BD4271FP2-CE2

Datasheet LDO Regulators with Watchdog Timer and Voltage Detector 550 mA Output LDO Regulator with WDT and Voltage Detector BD4271xxx-C Series General Description Key Specifications AEC-Q100 qualified (Note 1) Qualified for Automotive Applications Wide Temperature Range (Tj): -40 °C to +150 °C Wide Operating Input Range: -0.3 V to +45 V Low Quiescent Current: 75 µA (Typ) Output Load Current: 550 mA Output Voltage: 5.0 V (Typ) ± 2 % Reset Detection Voltage Accuracy: 4.53 V to 4.77 V 4.65 V (Typ) ◼ Enable input ◼ Over Current Protection (OCP) ◼ Thermal Shutdown (TSD) BD4271xxx-C Series are automotive voltage regulators with watchdog timer and offers the output current of 550 mA while limiting the quiescent current low. A logical “HIGH” at the CTL pin enables the LDO regulator and “LOW” disables the LDO regulator and keeps current consumption low. A reset signal is generated for an output voltage V O of Typ 4.65 V. The reset delay time and watchdog time (WDT) can be programmed by the external capacitor. ◼ ◼ ◼ ◼ ◼ ◼ ◼ ◼ (Note1: Grade 1) Features ◼ ◼ ◼ ◼ Low ESR ceramic capacitors applicable for output Low drop voltage: PDMOS output transistor Power on and under-voltage reset Programmable reset delay and watchdog time by external capacitor Packages ◼ HFP: HRP7 ◼ FP2: TO263-7 ◼ EFJ: HTSOP-J8 W (Typ) x D (Typ) x H (Max) 9.395 mm x 10.540 mm x 2.005 mm 10.00 mm x 14.95 mm x 4.50 mm 4.9 mm x 6.0 mm x 1.0 mm Applications ◼ Onboard Vehicle Device (Engine ECU, Body-control, Car Stereos, Satellite HRP7 Navigation System, etc.) TO263-7 HTSOP-J8 Typical Application Circuit CIN ≥ 0.1 µF, CCT = 0.001 µF to 10 µF, CO ≥ 6 µF VCC CTL CIN 〇Product structure : Silicon integrated circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 RO GND CT CLK CCT VO CO 〇This product has no designed protection against radioactive rays. 1/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Pin Configurations (BD4271HFP-C, BD4271FP2-C) TO263-7 (TOP VIEW) HRP7 (TOP VIEW) FIN FIN 1 2 3 4 5 6 7 1 2 3 4 5 6 7 Pin Description (BD4271HFP-C, BD4271FP2-C) Pin No. Pin Name Function 1 VCC Input 2 CTL Output control 3 RO Reset output 4 GND 5 CT 6 CLK Input CLK from Microcomputer 7 VO Output FIN GND Ground Ground Setting Reset Delay Time and WDT time Pin Configuration (BD4271EFJ-C) HTSOP-J8 (TOP VIEW) 8 1 7 2 EXP-PAD 3 6 5 4 Pin Description (BD4271EFJ-C) Pin No. Pin Name Function 1 VCC Input 2 CTL Output control 3 N.C No Connection(Note 1) 4 RO Reset output 5 GND Ground 6 CLK Input CLK from Microcomputer 7 CT Setting Reset Delay Time and WDT time 8 VO Output EXP-PAD EXP-PAD No Connection(Note 2) (Note 1) This pin is not connected to the chip. It can keep open or it’s also possible to connect to GND. If Pin No.3 is shorted to GND, Pin No.3 will be adjacent to Pin No.2 CTL and Pin No.4 RO on the board layout. If adjacent pins are expected to be shorted, please confirm if there is any problem with the actual application. (Note 2) It is recommended to connect the EXP-PAD to the GND pattern to improve heat dissipation. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Block Diagram VCC VO TSD Error Amplifier CTL OCP Reference VO CT RO Control Reference UVLO CLK GND Block Descriptions Block Name Function TSD Thermal shutdown protection Reference Reference voltage OCP Over current protection The OCP protects the device from damage caused by over current. UVLO Under voltage lock out The UVLO prevents malfunction of the reset block in case of very low output voltage. Error Amplifier Error amplifier Control RESET + WDT time control www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Description of Blocks The TSD protects the device from overheating. If the chip temperature (Tj) reaches ca. 175 °C (Typ), the output is turned off. The Reference generates the Reference Voltage. The Error Amplifier amplifies the difference between the feedback voltage of the output voltage and the reference voltage. The reset delay time and watchdog time can be programmed. 