BD3852MUZ-ZTR

Datasheet Shock Sensor (Impact Sensor) IC BD3852MUZ-Z General Description Key Specifications BD3852MUZ-Z is connected with an external shock sensor. It is equipped with a function to amplify the shock detection signal from the shock sensor and transmit the amplified signal externally. It delivers high S/N characteristics and is ideal for control system applications such as HDD processing.  Recommended Operating Power Supply Voltage Range: 1.6 V to 2.3 V  Notch Frequency: 31 kHz (Typ)  Notch Attenuation Rate: -23 dB (Max)  Current Consumption: 3.9 mA (Typ)  Recommended Operating Temperature Range: -40 °C to +85 °C Features Package  Operating Power Supply Voltage Range: 1.6 V to 2.3 V, Single Power Supply Operation  Freely Tunable Frequency Characteristics and the Gain according to Applications  Built-in Notch Filter for Reducing the Effect of the Shock Sensor Resonance Point (fO: 31 kHz) VQFN16Z3030A W (Typ) x D (Typ) x H (Max) 3.0 mm x 3.0 mm x 0.4 mm Applications  HDD/light Pick-up Shock Detection and Write Protection  HDD/light Pick-up Inertial Force Fluctuation Feed Forward Control Typical Application Circuit 〇Product structure : Silicon integrated circuit www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays. 1/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Pin Configuration Pin Description Pin No. Pin Name 1 EN Enable input pin (H input: Power ON, L input: Power saving) Pull-down at 50 kΩ inside the IC 2 NC Connect to the GND pin 3 REF2 Reference output pin (0.8 V) 4 A2IP OP-AMP2 non-inverting input pin 5 A2O OP-AMP2 output pin 6 A2IM OP-AMP2 inverting input pin 7 FO Filter output pin 8 NC Connect to the GND pin 9 A1O OP-AMP1 output pin 10 NC Connect to the GND pin 11 NC Connect to the GND pin 12 VCC Power supply voltage pin 13 A1IP OP-AMP1 non-inverting input pin 14 A1IM OP-AMP1 inverting input pin 15 REF1 Reference output pin (0.4 V) 16 GND Ground pin - EXP-PAD www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function The EXP-PAD connect to the GND pin 2/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Block Diagram Description of Blocks OP-AMP1: Detects the charge signal generated in the shock sensor by the charge amplifier configuration. Filter: Amplifies by 13.9 dB with the preamplifier, and attenuates the f O component of the shock sensor resonance frequency (Typ: 31 kHz) with the notch filter. OP-AMP2: Serves as the amplifier for the signal amplification and the filter. (The gain is configurable using add-on R and C.) VREF: Generates the REF1 and REF2 output voltages. PS: Switches between the power saving and power ON states according to the EN pin input voltage. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Absolute Maximum Ratings Parameter Symbol Rating Unit VCC 4.5 V Input Voltage VA1IM, VA1IP, VA2IM, VA2IP, VEN -0.3 to VCC + 0.3 V Output Voltage VA1O, VA2O, VFO, VREF1, VREF2 -0.3 to VCC + 0.3 V Tjmax 150 °C Tstg -55 to +150 °C Power Supply Voltage Maximum Junction Temperature Storage Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Power Dissipation Parameter Power Dissipation(Note 1) Symbol Rating Unit Pd 3.00 W (Note 1) When a 114.3 mm x 76.2 mm x 1.6 mm glass epoxy substrate (JEDEC substrate) is mounted. Reduced at 24.9 mW/°C in Ta > 25 °C. Recommended Operating Conditions Parameter Symbol Operating Range Min Typ Max Unit Power Supply Voltage VCC 1.6 1.8 2.3 V Operating Temperature Topr -40 +25 +85 °C (Note 2) A short circuit between the adjacent pins, reverse connection, rotated connection, short circuit with the power supply, ground fault, and so on may destroy the IC. Since an overload voltage or overload current may be applied to peripheral components, pay sufficient attention during the design and installation. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Electrical Characteristics (VCC = 1.8 V, Ta = 25 °C unless otherwise specified.) Parameter Symbol Standard Values Unit Conditions Min Typ Max ICC 1.6 3.9 4.5 mA H input to the EN pin ICCPS - - 10 μA L input to the EN pin Current Consumption 1. EN Pin Parameter Symbol Standard Values Unit Min Typ Max VIH1 VCC x 0.7 - VCC + 0.3 V VIL1 -0.3 - VCC x 0.3 V RUD 35 50 65 kΩ Conditions Input Voltage Built-in Pull-down Resistance 2. OP-AMP Characteristics (1) OP-AMP1 Parameter Symbol Output DC Voltage VDC1 Standard Values Min Typ Max 0.3 0.4 0.5 Unit V Output Load Fluctuations (Source) VSOURCE1 -100 - - mV Output Load Fluctuations (Sink) VSINK1 - - +100 mV Conditions With no signal Difference between