Power LSI series for Digital Camera and Digital Video Camera
Strobe Charge Control IC
BD4233NUX
●Key Specifications
●Outline
The strobe charge IC is a self-oscillating switching
regulator that uses a transformer. It provides highly
efficient applications for charging capacitors in sets with
various strobes.
・SW pin input range:
48V
・SW pin peak current:
0.5A±20%
・Full charge detection voltage DC:
1.0V±1.1%
・Full charge detection voltage AC 200nsec:1.0V-1.1%~1.35%
・Full charge detection voltage AC 100nsec: 1.0V-1.1%~1.6%
・Vth(START,IGBT_AN)
0.6V~1.5V
●Features
1) Built-in lowVth48V DMOS
2) Adjustable transformer primary-side peak current
by RADJ pin
3) Charging control switching with the START pin
4) Includes high precision full charge voltage
detection circuit and output pin
5) Various built-in protective circuits (TSD, UVLO,
SDP)
6) Built-in IGBT driver
●Package
3.0mm×2.0mm×0.6mm VSON010X3020
●Use
Digital still cameras、Mobile Phone
●Recommended Application Circuit
RFU02VS8S(ROHM)
P
Battery
VCC
S
Cmain
80μF
300V
22μF
4.7μF
VCC
VCC
SW
5
Controller
10
VCC
STB
IGBT
START
VREF
UVLO
UVLO
6
START
STB
OSC
OFF
ON
TSD
UVLO
R
FULL
CLK Q
TSD
TSD
Xenon
SDP
STB
UVLO
TSD
VCC
LOGIC
OFF
PGND
SQ
MAX OFF
DRIVER
R
R
SDP
8
SDP
+
-
ON
1
PGND
RFB1=470kΩ
I/V
47kΩ
FULL
OSC
ENABLE
S Q
MAX ON
RADJ
OSC
OS
FULL
Q
R
9
+
-
S
4
OS
OFF
+
-
VC
(
3
)
RFB2=1.62kΩ
GND
VCC
STB
IGBT_IN
2
7
IGBT_OUT
68Ω
IGBT_IN
IGBT
10kΩ
IGBT
CY25BAH-8F
ルネサス テクノロジ
Fig.1 Application circuit
○Products:Silicon monolithic IC ○This product is not designed for normal operation with in a radioactive
Status of this document
The Japanese version of this document is the official specification. Please use the translation version of this document as a reference to expedite understanding of the official version.
If these are any uncertainty in translation version of this document, official version takes priority.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
1
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Pin Description
●package
SON 10pin package VSON010X3020
(2.0mm×3.0mm×0.6mm)
Pin No. Pin Name
1
PGND
2
IGBT_OUT
2.0±0.1
0.5±0.1
0.4±0.1
1
10
2
9
3
4
8
0.25 +0.05
-0.04
7
5
0.64±0.1
CO.2
6
(UNIT:mm)
Function
Power GND
IGBT Driver output pin
3
GND
GND pin
4
VC
Full charge detection pin
5
VCC
VCC supply pin
6
START
Charge start signal input pin
7
IGBT_IN
IGBT Driver output start signal input pin
8
RADJ
Ipeak current control setting pin
9
FULL
Full charge detection signal output pin
10
SW
Switching pin
2.39±0.1
Fig.2
●Block Diagram
VCC
SW
5
10
VCC
STB
VREF
IGBT
UVLO
UVLO
OSC
OSC
TSD
TSD
OS
START
6
START
STB
ENABLE
S Q
R
FULL
SDP
STB
UVLO
TSD
MAX ON
OSC
OFF
ON
TSD
UVLO
RADJ
CLK Q
VCC
LOGIC
OFF
PGND
SQ
MAX OFF
DRIVER
R
R
SDP
8
SDP
+
-
ON
1 PGND
I/V
FULL
Q
R
FULL 9
+
-
S
4