3/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Absolute Maximum Ratings Parameter Symbol Ratings Unit Supply Voltage VCC -0.3 to +45.0 V Output Control Voltage VCTL -0.3 to +45.0 V RO Voltage VRO -0.3 to +7.0 (≤ VO + 0.3) V Output Voltage VO -0.3 to +7.0 V VCLK -0.3 to VO + 0.3 V Junction Temperature Range Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C CLK Voltage Maximum Junction Temperature Caution: Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Voltage (IO ≤ 300 mA) VCC 5.5 45.0 V Supply Voltage (IO ≤ 550 mA) VCC 6.0 45.0 V Output Control Voltage VCTL 0 45.0 V Start -Up Voltage (Note 1) VCC 3.0 － V Output Current IO 0 550 mA Operating Ratings Temperature Ta -40 +125 °C (Note 1) When IO = 0 mA. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) θJA 96.0 22.0 °C/W ΨJT 6 2 °C/W HRP7 Junction to Ambient Junction to Top Characterization Parameter (Note 2) TO263-7 Junction to Ambient Junction to Top Characterization Parameter θJA 80.7 20.3 °C/W (Note 2) ΨJT 8 2 °C/W θJA 131.7 33.0 °C/W (Note 2) ΨJT 12 5 °C/W HTSOP-J8 Junction to Ambient Junction to Top Characterization Parameter (Note 1) Based on JESD51-2A (Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm Φ0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Electrical Characteristics (LDO) (Unless otherwise specified, Tj = -40 °C to +150 °C, VCC = 13.5 V, VCTL = 5 V, IO = 0 mA, the typical value is defined at Tj = +25 °C) Parameter Symbol Limit Min Typ Max Unit Conditions Circuit Current ICC － 75 150 μA Standby Current IST － 2.0 9.0 μA Output Voltage VO 4.90 5.00 5.10 V Output Voltage VO 4.90 5.00 5.10 V Dropout Voltage ΔVd － 0.2 0.5 V Ripple Rejection R.R. － 60 － dB Line Regulation Reg.I -30 － 30 mV 8 V ≤ VCC ≤ 16 V Load Regulation Reg.L － 10 40 mV 10 mA ≤ IO ≤ 300 mA TSD － 175 － °C Tj at TSD ON Over Current Protection IO 550 － － mA CTL ON Mode Voltage VthH 2.7 － － V Active Mode CTL OFF Mode Voltage VthL － － 0.8 V Off Mode CTL Input Current ICTL － 15 30 µA VCTL = 5 V Thermal Shutdown www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/31 IO = 0 mA VCTL = 0 V Tj ≤ 125 °C 6 V ≤ VCC ≤ 40 V 0 mA ≤ IO ≤ 300 mA 8 V ≤ VCC ≤ 26 V IO ≤ 550 mA VCC = 4.75 V IO = 300 mA f = 120 Hz, ein = 1 Vrms IO = 100 mA TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Electrical Characteristics (Reset, WDT Function) (Unless otherwise specified, Tj = -40 °C to +150 °C, VCC = 13.5 V, VCTL = 5 V, IO = 0 mA, the typical value is defined at Tj = +25 °C) Parameter Symbol Limit Unit Conditions Min Typ Max VRT 4.53 4.65 4.77 V － VRHYS 25 60 100 mV － Reset Pull-up Resistance RRO 18 30 46 kΩ － Reset Low Voltage VRO － － 0.4 V － CT Upper-side Threshold VCT_H － 1.80 － V － CT Lower-side Threshold VCT_L － 0.45 － V － CT Charge Current ICT_C － 16 － μA VCT = 0.15 V CT Discharge Current ICT_D － 3 － μA VCT = 1.35 V td 8 11.5 16 ms CCT = 0.1 μF (Note 1) WDT Monitor Time tWH 30 45 66 ms CCT = 0.1 μF (Note 1) WDT Reset Time tWL 5 9 15 ms CCT = 0.1 μF (Note 1) WDT OFF threshold Voltage VHCLK VO x 0.8 － VO V WDT ON threshold Voltage VLCLK 0 － VO x 0.3 V CLK is pulled down inside the IC when CLK open. CLK Input Current ICLK 1.5 5 15 μA VCLK = 5 V CLK Input Pulse Width tPCLK 3 － － μs Minimum Operation Voltage VOPR 1 － － V Reset Detection Voltage Reset Detection Hysteresis Delay Time L→H (Note 1) RO < 0.5 V td, tWH, and tWL can be varied by changing the CT capacitance value. (0.001 μF to 10 μF available) td1 (ms) ≈ td (the Delay Time at 0.1 μF) x CCT (μF) / 0.1 for example: when CCT = 1 μF, 80 ms ≤ td ≤ 160 ms tWH1 (ms) ≈ tWH (the WDT Monitor Time at 0.1 μF) x