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BD4233NUX-E2

BD4233NUX-E2

  • 厂商:

    ROHM(罗姆)

  • 封装:

    UFDFN10_EP

  • 描述:

    数码相机 PMIC VSON010X3020

  • 数据手册
  • 价格&库存
BD4233NUX-E2 数据手册
Power LSI series for Digital Camera and Digital Video Camera Strobe Charge Control IC BD4233NUX ●Key Specifications ●Outline The strobe charge IC is a self-oscillating switching regulator that uses a transformer. It provides highly efficient applications for charging capacitors in sets with various strobes. ・SW pin input range: 48V ・SW pin peak current: 0.5A±20% ・Full charge detection voltage DC: 1.0V±1.1% ・Full charge detection voltage AC 200nsec:1.0V-1.1%~1.35% ・Full charge detection voltage AC 100nsec: 1.0V-1.1%~1.6% ・Vth(START,IGBT_AN) 0.6V~1.5V ●Features 1) Built-in lowVth48V DMOS 2) Adjustable transformer primary-side peak current by RADJ pin 3) Charging control switching with the START pin 4) Includes high precision full charge voltage detection circuit and output pin 5) Various built-in protective circuits (TSD, UVLO, SDP) 6) Built-in IGBT driver ●Package 3.0mm×2.0mm×0.6mm VSON010X3020 ●Use Digital still cameras、Mobile Phone ●Recommended Application Circuit RFU02VS8S(ROHM) P Battery VCC S Cmain 80μF 300V 22μF 4.7μF VCC VCC SW 5 Controller 10 VCC STB IGBT START VREF UVLO UVLO 6 START STB OSC OFF ON TSD UVLO R FULL CLK Q TSD TSD Xenon SDP STB UVLO TSD VCC LOGIC OFF PGND SQ MAX OFF DRIVER R R SDP 8 SDP + - ON 1 PGND RFB1=470kΩ I/V 47kΩ FULL OSC ENABLE S Q MAX ON RADJ OSC OS FULL Q R 9 + - S 4 OS OFF + - VC ( 3 ) RFB2=1.62kΩ GND VCC STB IGBT_IN 2 7 IGBT_OUT 68Ω IGBT_IN IGBT 10kΩ IGBT CY25BAH-8F ルネサス テクノロジ Fig.1 Application circuit ○Products:Silicon monolithic IC ○This product is not designed for normal operation with in a radioactive Status of this document The Japanese version of this document is the official specification. Please use the translation version of this document as a reference to expedite understanding of the official version. If these are any uncertainty in translation version of this document, official version takes priority. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Pin Description ●package SON 10pin package VSON010X3020 (2.0mm×3.0mm×0.6mm) Pin No. Pin Name 1 PGND 2 IGBT_OUT 2.0±0.1 0.5±0.1 0.4±0.1 1 10 2 9 3 4 8 0.25 +0.05 -0.04 7 5 0.64±0.1 CO.2 6 (UNIT:mm) Function Power GND IGBT Driver output pin 3 GND GND pin 4 VC Full charge detection pin 5 VCC VCC supply pin 6 START Charge start signal input pin 7 IGBT_IN IGBT Driver output start signal input pin 8 RADJ Ipeak current control setting pin 9 FULL Full charge detection signal output pin 10 SW Switching pin 2.39±0.1 Fig.2 ●Block Diagram VCC SW 5 10 VCC STB VREF IGBT UVLO UVLO OSC OSC TSD TSD OS START 6 START STB ENABLE S Q R FULL SDP STB UVLO TSD MAX ON OSC OFF ON TSD UVLO RADJ CLK Q VCC LOGIC OFF PGND SQ MAX OFF DRIVER R R SDP 8 SDP + - ON 1 PGND I/V FULL Q R FULL 9 + - S 4 OS OFF + - VC 3 GND VCC STB 2 IGBT_IN 7 IGBT_OUT IGBT_IN IGBT Fig.3 ●Absolute maximum ratings (Ta=25℃) ●Operating condition Parameter Symbol Rating Unit Parameter Symbol VCC supply