OS
OFF
+
-
VC
3
GND
VCC
STB
2
IGBT_IN 7
IGBT_OUT
IGBT_IN
IGBT
Fig.3
●Absolute maximum ratings (Ta=25℃)
●Operating condition
Parameter
Symbol
Rating
Unit
Parameter
Symbol
VCC supply voltage
VCC
-0.3~7
V
VCC supply voltage range
SW pin
VSW
48
V
VC pin
VC pin
VC
-0.6~7
V
START Input pin voltage range
START pin
START
-0.3~7
V
FULL pin
FULL
-0.3~7
V
FULL Input pin voltage range
IGBT_IN pin
IGBT_IN
-0.3~7
V
Topr
-35~+85
SW pin current
Operating temperature range
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
150
℃
Power dissipation
Pd
1540
mW
Rating
Unit
VCC
2.5~5.5
V
VC
-0.6~VCC
V
VSTART
0~VCC
V
0~VCC
V
VFULL
0~5.5
V
ISW
0.5~2
A
IGBT_IN Input pin voltage range VIGBT_IN
Table 2. Operating Conditions
Table 1. Absolute Maximum Ratings
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
2
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics
(Unless specified, Ta=25℃, VCC=V(START)=3.4V,V(IGBT_IN)=0V
Parameter
Symbol
Limit
Unit
Min.
Typ.
Max.
Conditions
[Overall device]
VCC circuit current
Circuit current standby
operation
[Standby control START pin]
ICC
-
1.5
3
mA
ISTB
-
-
1
μA
START pin high voltage H1
VSTH
1.5
-
-
V
START pin high voltage H2
VSTH
1.3
-
-
V
START pin low voltage
VSTL
-
-
0.6
V
ISTART
12
24
36
μA
START=3.4V
Input bias current
START=0V
[Transformer primary-side driver block]
SW pin leak current
ISWL
-
-
1
μA
SW=48V
SW pin peak current
IPEAK
0.4
0.5
0.6
A
RADJ=100kΩ
SW saturation voltage
VSAT
-
0.2
0.4
V
ISW=0.5A
RADJ adjustable range
RADJ
33
-
100
kΩ
Max on time
TONMAX
25
50
100
μs
Max off time
TOFFMAX
12.5
25
50
μs
-
-
1
μA
1
1.011
V
1
1.0135
V
VC=200ns pulse input→FULL=H→L
1
1.0160
V
VC=100ns pulse input→FULL=H→L
1
2
kΩ
VC=VCC,FULL=0.5V
[Charging control block]
[Transformer secondary-side detection block]
VC pin input current
Full charge detection voltage
Full charge detection voltage
AC1
Full charge detection voltage
AC2
FULL pin ON resistor
FULL pin leak current
IVC
VFULLTH 0.989
VFULLTH_
0.9890
AC1
VFULLTH_
0.9890
AC2
RFULLL
0.5
VC=VCC
IFULLL
-
-
1
μA
FULL=3.4V
VUVLOTH
1.95
2.1
2.25
V
VCC detection
VUVLOHYS
120
200
280
mV
Output short high current
Ioso
90
140
200
mA
IGBT_IN=3.4V,START=0V,IGBT_OUT=0V
Output short low current
IGBT_IN input high voltage
Range H1
IGBT_IN input high voltage
range H2
IGBT_IN input high voltage
range
IGBT_IN sink current
Iosi
30
60
90
mA
IGBT_IN=0, START=0V,IGBT_OUT=3.4V
VIGBTH1
1.5
-
-
V
START=0V
VIGBTH2
1.3
-
-
-
START=0V,VCC =2.5V~5.5V
Ta=-25℃~85℃
VIGBTL
-
-
0.6
V
START=0V
IIGBT_IN
12
24
36
μA
START=0V
IGBT_IN response time Rise
Tres_rise
-
15
80
ns
IGBT_IN→IGBT_OUT response time
(rise)
IGBT_IN response time Fall
Tres_fall
-
60
200
ns
IGBT_IN→IGBT_OUT response time
(fall)
[Protection circuit block]
UVLO detect voltage
UVLO hysteresis
[IGBT driver block]
Table 3.
