1.6
1.2 W
1.2
0.8
0.4
0
1.3W
1.2
0.8
0.4
0
0
25
50
75
100
125
150
0
25
Ambient Temperature: Ta [°C]
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 20
Figure 21
HRP5
2.0
1.6 W
Power Dissipation: Pd [W]
1.6
IC mounted on a ROHM standard board
Substrate size: 70 mm x 70 mm x 1.6 mm
θja = 78.1 (°C / W)
1.2
0.8
0.4
0
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 22
Refer to the heat mitigation characteristics illustrated in Figure 20, 21 and 22 when using the IC in an environment where Ta
≥ 25 °C. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of
the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or be damaged. It is necessary to give
sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage
and the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC in temperatures not exceeding the
maximum junction temperature Tjmax. Figure 20 illustrates the power dissipation/heat mitigation characteristics for the
TO252-3 package. Operate the IC within the power dissipation (Pd) capabilities. The following method is used to calculate
the power consumption PC (W).
Where:
VCC is the input voltage.
VO is the output voltage.
IO is the load current.
ICC is the total supply current.
Pd is the power dissipation.
The load current IO is obtained to operate the IC within its power dissipation capacity.
(For more information about ICC, see Figure 15.)
The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process.
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Calculation Example
Example: BD3571YFP-M VCC = 12 V and VO = 5 V at Ta = 85 °C
0.624 12
12 5
89
θja = 104.2 °C / W → -9.6 mW / °C
25 °C = 1.2 W → 85 °C = 0.624 W
30μA
Where:
ICC is the total supply current.
Make a thermal calculation considering the above situation so that the whole operating temperature range will be within the
power dissipation capacity of the IC.
The power consumption (Pc) of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from
the following equation.
Where:
Ishort is the short current.
Peripheral Settings for Pins and Precautions
1. VCC pin
Insert capacitors with a capacitance from 0.33 µF to 1000 µF between the VCC and GND pins.
The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin.
2. Capacitors for stopping oscillation on output pins
Capacitors for stopping oscillations must be placed between each output pin and the GND pin. Use a capacitor within the
capacitance range of 0.1 µF and 1000 µF. Since oscillations do not occur even for ESR values from 0.001 Ω to 100 Ω, a
ceramic capacitor can be used. Abrupt input voltage and load fluctuations can affect output voltages. Output capacitor
capacitance values should be determined after sufficient testing of the actual application.
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
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BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Operational Notes – continued
11.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
N
Parasitic
Elements
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
12.
Pin B
B
Parasitic
Elements
GND
GND
N Region
close-by
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16. Rapid variation in VCC voltage and load current
In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output
current and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
17. Minute variation in output voltage
In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Marking Diagrams
TO252-3
(TOP VIEW)
TO252-5
(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
HRP5 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
BD3570Y
BD3570YHFP
BD3571Y
BD3571YHFP
BD3572Y
BD3572YHFP
BD3573Y
BD3573YHFP
BD3574Y
BD3574YHFP
BD3575Y
BD3575YHFP
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Package
TO252-3
HRP5
TO252-3
HRP5
TO252-5
HRP5
TO252-5
HRP5
TO252-5
HRP5
TO252-5
HRP5
Part Number
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
Reel of 2000
13/17
BD3570YFP-ME2
BD3570YHFP-MTR
BD3571YFP-ME2
BD3571YHFP-MTR
BD3572YFP-ME2
BD3572YHFP-MTR
BD3573YFP-ME2
BD3573YHFP-MTR
BD3574YFP-ME2
BD3574YHFP-MTR
BD3575YFP-ME2
BD3575YHFP-MTR
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TO252-3
14/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TO252-5
15/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
HRP5
16/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
BD357xYFP-M
BD357xYHFP-M
Datasheet
Series
Revision History
Date
Revision
Changes
20.Aug.2013
001
New Release
19.Sep.2013
002
Product name is revised.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/17
TSZ02201-0T2T0AN00160-1-2
19.Sep.2013 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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