voltage VCC -0.3~7 V VCC supply voltage range SW pin VSW 48 V VC pin VC pin VC -0.6~7 V START Input pin voltage range START pin START -0.3~7 V FULL pin FULL -0.3~7 V FULL Input pin voltage range IGBT_IN pin IGBT_IN -0.3~7 V Topr -35~+85 SW pin current Operating temperature range ℃ Storage temperature range Tstg -55~+150 ℃ Junction temperature Tjmax 150 ℃ Power dissipation Pd 1540 mW Rating Unit VCC 2.5~5.5 V VC -0.6~VCC V VSTART 0~VCC V 0~VCC V VFULL 0~5.5 V ISW 0.5~2 A IGBT_IN Input pin voltage range VIGBT_IN Table 2. Operating Conditions Table 1. Absolute Maximum Ratings www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics (Unless specified, Ta=25℃, VCC=V(START)=3.4V,V(IGBT_IN)=0V Parameter Symbol Limit Unit Min. Typ. Max. Conditions [Overall device] VCC circuit current Circuit current standby operation [Standby control START pin] ICC - 1.5 3 mA ISTB - - 1 μA START pin high voltage H1 VSTH 1.5 - - V START pin high voltage H2 VSTH 1.3 - - V START pin low voltage VSTL - - 0.6 V ISTART 12 24 36 μA START=3.4V Input bias current START=0V [Transformer primary-side driver block] SW pin leak current ISWL - - 1 μA SW=48V SW pin peak current IPEAK 0.4 0.5 0.6 A RADJ=100kΩ SW saturation voltage VSAT - 0.2 0.4 V ISW=0.5A RADJ adjustable range RADJ 33 - 100 kΩ Max on time TONMAX 25 50 100 μs Max off time TOFFMAX 12.5 25 50 μs - - 1 μA 1 1.011 V 1 1.0135 V VC=200ns pulse input→FULL=H→L 1 1.0160 V VC=100ns pulse input→FULL=H→L 1 2 kΩ VC=VCC,FULL=0.5V [Charging control block] [Transformer secondary-side detection block] VC pin input current Full charge detection voltage Full charge detection voltage AC1 Full charge detection voltage AC2 FULL pin ON resistor FULL pin leak current IVC VFULLTH 0.989 VFULLTH_ 0.9890 AC1 VFULLTH_ 0.9890 AC2 RFULLL 0.5 VC=VCC IFULLL - - 1 μA FULL=3.4V VUVLOTH 1.95 2.1 2.25 V VCC detection VUVLOHYS 120 200 280 mV Output short high current Ioso 90 140 200 mA IGBT_IN=3.4V,START=0V,IGBT_OUT=0V Output short low current IGBT_IN input high voltage Range H1 IGBT_IN input high voltage range H2 IGBT_IN input high voltage range IGBT_IN sink current Iosi 30 60 90 mA IGBT_IN=0, START=0V,IGBT_OUT=3.4V VIGBTH1 1.5 - - V START=0V VIGBTH2 1.3 - - - START=0V,VCC =2.5V~5.5V Ta=-25℃~85℃ VIGBTL - - 0.6 V START=0V IIGBT_IN 12 24 36 μA START=0V IGBT_IN response time Rise Tres_rise - 15 80 ns IGBT_IN→IGBT_OUT response time (rise) IGBT_IN response time Fall Tres_fall - 60 200 ns IGBT_IN→IGBT_OUT response time (fall) [Protection circuit block] UVLO detect voltage UVLO hysteresis [IGBT driver block] Table 3. ○This product is not designed for normal operation within a radioactive environment. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 3 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX 0.5 3.0 0.4 2.4 0.3 1.8 ICC [mA] ICC [uA] ●Electrical characteristics data (1) 0.2 Ta=25℃ Ta=-35℃ 0.1 Ta=85℃ Ta=25℃ Ta=-35℃ 1.2 Ta=85℃ 0.6 0.0 0.0 0 1.1 2.2 3.3 4.4 5.5 0 1.1 VCC [V] 3.3 4.4 5.5 4.4 5.5 VCC [V] Fig.5 Circuit Current (pwr_tr_on) Fig.4 Circuit Current (Standby Condition) 3.0 1.0 2.4 0.8 Ta=85℃ Ta=25℃ Ta=85℃ 1.8 0.6 1.2 ICC [mA] ICC [mA] 2.2 Ta=-35℃ 0.6 Ta=25℃ Ta=-35℃ 0.4 0.2 0.0 0.0 0 1.1 2.2 3.3 4.4 5.5 0 VCC [V] 2.2 3.3 VCC [V] Fig.6 Circuit Current (pwr_tr_off) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1.1 Fig.7 Circuit Current - VCC (IGBTDRV=ON) 4 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (2) 3.0 3.0 VCC=5.5V 2.4 2.4 VCC=5.5V VCC=3.4V ICC [mA] ICC [mA] 1.8 VCC=2.3V 1.2 0.6 1.8 VCC=3.4V 1.2 VCC=2.3V 0.6 0.0 0.0 -50 -25 0 25 50 75 100 -50 -25 0 Temp [°C] 75 100 3.0 2.5 2.5 2.0 2.0 1.5 1.5 SW [V] SW [V] 3.0 Ta=85℃ Ta=85℃ 1.0 Ta=85℃ Ta=25℃ Ta=25℃ Ta=-35℃ 0.5 50 Fig.9 Circuit Current – Temp (pwr_tr_off) Fig.8 Circuit Current – Temp (pwr_tr_on) 1.0 25 VCC [V] 0.5 Ta=25℃ Ta=-35℃ Ta=-35℃ 0.0 0.0 0 0.5 1 1.5 2 2.5 0 3 1 1.5 2 2.5 3 VCC [V] VCC [V] Fig.10 VCC UVLO Check (Detect) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 0.5 Fig. 11 VCC UVLO Check (Release) 5 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (3) 36.0 3.6 30.0 3.0 Ta=85℃ Ta=85℃ 24.0 Ta=25℃ Ta=-35℃ 2.4 18.0 FULL [V] START [uA] Ta=25℃ Ta=-35℃ 12.0 1.8 1.2 0.6 6.0 0.0 0.0 0 1.1 2.2 0 3.3 1.1 2.2 3.3 START [V] START [V] Fig.13 Start Threshold Voltage Fig.12 START Input Current 4.0 0.3 Ta=85℃ 3.2 0.2 Ta=25℃ FULL [uA] 0.1 ICC [mA] 2.4 Ta=-35℃ 1.6 Ta=-35℃ Ta=25℃ Ta=85℃ 0.0 -0.1 0.8 -0.2 0.0 0 1.1 VCC [V] 2.2 0 3.3 2.2 3.3 FULL [V] Fig.14 FULL Sink Current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1.1 Fig. 15 FULL Pin Leak Current 6 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (4) 4.0 1.0 Ta=85℃ 3.2 0.8 Ta=25℃ Ta=-35℃ Ta=85℃ 0.6 Ta=25℃ SW [uA] SW [V] 2.4 1.6 Ta=-35℃ 0.4 0.8 0.2 0.0 0.0 0 0.5 1 1.5 Ta=25℃ Ta=85℃ Ta=-35℃ 0 2 10 20 40 50 Fig.17 SW Leak Current Fig.16 SAT Voltage 40.0 75.0 60.0 30.0 VCC=3.4V VCC=3.4V OFF Time [us ] Time [us ] 30 SW [V] SW [A] 20.0 10.0 45.0 30.0 15.0 0.0 0.0 -50 -25 0 25 50 75 100 -50 Temp [°C ] 0 25 50 75 100 Temp [°C] Fig.18 START Delay Time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 -25 Fig. 19 MAX OFF Time 7 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (5) 35.0 36.0 30.0 VCC=3.4V 28.0 Ta=85℃ 24.0 Ta=25℃ ICC [mA] ON Time [us] 21.0 14.0 18.0 Ta=-35℃ 12.0 7.0 6.0 0.0 0.0 -50 -25 0 25 50 75 0 100 Temp [°C] 1.1 2.2 3.3 VCC [V] Fig.21 IGBT_IN Input Current Fig.20 MAX ON Time 3.6 80.0 3.0 60.0 IGBT_OUT [mA] IGBT_OUT [V] 2.4 Ta=85℃ 1.8 40.0 Ta=25℃ Ta=-35℃ 1.2 Ta=85℃ Ta=25℃ Ta=-35℃ 20.0 0.6 0.0 0.0 0 1.1 2.2 3.3 0 IGBT_IN [V] 2.2 3.3 IGBT_OUT [V] Fig.22 IGBT_IN Threshold Voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1.1 Fig. 23 IGBT_OUT Sink Current 8 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (6) 25.0 180.0 20.0 VCC=3.4V 15.0 Time [ns ] IGBT_OUT [mA] 135.0 90.0 Ta=85℃ Ta=25℃ 45.0 10.0 5.0 Ta=-35℃ 0.0 0.0 0 1.1 2.2 -50 3.3 -25 0 IGBT_OUT [V] 50 75 100 Fig.25 IGBT Response time Rise1 (START=0) Fig.24 IGBT_OUT Source Current 0.3 75.0 60.0 0.2 VCC=3.4V 0.1 VC [uA] 45.0 Time [ns ] 25 Temp [°C ] 30.0 -0.1 0.0 -0.2 -25 0 25 50 75 0 100 Ta=85℃ 1.1 2.2 3.3 VC [V] Temp [°C ] Fig.27 VC Input Current Fig.26 IGBT Response time Fall1 (START=0) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Ta=25℃ 0.0 