○This product is not designed for normal operation within a radioactive environment.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
3
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
0.5
3.0
0.4
2.4
0.3
1.8
ICC [mA]
ICC [uA]
●Electrical characteristics data (1)
0.2
Ta=25℃
Ta=-35℃
0.1
Ta=85℃
Ta=25℃
Ta=-35℃
1.2
Ta=85℃
0.6
0.0
0.0
0
1.1
2.2
3.3
4.4
5.5
0
1.1
VCC [V]
3.3
4.4
5.5
4.4
5.5
VCC [V]
Fig.5 Circuit Current
(pwr_tr_on)
Fig.4 Circuit Current
(Standby Condition)
3.0
1.0
2.4
0.8
Ta=85℃
Ta=25℃
Ta=85℃
1.8
0.6
1.2
ICC [mA]
ICC [mA]
2.2
Ta=-35℃
0.6
Ta=25℃
Ta=-35℃
0.4
0.2
0.0
0.0
0
1.1
2.2
3.3
4.4
5.5
0
VCC [V]
2.2
3.3
VCC [V]
Fig.6 Circuit Current
(pwr_tr_off)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
1.1
Fig.7 Circuit Current - VCC
(IGBTDRV=ON)
4
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (2)
3.0
3.0
VCC=5.5V
2.4
2.4
VCC=5.5V
VCC=3.4V
ICC [mA]
ICC [mA]
1.8
VCC=2.3V
1.2
0.6
1.8
VCC=3.4V
1.2
VCC=2.3V
0.6
0.0
0.0
-50
-25
0
25
50
75
100
-50
-25
0
Temp [°C]
75
100
3.0
2.5
2.5
2.0
2.0
1.5
1.5
SW [V]
SW [V]
3.0
Ta=85℃
Ta=85℃
1.0
Ta=85℃
Ta=25℃
Ta=25℃
Ta=-35℃
0.5
50
Fig.9 Circuit Current – Temp
(pwr_tr_off)
Fig.8 Circuit Current – Temp
(pwr_tr_on)
1.0
25
VCC [V]
0.5
Ta=25℃
Ta=-35℃
Ta=-35℃
0.0
0.0
0
0.5
1
1.5
2
2.5
0
3
1
1.5
2
2.5
3
VCC [V]
VCC [V]
Fig.10 VCC UVLO Check
(Detect)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
0.5
Fig. 11 VCC UVLO Check
(Release)
5
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (3)
36.0
3.6
30.0
3.0
Ta=85℃
Ta=85℃
24.0
Ta=25℃
Ta=-35℃
2.4
18.0
FULL [V]
START [uA]
Ta=25℃
Ta=-35℃
12.0
1.8
1.2
0.6
6.0
0.0
0.0
0
1.1
2.2
0
3.3
1.1
2.2
3.3
START [V]
START [V]
Fig.13 Start Threshold Voltage
Fig.12 START Input Current
4.0
0.3
Ta=85℃
3.2
0.2
Ta=25℃
FULL [uA]
0.1
ICC [mA]
2.4
Ta=-35℃
1.6
Ta=-35℃
Ta=25℃
Ta=85℃
0.0
-0.1
0.8
-0.2
0.0
0
1.1
VCC [V]
2.2
0
3.3
2.2
3.3
FULL [V]
Fig.14 FULL Sink Current
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
1.1
Fig. 15 FULL Pin Leak Current
6
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (4)
4.0
1.0
Ta=85℃
3.2
0.8
Ta=25℃
Ta=-35℃
Ta=85℃
0.6
Ta=25℃
SW [uA]
SW [V]
2.4
1.6
Ta=-35℃
0.4
0.8
0.2
0.0
0.0
0
0.5
1
1.5
Ta=25℃ Ta=85℃
Ta=-35℃
0
2
10
20
40
50
Fig.17 SW Leak Current
Fig.16 SAT Voltage
40.0
75.0
60.0
30.0
VCC=3.4V
VCC=3.4V
OFF Time [us ]
Time [us ]
30
SW [V]
SW [A]
20.0
10.0
45.0
30.0
15.0
0.0
0.0
-50
-25
0
25
50
75
100
-50
Temp [°C ]
0
25
50
75
100
Temp [°C]
Fig.18 START Delay Time