CCT (μF) / 0.1 for example: when CCT = 1 μF, 300 ms ≤ td ≤ 660 ms tWL1 (ms) ≈ tWL (the WDT Reset Time at 0.1 μF) x CCT (μF) / 0.1 for example: when CCT = 1 μF, 50 ms ≤ td ≤ 150 ms td2 (ms) ≈ td (the Delay Time at 0.1 μF) x CCT (μF) / 0.1 ± 0.1 for example: when CCT = 0.01 μF, 0.7 ms ≤ td ≤ 1.7 ms tWH2 (ms) ≈ tWH (the WDT Monitor Time at 0.1 μF) x CCT (μF) / 0.1 ± 0.1 for example: when CCT = 0.01 μF, 2.9 ms ≤ td ≤ 6.7 ms tWL2 (ms) ≈ tWL (the WDT Reset Time at 0.1 μF) x CCT (μF) / 0.1 ± 0.1 for example: when CCT = 0.01 μF, 0.4 ms ≤ td ≤ 1.6 ms www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/31 CT Capacitor: 0.1 μF ≤ CCT ≤ 10 μF CT Capacitor: 0.1 μF ≤ CCT ≤ 10 μF CT Capacitor: 0.1 μF ≤ CCT ≤ 10 μF CT Capacitor: 0.001 μF ≤ CCT < 0.1 μF CT Capacitor: 0.001 μF ≤ CCT < 0.1 μF CT Capacitor: 0.001 μF ≤ CCT < 0.1 μF TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series 6 6 5 5 Output Voltage : VO [V] Output Voltage : VO [V] Typical Performance Curves (Unless otherwise specified, Tj = 25 °C, VCC = 13.5 V, VCTL = 5 V) 4 3 2 Tj = -40 ℃ Tj = 25 ℃ Tj = 125 ℃ 1 4 3 2 Tj = -40 ℃ Tj = 25 ℃ Tj = 125 ℃ 1 0 0 0 10 20 30 40 50 0 2 Supply Voltage : VCC [V] 4 6 8 10 Supply Voltage : VCC [V] Figure 1. Output Voltage vs Supply Voltage (RL = 25 Ω) Figure 2. Output Voltage vs Supply Voltage (RL = 25 Ω) 5.2 1500 Tj = -40 °C Tj = 25 °C 1200 Tj = 150 °C Circuit Current : ICC [μA] Output Voltage : VO [V] 5.1 5.0 4.9 4.8 900 600 300 0 -40 0 40 80 120 160 10 20 30 40 50 Supply Voltage : VCC [V] Junction Temperature : Tj [℃] Figure 3. Output Voltage vs Junction Temperature (RL = 1 kΩ) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 4. Circuit Current vs Supply Voltage 8/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series 150 150 130 120 Circuit Current :ICC [μA] Circuit Current :ICC [μA] Typical Performance Curves - continued 110 90 90 60 30 70 0 50 -40 0 40 80 120 Junction Temperature : Tj [℃] 0 160 100 200 300 400 500 600 Output Current : IO [mA] Figure 6. Circuit Current vs Output Current Figure 5. Circuit Current vs Junction Temperature 6 1200 5 4 Output Current : IO [mA] Output Voltage: VO [V] Tj = -40 °C Tj = 25 °C Tj = 150 °C 3 2 1100 1000 900 1 0 800 0 200 400 600 800 1000 1200 -40 40 80 120 160 Junction Temperature : Tj [℃] Output Current : IO [mA] Figure 8. Output Current vs Junction Temperature Figure 7. Output Voltage vs. Output Current (Over Current Protection) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 9/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Typical Performance Curves - continued 600 6 Tj = -40 °C Tj = 25 °C Tj = 150 °C 5 400 Output Voltage:VO [V] Dropout Voltage : ΔVd [mV] 500 300 200 4 3 2 1 100 0 0 0 100 200 300 400 100 500 120 160 180 Junction Temperature : Tj [℃] Output Current : IO [mA] Figure 10. Output Voltage vs Junction Temperature (Thermal Shutdown) Figure 9. Dropout Voltage vs Output Current (VCC = 4.75 V) 5 6 5 4 CTL Voltage : VCTL [V] Output Voltage : VO [V] 140 4 3 2 Tj = -40 °C Tj = 25 °C 1 3 CTL ON CTL OFF 2 1 Tj = 150 °C 0 0 0 1 2 3 4 5 -40 0 40 80 120 160 CTL Voltage : VCTL [V] Junction Temperature : Tj [℃] Figure 11. Output Voltage vs CTL Voltage Figure 12. CTL Voltage vs Junction Temperature www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Typical Performance Curves - continued 30 4.9 Reset Detection Voltage : VRT [V] CTL Current : ICTL [μA] 25 20 15 10 5 0 -40 0 40 80 120 4.8 VRT++VVRHY VRT RHYS VRT VRT 4.7 4.6 4.5 4.4 160 -40 Junction Temperature : Tj [℃] 40 80 120 160 Junction Temperature : Tj [℃] Figure 14. Reset Detection Voltage vs Junction Temperature Figure 13. CTL Current vs Junction Temperature 6 6 Tj = -40 °C Tj = 25 °C Tj = 150 °C Tj = -40 °C Tj = 25 °C Tj = 150 °C 5 Reset Voltage : VRO [V] 5 Reset Voltage : VRO [V] 0 4 3 2 4 3 2 1 