BD3841FS-E2

Sound Processors for Home Theater Systems 6ch / 9ch Stereo Input Selectors BD3843FS,BD3841FS No.10081EAT07 ●Description BD3843FS is a function switch IC with two 6ch (9ch for BD3841FS) inputs. It can independently control outputs of 2 systems: 2ch REC output (3ch for BD3841FS) and 1ch line output. Therefore, it is can be used for 2nd room entertainment and 2nd source recording. BD3843FS has excellent cross-talk characteristics between channels and selectors. Low distortion, and low noise are realized by a basic pattern layout. ●Features 1) 2 room entertainment / 2 source recording. 2) 6ch volume LSI BD3813KS/BD3815KS can be controlled simultaneously by the serial control bus. 3) 7ch volume LSI BD3816K1, BD3817KS with BD3843FS can be controlled simultaneously by the serial control bus. 4) 14ch input is available by combining 2chips (BD3843FS and BD3841FS). 5) Excellent cross-talk characteristics between channels by basic pattern layout. 6) Built-in buffer amplifier. 7) 2-line serial control bus (for both 3.3V and 5V). 8) Operated by single and dual power sources. ●Applications AV receivers, home theater systems, mini-audio systems, and TVs. ●Product lineup Parameter BD3843FS BD3841FS Input selector 6 9 REC output 2 3 SSOP-A24 SSOP-A32 Package ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings VCC 7.5 *1 VEE -7.5 Input signal voltage VIN VCC+0.3～VEE-0.3 Power Dissipation Pd Unit Power Supply Voltage V 800 (BD3843FS) 950 (BD3841FS) V *2 mW Operating temperature Topr －20～+75 ℃ Storage temperature Tastg －55～+125 ℃ *1 *2 Even in the specified range of Power Supply Voltage, applying voltage only to the VCC side may cause an excessive current may cause permanent damage to the IC. When starting up power supplies, VEE and VCC should be powered on simultaneously, or VEE first followed by VCC. Reduced by 8 mW/℃ over 25℃ (BD3843FS), when installed on the standard board (size: 70 x 70 x 1.6mm). Reduced by 7.7 mW/℃ over 25℃ (BD3841FS), when installed on the standard board (size: 70 x 70 x 1.6mm). www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/9 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS ●Operating range Must function normally at Ta = 25℃, Part No. BD3843FS BD3841FS Symbol Parameter Min. Typ. Max. VCC 4 7 7.3 VEE -7.3 -7 -4 VCC- VEE 8 14 14.6 VCC 5 7 7.3 VEE -7.3 -7 -5 VCC- VEE 10 14 14.6 Action power source voltage (both power sources) Action power source voltage (single power source) Action power source voltage (both power sources) Action power source voltage (single power source) Ratings Unit V V Output ●Electrical characteristics Ta=25℃, VCC=7V, VEE=7V, f=1kHz, Vin=1Vrms, RL=10kΩ, Rg=600Ω, unless otherwise noted. Limits Symbol Unit Conditions Parameter Min. Typ. Max. VCC ― 3 10 Circuit current IQ mA No signal VEE -10 -3 ― Output voltage gain 1ch Gv1 -2 0 2 dB Output voltage gain 2ch Gv2 -2 0 2 dB Total harmonic distortion ratio 1ch THD1 ― 0.004 0.05 % BW=400～30kHz Total harmonic distortion ratio 2ch THD2 ― 0.004 0.05 % BW=400～30kHz Maximum output voltage 