Datasheet
LDO Regulator
BD3650FP-M
General Description
Key Specifications
The BD3650FP-M is a low-saturation regulator.
This IC has a built-in over-current protection circuit that
prevents the destruction of the IC due to output short
circuits. It also has a built-in thermal shutdown circuit
that protects the IC from thermal damage due to
overloading.
Input Supply Voltage Range:
Output Voltage:
Output Current:
Operating Temperature Range:
Package
Features
5.6V to 30V
5.0V (Typ)
0.3A (Max)
-40°C to +125°C
W(Typ) x D(Typ) x H(Max)
High Output Voltage Precision: ±2%
Low Saturation with PDMOS Output
Built-in Over-Current Protection Circuit that
Prevents Destruction of the IC Due to Output Short
Circuits
Built-in Thermal Shutdown Circuit that Protects the
IC From Thermal Damage Due to Overloading
Low ESR Capacitor
Applications
Onboard devices (vehicle equipment, car stereos,
satellite navigation systems, etc.)
Block Diagram
TO252-3
6.50mm x 9.50mm x 2.50mm
GND
FIN
VREF：Bandgap Reference
OCP：Over Current Protection Circuit
TSD：Thermal Shut Down Circuit
Driver：Power Transistor Driver
VREF
DRIVER
OCP
TSD
1
2
3
Vcc
VCC
N.C.
Vo
VO
Pin Configuration
Pin Descriptions
TOP VIEW
○Product structure：Silicon monolithic integrated circuit
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Pin No.
Pin Name
Function
1
VCC
Power supply pin
2
N.C.
No connection pin
3
VO
Output pin
FIN
GND
GND
○This product has no designed protection against radioactive rays
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BD3650FP-M
Datasheet
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
(Note 1)
VCC
-0.3 to +36.0
V
Power Dissipation
(Note 2)
Pd
1.2
W
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
150
°C
Maximum Junction Temperature
(Note 1) Not to exceed Pd.
(Note 2) TO252-3: Derate by 9.6mW /°C when operating above Ta = 25°C and when mounted on glass
epoxy board with dimensions =70mm x 70mm x 1.6mm.
Caution: Operating the IC over the absolute maximum ratings may damage the IC.
The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry.
Therefore, it is important to consider circuit protection measures, such as adding a fuse,
in case the IC is operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta=-40°C to +125°C)
Parameter
Supply Voltage
(Note 3)
Output Current
Symbol
Min
Max
Unit
VCC
5.6
30.0
V
IO
0
0.3
A
(Note 3) The voltage drop (dropout voltage) due to the output current should be considered.
Electrical Characteristics (Unless otherwise specified, Ta=-40°C to +125°C, VCC=10V, IO=0mA)
Parameter
Symbol
Min
Typ
Max
Unit
Circuit Current
ICC
－
0.5
1.0
mA
Output voltage
VO
4.90
5.00
5.10
V
IO=200mA
Dropout Voltage
ΔVD
－
0.2
0.4
V
VCC=VO x 0.95, IO=200mA
Ripple Rejection
R.R.
45
60
－
dB
f=120Hz, ein=1VRMS,
IO=100mA
Line Regulation
REG_I
－
5
35
mV
VCC=5.6V to 30V
Load Regulation
REG_L
－
10
50
mV
IO=10mA to 300mA
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Conditions
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BD3650FP-M
Datasheet
Typical Performance Curves
Unless otherwise specified, Ta=-40°C to +125°C, VCC=10V, IO=0mA
6.0
5.0
0.8
OUTPUT
VOLTAGE:
Output Voltage:
VOVo[V]
[V]
CIRCUIT
CURRENT:
FEEDBACK_R [mA][mA]
Circuit
Current:
ICCIb+I
+I Feedback_R
1.0
125°C
0.6
25°C
0.4
-40°C
0.2
4.0
3.0
-40°C
2.0
0.0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Supply Voltage:
VCCVcc[V]
[V]
SUPPLY
VOLT AGE:
0 2 4 6 8 10 12 14 16 18 20 2224 26 28 30
SUPPLY
Vcc[V]
Supply VOLTAGE:
Voltage: VCC
[V]
Figure 2. Output Voltage vs Supply Voltage
(Line Regulation, IO=0mA)
6.0
6.0
5.0
5.0
OUTPUT
Output VOLTAGE:
Voltage: VOVo[V]
[V]
OUTPUT
Output VOLTAGE:
Voltage: VOVo[V]
[V]
Figure 1. Circuit Current vs Supply Voltage