15.0 -50 Ta=-35℃ 9 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Electrical characteristics data (7) 1.5 200.0 VCC=3.4V 100.0 VC Threshold [mV] VC-FULL Threshold [V] 1.2 0.9 0.6 VCC=3.4V 0.0 -100.0 0.3 0.0 -200.0 -50 -25 0 25 50 75 100 -50 Temp [°C ] Fig.28 VC FULL Threshold Voltage vs TEMP ( Monitor FULL, sweep VC from –0.2 to 0.2 ) -25 0 25 50 Temp [°C ] 75 100 Fig. 29 VC OFF Threshold Voltage vs TEMP ( Monitor SW, sweep VC from –0.2 to 0.2 ) 2.0 RADJ=33kΩ Ipeak [A ] 1.5 1.0 RADJ=62kΩ 0.5 RADJ=100kΩ 0.0 -50 -25 0 25 50 75 100 temp [℃ ] Fig. 30 ICOMP Peak Current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 10 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Timing Chart and Description of Operation V(START) (VENABLE) V(FULL) V(CAP) Voltage at Completion of Charge 充電完了電圧 V(IGBT_IN) V(IGBT_OUT) A B C D E F I G H J Fig 31. Timing Chart 1: Overall Operation ■Charge start/stop A and ○ C in Fig 31.). In order to In this IC, a charging operation starts when the START pin is set to "H" (See Time ○ A to ○ B , ○ C to○ I in Fig 31.) If any of maintain the charging operation, the START pin must be set to "H". (See Time ○ the conditions ① to ③ are satisfied, the charging operation stops. ① The START pin is set to "L". F in Fig 31.) ② Charging is completed. The VC pin voltage reaches the specified voltage. (See Time ○ ③ The protective circuit is activated (See Fig 33 and the Protective Circuit.)。 To re-charge, set the START pin to "L", and the FULL pin is changed from “L” to “H”. Also, if the CHARGE_ON pin is C in Fig 31.) changed from "L" to "H" again, the charging operation re-starts. (See Time ○ ■IGBT driver Set the IGBT_IN pin to "H" when the IGBT driver satisfies the following 4 conditions. The "H" signal is output to the G and ○ J in Fig 31.) IGBT_OUT pin. (See Time ○ ① The VCC voltage is the UVLO release voltage or more. ② The FULL pin is set at "L". ③ Even if the IGBT_IN pin is set to "H" while the START pin is set to "H", the IGBT_OUT pin remains at "L" and no light flashes. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 11 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Timing Chart and Description of Operation VCC V(START) I(SW) ON Ipeak OFF ON OFF ON ON 2次側ピーク電流 Secondary-side current V(SW) VBAT ADJ V(VC) 満充電電圧 Full charge voltage Maximum OFF time 最大OFF時間 GND OFF detection voltage OFF検出電圧 -VBAT V(CAP) 満充電電圧 Full charge voltage V (FULL) A B C D E F G H I J K L Fig 32. Timing Chart 2: Switching Operation ■Charging operation The switching operation of this IC is shown in Fig.32 Timing Chart 2. A →○ B .) If the START pin is set to "H", all internal circuits are reset , the internal PowerTr is turned ON. (See Fig 32. Time ○ While the internal PowerTr is turned ON, a current is passed into the SW pin. When the current specified at the RADJ pin c in Fig 32.) The time tON when the PowerTr is ON is voltage is reached, the PowerTr is turned OFF. (See Time ○ indicated as follows: LP: Transformer primary-side inductance value I  I PEAK : Primary-side peak current (1) t ON  LP  PEAK  VBAT : Battery voltage V  BAT  When