the output DC voltage with no load and the output DC voltage when 80 µA is subtracted Difference between the output DC voltage with no load and the output DC voltage when 80 µA is added (2) OP-AMP2 Parameter Symbol Standard Values Unit Min Typ Max IIN -50 - +50 nA Output DC Voltage 1 VDC21 0.67 0.80 0.93 V Output DC Voltage 2 VDC22 0.75 0.80 0.85 V Output Voltage Range (L side) VOL2 - - 0.3 V Output Voltage Range (H side) VOH2 VCC - 0.3 - - V Output Source Current IASO2 80 - - µA Output Sink Current IASI2 80 - - μA Input Current www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/14 Conditions When the A2IP and REF2 pins are connected When 0.8 V is input to the A2IP pin Current flowing into the A2O pin when VCC - 0.3 V is applied to the A2O pin Current flowing out of the A2O pin when 0.3 V is applied to the A2O pin TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z 2. OP-AMP Characteristics – continued (3) Filter Parameter Symbol Standard Values Unit Min Typ Max VDC3 200 400 600 mV Output Load Fluctuations (Source) VSOURCE3 -100 - - mV Output Load Fluctuations (Sink) VSINK3 - - +100 mV Voltage Gain GV - 13.9 - dB Notch Attenuation Rate ATT - - -23 dB Output DC Voltage Conditions Difference between the output DC voltage with no load and the output DC voltage when 80 µA is subtracted Difference between the output DC voltage with no load and the output DC voltage when 80 µA is added Attenuation rate at fO = 31 kHz when the signal amplitude of the A1O pin is 5 mVpp (4) VREF Parameter Symbol Standard Values Min Typ Max Unit Conditions REF1 Output Voltage VREF1 0.35 0.40 0.45 V With no load REF2 Output Voltage VREF2 0.68 0.80 0.92 V With no load REF2 Output Load Fluctuations (Source) VREF2SO -100 - - mV REF2 Output Load Fluctuations (Sink) VREF2SI - - +100 mV Difference in the output DC voltages with no load and when 80 µA is subtracted Difference in the output DC voltages with no load and when 80 µA is added Reference Data(Note 3) (Note 3) No shipping test is performed for the reference data. 1. OP-AMP1 Parameter Symbol Standard Values Min Typ Max Unit Input Bias Voltage VIN - 0.4 - V Input Impedance ZIN - 60 - MΩ GBW (Cut-off Frequency) fT1 - 1.5 - MHz Conditions With no signal 2. OP-AMP2 Parameter Symbol GBW (Cut-off Frequency) fT2 Standard Values Min Typ Max - 1.5 - Unit Conditions MHz 3. Filter Parameter Symbol Notch Frequency www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 fO Standard Values Min Typ Max - 31 - 6/14 Unit Conditions kHz When the signal amplitude of the A1O pin is 5 mVpp TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Reference Data – continued 4. Specifications of the EN Pin at Startup and during Power Saving Parameter Symbol Standard Values Min Typ Max Unit Shutdown Time tSD - 6 10 μs Startup Time tSU - 10 50 ms Conditions Time elapsed after the EN pin input is changed from H to L until the REF2 output voltage is decreased to 10 % of VREF2 or less Time elapsed after the EN pin input is changed from H to L until the REF2 output voltage is increased to 90 % of VREF2 or more Application Example www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z I/O Equivalence Circuits (1) EN (3) REF2 (4) A2IP (5) A2O (6) A2IM (7) FO www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z I/O Equivalence Circuits – continued (9), (14) A1O/A1IM www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 (13), (15) A1IP/REF1 9/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Operational Notes – continued 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 10. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Example of Monolithic IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Ordering Information B D 3 8 5 2 M U Package MUZ: VQFN16Z3030A Z - ZTR Packaging and forming specification TR: Embossed tape and reel Marking Diagram VQFN16Z3030A (TOP VIEW) Part Number Marking B D 3 8 5 2 LOT Number Pin 1 Mark www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Physical Dimension and Packing Information Package Name www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VQFN16Z3030A 13/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 BD3852MUZ-Z Revision History Date Revision 11.Mar.2020 001 Changes New Release www.rohm.com © 2020 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/14 TSZ02201-0E3E0FZ00890-1-2 11.Mar.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. 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Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001