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
-25
Fig. 19 MAX OFF Time
7
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (5)
35.0
36.0
30.0
VCC=3.4V
28.0
Ta=85℃
24.0
Ta=25℃
ICC [mA]
ON Time [us]
21.0
14.0
18.0
Ta=-35℃
12.0
7.0
6.0
0.0
0.0
-50
-25
0
25
50
75
0
100
Temp [°C]
1.1
2.2
3.3
VCC [V]
Fig.21 IGBT_IN Input Current
Fig.20 MAX ON Time
3.6
80.0
3.0
60.0
IGBT_OUT [mA]
IGBT_OUT [V]
2.4
Ta=85℃
1.8
40.0
Ta=25℃
Ta=-35℃
1.2
Ta=85℃
Ta=25℃
Ta=-35℃
20.0
0.6
0.0
0.0
0
1.1
2.2
3.3
0
IGBT_IN [V]
2.2
3.3
IGBT_OUT [V]
Fig.22 IGBT_IN Threshold Voltage
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
1.1
Fig. 23 IGBT_OUT Sink Current
8
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (6)
25.0
180.0
20.0
VCC=3.4V
15.0
Time [ns ]
IGBT_OUT [mA]
135.0
90.0
Ta=85℃
Ta=25℃
45.0
10.0
5.0
Ta=-35℃
0.0
0.0
0
1.1
2.2
-50
3.3
-25
0
IGBT_OUT [V]
50
75
100
Fig.25 IGBT Response time Rise1
(START=0)
Fig.24 IGBT_OUT Source Current
0.3
75.0
60.0
0.2
VCC=3.4V
0.1
VC [uA]
45.0
Time [ns ]
25
Temp [°C ]
30.0
-0.1
0.0
-0.2
-25
0
25
50
75
0
100
Ta=85℃
1.1
2.2
3.3
VC [V]
Temp [°C ]
Fig.27 VC Input Current
Fig.26 IGBT Response time Fall1
(START=0)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Ta=25℃
0.0
15.0
-50
Ta=-35℃
9
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Electrical characteristics data (7)
1.5
200.0
VCC=3.4V
100.0
VC Threshold [mV]
VC-FULL Threshold [V]
1.2
0.9
0.6
VCC=3.4V
0.0
-100.0
0.3
0.0
-200.0
-50
-25
0
25
50
75
100
-50
Temp [°C ]
Fig.28 VC FULL Threshold Voltage vs TEMP
( Monitor FULL, sweep VC from –0.2 to 0.2 )
-25
0
25
50
Temp [°C ]
75
100
Fig. 29 VC OFF Threshold Voltage vs TEMP
( Monitor SW, sweep VC from –0.2 to 0.2 )
2.0
RADJ=33kΩ
Ipeak [A ]
1.5
1.0
RADJ=62kΩ
0.5
RADJ=100kΩ
0.0
-50
-25
0
25
50
75
100
temp [℃ ]
Fig. 30 ICOMP Peak Current
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
10
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Timing Chart and Description of Operation
V(START)
(VENABLE)
V(FULL)
V(CAP)
Voltage at Completion
of Charge
充電完了電圧
V(IGBT_IN)
V(IGBT_OUT)
A
B
C D E
F
I
G H
J
Fig 31. Timing Chart 1: Overall Operation
■Charge start/stop
A and ○
C in Fig 31.). In order to
In this IC, a charging operation starts when the START pin is set to "H" (See Time ○
A to ○
B , ○
C to○
I in Fig 31.) If any of
maintain the charging operation, the START pin must be set to "H". (See Time ○
the conditions ① to ③ are satisfied, the charging operation stops.