the PowerTr is turned OFF, the magnetic energy stored in the transformer is released to the transformer secondary-side. While the energy is released, the VC pin voltage and the SW pin voltage indicated by the following equations are generated: V (VC )  (VBATV ・Np)  V (VC )  (Vcap+Vdiode )  V (SW )  Vcap NP ( RFB 2 // RFB 3 ) RFB 2  VBAT www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 RFB1  ( RFB 2 // RFB3 )  (2) RFB1  RFB 2  (3) (4) 12 V(VC) : Full charge detection voltage Vcap : Main capacitor voltage Vdiode: Diode forward voltage V(SW): SW pin voltage NP: S winding vs. P winding Winding ratio TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX When the energy release to the transformer secondary-side is completed, the VC pin voltage and the SW pin voltage D in Fig 32.) At this time, produce resonance by the parasitic capacitance and the transformer inductance. (See Time ○ unless the VC pin voltage becomes the GND voltage or less shown, the PowerTr remains OFF till the maximum OFF E in Fig 32.) As soon as the OFF detection voltage or less is reached, the PowerTr is turned time is reached. (See Time ○ G in Fig 32.) The time, t OFF when the secondary-side releases energy is represented by the following ON. (See Time ○ equation:  I t OFF  LS  PEAK V  N P  cap     LS : Secondary-side inductance (5) After the above operations are repeated, if it is detected that the VC pin voltage reaches the full charge detection voltage, the FULL pin is set to "L" and the switching operation is stopped. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 13 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Timing Chart and Description of Operation( about protection function ) Operation stop due to UVLO detection VCC UVLO検出により動作停止 Operation restart due to UVLO release UVLO解除により動作復帰 ヒステリシス Hysteresis UVLO検出電圧 UVLO detection voltage t V(START) t V(VC) Operation stop due to increase of chip temperature チップ温度上昇により動作停止 Operation restart due to decrease of chip temperature チップ温度下降により動作復帰 TSDP t V(cap) Voltage at completion of charge 充電完了電圧 t I(VBAT) t A B C D E F G H I Fig 33. Timing Chart 3: Under Protective Circuit Operation ■Protection Functions ◆UVLO If the VCC voltage is reduced to the UVLO detection voltage specified in the electrical characteristics or less, the C and ○ E in Fig 33.) UVLO protective circuit is activated and the charging operation temporarily stops. (See Time ○ After that, when the VCC voltage becomes the UVLO release voltage or more, the charging operation automatically D and ○ F in Fig 33.) restarts. (See Time ○ This UVLO also works for the IGBT_OUT pin. If the VCC voltage becomes the UVLO detection voltage or less, the IGBT_OUT voltage is forced to be set to "L". ◆Thermal Shut Down (TSD) It protects the IC against thermal runaway due to excessive temperature rise (Tj>175°C [TYP]). After detection, the G in Fig 33.), and when the chip temperature decreases, (Tj (Pin A) in the case of the resistor, and when GND > (Pin B) in the case of the transistor (NPN) Also, a parasitic NPN transistor operates by the N layer of