1ch Vomax1 3.4 4.2 ― Vrms THD=1% Maximum output voltage 2ch Vomax2 3.4 4.2 ― Vrms THD=1% Output noise voltage 1ch Vno1 ― 1 5 µVrms Rg=0Ω, BW=IHF-A Output noise voltage 2ch Vno2 ― 1 5 µVrms Rg=0Ω, BW=IHF-A CTC12 ― -95 -80 dB Rg=0Ω, BW=IHF-A CTC21 ― -95 -80 dB Rg=0Ω, BW=IHF-A Cross-talk between selectors 1ch CTS1 ― -95 -80 dB Rg=0Ω, BW=IHF-A Cross-talk between selectors 2ch CTS2 ― -95 -80 dB Rg=0Ω, BW=IHF-A R voltage gain 1ch GVR1 -2 0 2 dB RL=47kΩ, R voltage gain 2ch GVR2 -2 0 2 dB RL=47kΩ, R Total harmonic distortion ratio 1ch THDR1 ― 0.01 0.09 % R Total harmonic distortion ratio 2ch THDR2 ― 0.01 0.09 % R output noise voltage 1ch VnoR1 ― 1 5 µVms Rg=0Ω, BW=IHF-A R output noise voltage 2ch VnoR2 ― 1 5 µVms Rg=0Ω, BW=IHF-A R output impedance 1ch RoutR1 ― 50 100 Ω R output impedance 2ch RoutR2 ― 50 100 Ω REC output Cross-talk between channels 1ch→2ch Cross-talk between channels 2ch→1ch RL=47kΩ, BW=400～30kHz RL=47kΩ, BW=400～30kHz * Note: This IC is not designed to be radiation-resistant. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/9 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS ●Timing chart 1. Signal timing standards ・Data is read at the rise of clock. ・Latch is read at the fall of clock. ・End latch signal at LOW. * To avoid malfunctions, clock and data signals must terminate with the LOW state. 1byte=17bit CL （CLOCK） tsu 90％ 90％ 10％ thd DA DATA LATCH 90％ twd ts 90％ DATA th 90％ 10％ 10％ tsd thd tsl 10％ thl 90％ 90％ twh 10％ 90％ twc twc DATA 10％ 90％ twl LATCH Finish at Low Fig.1 Parameter Symbol Limit Min. Typ. Max. Unit Minimum clock width twc 2.0 － － µs Minimum data width twd 2.0 － － µs Minimum latch width twl 2.0 － － µs LOW hold width twh 2.0 － － µs Data setup time (DATA→CLK) tsd 1.0 － － µs Data hold time (CLK→DATA) thd 1.0 － － µs Latch setup time (CLK→LATCH) tsl 1.0 － － µs Latch hold time (DATA→LATCH) thl 1.0 － － µs Latch low setup time ts 1.0 － － µs Latch low hold time th 1.0 － － µs 2. Voltage standards of control signal Parameter “H” input voltage “L” input voltage Conditions Vcc=5～7.3V VEE=-5～-7.3V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Limits Unit Min. Typ. Max.(≦Vcc) 2.2 － 5.5 V 0 － 1.0 V 3/9 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS 3. Control data format list (1) BD3843FS control data format Data input direction MSB D16 LSB D15 D14 D13 D12 D11 D10 D9 Data INPUT FUNCTION 1 INPUT FUNCTION 2 D8 D7 RECA RECB 0:OFF 0:OFF 1:ON 1:ON D6 D5 D4 D3 * 0 0 0 D2 D1 D0 Select Address (2) BD3841FS control data format Data input direction MSB D16 LSB D15 D14 D13 D12 D11 D10 D9 Data INPUT FUNCTION 1 INPUT FUNCTION 2 D8 D7 D6 RECA RECB RECC 0:OFF 0:OFF 0:OFF 1:ON 1:ON 1:ON D5 D4 D3 D2 D1 D0 * * * 1 0 1 *:Don’t care. (Ex.) MSB Data input direction LSB Data L "L" represents latch. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/9 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS OUT2 17 16 15 14 13 4 5 6 7 8 9 10 11 12 47K 47K 47μ 47K OUT1 RECB2 RECB1 18 10K 10K RECA2 19 47K VCC 20 47μ GND 21 VEE DA CL DGND 1)BD3843FS) (both power sources) RECA1 ●Block diagram, application circuit 24 23 22 47K INF2 OUT2 47K INF1 OUT1 47K INE2 INE1 47K 47K IND2 IND1 47K 47K INC2 INC1 47K INB2 INB1 47K INA2 INA1 47K 3 47K 2 1 47K F-SW2 F-SW1 LOGIC Fig.2 32 31 30 INI2 47K 47K INI1 RECC2 47K 47K RECC1 RECB2 47K 47K 47K RECB1 RECA2 RECA1 47K 47μ V cc V EE 47μ 10KΩ 10KΩ CL DA 2)BD3841FS (both power sources) 29 28 27 26 25 24 23 22 21 20 19 18 17 4 5 6 7 8 9 10 11 12 13 14 15 16 47K INH2 47K INH1 47K ING2 47K ING1 47K INF2 47K INF1 47K INE2 INE1 47K 47K IND2 47K IND1 47K INC2 47K INC1 INB2 INB1 47K INA2 INA1 3 47K 2 47K 1 47K F-SW2 F-SW1 LOGIC Fig.3 UNIT RESISTANCE：Ω CAPACITOR：F * F-SW1：INPUT FUNCTION1 F-SW2：INPUT FUNCTION2 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/9 2010.06 - Rev.A * © 2010 ROHM Co., Ltd. All rights reserved. www.rohm.com F-SW1：INPUT FUNCTION1 F-SW2：INPUT FUNCTION2 Fig.5 6/9 23 22 21 20 19 18 17 4 5 6 7 8 9 10 11 12 13 14 15 16 10μ 47K 6 7 8 9 10 11 12 INI2 47K 47K 47K 10μ 47K 10μ 10μ 10μ 5 10μ 10μ 47K 10μ 47K 10μ 47K 10μ OUT2 OUT1 RECB2 RECB1 RECA2 RECA1 4 47K 10μ 13 47K 10μ INF2 INF1 INE2 INE1 IND2 47K 14 INI1 OUT2 OUT1 RECC2 RECC1 RECB2 10μ 15 47K 10μ 10μ 10μ 47K 10μ 47K 10μ 47K 10μ IND1 VCC 47μ 16 47K 24 RECB1 10μ 47K 1/2VCC 17 10μ 25 47K 10μ INC2 GND 18 INH2 26 RECA2 47K 47K DA CL 19 47K 47K 47K 47K 47K 47K 47K 47K 27 47K 10μ 10μ 10μ 10K 10K DGND 20 10μ 10μ 10μ 10μ 10μ 10μ 10μ 10μ INC1 INB2 LOGIC 21 INH1 ING2 ING1 INF2 INF1 INE2 INE1 IN D2 28 RECA1 29 47K 10μ 4)BD3841FS (single power source) 10μ 47K V cc 47μ 47K F-SW2 F-SW1 3)BD3843FS (single power source) IND1 47K 10μ 3 10μ INB1 47K 47K 22 INC2 3 47K LOGIC 1/2Vcc 30 10μ 10μ 2 10μ INA2 INA1 23 INC1 DA CL 1 10μ 47K 10KΩ 10KΩ 24 INB2 2 10μ 47K F-SW2 31 INB1 47K 47K 1 10μ 10μ F-SW1 32 INA2 INA1 BD3843FS,BD3841FS Technical Note Fig.4 UNIT RESISTANCE：Ω CAPACITOR：F RESISTANCE：Ω 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS ●Reference data 10 3 VCC 2 1 0 -1 VEE -2 -3 -4 10 1 1 THD+N （%） 4 OUTPUT VOLTAGE (Vrms) CIRCUIT CURRENT (mA) 5 0.1 0 2 4 6 8 0.001 0.0001 0.01 0.1 1 10 Fig.7 Output Voltage - Input Voltage OUTPUT VOLTAGE (Vrms) NOISE (μVrms) 3.0 2.0 -1 1.0 100 1000 10000 FREQUENCY(Hz) 0 100000 4 6 8 10 1 GAIN (dB) 0.0001 0.01 0.1 1 10 INPUT VOLTAGE (Vrms) Fig.12 REC Total Harmonic Distortion - Input Voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 0.1 1 10 5.0 4.0 0 -1 0.001 0.01 Fig.11 REC Output Voltage Input Voltage 1 0.01 0.01 INPUT VOLTAGE (Vrms) 2 0.1 0.1 VCC,VEE (V) 10 0.001 2 Fig.10 Output Noise Voltage – Supply Voltage Fig.9 Voltage Gain Frequency 10 1 0.001 0.001 0.0 -2 NOISE(μVrms) GAIN(dB) 0 1 10 4.0 1 0.1 Fig.8 Total Harmonic Distortion - Input Voltage 5.0 2 0.01 INPUT VOLTAGE (Vrms) INPUT VOLTAGE (Vrms) Fig.6 Circuit Current - Supply Voltage THD+N (%) 0.001 10 VCC,VEE (V) 10 0.01 0.01 0.001 0.001 -5 0.1 3.0 2.0 1.0 0.0 -2 10 100 1000 10000 100000 FREQUENCY (Hz) Fig.13 REC Voltage Gain Frequency 7/9 0 2 4 6 8 10 VCC,VEE(V) Fig.14 REC Output Noise Supply Voltage 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS ●Notes for use 1. Numbers and data in entries are representative design values and are not guaranteed values of the items. 