① The START pin is set to "L".
F in Fig 31.)
② Charging is completed. The VC pin voltage reaches the specified voltage. (See Time ○
③ The protective circuit is activated (See Fig 33 and the Protective Circuit.)。
To re-charge, set the START pin to "L", and the FULL pin is changed from “L” to “H”. Also, if the CHARGE_ON pin is
C in Fig 31.)
changed from "L" to "H" again, the charging operation re-starts. (See Time ○
■IGBT driver
Set the IGBT_IN pin to "H" when the IGBT driver satisfies the following 4 conditions. The "H" signal is output to the
G and ○
J in Fig 31.)
IGBT_OUT pin. (See Time ○
①
The VCC voltage is the UVLO release voltage or more.
②
The FULL pin is set at "L".
③
Even if the IGBT_IN pin is set to "H" while the START pin is set to "H", the IGBT_OUT pin remains at "L"
and no light flashes.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
11
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Timing Chart and Description of Operation
VCC
V(START)
I(SW)
ON
Ipeak
OFF
ON
OFF
ON
ON
2次側ピーク電流
Secondary-side
current
V(SW)
VBAT
ADJ
V(VC)
満充電電圧
Full charge
voltage
Maximum
OFF time
最大OFF時間
GND
OFF detection
voltage
OFF検出電圧
-VBAT
V(CAP)
満充電電圧
Full charge
voltage
V (FULL)
A
B
C
D
E
F
G
H
I
J
K
L
Fig 32. Timing Chart 2: Switching Operation
■Charging operation
The switching operation of this IC is shown in Fig.32 Timing Chart 2.
A →○
B .)
If the START pin is set to "H", all internal circuits are reset , the internal PowerTr is turned ON. (See Fig 32. Time ○
While the internal PowerTr is turned ON, a current is passed into the SW pin. When the current specified at the RADJ pin
c in Fig 32.) The time tON when the PowerTr is ON is
voltage is reached, the PowerTr is turned OFF. (See Time ○
indicated as follows:
LP: Transformer primary-side inductance value
I
I PEAK : Primary-side peak current
(1)
t ON LP PEAK
VBAT : Battery voltage
V
BAT
When the PowerTr is turned OFF, the magnetic energy stored in the transformer is released to the transformer
secondary-side. While the energy is released, the VC pin voltage and the SW pin voltage indicated by the following
equations are generated:
V (VC ) (VBATV ・Np)
V (VC ) (Vcap+Vdiode )
V (SW )
Vcap
NP
( RFB 2 // RFB 3 )
RFB 2
VBAT
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
RFB1 ( RFB 2 // RFB3 ) (2)
RFB1 RFB 2
(3)
(4)
12
V(VC) : Full charge detection voltage
Vcap : Main capacitor voltage
Vdiode: Diode forward voltage
V(SW): SW pin voltage
NP: S winding vs. P winding Winding ratio
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
When the energy release to the transformer secondary-side is completed, the VC pin voltage and the SW pin voltage
D in Fig 32.) At this time,
produce resonance by the parasitic capacitance and the transformer inductance. (See Time ○
unless the VC pin voltage becomes the GND voltage or less shown, the PowerTr remains OFF till the maximum OFF
E in Fig 32.) As soon as the OFF detection voltage or less is reached, the PowerTr is turned
time is reached. (See Time ○
G in Fig 32.) The time, t OFF when the secondary-side releases energy is represented by the following
ON. (See Time ○
equation:
I
t OFF LS PEAK
V N
P
cap
LS : Secondary-side inductance
(5)
After the above operations are repeated, if it is detected that the VC pin voltage reaches the full charge detection voltage,
the FULL pin is set to "L" and the switching operation is stopped.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
13
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Timing Chart and Description of Operation( about protection function )
Operation stop due to UVLO detection
VCC
UVLO検出により動作停止
Operation restart due to UVLO release
UVLO解除により動作復帰
ヒステリシス
Hysteresis
UVLO検出電圧
UVLO detection
voltage
t
V(START)
t
V(VC)
Operation stop due to increase
of chip temperature
チップ温度上昇により動作停止
Operation
restart due to decrease of chip temperature
チップ温度下降により動作復帰
TSDP
t
V(cap)
Voltage at completion
of charge
充電完了電圧
t
I(VBAT)
t
A
B C
D
E
F
G
H
I
Fig 33. Timing Chart 3: Under Protective Circuit Operation
■Protection Functions
◆UVLO
If the VCC voltage is reduced to the UVLO detection voltage specified in the electrical characteristics or less, the
C and ○
E in Fig 33.)