another element adjacent to the previous diode in the case of a transistor (NPN) when GND > (Pin B). The parasitic element consequently emerges through the potential relationship because of IC’s structure. The parasitic element pulls interference out of the circuit which may be the cause of malfunction or destruction. Therefore, excessive caution is required to avoid operation of the parasitic element which is caused by applying voltage to an input pin lower than GND (P board), etc. Resistor ~ ~ Transistor (NPN) B (Pin B) C E ~ ~ (Pin A) GND N P P+ P+ P P+ N P+ N N N N N P substrate P substrate GND GND Parasitic Parasitic element Element (Pin B) ~ ~ (Pin A) ~ ~ B Parasitic element C E GND GND Parasitic Fig 47. Other adjacent elements www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 24 element TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ◆VC pin minus voltage When Power transistor is active, VC pin occur minus voltage with formula (2) at figure 32 between B to C page12.Please set up transformer ratio not to over absolute voltage -0.6V. ◆SW pin AC pulse input voltage Please set up to transformer ratio not to reach 53V AC pulse of SW pin voltage. ◆SW pin minus voltage When transformer secondary side current is discharged, discharge current is not zero at FRD recovery time. SW pin minus voltage is occurred by SW pin minus current that is occurred by transformer ratio. (fig 48 Ⓐ→Ⓑ、Ⓓ→Ⓔ、Ⓖ→Ⓗ、Ⓙ→Ⓚ)。 Please set up SW pin minus voltage is not under -1.5V because it might cause malfunction of IC. START V(SW) 0VA I(SW) 0A トランス 2次側 0A 電流 A B C D E G H F I J K Fig 48. SW pin minus voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 25 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 BD4233NUX ●Heat reduction characteristics Reduced by 12.32 mW/°C at Ta=25°C or more 1.8 1.6 1.4 1.2 Pd(W) 1 0.8 0.6 0.4 0.2 0 0 25 50 75 Ta(℃) 100 125 150 Fig 49. Heat reduction characteristics (VSON010V3020) ●Ordering part number Fig 50. Selecting a model name when ordering. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 26 TSZ02201-0Q2Q0J400010-1-2 11.Sep.2013 Rev.003 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001
BD4233NUX-E2 价格&库存

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BD4233NUX-E2
    •  国内价格 香港价格
    • 1+21.930601+2.72048
    • 10+5.6801510+0.70462
    • 50+4.1080450+0.50960
    • 100+3.58664100+0.44492
    • 500+3.23903500+0.40180
    • 1000+3.167931000+0.39298
    • 2000+3.112632000+0.38612
    • 4000+3.073134000+0.38122

    库存:100

    BD4233NUX-E2
      •  国内价格
      • 5+17.10969
      • 10+10.95021
      • 50+9.32478
      • 100+7.61382
      • 200+7.20318
      • 500+6.15094

      库存:800

      BD4233NUX-E2
      •  国内价格 香港价格
      • 4000+6.057764000+0.75147
      • 8000+5.751118000+0.71343
      • 12000+5.5964712000+0.69424

      库存:4000

      BD4233NUX-E2
      •  国内价格 香港价格
      • 1+20.764951+2.57589
      • 10+13.0532910+1.61926
      • 25+11.0297025+1.36823
      • 100+8.74524100+1.08485
      • 250+7.62267250+0.94559
      • 500+6.93236500+0.85996
      • 1000+6.354101000+0.78823

      库存:4000