1 0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Output Voltage : VO [V] 4.5 4.6 4.7 4.8 Output Voltage : VO [V] Figure 15. RO Voltage vs Output Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4.4 Figure 16. RO Voltage vs Output Voltage 11/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Typical Performance Curves - continued 2.4 20 2.0 12 CT Voltage : VCT [V] CT Current : ICT [μA] 16 ICTICT_C charge ICTICT_D discharge 8 1.6 VCT_H VCTH 1.2 VCT_L VCTL 0.8 4 0.4 0 0.0 -40 0 40 80 120 160 -40 0 40 80 120 160 Junction Temperature : Tj [℃] Junction Temperature : Tj [℃] Figure 17. CT Current vs Junction Temperature Figure 18. CT Voltage vs Junction Temperature 16 10000 Delay Time L→H : td [ms] Delay Time L→H : td [ms] 1000 14 12 10 100 10 1 0.1 8 -40 0 40 80 120 160 Junction Temperature : Tj [℃] 0.01 0.1 1 10 CT Capacitance : CCT [μF] Figure 19. Delay Time L→H vs Junction Temperature (CCT = 0.1 µF) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.01 0.001 Figure 20. Delay Time L→H vs CT Capacitance 12/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Typical Performance Curves - continued 70 10000 1000 Watchdog Time : tWH, tWL [ms] Watchdog Time : tWH, tWL [ms] 60 50 40 tWH tWH 30 tWL tWL 20 10 0 -40 0 40 80 120 160 10 1 tWH tWH tWL tWL 0.1 0.01 0.001 0.01 0.1 1 10 CT Capacitance : CCT [μF] Junction Temperature : Tj [℃] Figure 22. Watchdog Time vs CT Capacitance Figure 21. Watchdog Time vs Junction Temperature www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 13/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Measurement Circuit FIN FIN VCC CTL RO GND CT CLK VCC VO CTL RO FIN GND CT CLK VO VCC CTL RO GND CT CLK VO IO V 0.1µF 0.1µF 10µF A 0.1µF Measurement setup for Figure 1,2,3,10. 0.1µF CTL RO GND CT CLK VO VCC CTL RO GND 0.1µF 10µF Measurement setup for Figure 7,8. CT RO GND Measurement setup for Figure 6. CLK VO VCC CTL RO CLK VO CT CLK VO V 0.1µF 0.1µF 10µF Measurement setup for Figure 9. 0.1µF VCC CTL RO GND 10µF Measurement setup for Figure 11,12,13. FIN CT GND A IO 0.1µF FIN CTL 10µF FIN V VCC 0.1µF FIN A 0.1µF 0.1µF Measurement setup for Figure 4,5. FIN VCC 10µF FIN CT CLK VCC VO CTL RO GND CT CLK VO V V A V 0.1µF 0.1µF 10µF Measurement setup for Figure 14,15,16. 0.1µF 0.1µF Hz 　 Hz 　 10µF Measurement setup for Figure 17,18. 0.1µF 0.1µF 10µF Measurement setup for Figure 19,20,21,22. Figure 23. Measurement Circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Timing Chart 1. When supply voltage VCC is ON ↔ OFF (Not to input CLK voltage VCLK when output voltage VO = Low) VCC 13.5V 0V VCTL 5V VthH VRO td tWH tWL ≒Vo VCT VCT_H VCT_L VCLK 0V VO VRHYS 5V VRT Figure 24. Timing Chart 1 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Timing Chart – continued 2. When output control voltage VCTL is ON ↔ OFF (Not to input CLK voltage VCLK when output voltage VO = Low) VCC 13.5V VCTL 5V VthH VthL 0V VRO td twH twL ≒Vo VCT VCT_H VCT_L VCLK 0V VO VRHYS 5V VRT Figure 25. Timing Chart 2 The Delay Time ( td ) is estimated roughly by following calculation. t d [s] ≈ VCT_H [V] × CCT [F] ICT_C [A] Basically, verify the Delay Time ( td ) by the ratio of the value at CCT = 0.1 μF specified in datasheet and the actual CCT capacitance used to calculate. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Timing Chart – continued 3. When WDT threshold Voltage VCLK is ON ↔ OFF VCC 13.5V VCTL 5V VthH VRO td twH twL ≒Vo VCT VCT_H VCT_L VCLK tPCLK 5V 0V VO VRHYS 5V VRT Figure 26. Timing Chart 3 The WDT Monitor Time ( tWH ) and the WDT Reset Time ( tWL ) is estimated roughly by following calculation. t WH [s] ≈ |VCT_H − VCT_L |[V] × CCT [F] ICT_D [A] t WL [s] ≈ |VCT_L − VCT_H |[V] × CCT [F] ICT_C [A] Basically, verify the WDT Monitor Time ( tWH ) and the WDT Reset Time ( tWL ) by the ratio of the value at CCT = 0.1 μF specified in datasheet and the actual CCT capacitance used to calculate www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Disable WDT behavior VCC VO CTL RO CIN CO RCT CT_SW CLK GND CT CCT Figure 27. Application Circuit VO 5V CT_SW CT_SW OFF CT_SW ON CT_SW OFF VCT Vo VCT_H VCT_L VRO twH twL Figure 28. Timing Chart 4 By pulling up the CT pin to the VO pin and keeping CT voltage above V CT_H, RO switching and WDT behavior are disabled. However, if under voltage reset is detected with the CT pin pulled up to the VO pin, the circuit that rapidly discharges the CCT electron will operate and current will flow into the CT pin. Therefore, when pulling up the CT pin to the VO pin, the pull up resister must be required between the VO pin and the CT pin for limiting current. Recommended pull up resistance: 10 kΩ ~ 200 kΩ www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Selection of Components Externally Connected ・VCC pin capacitor Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and GND pin. We recommend using ceramic capacitor generally featuring good high frequency characteristic. When selecting a ceramic capacitor, please be consider about temperature and DC-biasing characteristics. Place capacitors closest possible to VCC-GND pin. When input impedance is high, e.g. in case there is distance from battery, line voltage drop needs to be prevented by large capacitor. Choose the capacitance according to the line impedance between the power smoothing circuit and the VCC pin. Selection of the capacitance also depends on the applications. Verify the application and allow sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. ・Output pin capacitor In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend using a ceramic capacitor with a capacitance of 6 μF or higher. In selecting the capacitor, ensure that the capacitance of 6 μF or higher is maintained at the intended applied voltage and temperature range. Due to changes in temperature the capacitor's capacitance can fluctuate possibly resulting in oscillation. In actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic capacitor, we recommend using X7R or better components with excellent temperature and DC-biasing characteristics and high voltage tolerance. In case of the transient input voltage and the load current fluctuation, output voltage may fluctuate. In case this fluctuation can be problematic for the application, connect low ESR capacitor (capacitance > 6 μF, ESR < 1 Ω) in paralleled to large capacitor with a capacitance of 13 μF or higher and ESR of 5 Ω or lower. Electrolytic and tantalum capacitors can be used as large capacitor. When selecting an electrolytic capacitor, please consider about increasing ESR and decreasing capacitance at cold temperature. Place the capacitor closest possible to output pin. 6 Unstable Available Area 5 ESR [Ω] 4 3 Stable Available Area 2 1 0 1 10 100 1000 Output Capacitance : CO [μF] Figure 29. Output Capacitance ESR Available Area -40 °C ≤ Tj ≤ +150 °C, 6 V ≤ VCC ≤ 45 V, VCTL = 5 V, IO = 0 mA to 550 mA www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Power Dissipation ◼ HRP7 10 Power Dissipation: Pd[W] 8 (2) 5.7 W 6 4 2 (1) 1.3 W 0 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Figure 30. HRP7 Package Data ◼ TO263-7 10 8 Power Dissipation: Pd[W] IC mounted on ROHM standard board based on JEDEC. (1) : 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. (2) : 4-layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB: 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, 2 oz. copper. Condition (1): θJA = 96.0 °C/W, ΨJT (top center) = 6 °C/W Condition (2): θJA = 22.0 °C/W, ΨJT (top center) = 2 °C/W (2) 6.16 W 6 4 (1) 1.55 W 2 0 0 25 50 75 100 125 Ambient Temperature: Ta [°C] Figure 31. TO263-7 Package Data www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 150 IC mounted on ROHM standard board based on JEDEC. (1) : 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. (2) : 4-layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB: 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, 2 oz. copper. Condition (1): θJA = 80.7 °C/W, ΨJT (top center) = 8 °C/W Condition (2): θJA = 20.3 °C/W, ΨJT (top center) = 2 °C/W 20/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Power Dissipation – continued ◼ HTSOP-J8 5 (2) 3.79 W Power Dissipation: Pd[W] 4 3 2 (1) 0.95W 1 0 0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] Figure 32. HTSOP-J8 Package Data www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 IC mounted on ROHM standard board based on JEDEC. (1) : 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. (2) : 4-layer PCB (2 inner layers and Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.60 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB: 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, 2 oz. copper. Condition (1): θJA = 131.7 °C/W, ΨJT (top center) = 12 °C/W Condition (2): θJA = 33 °C/W, ΨJT (top center) = 5 °C/W 21/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Thermal Design This product exposes a frame on the back side of the package for thermal efficiency improvement. Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. Refer to power dissipation curves illustrated in Figure 30, 31 and 32 when using the IC in an environment of Ta ≥ 25 °C. Even if the ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range. Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods. 1. The following method is used to calculate the junction temperature Tj. Tj = Ta + PC × θJA Tj Ta PC θJA : Junction Temperature : Ambient Temperature : Power Consumption : Thermal Impedance (Junction to Ambient) 2. The following method is also used to calculate the junction temperature Tj. Tj = TT + PC × ΨJT Tj TT PC ΨJT : Junction Temperature : Top Center of Case’s (mold) Temperature : Power Consumption : Thermal Impedance (Junction to Top Center of Case) The following method is used to calculate the power consumption P C (W). PC = (VCC - VO) × IO + VCC × ICC PC VCC VO IO ICC : Power Consumption : Supply Voltage : Output Voltage : Load Current : Circuit Current ・Calculation Example If VCC = 13.5 V, VO = 5.0 V, IO = 200 mA, ICC = 85 μA, the power consumption PC can be calculated as follows: PC = (VCC - VO) × IO + VCC × ICC = (13.5 V – 5.0 V) × 200 mA + 13.5 V × 85 μA = 1.7 W At the ambient temperature Ta = 85 °C, the thermal impedance (Junction to Ambient) θJA = 22.0 °C/W (4-layer PCB), Tj = Ta + PC × θJA = 85 °C + 1.7 W × 22.0 °C/W = 122.4 °C When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 6 °C/W (1-layer PCB), Tj = TT + PC × ΨJT = 100 °C + 1.7 W × 6 °C/W = 110.2 °C For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Application Examples ・Applying positive surge to the VCC If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between the VCC and GND as shown in the figure below. VCC VO GND ・Applying negative surge to the VCC If the possibility exists that negative surges lower than the GND are applied to the VCC, a Shottky Diode should be place between the VCC and GND as shown in the figure below. VCC VO GND ・Implementing a Protection Diode If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup and shutdown, a protection diode should be placed as shown in the figure below. VCC VO GND ・Reverse Polarity Diode In some applications, the VCC and the VO potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, the accumulated charge in the output pin capacitor flowing backward from the VO to the VCC when the VCC shorts to the GND. In order to