UVLO protective circuit is activated and the charging operation temporarily stops. (See Time ○
After that, when the VCC voltage becomes the UVLO release voltage or more, the charging operation automatically
D and ○
F in Fig 33.)
restarts. (See Time ○
This UVLO also works for the IGBT_OUT pin. If the VCC voltage becomes the UVLO detection voltage or less, the
IGBT_OUT voltage is forced to be set to "L".
◆Thermal Shut Down (TSD)
It protects the IC against thermal runaway due to excessive temperature rise (Tj>175°C [TYP]). After detection, the
G in Fig 33.), and when the chip temperature decreases, (Tj (Pin A) in the case of the resistor, and when GND > (Pin B) in the
case of the transistor (NPN)
Also, a parasitic NPN transistor operates by the N layer of another element adjacent to the previous diode in the case of a
transistor (NPN) when GND > (Pin B).
The parasitic element consequently emerges through the potential relationship because of IC’s structure. The parasitic
element pulls interference out of the circuit which may be the cause of malfunction or destruction. Therefore, excessive
caution is required to avoid operation of the parasitic element which is caused by applying voltage to an input pin lower than
GND (P board), etc.
Resistor
~
~
Transistor (NPN)
B
(Pin B) C
E
~
~
(Pin A)
GND
N
P
P+
P+
P
P+
N
P+
N
N
N
N
N
P substrate
P substrate
GND
GND
Parasitic
Parasitic element
Element
(Pin B)
~
~
(Pin A)
~
~
B
Parasitic element
C
E
GND
GND
Parasitic
Fig 47. Other adjacent elements
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
24
element
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
◆VC pin minus voltage
When Power transistor is active, VC pin occur minus voltage with formula (2) at figure 32 between B to C page12.Please
set up transformer ratio not to over absolute voltage -0.6V.
◆SW pin AC pulse input voltage
Please set up to transformer ratio not to reach 53V AC pulse of SW pin voltage.
◆SW pin minus voltage
When transformer secondary side current is discharged, discharge current is not zero at FRD recovery time. SW pin minus
voltage is occurred by SW pin minus current that is occurred by transformer ratio. (fig 48 Ⓐ→Ⓑ、Ⓓ→Ⓔ、Ⓖ→Ⓗ、Ⓙ→Ⓚ)。
Please set up SW pin minus voltage is not under -1.5V because it might cause malfunction of IC.
START
V(SW)
0VA
I(SW)
0A
トランス
2次側 0A
電流
A B
C
D E
G H
F
I
J
K
Fig 48. SW pin minus voltage
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
25
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
BD4233NUX
●Heat reduction characteristics
Reduced by 12.32 mW/°C at Ta=25°C or more
1.8
1.6
1.4
1.2
Pd(W)
1
0.8
0.6
0.4
0.2
0
0
25
50
75
Ta(℃)
100
125
150
Fig 49. Heat reduction characteristics (VSON010V3020)
●Ordering part number
Fig 50. Selecting a model name when ordering.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
26
TSZ02201-0Q2Q0J400010-1-2
11.Sep.2013 Rev.003
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001