Datasheet
CXPI Transceiver for Automotive
BD41001FJ-C
General Description
Key Specifications
BD41001FJ-C can reduce EMI (Electromagnetic
Emission) noise of AM frequency band in comparison
with BD41000AFJ-C. BD41001FJ-C is a transceiver for
the CXPI (Clock Extension Peripheral Interface)
communication. Switching between Master/Slave Mode
can be done using the external pin (the MS pin). Low
power consumption during standby (non-communication)
using Power Saving function. Arbitration function stops
transmitter output upon the detection of BUS data
collision. Also Fail-safe function stops transmitter output
upon the detection of under voltage or temperature
abnormality.
Power Supply Voltage:
+7 V to +18 V
Absolute Maximum Rating of BAT: -0.3 V to +40 V
Absolute Maximum Rating of BUS: -27 V to +40 V
Power OFF Mode Current:
3 μA (Typ)
Operating Temperature Range:
-40 °C to +125 °C
Package
W(Typ) x D(Typ) x H(Max)
SOP-J8
4.90 mm x 6.00 mm x 1.65 mm
Features
AEC-Q100 Qualified(Note 1)
CXPI Standards Qualified
Transmission Speed Range from 18.8 kbps to 20 kbps
Master/Slave Switching Function
Microcontroller Interface Corresponds to 3.3 V/5.0 V
Built-in Terminator (30 kΩ(Typ))
Power Saving Function
Data Arbitration Function
Built-in Under Voltage Lockout (UVLO) Function
Built-in Thermal Shutdown (TSD) Function
Low Electro Magnetic Interference (EMI)
High Electro Magnetic Susceptibility (EMS)
High Electro Static Discharge (ESD) Robustness
SOP-J8
(Note 1) Grade 1
Applications
Automotive Networks
Typical Application Circuit
CXPI
BUS
Master node
VECU
Regulator
10kΩ
2.7kΩ
VDD
MS(8)
INT
RXD
RXD(1)
Micro
TXD
Controller
TXD(4)
CLK
CLK(3)
(Note 2)
BAT(7)
100nF
BD41001FJ-C
1kΩ
BUS(6)
NSLP(2)
I/O
GND
1nF
GND(5)
Slave node
Regulator
2.7kΩ
VDD
MS(8)
INT
RXD
RXD(1)
Micro
TXD
Controller
TXD(4)
CLK
CLK(3)
(Note 2)
10kΩ
2.7kΩ (Note 3)
BAT(7)
100nF
BD41001FJ-C
BUS(6)
NSLP(2)
I/O
GND
GND(5)
220pF
(Note 2) INT: Interrupt, RXD: UART RXD, TXD: UART TXD, CLK: Clock, I/O: General Purpose I/O
(Note 3) While using slave, it is no problem that the CLK pin is opened in the case of non-using the CLK output.
Figure 1. Typical Application Circuit
Consider the actual application design confirming the following linked document before applying this product.
Application Note
〇Product structure : Silicon monolithic integrated circuit
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BD41001FJ-C
Pin Configuration
(TOP VIEW)
RXD 1
8
MS
NSLP 2
7
BAT
CLK
3
6
BUS
TXD
4
5
GND
Figure 2. Pin Configuration
Pin Description
Table 1. Pin Description
Pin No.
Pin Name
Function
1
RXD
2
NSLP
3
CLK
Clock signal input/output pin
(Master setting: Input, Slave setting: Output)
4
TXD
Transmission data input pin
5
GND
Ground
6
BUS
CXPI BUS pin
7
BAT
Power supply pin
8
MS
Master/Slave switching pin
(“H”: Master, “L”: Slave)
Received data output pin
Power saving control input pin
(“H”: Change to “Codec Mode”,
“L”: Change to “Power OFF Mode”)
Block Diagram
7
BAT
6
BUS
5
GND
BAT
MS
Thermal
Shutdown
(TSD)
8
Under Voltage
Lockout
(UVLO)
Power on
Reset
(POR)
Regulator
To each block
LOGIC
RXD
Low Pass
Filter
1
Decoder
Wakeup
Timer
Slope Control
TXD
4
Arbiter
Encoder
Dominant
Timeout Counter
(DTC)
Controller
NSLP
2
CLK
3
Slope
Timer
Timing
Generator
Oscillator
Figure 3. Block Diagram
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BD41001FJ-C
Description of Blocks
State Transition Diagram
BD41001FJ-C has “Power OFF Mode”, “Through Mode”, “RX Through Mode” other than “CODEC Mode” for power saving
control. Each mode is controlled by the NSLP, BUS, and TXD pins.
Non-power Supply
When VBAT Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 21. Example of Monolithic IC Structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD41001FJ-C
Ordering Information
B
D
4
1
0
0
1
Part Number
F
J
Package
FJ: SOP-J8
C
-
E
2
Product Rank
C: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8(TOP VIEW)
Part Number Marking
4 1 0 0 1
LOT Number
Pin 1 Mark
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BD41001FJ-C
Physical Dimension and Packing Information
Package Name
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TSZ22111 • 15 • 001
SOP-J8
20/21
TSZ02201-0E2E0H600200-1-2
26.Mar.2019 Rev.002
BD41001FJ-C
Revision History
Date
Revision
16.Mar.2018
001
26.Mar.2019
002
Changes
New Release
P1
Added the ApplicationNote information
P9
1. In case of collision is happened by transmitting from other node at the same
time
Added a caution about the time to validate the transmit after an arbitration
defeat occurred.
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001