4.0
3.0
-40°C
1.0
25°C
1.0
0.0
2.0
125°C
125°C
25°C
4.0
3.0
2.0
-40°C
1.0
25°C
125°C
0.0
0.0
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
SupplyVOLTAGE:
Voltage: VVcc[V]
CC [V]
SUPPLY
Figure 3. Output Voltage vs Supply Voltage
(Line Regulation, IO=200mA)
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250
500
750 1000 1250
Output Current:
IO [mA]
OUTPUT
CURRENT:
Io[mA]
1500
Figure 4. Output Voltage vs Output Current
(Load Stability)
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BD3650FP-M
Datasheet
Typical Performance Curves – continued
Unless otherwise specified, Ta=-40°C to +125°C, VCC=10V, IO=0mA
80
Ripple
R.R.R.R.[dB]
[dB]
RIPPLERejection:
REJECTION:
300
Dropout Voltage: ∆VD [mV]
250
125°C
200
150
25°C
100
-40°C
50
100
200
60
50
-40°C
40
30
25°C
20
125°C
10
0
100
0
0
70
300
Output CURRENT:
Current: IO [mA]
OUTPUT
Io[mA]
6.0
1.0
CIRCUIT
CURRENT:
Ib[mA]
Circuit Current:
ICC [mA]
5.0
OUTPUT
VOLTAGE:
Vo[V]
Output Voltage:
VO[V]
1000000
Figure 6. Ripple Rejection vs Frequency
(IO=100mA)
Figure 5. Dropout Voltage vs Output Current
(VCC=4.75V, IO=0mA to 300mA)
4.0
3.0
2.0
1.0
0.8
125°C
0.6
25°C
0.4
-40°C
0.2
0.0
0.0
-40 -20 0 20 40 60 80 100 120
AMBIENT
TEMPERATURE:
Ta [℃]
Ambient Temperature:
Ta [°C]
0
50
100 150 200 250
Output
Current: IO Io[mA]
[mA]
OUTPUT CURRENT:
300
Figure 8. Circuit Current vs Output Current
(lO=0mA to 300mA)
Figure 7. Output Voltage vs Ambient Temperature
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1000
10000
100000
Frequency: f f[Hz]
FREQUENCY:
[Hz]
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BD3650FP-M
Datasheet
Typical Performance Curves – continued
Unless otherwise specified, Ta=-40°C to +125°C, VCC=10V, IO=0mA
Output Voltage:
VO[V]Vo[V]
OUTPUT
VOLTAGE:
6.0
5.0
4.0
3.0
2.0
1.0
0.0
130
140
150
160
170
180
Ambient
Temperature: TaTa[℃]
[°C]
AMBIENT
TEMPERATURE:
190
Figure 9. Output Voltage vs Ambient Temperature
(Thermal Shutdown Circuit Characteristics)
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Datasheet
Measurement Circuit for Typical Performance Curves
A
VO
VCC
2.2 µF
GND
VO
VCC
2.2 µF
4.7 µF
2.2 µF
4.7 µF
V
GND
VO
VCC
4.7 µF
GND
V
200mA
Measurement Circuit of Figure 1.
Measurement Circuit of Figure 2.
Measurement Circuit of Figure 3.
V
VO
VCC
VO
VCC
VO
VCC
1Vrms
2.2 µF
GND
2.2 µF
4.7 µF A
µF A
4.7
2.2 µF
～
4.7 µF
GND
GND
4.75V
10V
10V
Measurement Circuit of Figure 4.
Measurement Circuit of Figure 5.
VO
VCC
2.2 µF
GND
2.2 µF
GND
VO
VCC
4.7µF
2.2 µF
4.7µF
GND
V
10V
10V
10V
Measurement Circuit of Figure 7.
Measurement Circuit of Figure 8.
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Measurement Circuit of Figure 6.
VO
VCC
4.7µF
V
100mA
A
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Measurement Circuit of Figure 9.
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BD3650FP-M
Datasheet
Power Dissipation
5
5
ROHM standard board
Board size：70mm x 70mm x 1.6mm
foil area:7mm x 7mm
TO252-3:θja=104.2(°C/W)
①
②
③
4
Power
Pd(W)
[W]
PowerDissipation:
Dissipation: Pd
Power
Dissipation: Pd
Pd (W)
Power
Dissipation:
[W]
4
ROHM standard board
Board size:70mm x 70mm x 1.6mm
foil area:7mm x 7mm
③ 4.80
3
2
1.20
1
② 3.50
2-layer board(back surface copper foil area:15mm x 15mm)
2-layer board(back surface copper foil area:70mm x 70mm)
4-layer board(back surface copper foil area:70mm x 70mm)
①θja=67.6(°C/W)
②θja=35.7(°C/W)
③θja=26.0(°C/W
3
① 1.85
2
1
0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Ambient
Temperature:
[°C]
Ambient
Temperature:Ta
Ta(℃)
Ambient Temperature: Ta(℃)
Figure 10
Figure 11
(Reference Data)
When operating at temperatures above Ta=25°C, please refer to the derating factor shown in Figure 10 and Figure 11.