2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for sufficient margins when determining circuit constants. 3. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr), may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times where the absolute maximum ratings may be exceeded. 4. VEE potential Make the VEE pin voltage such that it is the lowest voltage even when operating below it. Actually confirm that the voltage of each pin does not become a lower voltage than the VEE pin, including transient phenomena. 5. Thermal design Perform thermal design, in which there are adequate margins, by taking into account the power dissipation (Pd) in actual states of use. 6. Short circuit between terminals and erroneous mounting Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other components on the circuits, can damage the IC. 7. Operation in strong electromagnetic field Using the ICs in a strong electromagnetic field can cause operation malfunction. 8. Operating Voltage Range and Operating Temperature Range Circuit function actions are guaranteed within the action voltage range and the action temperature range. However, the specific values of the electrical characteristics are guaranteed under the specified conditions of the electrical characteristics. Therefore, carry out set considerations in sufficient consideration of IC characteristic fluctuations.. 9. Power ON/OFF (a) At power ON/OFF, a shock sound will be generated. Therefore, use MUTE on the set. (b) When turning on power supplies, VEE and VCC should be powered on simultaneously, or VEE first followed by VCC. If the VCC side is started up first, an excessive current may flow from VCC to VEE. 10. Serial control For the CL and DA terminals, the patterned and other wirings should be routed as not to cause interference with the analog-signal-related lines. 11. Function switching For all functions, other than Master Volume, Treble, and Bass Gain Settings, use MUTE on the set. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/9 2010.06 - Rev.A Technical Note BD3843FS,BD3841FS ●Ordering part number B D 3 Part No. 8 4 3 F Part No. 3843 3841 S - Package FS: SSOP-A24 SSOP-A32 E 2 Packaging and forming specification None: Tray SSOP-A24 10 ± 0.2 (MAX 10.35 include BURR) 0.5±0.2 12 Tape Embossed carrier tape Quantity 2000pcs 0.1±0.1 0.8 0.1 Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) +0.1 0.17 −0.05 1.8±0.1 1 1.2±0.15 7.8±0.3 13 5.4±0.2 24 +6° 4° −4° 1pin 0.38±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. SSOP-A32 13.6 ± 0.2 (MAX 13.95 include BURR) 17 Tape Embossed carrier tape Quantity 2000pcs Direction of feed 0.3MIN 5.4±0.2 7.8±0.3 32 1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 16 0.11 1.8±0.1 0.15 ± 0.1 0.36 ± 0.1 0.1 0.8 1pin Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/9 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.06 - Rev.A Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001