minimize the damage in such case, use a capacitor with a capacitance less than 1000 μF. Also by inserting a reverse polarity diode in series to the VCC, it can prevent reverse current from reverse battery connection or the case. When the point A is short-circuited GND, if there may be any possible case point B is short-circuited to GND, we also recommend using a bypass diode between the VCC and the VO. Bypass Diode Reverse Polarity Diode A VCC B www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VO GND 23/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series I/O Equivalence Circuits (Note 1) VCC CTL VCC CTL 340 kΩ IC IC RO 5 kΩ 370 kΩ 370 kΩ 140 kΩ 140 kΩ CT VO VO VO 30 kΩ 1 kΩ 0.1 kΩ RO CT 50 kΩ CLK VO VO VO VCC VO 50 kΩ CLK 10 kΩ 1550 kΩ Reset IC Block 1000 kΩ 525 kΩ (Note 1) Resistance value is Typical. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the Pd rating. Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Operational Notes – continued 10. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: ○ The P/N junction functions as a parasitic diode when the GND > pin A for the resistor, or the GND > pin B for the transistor. ○ Also, when the GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the other adjacent elements to operate as a parasitic NPN transistor. Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (P substrate) GND. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Pin B B Parasitic Elements GND GND N Region close-by 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Thermal Shutdown Circuit (TSD) This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Ordering Information B D 4 2 7 1 Part Number x x x Package HFP: HRP7 FP2: TO263-7 EFJ: HTSOP-J8 - C x x Product Rank C: for Automotive Packaging and forming specification TR: Embossed tape and reel E2: Embossed tape and reel Marking Diagram HRP7 (TOP VIEW) TO263-7 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number Pin 1 Mark Pin 1 HTSOP-J8 (TOP VIEW) Part Number Marking LOT Number Pin 1 Mark Part Number Marking Package Orderable Part Number HRP7 BD4271HFP-CTR BD4271 TO263-7 BD4271FP2-CE2 HTSOP-J8 BD4271EFJ-CE2 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HRP7 28/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Physical Dimension, Tape and Reel Information – continued Package Name TO263-7 < Tape and Reel Information > Tape Embossed carrier tape Quantity 500pcs Direction of feed E2 The direction is the pin 1 of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand Reel www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1Pin 29/31 Direction of feed TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Physical Dimension and Packing Information – continued Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 HTSOP-J8 30/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 BD4271xxx-C Series Revision History Date Revision Mar.30.2016 001 New Release. Jun.21.2016 002 TO263-7 PKG added. Thermal resistance format updated. 003 Subtitle correction. Symbol correction “Reset Detection Hysteresis”. Symbol correction “CT Upper-side Threshold”. Symbol correction “CT Lower-side Threshold”. Symbol correction “CT Charge Current”. Symbol correction “CT Discharge Current”. Formula correction “WDT Monitor Time”. Formula correction “WDT Reset Time”. Graph title correction Figure 13. Vertical axis label and Graph title correction Figure 14. Legend correction Figure 17. Legend correction Figure 18. Vertical axis label and Graph title correction Figure 19. Vertical axis label and Graph title correction Figure 20. HTSOP-J8 PKG added. Mar.25.2021 Changes www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/31 TSZ02201-0G9G0AN00610-1-2 25.Mar.2021 Rev.003 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001