The IC characteristics are closely related to the temperature at which the IC is used. It is necessary to operate the IC at
temperatures below the maximum junction temperature (Tjmax).
Figure 10 and Figure 11 show the acceptable loss and derating factor of the TO252-3 package. The chip junction
temperature (Tj) may be quite high even if the ambient temperature (Ta) is at room temperature (25°C). It is recommended to
operate the IC at temperatures where Power Consumption (Pc) is less than the Power Dissipation (Pd).
The calculation method for Power Consumption Pc (W) is as follows :( Figure 11③)
Pc VCC VO I O VCC I CC
Acceptable loss Pd≥Pc
Solving for load current Io in order to operate within the acceptable dissipation,
IO ≦
Pd VCC I CC
VCC VO
(Please refer to Figure 8 for ICC.)
where:
VCC is the Input voltage
VO is the Output voltage
IO is the Load current
ICC is the Circuit current
Ishort is the Short current
It is then possible to find the maximum load current (IOMAX) with respect to the applied voltage (Vcc) at the time of thermal
design.
Calculation Example:
When Ta=85°C, VCC=10V, VO=5V:
IO ≦
2.469 10 I CC
5
IO≤300mA
Figure 11③:θja=26.0°C/W to -38.4mW/°C
25°C=4.80W to 85°C =2.496W
(ICC=0.5mA)
Please refer to the information above to keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption (Pc) of the IC when there is a short circuit (short between VO and GND) is:
Pc VCC ( I CC I short )
(Please refer to Figure 4 for Ishort.)
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BD3650FP-M
Datasheet
I/O Equivalent Circuit
(Resistances are Typical Values.)
VCC Pin
VO Pin
VCC
100 k Ω
VCC
VO
IC
83.5 k Ω
15kΩ
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Datasheet
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
Tjmax : Maximum junction temperature=150[°C] , Ta : Peripheral temperature[°C] ,
θja : Thermal resistance of package-ambience[°C/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], VCC : Input Voltage, VO : Output Voltage, IO : Load, ICC : Circuit Current
Package Power dissipation
Power dissipation
: Pd W Tj max Ta / ja
: PcW VCC VO IO VCC ICC
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
Operational Notes – continued
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 12. Example of monolithic IC structure
12. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. VCC Pin
Insert a capacitor (capacitor ≥ 2.2µF) between the VCC and GND pins. The appropriate capacitance value varies by
application. Be sure to allow a sufficient margin for input voltage levels.
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Datasheet
Operational Notes – continued
15. Output Pins
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable
capacitance values range from 4.7µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low
enough to prevent oscillation (0.001Ω to 2Ω). Abrupt fluctuations in input voltage and load conditions may affect the
output voltage.
Output capacitance values should be determined only through sufficient testing of the actual application.
VCC=5.6V to 30V
Ta=-40°C to +125°C
IO=0A to 0.3A
CIN=2.2µF to 100µF COUT=4.7µF to 100µF
COUT_ESR [Ω]
Unstable operating region
VCC
Vcc
(5.6 to 30V)
Stable operating region
VO
Cout
(above 4.7μF)
Cin
(above 2.2μF)
GND
Io(ROUT)
ESR
(above 0.001Ω)
IO [mA]
COUT_ESR vs IO (Reference Data)
(Note) Measurement Circuit
16. In some application or process testing, the voltage on the VCC or other pins may be reversed. If a large capacitor is
connected between the output and ground, the current from the charged capacitor can flow to the output and possibly
damage the IC. In order to avoid these problems, limiting output pin capacitance to 1000μF or less and inserting a VCC
series countercurrent prevention diode or bypass diode between the various pins and the VCC is recommended.
Bypass diode
Countercurrent prevention diode
VCC
Pin
17. Positive voltage surges on VCC pin
A power Zener diode should be inserted between VCC and GND for protection against voltage surges of more than
36V on the VCC pin.
VCC
GND
18. Negative voltage surges on VCC pin
A Schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on
the VCC pin.
VCC
GND
19. Output Protection Diode
Output loads with large inductive component may cause reverse current flow to the output pin during startup or
shutdown. In such cases, a protection diode should be inserted at the output to protect the IC.
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BD3650FP-M
Datasheet
Ordering Information
B
D
3
6
5
0
Part
Number
F
P
-
Package
FP : TO252-3
ME2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
TO252-3
(TOP VIEW)
Part Number Marking
3
6
5
0
LOT Number
Part Number Marking
3650
Package
TO252-3
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Part Number
Reel of 2000
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BD3650FP-M
Datasheet
Physical Dimension, Tape and Reel Information
Package Name
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BD3650FP-M
Datasheet
Revision History
Date
Revision
20.Oct.2014
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
